JP2020506284A - Combination mechanism for electroplating - Google Patents

Abstract

The present invention discloses a combination mechanism for electroplating, comprising an electroplating barrel, wherein the electroplating barrel includes an annular cylinder, a rotating shaft, an engagement portion, and a plurality of vortex forming blades, and a first end of the rotating shaft. Is provided on the ring-shaped cylinder, the engaging portion is provided on the bottom of the ring-shaped cylinder, and is driven to rotate by a driver, and the vortex forming blade is provided on the bottom of the ring-shaped cylinder.

Description

  The present invention relates to a combination mechanism for electroplating, and more particularly to a combination mechanism for electroplating for electroplating or chemical plating a plurality of small parts.

  Generally, there are two types of electroplating, rack plating and barrel plating. Rack plating is an electroplating method in which a component is hooked on a jig to deposit a plating layer, and is generally used for electroplating large-sized components. Barrel plating is generally used for small components that cannot be hooked or are difficult to hook depending on the shape and size. Barrel plating is also called barrel electroplating, in which a predetermined number of small parts are put into a dedicated barrel, and various metal plating layers or alloy plating layers are deposited on the surface of the parts by indirect conduction while rotating. And fulfills the purpose of surface protection, decoration or function addition. Barrel plating differs greatly from rack plating in the plating method for plating components.Rack plating is performed with components separated, whereas barrel plating is used when a large number of components gather or separate. In such a process, a mixing cycle of parts occurs, and rack plating is performed with parts completely exposed, whereas barrel plating is performed in a closed barrel (wall plate). (With holes) at low solution concentrations. Due to the difference in plating method for parts, barrel plating has two drawbacks: a drawback due to the mixing cycle and a structural drawback due to barrel plating. The above disadvantages have an adverse effect on barrel plating production efficiency and product quality improvement, and the advantages of barrel plating cannot be fully utilized.

  In addition, the conventional barrel plating technology connects the barrel to a driving device, loads a work to be plated into the barrel, and then puts the work into an electroplating tank and operates the driving device to reverse the work to be plated. In general, surface electroplating of a large number of needle-shaped or flake-shaped microelectronic components is performed in an electroplating barrel. There are many types of plating barrels, and most of the electroplating barrels are driven by a horizontal drive, have a complicated structure, are difficult to change the solution, have low electroplating efficiency, and have a high maintenance cost. Often have.

  In addition, an electroplating barrel is arranged at the lower end of the drive shaft, and an electroplating tank having an anode is driven to rotate. The centrifugal force generated when the electroplating barrel is driven to rotate flows from the inside of the electroplating barrel to the outside. Some flow from inside. However, since the electroplating barrel is fixed to the lower end of the drive shaft and cannot be moved or replaced, the electroplating step of automatically moving between the tanks cannot be performed.

  Therefore, it is necessary to provide an improved combination mechanism for electroplating to solve the above-mentioned problems of the prior art.

  In view of the above, a main object of the present invention is to make the electroplating solution in the annular cylinder vortex by the vortex forming blades, thereby accelerating the repetition of the electroplating solution and flowing the electroplating solution through the power line guide ring. An object of the present invention is to provide a combination mechanism for electroplating in which an effect of stabilizing the direction, uniformly immersing a small component with an electroplating solution, and uniformly electroplating the surface of the small component is obtained.

  In order to achieve the above object, the present invention provides a combination mechanism for electroplating for electroplating a plurality of small parts, wherein the combination mechanism for electroplating comprises an electroplating barrel containing the small parts. The electroplating barrel includes an annular cylinder, a rotating shaft, an engagement portion, and a plurality of vortex forming blades. A first end of the rotating shaft is provided on the ring-shaped cylinder, the engaging portion is provided on a bottom of the ring-shaped cylinder, and driven to rotate by a driver, and the vortex forming blade is located on a bottom of the ring-shaped cylinder. Is provided.

  In one embodiment of the present invention, the combination mechanism for electroplating further includes a moving frame to which the electroplating barrel is mounted, wherein the moving frame has one fixed plate and two fixed plates mounted on both sides of the fixed plate. Two side levers, two auxiliary levers provided between the two side plates, wherein the ring-shaped cylinder is located above the auxiliary lever, and two auxiliary levers are pivotally attached to the fixed plate, and the rotation And a rotary joint integrally combined with the second end of the shaft.

  In one embodiment of the present invention, the moving frame further includes two cathode holders respectively provided on both sides of the bottom of the fixing plate and electrically connected to a cathode ring.

  In one embodiment of the present invention, the moving frame further includes a cathode wire connected to the two cathode holders and electrically connected to the cathode ring.

  In one embodiment of the present invention, the annular cylinder includes a base, a peripheral wall, an upper lid, and a cathode ring, the base is coupled to the peripheral wall, and the upper lid is covered on the peripheral wall to form an internal space, The rotating shaft is connected to the upper lid from the base and extends outward, and the cathode ring is provided in the peripheral wall.

  In one embodiment of the present invention, the electroplating barrel further includes a power line guide ring provided in the annular cylinder and having a distance from the peripheral wall.

  In one embodiment of the present invention, the electroplating barrel further includes a current transmission layer provided on a base of the annular body.

  In one embodiment of the present invention, the ring-shaped cylinder further includes a plurality of cathode circular sheets and a plurality of flow guide slopes, and the cathode circular sheet and the flow guide slope are provided on the current transfer layer at intervals. And the cathode circular sheet is located between two adjacent diversion slopes.

  As described above, when the cathode ring of the peripheral wall of the ring-shaped cylinder is electrically connected to the cathode holder through the cathode wire by the rotation shaft, and the electroplating barrel rotates to generate centrifugal force, The small components in the annular cylinder are driven to move to the cathode ring, and at the same time, the vortex forming blades make the electroplating solution in the annular cylinder a vortex, thereby accelerating the switching of the electroplating solution. The design of the power line guide ring stabilizes the flow direction of the electroplating solution, uniformly immerses the small components with the electroplating solution, and further uniformly electroplates the surface of the small components. The effect is obtained.

1 is a cross-sectional view of a preferred embodiment of a combination mechanism for electroplating according to the present invention. 1 is an exploded view of a preferred embodiment of a combination mechanism for electroplating according to the present invention. FIG. 4 is an exploded view of another preferred embodiment of the combination mechanism for electroplating according to the present invention.

  The following description of the embodiments illustrates, by way of example, certain embodiments of the invention, with reference to the drawings. Further, according to the present invention, the upper, lower, top, bottom, front, rear, left, right, inside, outside, side, peripheral, center, horizontal, horizontal, vertical, vertical, axial, radial, Terms relating to directions, such as upper or lower layers, refer only to directions based on the drawings. Accordingly, the directional terms used are for the purpose of explanation and understanding of the invention and are not limiting.

  1 and 2 show a preferred embodiment of a combination mechanism for electroplating according to the present invention for electroplating or chemical plating various small parts such as chip-type resistors, inductors, capacitors, connectors and precision parts. It is shown. The combination mechanism for electroplating includes a moving frame 2 and an electroplating barrel 3. In the present invention, the detailed structure, assembly relationship, and operation principle of each unit will be described later in detail.

  Further, as shown in FIGS. 1 and 2, the moving frame 2 includes one fixed plate 21, two side plates 22, two auxiliary levers 24, two gripping members 26, and one rotary joint. 27, two cathode holders 28, and one cathode wire 29, the side plates 22 are attached to both sides of the fixed plate 21, the auxiliary levers 24 are provided between the side plates 22, and the holding members 26 are spaced apart from each other. Are provided on both sides of the top surface of the fixed plate 21 and are moved by being pulled. The rotary joint 27 is pivotally attached to the fixed plate 21 and is integrally combined with the second end 322 of the rotating shaft 32. The cathode holders 28 are provided on both sides of the bottom of the fixing plate 21, and the cathode wires 29 are connected to the cathode holders 28 on both sides.

  Further, as shown in FIGS. 1 and 2, the electroplating barrel 3 accommodates small parts (not shown) and is attached to the moving frame 2, and the electroplating barrel 3 includes a ring-shaped cylindrical body 31 and a rotating shaft 32. , An engagement portion 33, a current transmission layer 34, a power line guide ring 36, and a plurality of vortex forming blades 37, a first end 321 of the rotating shaft 32 is provided on the annular cylindrical body 31, and the engagement portion 33 is a first Located below the end 321, swirl-forming vanes 37 are provided on the disc 38 so as to surround the rotating shaft 32 and be spaced apart therefrom. Further, the engaging portion 33 is provided at the bottom of the ring-shaped cylindrical body 31, one end face of the second end 322 is in the shape of a holding claw, and the auxiliary lever 24 is provided between the side plates 22. The engaging portion 33 is located above the auxiliary lever 24 and is attached to a driver (not shown), and is rotationally driven by driving wheels of the driver.

  The current transmission layer 34 is made of titanium metal or titanium plating or a titanium spray material. The annular cylinder 21 is made of a plastic material. Between the current transmission layer 34 and the annular cylinder 21 is a plastic material. Is provided.

  Further, as shown in FIGS. 1 and 2, the ring-shaped cylindrical body 31 includes a base 311, a peripheral wall 312, an upper lid 313, and a cathode ring 314, the base 311 is coupled to the peripheral wall 312, and the upper lid 313 covers the peripheral wall 312. To form an internal space (not shown), the internal space accommodates small components, the rotating shaft 32 is connected to the upper lid 313 from the base 311 and extends upward, and the cathode ring 314 is provided on the inner surface of the peripheral wall 312. The cathode wire 29 is electrically connected to the cathode ring 314 by the rotating shaft 22. The disk 38 is attached to the base 311, and the vortex forming blades 37 are located above the base 311.

  According to the above structure, the ring-shaped cylindrical body 31 and the rotating shaft 32 can be simultaneously removed from the moving frame 2 by loosening the rotary joint 27, and the cathode holders 28 on both sides of the bottom of the fixed plate 21 are electrically contacted. Then, it is electrically connected to the cathode ring 314, and when the fixed plate 21 is moved, the current is cut off. When the cathode ring 314 is accelerated to a predetermined number of revolutions, the small parts (plated objects) in the ring-shaped cylinder 31 are brought into close contact with the cathode ring 314 by centrifugal force and energized to perform electroplating. When the power is cut off, the cathode ring 314 is decelerated to a low rotation speed, and the small components (plated objects) in the annular cylinder 31 fall to the bottom of the annular cylinder 31 due to gravity and mix. After the plating) is mixed, the cathode ring 314 rotates to a predetermined number of revolutions, and thus, after the low-speed mixing and acceleration electroplating of the small parts (plated objects), the low-speed mixing and acceleration electroplating are intermittently performed. By doing so, the effect of uniformly electroplating the surface of the small component (plated object) can be obtained.

  According to the above design, the cathode ring 314 of the peripheral wall 312 of the ring-shaped cylindrical body 31 is electrically connected to the cathode holder 28 through the cathode wire 29 by the rotating shaft 22, and the electroplating barrel 3 rotates to generate centrifugal force. When this is done, the small components in the ring-shaped cylinder 21 are driven to move to the cathode ring 314, and at the same time, the vortex-forming blades 37 vortex the electroplating solution in the ring-shaped cylinder 21 so that the electroplating solution is By accelerating the replacement and stabilizing the flow direction of the electroplating solution by designing the power line guide ring 36, the small parts are uniformly immersed in the electroplating solution, and the surface of the small parts is uniformly electroplated. The effect is obtained.

  Further, according to the design of the engaging portion 33, the engaging portion 33 can be easily engaged with the driver and is driven to rotate by the driver. In addition, according to the design of the rotary joint 27, the electroplating barrel 3 can be easily attached to or removed from the moving frame 2, and the speed of removing and replacing the electroplating barrel 3 can be increased. Improve the efficiency of electroplating work. In addition, the engagement of the engagement portion 33 causes the ring-shaped cylinder 31 to rotate, and the centrifugal force at the time of rotation drives the small parts in the ring-shaped cylinder 21 to move to the cathode ring 314, and further, the small parts are electrically operated. Efficiently moves and turns back in the plating solution.

  FIG. 3 shows another preferred embodiment of the combination mechanism for electroplating according to the invention, in which the same unit names and drawing numbers are used as in the preferred embodiment described above, and these two implementations are used. The following features are different in the example. The annular cylindrical body 31 includes a plurality of cathode circular sheets 317 and a plurality of flow guiding slopes 318. The cathode circular sheets 317 and the flow guiding slopes 318 are provided on the current transfer layer 34 at intervals from each other. Is located between two adjacent diversion slopes 318. Therefore, even in the preferred embodiment, the electroplating barrel 3 can be easily moved and replaced, and the surface of the small component is uniformly electroplated according to the requirements of electroplating with various small components. Is obtained.

  As described above, the cathode ring 314 of the peripheral wall 312 of the ring-shaped cylindrical body 31 is electrically connected to the cathode holder 28 through the cathode wire 29 by the rotating shaft 22, and the electroplating barrel 3 rotates to generate centrifugal force. At this time, the small parts in the annular cylinder 21 are driven and move to the cathode ring 314. At the same time, the vortex forming blades 37 make the electroplating solution in the annular cylinder 21 vortex, thereby accelerating the repetition of the electroplating solution, and stabilizing the flow direction of the electroplating solution by designing the power line guide ring 36. As a result, the effect of uniformly immersing the small component in the electroplating solution and uniformly electroplating the surface of the small component can be obtained.

  Although the present invention has been described in the related embodiment, the above embodiment is only a preferred embodiment of the present invention. The disclosed embodiments do not limit the scope of the present invention. Rather, any modifications and equivalent arrangements included within the spirit and scope of the claims are included within the scope of the invention.

21 Ring Cylindrical Body 22 Side Plate 24 Auxiliary Lever 27 Rotary Joint 29 Cathode Wire 31 Ring Cylindrical Body 311 Base 312 Peripheral Wall 313 Top Lid 314 Cathode Ring 317 Cathode Circular Sheet 32 Rotation Axis 36 Power Line Guide Ring

Claims (8)

A combination mechanism for electroplating for electroplating a plurality of small parts,
Including an electroplating barrel for storing the small parts,
The electroplating barrel is
An annular cylinder,
A rotating shaft having a first end provided on the annular cylinder;
An engagement portion provided at the bottom of the ring-shaped cylinder and driven to rotate by a driver,
A plurality of vortex forming blades provided at the bottom of the annular cylinder;
A combination mechanism for electroplating, comprising: Further comprising a moving frame to which the electroplating barrel is attached;
The moving frame is
Fixed plate,
Two side plates attached to both sides of the fixed plate,
Two auxiliary levers provided between the two side plates, wherein the annular cylinder is located above the auxiliary lever; and
A rotary joint pivotally attached to the fixed plate and integrally combined with the second end of the rotating shaft;
The combination mechanism for electroplating according to claim 1, comprising:   The combination for electroplating according to claim 2, wherein the moving frame further includes two cathode holders respectively provided on both sides of a bottom of the fixing plate and electrically connected to a cathode ring. mechanism.   The combination mechanism according to claim 3, wherein the moving frame further includes a cathode wire connected to the two cathode holders and electrically connected to the cathode ring.   The ring-shaped cylinder includes a base, a peripheral wall, an upper lid, and a cathode ring, the base is coupled to the peripheral wall, the upper lid is covered on the peripheral wall to form an internal space, and the rotation axis is moved from the base to the base. The combination mechanism for electroplating according to claim 1, wherein the cathode ring is connected to the upper lid and extends outward, and the cathode ring is provided in the peripheral wall.   The combination mechanism for electroplating according to claim 5, wherein the electroplating barrel further includes a power line guide ring provided in the annular cylinder and spaced from the peripheral wall.   The combination mechanism according to claim 1, wherein the electroplating barrel further includes a current transmission layer provided on a base of the annular body.   The annular cylinder further includes a plurality of cathode circular sheets and a plurality of flow guiding slopes, wherein the cathode circular sheet and the flow guiding slope are provided on the current transfer layer at intervals from each other, and the cathode circular sheet is The combination mechanism for electroplating according to claim 7, wherein the combination mechanism is located between two adjacent flow guide slopes.

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