WO2014026806A3 - Plating bath composition for immersion plating of gold - Google Patents

Plating bath composition for immersion plating of gold Download PDF

Info

Publication number
WO2014026806A3
WO2014026806A3 PCT/EP2013/064725 EP2013064725W WO2014026806A3 WO 2014026806 A3 WO2014026806 A3 WO 2014026806A3 EP 2013064725 W EP2013064725 W EP 2013064725W WO 2014026806 A3 WO2014026806 A3 WO 2014026806A3
Authority
WO
WIPO (PCT)
Prior art keywords
gold
plating
plating bath
ions
bath composition
Prior art date
Application number
PCT/EP2013/064725
Other languages
French (fr)
Other versions
WO2014026806A2 (en
Inventor
Sandra Niemann
Britta Schafsteller
Jenny Schulz
Ellen Habig
Heiko Brunner
Lars Kohlmann
Sven Rückbrod
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Priority to CN201380042872.8A priority Critical patent/CN104520471B/en
Publication of WO2014026806A2 publication Critical patent/WO2014026806A2/en
Publication of WO2014026806A3 publication Critical patent/WO2014026806A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

The present invention relates to a cyanide-free aqueous immersion-type plating bath for deposition of gold, comprising gold ions, at least one complexing agent, sulfite ions, thiosulfate ions, and at least one ureylene polymer additive. The gold layer deposited from the plating bath according to the present invention shows a lemon-yellow colour and a sufficient wettability for tin based solder materials.
PCT/EP2013/064725 2012-08-13 2013-07-11 Plating bath composition for immersion plating of gold WO2014026806A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201380042872.8A CN104520471B (en) 2012-08-13 2013-07-11 Bath compositions for the immersion plating of gold

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP12180227.6A EP2698449B1 (en) 2012-08-13 2012-08-13 Plating bath composition for immersion plating of gold
EP12180227.6 2012-08-13

Publications (2)

Publication Number Publication Date
WO2014026806A2 WO2014026806A2 (en) 2014-02-20
WO2014026806A3 true WO2014026806A3 (en) 2014-08-28

Family

ID=46939477

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2013/064725 WO2014026806A2 (en) 2012-08-13 2013-07-11 Plating bath composition for immersion plating of gold

Country Status (4)

Country Link
EP (1) EP2698449B1 (en)
CN (1) CN104520471B (en)
TW (1) TWI551723B (en)
WO (1) WO2014026806A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2834877T3 (en) * 2018-01-26 2021-06-21 Atotech Deutschland Gmbh Electrolytic gold plating bath
DE102019202899B3 (en) * 2019-03-04 2019-11-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Aqueous formulation for producing a layer of gold and silver
EP3933073B1 (en) * 2020-06-29 2023-11-29 Atotech Deutschland GmbH & Co. KG Copper electroplating bath

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000192248A (en) * 1998-12-24 2000-07-11 Ishihara Chem Co Ltd Substituted gold plating bath and metal plating method using the bath
EP1201789A2 (en) * 2000-10-19 2002-05-02 ATOTECH Deutschland GmbH Plating bath and method for electroplating tin-zinc alloys
US20060269761A1 (en) * 2004-07-09 2006-11-30 Akihiro Aiba Electroless gold plating liquid

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4618513A (en) * 1984-12-17 1986-10-21 Texo Corporation Tin plating immersion process
JP4932094B2 (en) * 2001-07-02 2012-05-16 日本リーロナール有限会社 Electroless gold plating solution and electroless gold plating method
JP2004250765A (en) 2003-02-21 2004-09-09 Murata Mfg Co Ltd Gold plating liquid, and method of producing electronic component
JP4759416B2 (en) * 2006-03-20 2011-08-31 新光電気工業株式会社 Non-cyanide electroless gold plating solution and electroless gold plating method
TW200848544A (en) * 2007-06-13 2008-12-16 Solution Chemicals Co Ltd Electroless golden plating bath without cyanide
ES2788080T3 (en) 2009-09-08 2020-10-20 Atotech Deutschland Gmbh Polymers with amino terminal groups and their use as additives for zinc plating and zinc alloy baths

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000192248A (en) * 1998-12-24 2000-07-11 Ishihara Chem Co Ltd Substituted gold plating bath and metal plating method using the bath
EP1201789A2 (en) * 2000-10-19 2002-05-02 ATOTECH Deutschland GmbH Plating bath and method for electroplating tin-zinc alloys
US20060269761A1 (en) * 2004-07-09 2006-11-30 Akihiro Aiba Electroless gold plating liquid

Also Published As

Publication number Publication date
WO2014026806A2 (en) 2014-02-20
TWI551723B (en) 2016-10-01
EP2698449A1 (en) 2014-02-19
CN104520471A (en) 2015-04-15
CN104520471B (en) 2016-08-24
TW201413051A (en) 2014-04-01
EP2698449B1 (en) 2019-10-02

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