JP2616324B2 - Control method of eutectoid amount of composite plating film - Google Patents
Control method of eutectoid amount of composite plating filmInfo
- Publication number
- JP2616324B2 JP2616324B2 JP3339755A JP33975591A JP2616324B2 JP 2616324 B2 JP2616324 B2 JP 2616324B2 JP 3339755 A JP3339755 A JP 3339755A JP 33975591 A JP33975591 A JP 33975591A JP 2616324 B2 JP2616324 B2 JP 2616324B2
- Authority
- JP
- Japan
- Prior art keywords
- amount
- eutectoid
- composite plating
- insoluble particles
- dispersed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は、金属めっき液中に不溶
性粒子を分散させた複合めっき液を用いて、被めっき物
表面に金属マトリックス中に不溶性粒子が共析分散した
複合めっき皮膜を形成する場合に、金属マトリックス中
への不溶性粒子の共析量を効果的にコントロールする複
合めっき皮膜の共析量コントロール方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention uses a composite plating solution in which insoluble particles are dispersed in a metal plating solution to form a composite plating film in which insoluble particles are eutectoidally dispersed in a metal matrix on the surface of an object to be plated. The present invention relates to a method for controlling the amount of eutectoid of a composite plating film, which effectively controls the amount of eutectoid of insoluble particles in a metal matrix.
【０００２】[0002]
【従来の技術及び発明が解決しようとする課題】従来よ
り、ニッケルめっき液などの金属めっき液中にジルコニ
ア、アルミナなどの不溶性粒子を分散させた複合めっき
液により、被めっき物上に複合めっき皮膜、即ちニッケ
ル等の金属マトリックス中にジルコニア、アルミナなど
の不溶性粒子を共析分散させためっき皮膜を形成するこ
とが知られている。この複合めっき皮膜は、その金属マ
トリックスや不溶性粒子の種類に応じ、耐摩耗性，耐熱
性，断熱性などの種々の特性を発揮するものである。2. Description of the Related Art Conventionally, a composite plating film is formed on an object to be plated by using a composite plating solution in which insoluble particles such as zirconia and alumina are dispersed in a metal plating solution such as a nickel plating solution. That is, it is known to form a plating film in which insoluble particles such as zirconia and alumina are eutectoidally dispersed in a metal matrix such as nickel. The composite plating film exhibits various characteristics such as abrasion resistance, heat resistance, and heat insulation, depending on the type of the metal matrix and the insoluble particles.
【０００３】この場合、このような特性をより有効に発
揮させるためには、上記不溶性粒子の共析量をコントロ
ールし、不溶性粒子の金属マトリックス中における分散
量を適宜なものにする必要がある。In this case, in order to exhibit such characteristics more effectively, it is necessary to control the eutectoid amount of the above-mentioned insoluble particles and to make the amount of the insoluble particles dispersed in the metal matrix appropriate.
【０００４】このように、用途等に応じて金属マトリッ
クス中の不溶性粒子の共析量を制御することが望まれる
が、特に最近では複合めっき皮膜の内側と外側とで不溶
性粒子の共析量が異なる傾斜機能を持った複合めっき皮
膜も望まれており、かかる傾斜機能を有する複合めっき
皮膜を得る場合は、不溶性粒子の共析量を自由に制御す
ることが必須である。As described above, it is desired to control the amount of eutectoids of insoluble particles in the metal matrix according to the application and the like. In particular, the amount of eutectoids of insoluble particles between the inside and outside of the composite plating film has recently been increased. Composite plating films having different inclination functions are also desired, and in order to obtain a composite plating film having such inclination functions, it is essential to freely control the amount of eutectoids of insoluble particles.
【０００５】従来、複合めっきにおいて、不溶性粒子の
共析量をコントロールする方法としては、めっき液中へ
の不溶性粒子の分散量を増減する方法、更にめっき液の
撹拌速度やめっき温度を調節し、また電気めっきの場合
は電流密度を高くするなど、めっき条件を調節する方法
が採られている。Conventionally, in composite plating, as a method of controlling the amount of eutectoid of insoluble particles, a method of increasing or decreasing the amount of dispersion of insoluble particles in a plating solution, and further adjusting a stirring speed and a plating temperature of the plating solution, In the case of electroplating, a method of adjusting plating conditions such as increasing the current density is adopted.
【０００６】しかし、めっき液中への不溶性粒子の分散
量を調節する方法は、分散量を多くするほど共析量は増
大するが、実用上の観点から分散量をむやみに増加させ
ることはできず、この方法には一定の限界がある。ま
た、めっき条件を調節する方法は、その共析量を広い範
囲でコントロールするには十分でない。However, in the method of adjusting the amount of dispersion of the insoluble particles in the plating solution, the amount of eutectoid increases as the amount of dispersion increases, but the amount of dispersion cannot be increased unnecessarily from a practical viewpoint. However, this method has certain limitations. Also, the method of adjusting the plating conditions is not enough to control the amount of eutectoid in a wide range.
【０００７】従って、上記方法に加えて、さらに効果的
に共析量をコントロールすることができる複合めっき皮
膜の共析量コントロール方法の開発が望まれる。Therefore, in addition to the above-mentioned method, it is desired to develop a method for controlling the amount of eutectoid of a composite plating film, which can more effectively control the amount of eutectoid.
【０００８】本発明は、上記事情に鑑みなされたもの
で、金属めっき液中に不溶性粒子を分散させた複合めっ
き液を用いて、被めっき物表面に金属マトリックス中に
不溶性粒子が共析分散した複合めっき皮膜を形成する場
合に、金属マトリックス中への不溶性粒子の共析量を効
果的にコントロールすることができ、傾斜機能を有する
複合めっき皮膜を容易に得ることができる複合めっき皮
膜の共析量コントロール方法を提供することを目的とす
る。The present invention has been made in view of the above circumstances, and uses a composite plating solution in which insoluble particles are dispersed in a metal plating solution, in which insoluble particles are eutectoidally dispersed in a metal matrix on the surface of the object to be plated. When forming a composite plating film, the eutectoid amount of insoluble particles in the metal matrix can be effectively controlled, and a composite plating film having a gradient function can be easily obtained. It is intended to provide an amount control method.
【０００９】[0009]
【課題を解決するための手段及び作用】本発明者は、目
的を達成するため鋭意検討を行なった結果、複合めっき
において、金属マトリックス中への不溶性粒子の共析量
は該粒子の比表面積に依存することを知見した。The present inventors have conducted intensive studies to achieve the object. As a result, in composite plating, the eutectoid amount of insoluble particles in the metal matrix is reduced by the specific surface area of the particles. Was found to be dependent.
【００１０】即ち、後述する実施例の記載から明らかな
ように、不溶性粒子の平均粒径及びめっき液中の分散量
を一定にして同一めっき条件で複合めっきを行なった場
合、粒子の比表面積が小さいほどその共析量が増大する
一方、比表面積が大きいほどその共析量が減少するこ
と、この場合、上記不溶性粒子の比表面積と共析量との
間にほぼ反比例関係が成立ち、このように比表面積から
共析量を容易に予測し得ることが見出され、従って金属
マトリックス中への不溶性粒子の共析量を該粒子の比表
面積を選定することにより容易かつ確実に、しかも広い
範囲にわたってコントロールし得、被めっき物を互いに
異なる比表面積を有する不溶性粒子が分散された複数の
複合めっき液で順次めっきすることにより、上記被めっ
き物に内側と外側とで不溶性粒子の共析量が異なる傾斜
機能を持つ複合めっき皮膜を容易に形成し得ることを知
見し、本発明を完成したものである。That is, as is apparent from the description of the examples described below, when the composite plating is performed under the same plating conditions while keeping the average particle size of the insoluble particles and the amount of dispersion in the plating solution constant, the specific surface area of the particles is reduced. The smaller the smaller, the larger the amount of eutectoid, the larger the specific surface area, the smaller the amount of eutectoid.In this case, an almost inverse relationship is established between the specific surface area of the insoluble particles and the amount of eutectoid. It has been found that the amount of eutectoid can be easily predicted from the specific surface area, and thus the amount of eutectoid insoluble particles in the metal matrix can be easily, reliably and broadly determined by selecting the specific surface area of the particles. The plating object can be controlled over a range, and by sequentially plating the object to be plated with a plurality of composite plating solutions in which insoluble particles having different specific surface areas are dispersed, the inside and outside of the object are plated. It was found that the composite plating film can easily be formed with a eutectoid amount different functional gradient of insoluble particles, and completed the present invention.
【００１１】従って、本発明は、金属めっき液中に不溶
性粒子を分散させた複合めっき液を用いて被めっき物に
金属マトリックス中に不溶性粒子が共析分散した複合め
っき皮膜を形成するに当たり、上記金属めっき液中に分
散させる不溶性粒子の比表面積を調節することにより、
金属マトリックス中への不溶性粒子の共析量をコントロ
ールすることを特徴とする複合めっき皮膜の共析量コン
トロール方法を提供する。Accordingly, the present invention provides a method for forming a composite plating film in which insoluble particles are eutectoidally dispersed in a metal matrix on an object to be plated using a composite plating solution in which insoluble particles are dispersed in a metal plating solution. By adjusting the specific surface area of the insoluble particles to be dispersed in the metal plating solution,
Provided is a method for controlling the amount of eutectoid of a composite plating film, which comprises controlling the amount of eutectoid of insoluble particles in a metal matrix.
【００１２】以下、本発明につき更に詳しく説明する
と、本発明の複合めっき皮膜の共析量コントロール方法
は、上述したように、金属めっき液中に不溶性粒子を分
散させた複合めっき液を用い、金属マトリックス中に該
粒子が共析分散した複合めっき皮膜を得る場合に、上記
金属めっき液中に分散させる不溶性粒子の比表面積を選
定することにより、所望の共析量の複合めっき皮膜を得
るものである。Hereinafter, the present invention will be described in more detail. The method of controlling the amount of eutectoid of a composite plating film according to the present invention uses a composite plating solution in which insoluble particles are dispersed in a metal plating solution as described above. When obtaining a composite plating film in which the particles are eutectoidally dispersed in the matrix, by selecting a specific surface area of the insoluble particles to be dispersed in the metal plating solution, a composite plating film having a desired eutectoid amount is obtained. is there.
【００１３】ここで、複合めっきは、電気めっき法によ
っても無電解めっき法によっても良く、また金属めっき
液としては、ニッケルめっき液、ニッケル合金めっき
液、銅めっき液、亜鉛めっき液、スズめっき液、スズ合
金めっき液などが挙げられ、これらめっき液は、公知の
組成とすることができるが、特に本発明法は、ニッケル
めっき液、ニッケル合金めっき液及び銅めっき液に対し
て好適に採用される。Here, the composite plating may be performed by an electroplating method or an electroless plating method. The metal plating solution may be a nickel plating solution, a nickel alloy plating solution, a copper plating solution, a zinc plating solution, a tin plating solution. , Tin alloy plating solutions and the like, and these plating solutions can have a known composition. In particular, the method of the present invention is suitably adopted for nickel plating solutions, nickel alloy plating solutions and copper plating solutions. You.
【００１４】また、金属めっき液に分散される不溶性粒
子としては、ジルコニア，アルミナ，シリカ，チタニ
ア，セリア等の酸化物及びこれらの２種以上からなる複
合酸化物、炭化珪素，炭化チタン等の炭化物、窒化珪
素，窒化硼素等の窒化物、フッ素樹脂粉末、ナイロン粉
末，ポリエチレン粉末等の有機高分子粉末などが挙げら
れるが、これらに限定されるものではなく、その他種々
の不溶性粒子を使用することもできる。The insoluble particles dispersed in the metal plating solution include oxides such as zirconia, alumina, silica, titania, and ceria, and composite oxides comprising two or more of these, and carbides such as silicon carbide and titanium carbide. , Silicon nitride, nitride such as boron nitride, organic resin powder such as fluororesin powder, nylon powder, polyethylene powder, etc., but not limited thereto, and use of various other insoluble particles. Can also.
【００１５】この場合、本発明においては、不溶性粒子
はその比表面積を適宜選定使用して共析量をコントロー
ルするもので、共析量を多くしたい場合は比表面積の小
さいものを選定し、共析量を少なくしたい場合は比表面
積の大きいものを選定する。ここで、比表面積の範囲
は、特に制限されるものではないが、通常０．１〜１０
０ｍ2／ｇ、特に０．５〜１０ｍ2／ｇの範囲から選定す
ることが好ましい。In this case, in the present invention, the insoluble particles are used to control the amount of eutectoid by appropriately selecting and using the specific surface area. If the amount of eutectoid is to be increased, the particles having a small specific surface area are selected. To reduce the amount of precipitation, select one with a large specific surface area. Here, the range of the specific surface area is not particularly limited, but is usually 0.1 to 10
0 m 2 / g, it is particularly preferable to select from a range of 0.5 to 10 m 2 / g.
【００１６】また、本発明においては、不溶性粒子の粒
径範囲に限定はなく、適宜な粒径の不溶性粒子を使用す
ることができるが、通常は平均粒径０．１〜２０μｍ、
特に０．２〜１０μｍの範囲から選定することが好まし
い。In the present invention, the particle size range of the insoluble particles is not limited, and insoluble particles having an appropriate particle size can be used.
In particular, it is preferable to select from the range of 0.2 to 10 μm.
【００１７】不溶性粒子の金属めっき液中への分散量も
適宜選定され、特に制限されるものではないが、通常５
〜８００ｇ／Ｌ、特に１０〜５００ｇ／Ｌとされる。な
お、不溶性粒子の金属めっき液中への分散量の多少も共
析量に影響を与える比較的大きい要因であるので、本発
明コントロール法の実施に当たり、不溶性粒子の金属め
っき液中への分散量もコントロールする必要がある。The amount of the insoluble particles dispersed in the metal plating solution is also appropriately selected and is not particularly limited.
To 800 g / L, especially 10 to 500 g / L. Since the amount of the insoluble particles dispersed in the metal plating solution is a relatively large factor that affects the amount of eutectoid, the amount of the insoluble particles dispersed in the metal plating solution is reduced when the control method of the present invention is performed. Also need to be controlled.
【００１８】更に、複合めっき条件は、めっき液の種
類、めっき方法等に応じた公知の条件を採用することが
できるが、撹拌方法、撹拌速度、めっき温度、陰極電流
密度などの各めっき条件を適宜コントロールすることも
また共析量コントロールの点から必要である。Further, as the composite plating conditions, known conditions according to the type of plating solution, plating method and the like can be adopted, but each plating condition such as stirring method, stirring speed, plating temperature, cathode current density, etc. Appropriate control is also necessary from the viewpoint of eutectoid amount control.
【００１９】本発明の複合めっきの共析量コントロール
方法によれば、単に不溶性粒子の比表面積を変えるだけ
で共析量を変えることができ、従って所望の共析量の複
合めっき皮膜を簡単にしかも確実に得ることができる
が、特に、互いに比表面積の異なる不溶性粒子を分散さ
せた複数の複合めっき液を用意し、被めっき物をこれら
複合めっき液で順次めっきすることにより、複合めっき
皮膜の内側、中間部、外側で互いに共析量が異なる傾斜
機能を持った複合めっき皮膜を容易に形成できる。According to the method for controlling the amount of eutectoid in the composite plating of the present invention, the amount of eutectoid can be changed simply by changing the specific surface area of the insoluble particles. In addition, it is possible to reliably obtain the composite plating film, particularly by preparing a plurality of composite plating solutions in which insoluble particles having different specific surface areas are dispersed, and sequentially plating an object to be plated with these composite plating solutions. It is possible to easily form a composite plating film having a tilt function in which the eutectoid amount is different between the inner side, the intermediate part, and the outer side.
【００２０】[0020]
【実施例】以下、実施例，比較例を示して本発明を具体
的に説明するが、本発明は下記実施例に制限されるもの
ではない。EXAMPLES The present invention will be described in detail below with reference to examples and comparative examples, but the present invention is not limited to the following examples.
【００２１】［実施例１］まず図１に示す構造の複合め
っき装置を構成した。即ち、図中１は複合めっき液が収
容されるトールビーカーであり、このトールビーカー１
は回転計付きのマグネチックスターラー２上の恒温槽３
内に半漬状態に配置されている。上記ビーカー１内に
は、その中心部にステンレススチール板（ＳＵＳ３０
４、２０ｍｍ×４０ｍｍ×０．２ｍｍ）からなるカソー
ド４が配置されており、またこのカソード４を挟んで左
右に電解ニッケル板からなるアノード５が配置されてい
る。更に、このビーカー１内の底壁上には、上記スター
ラー２によって回転させられる撹拌子６が載置されてい
る。なお、図中７は上記カソード４とアノード５との間
を通電する直流電源、８，９はそれぞれ電流計，電圧
計、１０はヒーター、１１は温度調節器である。Example 1 First, a composite plating apparatus having the structure shown in FIG. 1 was constructed. That is, reference numeral 1 in the figure denotes a tall beaker in which a composite plating solution is stored.
Is a thermostat 3 on a magnetic stirrer 2 with a tachometer
It is placed in a semi-soaked state. Inside the beaker 1, a stainless steel plate (SUS30
A cathode 4 of 4, 20 mm × 40 mm × 0.2 mm) is arranged, and anodes 5 made of an electrolytic nickel plate are arranged on the left and right sides of the cathode 4. Further, a stirrer 6 rotated by the stirrer 2 is placed on a bottom wall in the beaker 1. In the figure, reference numeral 7 denotes a DC power supply for supplying electricity between the cathode 4 and the anode 5, 8, 9 denote ammeters and voltmeters, 10 denotes a heater, and 11 denotes a temperature controller.
【００２２】この複合めっき装置のビーカー１内にスル
ファミン酸ニッケルめっき液（スルファミン酸ニッケル
１．２ｍｏｌ／Ｌ、塩化ニッケル０．０２ｍｏｌ／Ｌ、
ホウ酸０．４ｍｏｌ／Ｌ）に表１及び表２に示したジル
コニア系セラミック粉末（ＺｒＯ2／Ｙ2Ｏ3の二成分
系）を分散した複合めっき液を収容し、これを３０分間
スターラー２で撹拌子６を回転させて撹拌、熟成した
後、以下に示すめっき条件で複合めっきを行った。得ら
れた複合めっき皮膜中のジルコニア系セラミック粉末共
析量を表１及び表２に示す。また、図２に実質的に同一
の平均粒径を有するジルコニア系セラミック粉末（表１
のジルコニア系セラミック粉末）の比表面積と共析量と
の関係を示す。なお、共析量の測定は、まず皮膜が形成
されたカソードの重量増化から皮膜重量を求め、皮膜量
を算出し、次いで皮膜を硝酸を用いて溶解し、メンブラ
ンフィルターで粒子のみを捕集，乾燥した後、秤量する
重量法により求めた。めっき条件 陰極電流密度 ０．５Ａ／ｄｍ2又は１．０
Ａ／ｄｍ2 共析粒子分散量 ４００ｇ／Ｌ ｐＨ ３．８（建浴時） 浴温 ４０℃ スターラー回転数 ４００ｒｐｍIn the beaker 1 of this composite plating apparatus, nickel sulfamate plating solution (nickel sulfamate 1.2 mol / L, nickel chloride 0.02 mol / L,
A composite plating solution in which the zirconia-based ceramic powder (two-component system of ZrO 2 / Y 2 O 3 ) shown in Tables 1 and 2 was dispersed in boric acid (0.4 mol / L) was accommodated, and this was stirred for 30 minutes with a stirrer 2 After rotating the stirrer 6 for stirring and aging, composite plating was performed under the following plating conditions. Tables 1 and 2 show the amount of zirconia-based ceramic powder eutectoid in the obtained composite plating film. FIG. 2 shows a zirconia-based ceramic powder having substantially the same average particle size (Table 1).
The relationship between the specific surface area of the zirconia-based ceramic powder) and the amount of eutectoid is shown. The eutectoid amount was measured by first obtaining the coating weight from the increase in the weight of the cathode on which the coating was formed, calculating the coating weight, then dissolving the coating using nitric acid, and collecting only the particles with a membrane filter. After drying, the weight was determined by a gravimetric method. Plating conditions Cathode current density 0.5 A / dm 2 or 1.0
A / dm 2 eutectoid particle dispersion amount 400 g / L pH 3.8 (at the time of building bath) Bath temperature 40 ° C. Stirrer rotation speed 400 rpm
【００２３】[0023]
【表１】 [Table 1]
【００２４】[0024]
【表２】 [Table 2]
【００２５】表１、表２及び図２に示した結果から、ほ
ぼ同じ比表面積のジルコニア系セラミック粉末（表２）
において、平均粒径を変化させても共析量の変化はほと
んど見られないが、ほぼ同じ平均粒径のジルコニア系セ
ラミック粉末（表１及び図１）において、比表面積を変
化させると、それに応じて共析量が変化することが認め
られる。即ち、ニッケルめっき液中に分散させるジルコ
ニア系セラミック粉末の比表面積を調節することによ
り、ニッケルマトリックス中へのジルコニア系セラミッ
ク粉末の共析量をコントロールすることが可能であるこ
とが確認された。From the results shown in Table 1, Table 2 and FIG. 2, zirconia-based ceramic powder having almost the same specific surface area (Table 2)
, The amount of eutectoid hardly changed even when the average particle size was changed, but when the specific surface area was changed in the zirconia-based ceramic powder having almost the same average particle size (Table 1 and FIG. 1), Change in the amount of eutectoid. That is, it was confirmed that by adjusting the specific surface area of the zirconia-based ceramic powder dispersed in the nickel plating solution, the amount of eutectoid of the zirconia-based ceramic powder in the nickel matrix can be controlled.
【００２６】次に、上記ジルコニア系セラミック粉末Ｎ
ｏ．９、Ｎｏ．５、Ｎｏ．２がそれぞれ分散した３種の
複合めっき液に被めっき物（銅板）を順次浸漬し、それ
ぞれ１．０Ａ／ｄｍ2で同時間複合めっきを行い、厚さ
約１０μｍの複合めっき皮膜を得た。Next, the zirconia ceramic powder N
o. 9, No. 5, no. The objects to be plated (copper plates) were sequentially immersed in three types of composite plating solutions in which each of 2 was dispersed, and composite plating was performed at 1.0 A / dm 2 for the same time to obtain a composite plating film having a thickness of about 10 μm.
【００２７】このめっき皮膜は、共析粒子（ジルコニア
系セラミック粉末）の共析量が内側約１２ｖｏｌ％、中
間部約１８ｖｏｌ％、外側約２６ｖｏｌ％の傾斜機能を
有するものであり、内側の粒子が少ないため基材（銅
板）との密着性がよく、また外側の粒子が多いので該粒
子の特性をより効果的に発揮する。This plating film has a gradient function of eutectoid particles (zirconia ceramic powder) having an eutectoid amount of about 12 vol% on the inner side, about 18 vol% on the middle part, and about 26 vol% on the outer side. Since the amount is small, the adhesion to the base material (copper plate) is good, and since the number of outer particles is large, the characteristics of the particles are more effectively exhibited.
【００２８】［実施例２］比表面積が１３．７ｍ2／
ｇ、平均粒径が０．９０μｍのＳｉＣ粉末が分散した実
施例１と同様の複合めっき液に銅板を浸漬し、陰極電流
密度０．５Ａ／ｄｍ2で３μｍの複合めっきを行った
後、比表面積が５．７ｍ2／ｇ、平均粒径が１．８０μ
ｍのＳｉＣ粉末が分散した実施例１と同様の複合めっき
液に直ちに浸漬し、陰極電流密度０．５Ａ／ｄｍ2で３
μｍの複合めっきを行った。Example 2 Specific surface area was 13.7 m 2 /
g, the copper plate was immersed in the same composite plating solution as in Example 1 in which SiC powder having an average particle size of 0.90 μm was dispersed, and 3 μm composite plating was performed at a cathode current density of 0.5 A / dm 2. Surface area is 5.7 m 2 / g, average particle size is 1.80μ
m of SiC powder dispersed therein and immediately immersed in the same composite plating solution as in Example 1 at a cathode current density of 0.5 A / dm 2 .
μm composite plating was performed.
【００２９】得られた複合めっき皮膜は、ＳｉＣ粉末が
内側に１５．５０ｖｏｌ％、外側に２１．０３ｖｏｌ％
共析した傾斜機能を有するものであった。In the obtained composite plating film, the SiC powder was 15.50 vol% on the inside and 21.03 vol% on the outside.
It had an eutectoid tilt function.
【００３０】[0030]
【発明の効果】以上説明したように、本発明の複合めっ
き皮膜の共析量コントロール方法によれば、金属めっき
液中に分散させる不溶性粒子の比表面積を調節すること
により、容易かつ確実に、しかも広い範囲で金属マトリ
ックス中への不溶性粒子の共析量をコントロールするこ
とができ、傾斜機能を有する複合めっき皮膜を容易に得
ることができる。As described above, according to the method for controlling the eutectoid content of a composite plating film of the present invention, the specific surface area of insoluble particles dispersed in a metal plating solution is adjusted easily and reliably. Moreover, the eutectoid amount of insoluble particles in the metal matrix can be controlled in a wide range, and a composite plating film having a gradient function can be easily obtained.
【図１】実施例で用いた複合めっき装置を示す概略図で
ある。FIG. 1 is a schematic view showing a composite plating apparatus used in Examples.
【図２】平均粒径５．６〜６．６μｍのジルコニア系セ
ラミック粉末の共析量と比表面積との関係を示すグラフ
である。FIG. 2 is a graph showing the relationship between the amount of eutectoid and the specific surface area of a zirconia-based ceramic powder having an average particle size of 5.6 to 6.6 μm.
１ ビーカー ２ 回転計付きスターラー ３ 恒温槽 ４ カソード ５ アノード ６ 撹拌子 ７ 直流電源 ８ 電流計 ９ 電圧計 １０ ヒーター １１ 温度調節器 DESCRIPTION OF SYMBOLS 1 Beaker 2 Stirrer with tachometer 3 Thermostat 4 Cathode 5 Anode 6 Stirrer 7 DC power supply 8 Ammeter 9 Voltmeter 10 Heater 11 Temperature controller
───────────────────────────────────────────────────── フロントページの続き (72)発明者 堀田 佳子 大阪府枚方市出口１丁目５番１号 上村 工業株式会社 中央研究所内 (72)発明者 吉川 逸治 大阪府豊中市寺内１丁目５番12号 フロ ーレンス緑地403号 (56)参考文献 特開 平３−264698（ＪＰ，Ａ) 特開 昭57−71812（ＪＰ，Ａ) ──────────────────────────────────────────────────続 き Continuation of the front page (72) Yoshiko Hotta, Inventor 1-5-1, Exit Hirakata, Osaka Prefecture Uemura Industry Co., Ltd. Central Research Laboratory (72) Inventor Itsuharu Yoshikawa 1-5-12, Terauchi, Toyonaka-shi, Osaka No. 403, Florence Green Space (56) References JP-A-3-264698 (JP, A) JP-A-57-71812 (JP, A)
Claims (2)
た複合めっき液を用いて被めっき物に金属マトリックス
中に不溶性粒子が共析分散した複合めっき皮膜を形成す
るに当たり、上記金属めっき液中に分散させる不溶性粒
子の比表面積を調節することにより、金属マトリックス
中への不溶性粒子の共析量をコントロールすることを特
徴とする複合めっき皮膜の共析量コントロール方法。When forming a composite plating film in which insoluble particles are eutectoidally dispersed in a metal matrix using a composite plating solution in which insoluble particles are dispersed in a metal plating solution, the metal plating solution A method for controlling the eutectoid content of a composite plating film, comprising controlling the eutectoid content of insoluble particles in a metal matrix by adjusting the specific surface area of the insoluble particles dispersed in the metal plating.
する不溶性粒子が分散された複数の複合めっき液で順次
めっきすることにより、上記被めっき物に内側と外側と
で不溶性粒子の共析量が異なる複合めっき皮膜を形成し
た請求項１記載の方法。2. The object to be plated is successively plated with a plurality of composite plating solutions in which insoluble particles having different specific surface areas are dispersed, so that the amount of eutectoid insoluble particles inside and outside the object to be plated is reduced. 2. The method according to claim 1, wherein different composite plating films are formed.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3339755A JP2616324B2 (en) | 1991-11-27 | 1991-11-27 | Control method of eutectoid amount of composite plating film |
| US07/971,555 US5266181A (en) | 1991-11-27 | 1992-11-05 | Controlled composite deposition method |
| FR929214265A FR2684113B1 (en) | 1991-11-27 | 1992-11-26 | COMPOSITE DEPOSIT CONTROL PROCESS. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3339755A JP2616324B2 (en) | 1991-11-27 | 1991-11-27 | Control method of eutectoid amount of composite plating film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05148689A JPH05148689A (en) | 1993-06-15 |
| JP2616324B2 true JP2616324B2 (en) | 1997-06-04 |
Family
ID=18330500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3339755A Expired - Fee Related JP2616324B2 (en) | 1991-11-27 | 1991-11-27 | Control method of eutectoid amount of composite plating film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2616324B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5865976A (en) * | 1994-10-07 | 1999-02-02 | Toyoda Gosei Co., Inc. | Plating method |
| JP3391113B2 (en) * | 1994-10-07 | 2003-03-31 | 豊田合成株式会社 | Composite plating method |
| KR100709290B1 (en) * | 2005-11-15 | 2007-04-19 | 한국과학기술연구원 | Composite layer including metal and inorganic powders and method for manufacturing the same |
| JP6408309B2 (en) * | 2014-09-03 | 2018-10-17 | 住友電気工業株式会社 | Method for producing dispersion strengthened copper-containing material |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03264698A (en) * | 1990-03-13 | 1991-11-25 | Nkk Corp | Zinc-silica composite electroplated steel sheet having superior corrosion resistance and weldability |
-
1991
- 1991-11-27 JP JP3339755A patent/JP2616324B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05148689A (en) | 1993-06-15 |
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