CN100529178C - Chemical plating apparatus - Google Patents
Chemical plating apparatus Download PDFInfo
- Publication number
- CN100529178C CN100529178C CNB2005100337374A CN200510033737A CN100529178C CN 100529178 C CN100529178 C CN 100529178C CN B2005100337374 A CNB2005100337374 A CN B2005100337374A CN 200510033737 A CN200510033737 A CN 200510033737A CN 100529178 C CN100529178 C CN 100529178C
- Authority
- CN
- China
- Prior art keywords
- chemical plating
- plating appts
- appts
- plating
- chemical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Chemically Coating (AREA)
Abstract
This invention relates to a chemical plating device, which comprises one main body that can contain the plating solution, one loading unit that can load the plating parts, and at least one agitator that is placed in the inner bottom of the main body. The agitator is connected with the external driving unit. The chemical plating device in this invention has such advantages as simple structure, low energy consumption, high yield and uniform plating.
Description
[technical field]
The present invention relates to a kind of chemical plating appts.
[background technology]
Chemical plating nickel technology is to adopt metal-salt and reductive agent, obtains the method for coating in material surface generation self-catalyzed reaction.Chemical Ni-plating layer has higher erosion resistance, high-wearing feature, by force, is not subjected to advantages such as product shape restriction with basal body binding force.Chemical plating nickel technology is widely used in industry such as oil, chemical industry, electronics, space flight, automobile.
Chemical nickel plating has following superior process characteristic:
(1) do not have the hydrogen embrittlement problem, promptly the hydrogen of Sheng Chenging can not be penetrated in the matrix metal, can not be penetrated in the coating yet.
(2) can be deposited on various material surfaces.
(3) deposit thickness is controlled, and its technology is simple, and is easy to operate, and temperature is low, and cost is low.
(4) thickness of coating is more even than electrolytic coating.It is in uneven thickness that chemical nickel plating can avoid that electrolytic coating brings owing to distribution of current is inhomogeneous, thickness of plating layer differs greatly on the especially complex-shaped part of whole part, the corner of part and from the near position of anode, coating is thicker, and in internal surface or very thin from anode local coating far away, even plating less than, adopt electroless plating can avoid electroplating this deficiency.
But the factor that influences the chemical nickel plating thickness evenness still exists.Owing to the hydrogen stream of being desired to separate out on the plating piece surface and the influence of bath concentration difference, the coating uniformity coefficient of shell is still variant.For homogeneity and the ideal plating speed that guarantees shell coating, the chemical nickel plating groove must be equipped with the solution stirring device, makes plating bath have certain flow rate, in time to drive out the bubble of desiring the plating piece surface, eliminate bath concentration difference, and avoid the plating bath local superheating and cause nickel to separate out in the coating bath surface.
As shown in Figure 1, general chemical plating appts 10 adopts the pneumatic blending system.This chemical plating appts 10 comprises: a main body 11 is used to hold plating bath; One is located at the arm hanging platform 12 of these main body 11 tops, is used for hanging desire plating piece 13; One is located at the void channels 14 of these main body 11 inner bottom, its external inflation mechanism (figure does not show).This inflation mechanism is inflated to void channels, and these void channels 14 produce numerous air-bubble and move upward, and bubble can be taken away the hydrogen microbubble of desiring 13 generations of plating piece surface and outwards discharging, can finish electroless plating at a high speed equably like this.But, be smooth profile if desire plating piece, still can plate out than homogeneous surface; If desire plating piece, then be difficult for forming the uniform coating of thickness, and be easy to desire the surperficial pin hole phenomenon that forms of plating piece for having tiny concavo-convex profile; And use pneumatic blending to bring greasy dirt easily into, increase the plating bath thermal losses.
As shown in Figure 2, on August 14th, 2002, No. 98108482.6 Chinese patent of bulletin disclosed a kind of chemical plating appts 20 that adopts vibrating device, and it comprises: a main body 21 is used to hold plating bath; One vibration rack 22, it is connected in main body 21 upper ends by some support springs 27; This vibration rack 22 comprises that two stretch into vibration width of cloth frame 22a, the 22b of tank liquor; One vibrating head 28 is connected in this two vibrations width of cloth frame 22a, 22b, and this vibrating head 28 is provided with some vibration blades 29; One vibrating motor 25 connects this vibration rack 22 and a Weight balancer 26.This chemical plating appts 20 makes vibration blade 29 stir tank liquor and reaches the purpose of removing bubble hydrogen by vibrating motor 25 control vibration rack 22 and vibrating heads 28.But the vibrational structure of this chemical plating appts 20 is too complicated, and its vibration has hysteresis quality, and vibration causes excessive power consumption after transmitting several times.
In view of this, provide a kind of and have chemical plating appts simple in structure, that energy consumption is low and plated film has good uniformity in fact for necessary.
[summary of the invention]
Below, will a kind of chemical plating appts simple in structure, that energy consumption is low and plated film has good uniformity that has be described with some embodiment.
For realizing foregoing, a kind of chemical plating appts is provided, it comprises:
One main body is used to hold plating bath;
One bogey is used for carrying and desires plating piece;
At least one agitator is located at the body interior bottom.
Wherein, the external drive unit of this agitator.
Preferably, this bogey can rotate with respect to main body.
Further, this bogey comprises a fixed part and a supporting part of being located at this main body top, and it is fixed in this fixed part, is used for carrying and desires plating piece.
Compared with prior art, the chemical plating appts of the technical program adopts the agitator of external drive unit, it can control rotating speed and sense of rotation effectively fast, make plating bath have certain flow rate, in time drive out the bubble of desiring the plating piece surface, avoid the plating bath local superheating and cause nickel to separate out, plated film is had good uniformity in body surfaces; And rotating bogey may command speed of rotation and sense of rotation cooperate agitator can find out best chemical nickel plating experiment parameter; In addition, the supporting part of this bogey can adopt the structure of the some desire plating pieces of carrying, also can improve product production.In sum, the coating bath of the technical program has advantage simple in structure, that energy consumption is low, output is high and plated film has good uniformity.
[description of drawings]
Fig. 1 is the chemical plating appts structural representation of prior art.
Fig. 2 is the chemical plating appts structural representation of No. 98108482.6 Chinese patent.
Fig. 3 is the chemical plating appts structural representation of the technical program embodiment.
[embodiment]
The present invention is described in further detail below in conjunction with drawings and Examples.
See also Fig. 3, the chemical plating appts 30 of the embodiment of the invention, it comprises: a main body 31 is used to hold plating bath; One bogey (not indicating); At least one agitator 34 is located at main body 31 inner bottom, and external drive unit (figure does not show); One Temperature controlled heater 35, the one fire end stretches in the plating bath, is used to control the temperature of plating bath.
The main body 31 of present embodiment can be selected Stainless Steel Shell for use, and in the tetrafluoroethylene of this inner walls spraying suitable thickness.Because tetrafluoroethylene has good temperature tolerance, insulativity, acid-and base-resisting, brine corrosion, not sticking simultaneously plating bath cleans easily and repairs, so be highly suitable for electroless plating.
The bogey of the technical program can rotate with respect to main body 31, and it comprises that the fixed part 32 and of being located at these main body 31 tops immerses the supporting part 33 of plating bath, is used for carrying and desires plating piece.Drive and control the turning direction and the speed of supporting part 33 by the rotation of fixed part 32.This fixed part 32 can be one-body molded with this supporting part 33, also can adopt the mode that is connected to be separated into the assembling of two parts.
Fixed part 32 in the present embodiment and supporting part 33 adopt the screw rod ways of connecting to mutually combine.The supporting part 33 of present embodiment is the ring-type cylinder, be provided with multiple tracks groove 331 at its outer fringe surface, and by this cylinder is divided into a plurality of five equilibriums, be not provided with groove 331 places and promptly form flange 332, on each flange 332, all be provided with a plurality of receiving holes 333 inwardly, the upper and lower side of the inner edge of each receiving hole is a scarp (figure does not show), desire plating piece (figure does not show) in order to accept, receiving hole 333 on each flange 332 is staggered with receiving hole 333 on its two adjacent flange 332 and arranges, to avoid adjacent desire plating piece (figure does not show) too tight, influence quality of coating.The ring-type cylinder center of this supporting part 33 is provided with a threaded openings, is connected with fixed part 32 by screw rod 36.Be understandable that this fixed part 32 of present embodiment and the moveable connection method that also can adopt other handled easily that is connected of this supporting part 33.
The agitator 34 of present embodiment is leaf, and it comprises a turning axle 341 and is fixed in this turning axle 341 lateral some blades 342.This blade 342 can adopt materials such as metal, synthetic resins.As adopt metallic substance, can select titanium, aluminium, copper, steel, stainless steel or its alloy for use; As adopt synthetic resins, can select polycarbonate, vinyl chloride-based resin, polypropylene etc. for use.In addition, be understandable that, the leaf agitator 34 of present embodiment, its structure is not limited to the structure that some blades 342 are fixed in turning axle 341, also can adopt integrally formed blade assembly, its base have one with the stationary installation of turning axle collocation, can play the effect that stirs plating bath equally at the drive lower blade assembly of this turning axle.
The plating bath of present embodiment can adopt single nickel salt, sodium hypophosphite and ammonium citrate to allocate with suitable proportion.When using this coating bath 30 to carry out chemical nickel plating, the plating bath that needs to configure injects the electroless plating tank main body, makes plating bath keep suitably height; By Temperature controlled heater 35 heating plating baths, plating bath is remained on about 40 degree; Start agitator 34 and keep working order always.After plating bath stirs, will install the supporting part 33 of desiring plating piece (figure does not show) and immerse plating bath, and control the rotating speed and the direction of supporting parts 33 by fixed part 32.In order to obtain better coating, its sense of rotation can be opposite with agitator 34 sense of rotation.
It is understandable that the supporting part of the technical program can adopt the nipper that has occurred on the market, as long as can satisfy fixing the desire function of plating piece and the anchor clamps of do not react with plating bath, as have single or some gripping units.The agitator of the technical program is except adopting leaf agitator, also can adopt other mechanical type whipping appts simple in structure, as long as it can be satisfied with under the effect of outside active device, this mechanical stirrer can be controlled the work that rotating speed and sense of rotation are carried out less energy-consumption effectively fast.In addition, in order to reach the effect of better stirring plating bath, can a plurality of agitators be set in the coating bath inner bottom equally.
Certainly, the chemical plating appts of the technical program is not only applicable to chemical nickel plating, and it can be widely used in various electroless platings equally, as electroless copper, chemical gilding etc.
The chemical plating appts of the technical program adopts the agitator of external drive unit, it can control rotating speed and sense of rotation effectively fast, make plating bath have certain flow rate, in time drive out the bubble of desiring the plating piece surface, avoid the plating bath local superheating and cause nickel to separate out, plated film is had good uniformity in body surfaces; And rotatable bogey may command speed of rotation and sense of rotation, cooperate agitator can find out best chemical nickel plating experiment parameter; In addition, the supporting part of this bogey can adopt the structure of the some desire plating pieces of carrying, also can improve product production.So, advantage simple in structure, that energy consumption is low, output is high and plated film has good uniformity that the coating bath of the technical program has.
In addition, those skilled in the art also can do other variations in spirit of the present invention, certainly, the variation that these are done according to spirit of the present invention, all should be included in the present invention's scope required for protection in.
Claims (13)
1. chemical plating appts, it comprises:
One main body is used to hold plating bath;
One bogey;
It is characterized in that, this bogey can rotate with respect to main body, it comprises that the fixed part and of being located at this main body top is fixed in the supporting part of this fixed part, this supporting part is a ring-type cylinder, be provided with the multiple tracks groove at its outer fringe surface, the adjacent grooves place forms flange, is provided with a plurality of receiving holes on each flange inwardly, in order to accepting the desire plating piece, this chemical plating appts comprises further that also at least one agitator is located at this body interior bottom.
2. chemical plating appts as claimed in claim 1 is characterized in that main body is a Stainless Steel Shell.
3. chemical plating appts as claimed in claim 2 is characterized in that Stainless Steel Shell inner-wall spraying polytetrafluoroethylene floor.
4. chemical plating appts as claimed in claim 1 is characterized in that this multiple tracks groove is divided into a plurality of five equilibriums with cylinder.
5. chemical plating appts as claimed in claim 4 is characterized in that ring-type cylinder center is provided with a threaded openings, is used for being connected with a screw rod.
6. chemical plating appts as claimed in claim 1 is characterized in that fixed part connects this supporting part by screw rod.
7. chemical plating appts as claimed in claim 1 is characterized in that agitator comprises leaf agitator.
8. chemical plating appts as claimed in claim 7 is characterized in that leaf agitator comprises a turning axle and the some blades that are fixed in this turning axle side.
9. chemical plating appts as claimed in claim 7 is characterized in that leaf agitator comprises a turning axle and a blade assembly, its base have one with the stationary installation of this turning axle collocation.
10. chemical plating appts as claimed in claim 8 or 9 is characterized in that blade is that metal or synthetic resins material are made.
11. chemical plating appts as claimed in claim 10 is characterized in that metal comprises titanium, aluminium, copper, steel or its alloy.
12. chemical plating appts as claimed in claim 10 is characterized in that synthetic resins is polycarbonate, vinyl chloride-based resin or polypropylene.
13. chemical plating appts as claimed in claim 1 is characterized in that chemical plating appts further comprises a Temperature controlled heater, the one fire end stretches in the plating bath, is used to control the temperature of plating bath.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100337374A CN100529178C (en) | 2005-03-18 | 2005-03-18 | Chemical plating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100337374A CN100529178C (en) | 2005-03-18 | 2005-03-18 | Chemical plating apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1834290A CN1834290A (en) | 2006-09-20 |
| CN100529178C true CN100529178C (en) | 2009-08-19 |
Family
ID=37002184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100337374A Expired - Fee Related CN100529178C (en) | 2005-03-18 | 2005-03-18 | Chemical plating apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100529178C (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101906611B (en) * | 2009-06-05 | 2013-03-20 | 鸿富锦精密工业（深圳）有限公司 | Coating machine |
| CN102218387A (en) * | 2010-04-19 | 2011-10-19 | 鸿富锦精密工业（深圳）有限公司 | Film plating machine |
| CN105002478A (en) * | 2015-07-07 | 2015-10-28 | 苏州华日金菱机械有限公司 | Non-electrolysis electroplating equipment |
| CN105369224B (en) * | 2015-11-30 | 2018-05-01 | 北大方正集团有限公司 | The production method of chemical plating appts and wiring board |
| CN110983304A (en) * | 2019-12-31 | 2020-04-10 | 广州兴森快捷电路科技有限公司 | Chemical plating equipment and surface treatment system |
| CN114214610A (en) * | 2021-12-17 | 2022-03-22 | 南京驰韵科技发展有限公司 | Surface treatment equipment for chemical gold plating |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2601259Y (en) * | 2003-01-30 | 2004-01-28 | 中国第一汽车集团公司 | Water bath heating chemical plating plant |
-
2005
- 2005-03-18 CN CNB2005100337374A patent/CN100529178C/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2601259Y (en) * | 2003-01-30 | 2004-01-28 | 中国第一汽车集团公司 | Water bath heating chemical plating plant |
Non-Patent Citations (4)
| Title |
|---|
| 化学镀镍. 翟金坤，69-74、81-84，北京航空学院出版社. 1987 |
| 化学镀镍. 翟金坤，69-74、81-84，北京航空学院出版社. 1987 * |
| 搅拌反应合成Al-Fe金属间化合物强化铝基复合材料. 刘江.重庆大学机械工程学院博士论文. 2004 |
| 搅拌反应合成Al-Fe金属间化合物强化铝基复合材料. 刘江.重庆大学机械工程学院博士论文. 2004 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1834290A (en) | 2006-09-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100529178C (en) | Chemical plating apparatus | |
| EP1516076B1 (en) | Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents | |
| US6261435B1 (en) | Plating method | |
| EP2167224B1 (en) | Apparatus and method for the wet chemical treatment of products | |
| JP2019533079A (en) | Process for providing a laminate coating on a workpiece and article made therefrom | |
| Hovestad et al. | Electroplating of metal matrix composites by codeposition of suspended particles | |
| TWI794463B (en) | Surface treatment device, surface treatment method and agitator | |
| US4085010A (en) | Process for powder-dispersed composite plating | |
| CN101435103B (en) | Plating jig | |
| CN101922002A (en) | Chemical composite plating bath | |
| JPS58207398A (en) | Composite plating method | |
| US4822468A (en) | Barrel plating apparatus | |
| CN210886305U (en) | Hanging tool swinging device | |
| US20230374691A1 (en) | Plating apparatus and plating method | |
| KR101595717B1 (en) | Ultrasonic electroplating system | |
| TWI332036B (en) | Plating device | |
| CN109487305B (en) | Electroforming metal mask equipment and electroforming liquid stirring device | |
| JP6408527B2 (en) | Plating apparatus, plating method and plating jig | |
| CN216074085U (en) | Electroplating equipment structure for fan-out type panel level packaging electroplating | |
| JPH06220697A (en) | Plating method | |
| Liu et al. | Effects of applied potential, initial gap, and megasonic vibrations on the localized electrochemical deposition of Ni-Co microcolumns | |
| JP3791605B2 (en) | Plating jig | |
| JP4273333B2 (en) | Plating jig, plating method, and electroplating apparatus | |
| KR20000071537A (en) | Anodizing method and apparatus for performing the same | |
| JP2769720B2 (en) | Barrel plating equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090819 Termination date: 20150318 |
|
| EXPY | Termination of patent right or utility model |