JP4273333B2 - Plating jig, plating method, and electroplating apparatus - Google Patents

Description

  The present invention relates to a plating jig, a plating method, and an electroplating apparatus. More specifically, the present invention relates to a plating treatment suitable for plating using, for example, a ring magnet used in a hard disk motor of a computer or the like as an object to be plated. The present invention relates to a tool, a plating method, and an electroplating apparatus.

  When electroplating a relatively small object to be plated, such as a ring magnet used in a motor, etc., place a plurality of objects to be plated in a container called a barrel and place the cathode in the barrel. Plating has been performed by the “barrel plating method” in which plating is performed while rotating the barrel, or the “hanging plating method” in which plating is performed by hooking the object to be plated on a jig that also serves as a cathode.

  However, in the plating method using a barrel, since the objects to be plated cannot be individually controlled, there is a problem that the film thickness tends to vary for each plated product in the batch. Even in individual plated products, a uniform film thickness cannot be obtained, and the film thickness often varies depending on the part. Furthermore, when the toughness (strength) of the object to be plated is low, chipping is likely to occur, and foreign matter is likely to be generated. In the plating method using the hook jig, there is a problem that jig traces are likely to remain on the plated product, and a uniform and dense plating film cannot be obtained.

  For this reason, the improvement technique (for example, patent document 1) regarding a barrel plating method, the improvement technique (for example, refer patent document 2, patent document 3) regarding a hook plating method, etc. are each proposed.

  However, in recent years, particularly high precision, that is, uniform and dense film formation has been required for plating of electronic parts, etc. In conventional plating using a barrel or hooking jig, Can't fully meet this demand. In particular, when the object to be plated has a shape having an inner peripheral surface such as a ring shape, the film thickness of the inner peripheral surface which is electrically shaded becomes extremely thin, or the film thickness of the end surface increases. There is a problem. As a countermeasure against this problem, a plating jig in which an auxiliary anode is provided in a hollow portion of an object to be plated having a hollow portion has been proposed (for example, Patent Document 4). However, in the case where the anode is easily leached, there is a problem in that the anode itself partially peels off and falls off, which causes generation of foreign matters.

Japanese Patent No. 3021728 JP 2001-131800 A JP 2001-152388 A JP 2001-73198 A

  Accordingly, there is a need to provide a plating jig and an electroplating apparatus capable of forming a dense and uniform film on an object to be plated when plating on electronic parts and the like that require high plating accuracy. Yes. This is the subject of the present invention.

  In order to solve the above-described problem, a first aspect of the present invention includes an opening penetrating and formed in a rotatable support body, and crossings provided so as to cross the opening at both ends of the opening, respectively. A plating solution guiding portion that promotes inflow of the plating solution toward the opening, and the space defined by the inner wall surface of the opening and the transverse line is divided into the objects to be plated. It is the plating jig characterized by having set it as the room arrange | positioned to.

  According to the invention of the plating jig, the space defined by the inner wall surface of the opening and the transverse line is a room in which the objects to be plated are individually arranged. In conventional plating using a barrel jig, it was impossible to control the movement of individual workpieces in the barrel, so a uniform film thickness could not be obtained. Although the plating jig of the present invention has a simple structure, it is easy to control the film thickness of the coating in the plated product and can suppress variations in film thickness. In addition, since the objects to be plated do not collide with each other during plating unlike plating with a barrel jig, even a material with low toughness is unlikely to crack. Moreover, by providing a plating solution guiding part that promotes the inflow of the plating solution, as shown in the examples described later, renewal of the plating solution in the room can be promoted, and the formation of the coating can be accelerated and the plating efficiency can be improved. At the same time, the variation in film thickness is further improved, and a more uniform film can be obtained.

  According to a second aspect of the present invention, there is provided an opening formed through the rotatable support, a transverse line extending across the opening at both ends of the opening, and the opening And a shielding wall for narrowing the opening surface, and the space defined by the inner wall surface of the opening and the transverse line is a room for individually placing the objects to be plated. It is a tool.

According to the invention of this plating jig, as shown in the examples described later, by providing a shielding wall that narrows the opening, the variation in film thickness is further improved, and a more uniform film can be obtained.
In addition, since the room is provided on a rotatable support body, the object to be plated moves in the room as the support body rotates. Accordingly, no jig trace remains on the plated product unlike the hook plating jig.

  According to a third aspect of the present invention, there is provided an opening formed through the rotatable support body, a transverse line extending across the opening at both ends of the opening, and the opening A wall in which the objects to be plated are individually arranged in a space defined by the inner wall surface of the opening and the transverse line. This is a plating jig characterized by the above. According to the invention of this plating jig, the same effect as the second aspect can be obtained.

  According to a fourth aspect of the present invention, there is provided a plating jig according to the second or third aspect, wherein the plating jig has a plating solution guiding portion that promotes inflow of the plating solution toward the opening. According to the invention of this plating jig, in addition to the same effect as the second or third aspect, the plating solution in the room can be renewed by providing the plating solution guiding part that promotes the inflow of the plating solution. Encouragement and prevention of plating efficiency can be prevented.

  According to a fifth aspect of the present invention, in the first or fourth aspect, the plating solution guiding portion is configured by a step portion formed around the opening portion so as to be lower than the support surface. It is a plating jig. According to the invention of this plating jig, in addition to the same effects as the first or fourth aspect, for example, by providing a step portion that forms the periphery of the opening portion lower than the surface of the support, a simple structure This makes it possible to promote the inflow of the plating solution.

  According to a sixth aspect of the present invention, in the first or fourth aspect, the plating solution guiding portion is configured by a slope that expands in a mortar shape from the opening toward the surface of the support. It is a plating jig characterized by these. According to the invention of the plating jig, in addition to the same effects as the first or fourth aspect, for example, by providing a slope that expands in a mortar shape from the opening toward the surface of the support, It is possible to promote the inflow of the plating solution with a simple structure.

  A seventh aspect of the present invention is a plating jig according to any one of the first to sixth aspects, wherein the transverse line also serves as an electrode for supplying a current to the object to be plated. . According to this feature, in addition to the same effects as any one of the first to sixth aspects, the structure of the plating jig can be simplified because the transverse line also serves as the electrode. Also, in electroplating, the object to be plated in the room can be reversed and brought into contact with the opposite electrode as the rotating support is reversed, and the object to be plated is lifted in the plating bath. Even in this case, it is possible to contact the upper electrode. Therefore, it is possible to ensure a state in which the object to be plated is energized through almost the entire plating time and to form a good film. Further, since the surface of the object to be plated that comes into contact with the electrode is replaced with the reversal operation, the film thickness on both surfaces can be controlled uniformly. Further, when only one surface is in contact with the electrode for a long time, the film defect such that the plating film is fixed to the electrode and peeled off does not occur.

  According to an eighth aspect of the present invention, in any one of the first to seventh aspects, the room stably supports an object to be plated that moves in the room as the support rotates. There are at least two stable positions, and the object to be plated moves from one stable position to the other stable position among the at least two stable positions. A plating jig having a structure in which an object to be plated comes into contact with a contact portion. According to the invention of the plating jig, in addition to the same effects as any one of the first to seventh aspects, the object to be plated moves from one stable position in the room to another stable position. In addition, by adopting a structure in contact with the wall surface of the room, it is possible to rotate the object to be plated in a certain direction with a simple configuration. In addition, the amount of rotation of the object to be plated can be easily controlled by the shape of the room.

  According to a ninth aspect of the present invention, in the eighth aspect, the shape of the room is such that the one stable position and the other stable position are in any state where the support is displaced to any rotational position. It is a plating jig characterized by the shape which does not overlap with the perpendicular direction the line which connects. According to this feature, in addition to the same effects as the eighth aspect, during the rotation of the support, the object to be plated is moved from one stable position to another stable position by gravity. A structure in contact with the wall surface of the room can be easily created, and the object to be plated can be rotated in a certain direction.

  A tenth aspect of the present invention is a plating jig according to any one of the first to ninth aspects, wherein a plurality of the chambers are arranged on the support. According to the invention of this plating jig, in addition to the same effects as any one of the first to ninth aspects, a plurality of objects are processed at a time by arranging a plurality of chambers on the support. it can. Therefore, it is possible to deal with a large amount of processing while controlling the plating film thickness by individually placing the objects to be plated in the room.

  An eleventh aspect of the present invention is the plating jig according to the tenth aspect, wherein the plating solution guiding portion is provided for each opening. In the invention of this plating jig, in addition to the same effects as the tenth aspect, by providing a plating solution guiding portion for each opening, the inflow of the plating solution to the opening can be equally promoted and supported. Unevenness due to the arrangement of openings on the body can be eliminated. Further, it is possible to individually control the inflow amount of the plating solution for each opening by changing the shape, area, etc. of the plating solution guiding portion according to the position of the opening.

  A twelfth aspect of the present invention is the plating treatment according to any one of the first to eleventh aspects, wherein the support has a structure in which two plates having through holes are stacked. It is a tool. According to the invention of this plating jig, in addition to the same operational effects as in any one of the first to eleventh aspects, the objects to be plated are arranged individually by making a structure in which two plates are stacked. You can easily form a room. That is, the room can be manufactured by overlapping two plates having a symmetrical structure provided with the through-opening and the plating solution guiding portion.

  A thirteenth aspect of the present invention is the plating jig according to any one of the first to twelfth aspects, wherein the support is configured in a plate shape elongated in the rotational radius direction. It is. In the invention of this plating jig, in addition to the same effects as in any one of the first to twelfth aspects, the support body is formed into a plate shape that is long in the rotational radius direction, thereby rotating the circumference Increases and the plating solution stirring function is sufficiently secured.

  A fourteenth aspect of the present invention is a plating jig according to any one of the first to thirteenth aspects, wherein a plurality of the support bodies are radially formed around a rotation axis. . In the invention of the plating jig, in addition to the same effects as any one of the first to thirteenth aspects, the plating solution is further agitated by forming a plurality of supports radially about the rotation axis. Function can be enhanced. Moreover, it can respond to a large number of processes, and can perform a plating process efficiently.

  The fifteenth aspect of the present invention is characterized in that plating is performed on an object to be plated having an inner peripheral surface using the plating jig according to any one of the first to fourteenth aspects. It is a plating method. According to the plating method of the present invention, plating can be performed while obtaining the same effects as any one of the first to fourteenth aspects. In particular, since the film thickness of the plating film can be controlled, the inner peripheral surface, the outer peripheral surface, and the end surface when the object to be plated has a shape having an inner peripheral surface, such as a ring shape or a cylindrical shape. The film thickness difference from the corner can be reduced.

  A sixteenth aspect of the present invention is an electroplating apparatus using the plating jig according to any one of the first to fourteenth aspects. According to the electroplating apparatus of the sixteenth aspect, the same effect as that of the fifteenth aspect can be obtained.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing an outline of a plating jig 100 according to an embodiment of the present invention. The plating jig 100 is a jig for electroplating, and includes two trays 10a and 10b as rotatable support bodies between the left and right frames 13a and 13b. In the trays 10a and 10b, a plurality of cells 30 are formed as rooms in which workpieces 70 to be plated are placed. The cell 30 is defined by inner walls of through openings formed in the trays 10a and 10b and cathode lines 33a and 33b as transverse lines. In addition, around each cell 30, a digging portion 37 is provided as a plating solution guiding portion.

FIG. 2 shows a state in which the plating jig 100 is viewed from the front. Here, the trays 10 a and 10 b stand in a substantially vertical state, and a work 70 is disposed in each cell 30.
The frame 13a is provided with a first gear 21, a second gear 23, and a third gear 25 engaged with each other. The second gear 23 is connected to the tray 10a, and the third gear 25 is connected to the tray 10b through through holes (not shown) of the frame 13a. The first gear 21 is connected to the drive motor 27 on the opposite side across the frame 13a.

  A support column 15 is provided on the upper part of the plating jig 100, and this portion can be held and moved or immersed in a plating bath. The front and back sides of the plating jig 100 are open, and an opening 19 is provided at the bottom, so that the plating solution can easily enter the cell 30 when immersed in the plating bath. ing.

At the upper part of the left and right frames 13a and 13b of the plating jig 100, hook portions 17 made of a conductive material such as metal are provided at four positions in the front and rear, and the hook portions 17 are immersed in a plating bath in the plating tank. It can be suspended on a rod-like object passed to 50 (see FIG. 9).
Further, the central portion of the gear 23 (the gear 25) is configured to be connectable with a wiring (not shown) here, so that the shaft 34 (see FIG. 3) of the tray 10 can be electrically connected.

  Next, details of the tray 10 (10a, 10b) will be described with reference to FIGS. 3 is a perspective view of the tray 10, and FIG. 4 is an exploded perspective view thereof. FIG. 5 is a plan view of the substrates 11a and 11b constituting the tray 10 having an overlapping structure. FIG. 5A shows the outside (surface structure) of the tray 10, and FIG. Shows the inside (surfaces facing each other) of the stacked trays 10. The substrate 11b shown in FIG. 5B is a state in which the substrate 11a shown in FIG. 5A is turned over, and the substrate 11a and the substrate 11b have basically the same structure.

  In the tray 10 of this embodiment, seven cells 30 in a row are formed in two rows as openings through which the cells 30 pass. As will be described later, the cell 30 has a shape in which a line connecting one stable position and another stable position does not overlap with the vertical direction in any state in which the tray 10 is displaced.

  Further, in the vicinity of both end portions of the through opening corresponding to the inlet and outlet of the cell 30, a shielding wall 39 is formed so as to protrude so as to narrow the opening. The shielding wall 39 has a function of partially shielding the work 70 when plating is performed by placing the work 70 in a space defined by the inner wall surface of the cell 30 and the cathode line 33. .

  As shown in FIG. 5A, in the present embodiment, a pair of shielding walls 39 for each opening 12 has two opposite edge portions of the opening 12 (the vertical direction of the paper in FIG. 5 of the opening 12). It is provided so as to protrude from the opening to the opening. From this figure, it can be seen that the opening 12 of the substrate 11a is narrowed by a shielding wall 39 that advances from both sides of the opening edge. Since the tray 10 rotates around the shaft 34 (see FIGS. 3 and 4) during the plating process, the shielding wall 39 moves the work 70 moving in the cell 30 by the rotation to a stable position (described later). In order to shield the lower part of the workpiece 70 in a certain state, it is provided at the two opposing edges. Thereby, the film thickness of the end surface part and corner | angular part of the ring-shaped workpiece | work 70 can be equalize | homogenized. In FIG. 5B, the shielding wall 39 of the substrate 11 b is shown in the back of the opening 12.

  Around each cell 30 is provided a digging portion 37 formed slightly lower than the surface of the substrate 11a (that is, the surface of the tray 10) for each cell (the same applies to the surface of the substrate 11b). The digging portion 37 functions as a plating solution guiding portion that promotes the inflow of the plating solution into the cell 10 by the rotation of the tray 10. Further, since the digging portion 37 is provided for each opening 12, the digging portion 37 acts to equalize the amount of the plating solution flowing into the cells 30 as the tray 10 rotates.

  In the present embodiment, the digging portion 37 is configured by a step portion in which an opening edge portion is formed lower than the surfaces of the substrates 11a and 11b. The action of promoting the inflow of the plating solution by the digging portion 37 is particularly advantageous in that the amount of inflow of the plating solution can be secured in a state where the opening area of the cell 30 is narrowed by providing the shielding wall 39.

  Moreover, it has the effect | action that the plating solution inflow amount can be controlled for every room by adjusting the depth and area of the digging part 37. FIG. For example, the amount of plating solution inflow between the cells 30 varies depending on factors such as the arrangement of the cells 30 in the tray 10, the size and shape of the tray 10, the size of the plating tank 50, and the flow rate and direction of the plating solution flow. In this case, by adjusting the depth, size, and shape of the digging portion 37 for each cell 30, the inflow amount of the plating solution in each cell 30 can be made uniform. It is also possible to make a difference in the inflow amount of the plating solution. In addition, as a structure of the plating solution guiding portion, a stepped portion as in the present embodiment, a tapered structure described later, a groove formed on the surface of the substrate 11a, 11b toward the edge of the cell 30, or the like can be given. .

  On both surfaces of the tray 10, two cathode lines 33 are disposed on each side in a state of being extended to all the cells 30 in the same row. That is, one cathode line 33 per side (a total of two on both sides) crosses the opening of each cell 30. The cathode line 33 is made of, for example, a conductive material such as stainless steel, iron, copper, titanium, or carbon, and is bonded to the fixtures 31a and 31b or the fixtures 32a and 32b formed of the same conductive material at both ends. ing.

  The cathode line 33 is exposed at both ends of the opening of each cell 30, that is, at the top and bottom of the opening (however, they are replaced when the tray 10 is inverted), and serves as an object to be plated disposed in the cell 30. It has the effect | action which contacts the workpiece | work 70 and energizes. Further, when the tray 10 is rotated in the plating bath, the work 70 is lifted in the cell 30 and may be separated from the lower cathode line 33. However, by disposing the cathode line 33 on both sides, There is also an effect that the energized state of the work 70 can be secured by contacting the cathode line 33. The number of cathode lines 33 can be two or more per one side of the cell 30 within a range that does not hinder plating. However, in consideration of a decrease in plating efficiency due to metal deposition on the cathode line 33, the number is one on each side. It is preferable. In addition, about the cathode line 33, it is preferable to insulate on parts other than the part required for the electricity supply to the workpiece | work 70. FIG.

  The cathode lines 33 are not limited to being arranged in parallel, and may be arranged in a grid, for example. Further, the cathode line 33 can be provided with a function as a fall prevention means for preventing the work 70 from dropping. When the workpiece 70 falls into the plating bath, the metal may elute from the workpiece 70 and adversely affect the plating performance. However, such a situation can be prevented by the fall prevention means.

  As described above, the cathode line 33 has a function of energizing in contact with the work 70, but the cathode line 33 is not necessary if the cathode is disposed at another position, for example, the inner wall of the cell 30. Further, when only the function as the fall prevention means is intended, it is possible to provide synthetic resin fibers or nets on both sides of the tray 10 instead of the cathode line 33.

  Each of the fixtures 31a and 31b includes a shaft 34. The shaft 34 functions as a rotating shaft and can be engaged with the second gear 23 or the third gear 25 by an engaging means (not shown). The shaft 34 is formed integrally with the conductive fixtures 31 a and 31 b, and can be electrically connected to a wiring (not shown) via the center of the second gear 23 or the third gear 25. The fixtures 32a and 32b have substantially the same configuration as the fixtures 31a and 31b except that the shaft 34 is not provided.

  As shown in FIG. 4, the fixtures 31 a and 31 b (32 a and 32 b) are formed of the board 11 a (which constitutes the tray 10 in the screw holes 36 and the screw holes 38 formed in the projecting pieces 35 with metal bolts or the like. 11b). The fixing tool 31a and the fixing tool 32a, and the fixing tool 31b and the fixing tool 32b are mounted so as to sandwich the two resin plates 11a and 11b. That is, in FIG. 4, the upper fixture 31 a and the lower fixture 32 a are configured so as to ensure an electrical connection state via metal bolts or the like that penetrate the screw holes 38 of the upper and lower protrusions 35. Has been. As described above, the conductive fixture constituting the tray 10 can be energized through a metal bolt or the like while being coated to suppress unnecessary metal deposition.

  As described above, the tray 10 has a structure in which two substrates 11a and 11b are overlapped. Thus, the tray 10 can be manufactured easily by adopting a structure in which the two substrates 11a and 11b provided with the cathode lines 33 on one side are bonded together.

  In the substrates 11a and 11b, the openings 12 that become the cells 30 in a stacked state are formed in a row. Since the substrates 11a and 11b constituting the tray 10 are made of a non-conductive material such as synthetic resin, for example, in addition to the function of supporting the workpiece 70, the substrate 11a and 11b also have a shielding action. Further, the tray 10 has a structure in which an area other than the opening 12 is sufficiently secured. Thereby, the action | action which stirs a plating bath in the case of rotation of the tray 10 is given. On one side of the substrates 11a and 11b, grooves 16 are provided so that the cathode lines 33 can be embedded therein.

  6 and 7 show the detailed structure of the cell 30. FIG. FIG. 7 is a plan view of the main part of the tray 10 near the cell 30, FIG. 7A is a cross-sectional view taken along the line VIIa-VIIa in FIG. 6, and FIG. 7B is FIG. It is an enlarged view of the area | region enclosed with the dashed-dotted line. Here, a ring-shaped workpiece 70 is arranged in the cell 30.

  As shown in FIG. 7, the cross-sectional structure of the tray 10 in the vicinity of the cell 30 is formed with digging portions 37, 37 from both outer sides of the stacked substrates 11a, 11b, and four shielding walls 39, 39, 39, 39. Projecting toward the opening of the cell 30, and a pair of cathode lines 33a and 33b embedded in the substrates 11a and 11b are provided.

  The work 70 in the cell 30 is shielded by the nonconductive substrates 11a and 11b constituting the cell 30 during plating. In particular, when the outer peripheral surface 70a of the workpiece 70 is in contact with or close to the wall surface of the cell 30, it is difficult for a film to be formed on the contact portion or the adjacent portion of the outer peripheral surface 70a by the wall of the non-conductive cell 30. . For this reason, for example, in a workpiece 70 having an inner peripheral surface 70b and an outer peripheral surface 70a, such as a ring shape, the inner and outer peripheral film thicknesses can be controlled uniformly.

  As shown in FIGS. 6 and 7, in order to obtain a sufficient shielding effect, in this embodiment, the total thickness L of the non-conductive substrates 11a and 11b is made larger than the width L1 of the ring-shaped workpiece 70. is doing. For example, when L1 = L, shielding may be insufficient, and the film 70 may be formed with a large film thickness, particularly on the outer peripheral surface, but the shielding effect is ensured by satisfying L1 <L. As a result, a uniform film thickness can be obtained.

The cathode lines 33a and 33b are arranged so as to bite into the substrates 11a and 11b.
That is, the cathode lines 33a and 33b are mounted so as to be embedded in the grooves 16 (see FIG. 4) formed in the substrates 11a and 11b, thereby defining the cells 30. Therefore, the distance L2 between the upper and lower cathode lines 33a and 33b facing each other is smaller than the total thickness L of the substrates 11a and 11b. As a result, the work 70 supported by the cathode lines 33a and 33b is hidden by the opening wall surfaces of the substrates 11a and 11b, so that a sufficient shielding effect is obtained. Further, by embedding the cathode lines 33a and 33b in the grooves 16 formed in the substrates 11a and 11b, the cathode lines 33a and 33b can be firmly fixed, and bending, distortion, displacement, and the like can be prevented.

  In addition, as shown to Fig.7 (a), the cathode rays 33a and 33b are arrange | positioned so that it may protrude slightly inward rather than the wall surface by the side of the cell of the shielding wall 39. FIG. That is, the distance L3 between the inner wall surfaces of the shielding wall 39 is configured to be longer than the distance L2 between the cathode lines 33a and 33b. This prevents the contact between the work 70 and the cathode line 33 by the shielding wall 39, and restricts the movement of the work 70 in the cell 30 by the cathode lines 33 a and 33 b, so that the work 70 becomes free of the shielding wall 39. This is to prevent a situation (hook) that cannot move due to contact with the top.

  In this example, the difference between the distance L2 between the two cathode lines 33a and 33b and the width L1 of the workpiece 70 is set to about 1 mm. If the difference between L2 and L1 becomes too large, the work 70 may be reversed in the cell 30 or the vertical and horizontal directions may be switched regardless of the operation of the tray 10, and the rotation in one direction may not be controlled. The distance L2 between the upper and lower cathode lines 33a and 33b is preferably adjusted according to the shape of the workpiece 70. Further, regarding the relationship between the distance L3 between the inner wall surfaces of the shielding wall 39 and the width L1 of the work 70, if there is a step at the joint between the substrates 11a and 11b, the work 70 is prevented from being caught there. Does not exceed twice L1.

  Moreover, it is preferable that the height h of the shielding wall 39 is ensured to be high enough to provide a shielding action. Specifically, as shown in FIG. 7B, when the workpiece 70 is ring-shaped, the height h of the shielding wall 39 (the height of the wall rising from the inner wall surface of the cell 30) is set to the periphery of the workpiece 70. Is larger than the thickness L4.

  FIG. 8 shows a cross-sectional structure in the vicinity of the cell 30 according to another embodiment, and is a cross-sectional view at the same position as in FIG. Here, the digging portion 37 ′ is formed as a slope that expands in a mortar shape from the opening toward the surface of the substrates 11 a and 11 b. Also with the tapered portion 37 ′ having such a tapered structure, an inflow effect of the plating solution can be obtained in the same manner as the stepped portion (FIGS. 6 and 7).

  FIG. 9 shows an electroplating apparatus 110 in which the electroplating jig 100 is disposed in the plating tank 50. The electroplating jig 100 is hung on the rods 60a and 60b at the four hooks 17 and is immersed to a predetermined position. As described above, since the shaft 34 can be electrically connected to the outside via the center portion of the second gear 23 or the third gear 25, wiring to the center portion allows the trays 10a and 10b to be connected. The cathode line 33 is energized. Then, by disposing the anode 41 on both sides of the electroplating jig 100, an electrochemical reaction occurs, and metal ions in the plating bath 50 are deposited on the surface of the work 70 in contact with the cathode wire 33 to form a film. Is done.

  When plating is performed using the plating jig 100, the first gear 21 is rotated at a predetermined speed by the drive motor 27. The movement of the first gear 21 may be a rotation in one direction, a rotation in the forward or reverse direction, or a swing that does not reach the rotation. If the drive motor 27 is not provided, this operation can also be performed manually. The rotation of the first gear 21 is transmitted to the second gear 23 and rotates the second gear 23. Similarly, the rotation of the second gear 23 is transmitted to the third gear 25 to rotate the third gear 25. For example, when the first gear 21 rotates in the direction indicated by the arrow in FIG. 9, the second gear 23 and the third gear 25 rotate in the direction of the arrow, respectively.

  The rotation of the second gear 23 and the third gear 25 is transmitted as it is to the trays 10a and 10b via the shaft 34, and the trays 10a and 10b rotate (rotate or swing).

  FIG. 10 shows the rotation of the tray 10 and the movement of the work 70 in the cell 30. Here, for convenience of explanation, only the cells 30 on one side of the tray 10 are illustrated, and the cathode lines 33, the digging portions 37, the shielding walls 39, and the like are not illustrated and are represented as a simple opening structure. First, consider a case where the tray 10 rotates from the A position to the B position shown in FIG. In the A position, the work 70 in the cell 30 is at the position closest to the end, that is, the position in contact with the inner wall surface of the cell 30. As the tray 10 rotates to the B position, the work 70 in the cell 30 gradually moves in the cell 30 toward the base end side in the direction indicated by the thick arrow. More specifically, it moves while sliding on a cathode line 33 (not shown).

  When the tray 10 is rotated to the C position, the work 70 in the cell 30 is completely in contact with a position from the base end side, that is, a wall surface facing the previous wall surface of the cell 30.

  When the tray 10 reaches the D position shown in FIG. 10B, the work 70 is reversed and is in contact with the cathode line 33 on the opposite side of the cell 30. When the tray 10 further rotates in the direction of the thin arrow from the D position to the E position, the inverted work 70 moves again toward the end of the tray 10 in the direction indicated by the thick arrow in the cell 30. When the tray 10 further rotates and reaches the F position, the workpiece 70 comes into contact with the inner wall of the cell 30, and then reverses again and returns to the state of the A position in FIG. As described above, the work 70 moves in the cell 30 by the rotation of the tray 10, and when the tray 30 is reversed, the work 70 is also reversed. The thick arrows in FIGS. 10A and 10B indicate the direction of movement of the work 70 in the cell 30, and this movement is given by gravity.

  FIG. 11 is a schematic diagram for explaining the movement of the work 70 in the plating jig 100 of the present invention. Here, description will be made with reference to FIG. 10 as appropriate. 11A to 11D, the cell 30 is shown as a simple square (plan view), a thick arrow indicates the moving direction of the work 70, and a thin arc arrow indicates the rotating direction of the work 70. Further, a line Y having arrows at both ends drawn on the side portions in each figure indicates a line direction connecting the base end portion (rotation center) and the end portion of the tray 10 with the shortest distance (hereinafter referred to as “Y”). Axis ").

  First, in FIG. 11A, the work 70 is in a state of being supported at one stable position in the cell 30. At this time, it is assumed that the cell 30 is at the position A in FIG.

  As the tray 10 is displaced from the state shown in FIG. 11A to the position C past the position B in FIG. 10A, the work 70 in the cell 30 moves toward the base end side of the tray 10. Move in. Specifically, it moves to the opposing wall surface of the cell 30 in the direction of the thick arrow in FIG. 11A while being in sliding contact with a cathode line 33 (not shown) disposed in the lower part of the cell 30. Then, as shown in FIG. 11 (b), the work 70 that collides with the opposing wall surface in the cell 30 moves in the direction indicated by the thick arrow while rotating along the wall surface. To the stable position [position of FIG. 11 (c)].

  When the tray 10 is further rotated and displaced to the F position through the D position and E position in FIG. 10B, the work 70 is turned upside down and moved in the direction indicated by the thick arrow in FIG. 11C. Go. Specifically, it moves to the opposing portion wall surface of the cell 30 while making sliding contact with the electrode disposed in the lower part. As the tray 10 rotates, the work 70 colliding with the opposite wall surface of the cell 30 moves in the direction indicated by the thick arrow in FIG. 11D while rotating along the wall surface. It reaches the original stable position [state of FIG. 11 (a)].

  By repeating the above operation, the work 70 moves while rotating discontinuously in the cell 30 in one direction. Not only when the tray 10 is rotated, but also when the workpiece 70 is swung at an angle of less than 360 °, the rotation in one direction is similarly obtained as long as the workpiece 70 moves within the cell 30 by its own weight. This rotation in one direction is a rotation having a vector perpendicular to the rotation vector axis of the tray 10. By this rotation, plating with a uniform film thickness is applied to the inner and outer periphery of the ring-shaped workpiece 70 having the inner peripheral surface 70b.

That is, as a result of the rotation of the work 70, the part where the outer peripheral surface 70a of the work 70 abuts against the wall surface of the cell 30 sequentially changes, so that the film thickness of the outer peripheral surface 70a becomes uniform due to the uniform shielding effect.
In addition, since the outer peripheral surface 70a of the work 70 is appropriately shielded by the walls of the cells 30, film formation is suppressed, and only the plating film on the outer peripheral surface 70a is not thickened. The difference in film thickness with the inner peripheral surface 70b can be reduced. Furthermore, by providing the shielding wall 39, the end face of the ring-shaped workpiece 70, the outer peripheral corner portion, and the inner peripheral corner portion can be made to have the same film thickness as the outer peripheral portion and the inner peripheral portion. A plated product having a coating is obtained.

  Further, the contact portion with the cathode line 33 on the end face of the work 70 changes in a short time as the work 70 rotates, and therefore does not adhere to the cathode line 33. Usually, when the film of the workpiece 70 is fixed to the electrode, it is known that the film is lost (plating peeled off), which causes an appearance defect as a decorative plating and a rust generation factor of the metal-based object. In the present invention, such a situation can be prevented and no jig traces remain.

  In FIG. 11, the rectangular cells 30 in plan view are arranged so as to be inclined with respect to the Y axis, for example, with an angle θ. However, by changing the angle θ with respect to the Y axis even in the same square (this This means that the amount of rotation can be adjusted).

  As shown in FIG. 11, the workpiece 70 in the cell 30 moves by gravity as the tray 10 rotates. By utilizing this movement and devising the movement path of the workpiece 70 so as not to overlap the Y axis [see FIG. 11], the workpiece 70 can be rotated in a certain direction within the cell 30. This can be easily understood in view of the fact that the tray 10 stands up in the middle of rotation. In the state where the tray 10 stands up (C position and F position in FIG. 10), the Y axis overlaps the vertical direction. Therefore, for example, when the line connecting the stable positions in the cell 30 overlaps with the Y axis (for example, in the case of a perfect circle or rhombus in plan view), the work 70 in the cell 30 moves to the Y axis in a state close to free fall. Move along the shortest distance along. In the case of such movement, the work 70 cannot be rotated in one direction within the cell 30. Even if rotation occurs, the direction cannot be controlled, and thus the amount of rotation cannot be controlled.

  However, a straight line connecting one stable position [position of FIG. 11A] in the cell 30 of the work 70 and another stable position [position of FIG. 11C] overlaps with the Y axis (vertical direction). If this is not done, the workpiece 70 can be brought into contact with the wall surface of the cell 30 during the movement and can be rotated. Since this rotation is in a fixed direction, the amount of rotation can be easily controlled. Moreover, since the rotation of the work 70 is given by the rotation of the tray 10 and the shape of the cell 30, a complicated mechanism is not required.

  The shape (plan view) of the cell 30 is not limited to a quadrangle. FIG. 12 shows an example of the shape (plan view) of the cell 30. In the figure, (a) is a parallelogram, (b) is a trapezoid, (c) is a pentagon, (d) is a triangle, (e) is an ellipse, (f) is a track shape, and an arrow is a workpiece 70. Indicates the direction of movement. The length of the arrow indicates the length of the moving distance, and the broken line indicates the movement without rotation. As can be seen from FIG. 12, the rotation amount of the work 70 can be changed depending on the shape of the cell 30. Further, if the shape of the cell 30 is the same, the rotation of the work 70 is always in one direction.

  In order to efficiently rotate the workpiece 70 in the cell 30, it is preferable to make the shape of the cell 30 non-axisymmetric with respect to the Y axis, as illustrated in FIGS. In this way, a cell having a shape in which a line connecting the position of FIG. 11A, which is one stable position, and the position of FIG. 11C, which is another stable position, does not overlap the vertical direction. 30 can be easily created. That is, during the turning operation of the tray 10, the workpiece 70 is in contact with at least one contact portion of the wall surface of the cell 30 while moving from one stable position to the other stable position due to gravity. Therefore, it becomes possible to give rotation to the object to be plated. In this way, by controlling the shape of the cell 30 in which the work 70 is placed, it is possible to give a desired rotation to the work 70 and form a uniform film.

  Plating using the plating jig 100 of the present invention can be performed according to normal plating steps and conditions. The outline of the case of performing electroplating with the plating jig 100 of the present invention will be exemplified. First, the work 70 is set in the cell 30 and washed as necessary, and then matte electroplating under a predetermined current is performed. Perform semi-gloss electroplating or luster electroplating. The plated product is washed and then dried to obtain a final plated product.

  As the work 70 as the object to be plated, for example, a disk-shaped, cylindrical, ring-shaped, or sphere-shaped one that is easy to rotate in the circumferential direction in the cell 30 is preferable. In particular, electroplating has an inner peripheral surface 70b such as a cylindrical shape or a ring shape, and is effective for a workpiece 70 having a shape in which the film thickness tends to be non-uniform on the inner and outer periphery in plating using a conventional jig.

  The material of the object to be plated may be either metal or non-metal, but it is also effective for materials that are difficult to perform precise plating with ordinary jigs, such as metal-nonmetal composites and metals with holes. . Examples of such a material include a sintered alloy, a composite of resin and powder metal, a cast alloy, and the like, and more specifically, for example, a sintered magnet, a bond magnet, and a cast magnet.

Examples of the magnet raw material include the following [1] to [6], but are not particularly limited thereto.
[1] One having R (where R is at least one of rare earth elements including Y) and a transition metal mainly comprising Co as basic components.
[2] R (where R is at least one of rare earth elements including Y), transition metal (TM) mainly containing Fe, and B as basic components.
[3] R (wherein R is at least one of rare earth elements including Y), transition metal (TM) mainly composed of Fe, and interstitial elements mainly composed of N .
[4] R (where R is at least one of rare earth elements including Y) and a transition metal (TM) such as Fe, and the soft magnetic phase and the hard magnetic phase are adjacent to each other ( Those having a composite structure (including those called nanocomposite structures in particular) that exist (including cases where they are adjacent via a grain boundary phase).
[5] A mixture of at least two of the compositions of [1] to [4].
[6] A mixture of at least one of the compositions [1] to [4] and a ferrite powder (for example, Sr-ferrite such as SrO.6Fe2O3).

Examples of the binding resin (binder) used for the bonded magnet include thermoplastic resins and thermosetting resins. Examples of the thermoplastic resin include polyamide generally called nylon, thermoplastic polyimide, polyethylene terephthalate, and the like, and one or more of these can be used in combination.
On the other hand, as a thermosetting resin, an epoxy resin, a phenol resin, a polyimide resin etc. are mentioned, for example, 1 type or 2 types or more of these can be mixed and used.

  The plating jig 100 of the present invention can form a very uniform plating film with a simple structure and does not cause a defect of the plating film due to jig marks or the like. It is most suitable for plating work 70 used in applications that require high dimensional accuracy, high rust prevention, dust prevention, etc.

EXAMPLES Next, although an Example and a test example demonstrate this invention further in detail, this invention is not restrict | limited to these.
Plating was performed using the plating jig 100 of the present invention and the comparative plating jig, and the thickness and appearance of the obtained plated products were compared. The conditions for plating are as follows.

<Plate 1>
A ring-shaped Nd—Fe—B bond magnet having an outer diameter of 9.4 mm, an inner diameter of 7 mm, and a height of 1.2 mm was used as the object to be plated.

<Plating condition 1>
(1) Invention plating jig:
The object to be plated was set on the plating jig shown in FIG. 1, and after washing, plating was performed at 2 A / dm 2 for 60 minutes. The obtained plated product was dried after washing with ultrasonic water washing, hot water washing or the like.
The number of treatments per batch was 28, and the rotation speed of the tray 10 during plating was 3 to 4 rpm.

(2) Comparative plating jig:
Plating was performed under the same conditions as described above using a jig having the same configuration as the plating jig 100 of the present invention except that the dug portion 37 was not provided.

<Measurement and result 1>
About the obtained plated product, the film thickness of the outer peripheral surface, the inner peripheral surface, the end surface A, the end surface B, the outer peripheral corner, and the inner peripheral corner was measured. The result is shown in FIG. As can be seen from FIG. 15, the plating product plated using the plating jig 100 of the present invention has the smallest difference in film thickness at the outer periphery, inner periphery, end surface A, end surface B, outer peripheral corner, and inner peripheral corner. It was uniform. Further, as the work 70 rolls in the cell 30 as the tray 10 rotates, no jig traces remain. On the other hand, in the case of the comparative plating jig, the film thicknesses on the outer periphery and the inner periphery are comparable and relatively good. Some differences occurred.

Furthermore, although an Example and a test example demonstrate this invention further in detail, this invention is not restrict | limited to these.
Plating was performed using the plating jig 100 of the present invention and the comparative plating jig, and the thickness and appearance of the obtained plated products were compared. The conditions for plating are as follows.

<Plate 2>
A ring-shaped rare earth bonded magnet having an outer diameter of 19 mm, an inner diameter of 17 mm, and a height of 3.6 mm was used as the object to be plated. In this magnet, a magnetic powder (MQP-B powder manufactured by MQI) composed of an R-TM-B alloy, an epoxy resin, and a small amount of a hydrazine antioxidant are mixed. Was kneaded at room temperature for 30 minutes to prepare a bonded magnet composition (compound). At this time, the blending ratio (weight ratio) of the magnet powder, the epoxy resin, and the hydrazine antioxidant was 95 wt%, 4 wt%, and 1 wt%, respectively.

  Next, the compound is weighed and filled into a mold of a press machine, and compression-molded at room temperature and at a pressure of 1370 MPa in a non-magnetic field. Then, the epoxy resin is cured by heating at 170 ° C. A bonded magnet was obtained. The bonded magnet was subjected to polishing treatment in the height direction. Thereafter, the bonded magnet was polished by barrel polishing until each ridge became R0.2, and this was used as a magnet body.

<Plating condition 2>
(1) Invention plating jig:
Set the object to be plated on the plating jig shown in FIG. 1, and after washing, perform matte electroplating using a 50 ° C matte watt bath at 2A / dm2 for 30 minutes, and then use a glossy watt bath at 50 ° C to gloss. Electroplating was performed at 2 A / dm2 for 20 minutes. The obtained plated product was dried after washing with ultrasonic water washing, hot water washing or the like.
The number of treatments per batch was 28, and the rotation speed of the tray 10 during plating was 3 to 4 rpm.

(2) Comparative plating jig 1:
Except that the shielding wall 39 and the digging portion 37 are not provided and that the cathode wire 33 crossing the cell 30 is two on one side, a jig having the same configuration as the plating jig 100 of the present invention is used, and the same conditions as described above. Was plated.

(3) Comparative plating jig 2 (barrel jig):
A barrel jig (having a known configuration) was used. Set the object to be plated on a barrel jig, and after washing, perform matte electroplating at 50 ° C in a matte Watt bath at 1A / dm2 for 100 minutes, then glossy electroplating in a 50 ° C glossy Watt bath at 1A / Dm 2 for 60 minutes. The obtained plated product was dried after washing with ultrasonic water washing, hot water washing or the like.

  The number of treatments per batch (barrel) was 30, and at the same time, 200 ml of nickel balls having a diameter of 5 mm were put into the barrel. The rotation speed of the barrel during plating was 3 to 4 rpm.

<Measurement and result 2>
(1) About the obtained plating product, 4 samples were extracted indiscriminately and the film thickness of the outer peripheral surface, the inner peripheral surface, the end surface A, the end surface B, the outer peripheral corner, and the inner peripheral corner was measured. The results are shown in Table 1 and FIG.

表１および図１６から見て取れるように、本発明めっき治具１００を用いてめっきを施しためっき製品は、外周、内周、端面Ａ、端面Ｂ、外周角部、内周角部における膜厚差が最も少なく、均一であった。また、トレイ１０の回動に伴いワーク７０がセル３０内を転動することにより、治具痕も残らなかった。さらに、めっき析出効率についても６９．７％と良好な値を示した。

As can be seen from Table 1 and FIG. 16, the plated products plated using the plating jig 100 of the present invention are different in film thickness at the outer periphery, inner periphery, end surface A, end surface B, outer peripheral corner, and inner peripheral corner. Was the smallest and uniform. Further, as the work 70 rolls in the cell 30 as the tray 10 rotates, no jig traces remain. Further, the plating deposition efficiency was a good value of 69.7%.

  On the other hand, in the plating using the comparative plating jig 2 (barrel jig), the film thickness varies greatly, and the inner peripheral surface and the outer peripheral surface, the outer peripheral corner portion and the inner peripheral corner portion have uniform film thicknesses, and the like. I couldn't. Further, the plating deposition efficiency was 21.0%, and about 80% was deposited on the barrel media for energization.

  In the case of the comparative plating jig 1, the film thicknesses on the outer periphery and the inner periphery are comparable and relatively good. However, the film thicknesses of these, the end surface, the outer peripheral corner, and the inner peripheral corner are slightly different. A difference has occurred. The deposition efficiency was 53.5%. This is probably because the number of electrodes (cathode lines 33) is larger than that of the jig of the present invention.

A test similar to the above was also performed on the auxiliary anode jig (Patent Document 4; the same configuration as in JP-A-2001-73198). In this jig, an auxiliary anode made of nickel is provided at the center of an annular support that also serves as a cathode, and the work is supported at three points by three ribs provided on the inner peripheral surface of the annular support at the outer periphery. The The arrangement of the anode in the plating bath was in accordance with FIG. For plating conditions, set the object to be plated on the plating jig, wash, perform matte electroplating using a matte watt bath at 50 ° C for 60 minutes at 1 A / dm2, and then gloss in a matte watt bath at 50 ° C. Electroplating was performed at 2 A / dm2 for 20 minutes. The obtained plated product was dried after washing with ultrasonic water washing, hot water washing or the like. The number of treatments per batch was 16, and the plate was kept stationary during the plating time. In addition, since the jig trace by contact | abutting with a rib remains on the outer periphery, it measured by avoiding the part in the measurement of plating film thickness. As a result, although the variation in film thickness was not so large, adhesion of foreign matters to the plated product was observed. This foreign material is considered to be the nickel used for the auxiliary anode desorbed. In addition, as described above, jig marks remained on the outer peripheral surface.
In addition, although a test was also conducted in the case of using an insoluble anode material (SUS, titanium-platinum, carbon, etc.) as an auxiliary anode separately, the anode effect was hardly obtained, and improving the film thickness difference between the inner and outer circumferences I could not do it.

The present invention has been described above with reference to various embodiments. However, the present invention is not limited to the above embodiments, and can be applied to other embodiments within the scope of the invention described in the claims. It is.
For example, in the above embodiment (FIG. 1), the electroplating jig 100 has been described. However, the structure in which the workpieces 70 are individually arranged in a room (cell 30) formed on the rotatable tray 10 is as follows. It can also be used for electroless plating. In this case, a synthetic resin line or the like can be provided as a transverse line instead of the cathode line 33.

  Further, the tray 10 is not limited to the configuration illustrated in FIG. 1, and may have a configuration such as a tray 111 illustrated in FIG. 13, for example. The tray 111 is not provided with a shielding wall, and is provided with a tapered digging portion 120 that expands from the opening edge toward the surface of the tray 111 as a plating solution guiding portion. The tray 111 is used as a jig for electroplating, and is formed in a short plate shape in the rotation vector axis direction and has a long plate shape in the rotation radius direction. Further, the area of the wall portion 80 as a contact surface with the plating solution is sufficiently secured. With such a shape, the function of stirring the plating solution is sufficiently ensured. Further, the inflow of the plating solution from the wall portion 80 having a large area to the digging portion 120 is further promoted.

  FIG. 14 is a perspective view showing an outline of a tray 112 according to another embodiment. This tray 112 can be used for electroless plating, has no shielding wall, and is not provided with electrodes. The workpiece 70 (not shown) can be disposed in the cell 30 with appropriate fall prevention means (line, net, rib, protruding piece, etc.). Further, the rotation mechanism can be configured according to the plating jig 100 of FIG. Here, the stirring function is enhanced by arranging two plate-like members or four plate-like members so as to have a cross shape in a side view. Also in the tray 112, the wall 80 has a sufficient area. Further, as the plating solution guiding portion, a digging portion 121 including a step portion provided with a step which makes the opening edge portion lower than the surface of the tray 112 is provided. Thereby, the inflow of the plating solution from the wall 80 having a large area to the trench 121 is further promoted.

  Furthermore, by arranging the plate-like members so as to have a cross shape in a side view, the number of cells 30 can be increased, and a large number of workpieces 70 can be processed at a time.

  In addition, although demonstrated in the example which does not arrange | position an electrode in FIG. 14, it can be used also for electroplating by arrange | positioning the cathode line (code | symbol 33) which serves also as fall prevention to the tray 112. FIG.

  Further, in FIG. 14, the plate-like member is arranged in a cross shape when viewed from the side in order to enhance the stirring function. However, for example, even when the plate-like member has three blades (Y-shape when viewed from the side) Rise. Further, a configuration in which the number of plate-like members is five or more is also possible as long as it can be attached by design, and even in such a configuration, a sufficient stirring effect can be expected.

The perspective view of a plating jig. The front view of the state which raised the tray. The perspective view of a tray. The exploded perspective view of a tray. The top view of a board | substrate. The enlarged view of a cell part. Sectional drawing of a cell part. Sectional drawing of the cell part in another aspect. The figure which uses for description of the use condition of an electroplating apparatus. The figure explaining the rotation operation | movement of a tray, and the movement of a workpiece | work. The figure used for description of the movement of the workpiece | work in a cell. The figure explaining the example of the shape of a cell. It is a perspective view which shows another aspect of a tray. It is a perspective view which shows another aspect of a tray. The graph which shows the film thickness for every site | part (Example 1). The graph which shows the film thickness for every site | part (Example 2).

Explanation of symbols

10 tray, 12 opening, 30 cell, 13 frame, 15 gripping part, 16 groove, 17 hooking part, 19 opening part, 21 first gear, 23 second gear, 25 third gear, 31a, 31b fixing tool, 32a, 32b Fixing tool, 33 Cathode wire, 34 Shaft, 35 Projection piece, 36 Screw hole, 37, 37 'Excavation part, 38 Screw hole, 39 Shielding wall, 41 Anode, 50 Plating tank, 51 Plating solution, 60a, 60b Bar, 70 Workpiece, 80 walls, electroplating device 110

Claims (12)

An opening formed through the rotatable support,
A transverse line extending across the opening at both ends of the opening,
A plating solution guiding portion configured by a step portion formed around the opening portion lower than the surface of the support , and
A plating jig characterized in that a space defined by an inner wall surface of the opening and the transverse line is a room in which objects to be plated are individually arranged. An opening formed through the rotatable support,
A transverse line extending across the opening at both ends of the opening,
From the opening, comprising a plating solution guiding portion constituted by a slope that spreads in a mortar shape toward the surface of the support ,
A plating jig characterized in that a space defined by an inner wall surface of the opening and the transverse line is a room in which objects to be plated are individually arranged. The plating jig according to claim 1 or 2 , wherein the transverse line also serves as an electrode for supplying a current to an object to be plated. In the plating jig according to any one of claims 1 to 3, wherein the room, at least two supporting the object to be plated moving in the room with the rotation of the support constant time stably Has two stable positions,
Among the at least two stable positions, the object to be plated comes into contact with at least one contact portion of the inner wall surface of the room while the object to be plated moves from one stable position to the other stable position. A plating jig characterized by having a structure. 5. The plating jig according to claim 4 , wherein the shape of the room is such that a line connecting the one stable position and the other stable position is in any rotational position of the support. A plating jig having a shape that does not overlap with a vertical direction. The plating jig according to any one of claims 1 to 5 , wherein a plurality of the chambers are arranged on the support body. The plating jig according to claim 6 , wherein the plating solution guiding portion is provided for each opening. The plating jig according to any one of claims 1 to 7 , wherein the support has a structure in which two plates having through holes are overlapped. The plating jig according to any one of claims 1 to 8 , wherein the support is configured in a plate shape that is long in a rotational radius direction. In the plating jig according to any one of claims 1 to 9, wherein the support is characterized in that a plurality of configured radially about the rotary shaft, plating jig. A plating method, wherein plating is performed on an object to be plated having an inner peripheral surface using the plating jig according to any one of claims 1 to 10 . An electroplating apparatus using the plating jig according to any one of claims 1 to 10 .

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