MX2022006822A - Lamina de aleacion de cobre, lamina de aleacion de cobre con pelicula de chapado y metodo para producir la misma. - Google Patents

Lamina de aleacion de cobre, lamina de aleacion de cobre con pelicula de chapado y metodo para producir la misma.

Info

Publication number
MX2022006822A
MX2022006822A MX2022006822A MX2022006822A MX2022006822A MX 2022006822 A MX2022006822 A MX 2022006822A MX 2022006822 A MX2022006822 A MX 2022006822A MX 2022006822 A MX2022006822 A MX 2022006822A MX 2022006822 A MX2022006822 A MX 2022006822A
Authority
MX
Mexico
Prior art keywords
copper alloy
alloy sheet
concentration
center
plating film
Prior art date
Application number
MX2022006822A
Other languages
English (en)
Inventor
Kazunari Maki
Shinichi Funaki
Naoki Miyashima
Yoshiteru AKISAKA
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of MX2022006822A publication Critical patent/MX2022006822A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F17/00—Multi-step processes for surface treatment of metallic material involving at least one process provided for in class C23 and at least one process covered by subclass C21D or C22F or class C25
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • C23F3/06—Heavy metals with acidic solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/16—Polishing
    • C25F3/22—Polishing of heavy metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/22—Electroplating: Baths therefor from solutions of zinc
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals

Abstract

Proporcionar una placa de aleación de cobre, en la que la concentración de Mg central en una parte central en la dirección del espesor de la placa es de 0.1 % en masa o más y menos de 0.3 % en masa, la concentración de P en el centro es 0.001 % en masa o 5 más y 0.2 % en masa o menos, y el balance está compuesto por Cu e impurezas inevitables; en el que la concentración de Mg superficial en una superficie es el 70 % o menos de la concentración de Mg central; en el que una parte de capa superficial definida por un espesor prescrito desde la superficie tiene un gradiente de concentración de Mg de 0.05% en masa/µm o más y 5% en masa/µm o menos que aumenta desde la superficie hacia la parte central de la dirección del espesor de la placa; y la que la restricción del cambio de color de la superficie y el aumento de la resistencia de contacto eléctrico y la adhesividad de una película de recubrimiento son excelentes debido a que la concentración máxima de Mg en la parte de capa superficial es del 90% de la concentración de Mg central.
MX2022006822A 2019-12-10 2020-12-08 Lamina de aleacion de cobre, lamina de aleacion de cobre con pelicula de chapado y metodo para producir la misma. MX2022006822A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019222646A JP7443737B2 (ja) 2019-12-10 2019-12-10 銅合金板、めっき皮膜付銅合金板及びこれらの製造方法
PCT/JP2020/045576 WO2021117698A1 (ja) 2019-12-10 2020-12-08 銅合金板、めっき皮膜付銅合金板及びこれらの製造方法

Publications (1)

Publication Number Publication Date
MX2022006822A true MX2022006822A (es) 2022-09-12

Family

ID=76311863

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2022006822A MX2022006822A (es) 2019-12-10 2020-12-08 Lamina de aleacion de cobre, lamina de aleacion de cobre con pelicula de chapado y metodo para producir la misma.

Country Status (8)

Country Link
US (1) US11920228B2 (es)
EP (1) EP4074848A4 (es)
JP (1) JP7443737B2 (es)
KR (1) KR20220113408A (es)
CN (1) CN114641585B (es)
MX (1) MX2022006822A (es)
TW (1) TW202136530A (es)
WO (1) WO2021117698A1 (es)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI3904549T3 (fi) * 2018-12-26 2023-10-19 Mitsubishi Materials Corp Kupariseoslevy, pinnoitekalvoon liitetty kupariseoslevy, ja menetelmät vastaavasti näiden tuotteiden valmistamiseksi
JP7116870B2 (ja) * 2019-03-29 2022-08-12 三菱マテリアル株式会社 銅合金板、めっき皮膜付銅合金板及びこれらの製造方法
JP2023097762A (ja) * 2021-12-28 2023-07-10 三菱マテリアル株式会社 銅合金異形条材、電子・電気機器用部品、端子、バスバー、リードフレーム、放熱基板
JP2023097756A (ja) * 2021-12-28 2023-07-10 三菱マテリアル株式会社 銅合金、銅合金塑性加工材、電子・電気機器用部品、端子、バスバー、リードフレーム、放熱基板
CN116247343B (zh) * 2023-05-12 2023-10-20 宁德时代新能源科技股份有限公司 一种电池外壳及其制备方法、二次电池和用电装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5054160B2 (ja) 2010-06-28 2012-10-24 三菱伸銅株式会社 Ｃｕ−Ｍｇ−Ｐ系銅合金条材及びその製造方法
JP6055242B2 (ja) 2012-08-30 2016-12-27 三菱伸銅株式会社 Ｃｕ−Ｍｇ−Ｐ系銅合金Ｓｎめっき板及びその製造方法
JP6001420B2 (ja) 2012-11-07 2016-10-05 株式会社フジクラ Ｃｕ−Ｍｇ合金体、Ｃｕ−Ｍｇ合金体の製造方法および伸線材の製造方法
JP2016166397A (ja) 2015-03-10 2016-09-15 三菱マテリアル株式会社 錫めっき銅合金端子材及びその製造方法並びに電線端末部構造
CN107208189B (zh) 2015-09-09 2020-08-04 三菱综合材料株式会社 铜合金、铜合金塑性加工材、组件、端子及汇流条
JP5910790B1 (ja) 2015-12-01 2016-04-27 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品、端子、及び、バスバー
JP6226097B2 (ja) 2016-03-30 2017-11-08 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片
JP6226098B2 (ja) 2016-03-30 2017-11-08 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片
JP7180101B2 (ja) 2018-03-30 2022-11-30 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー
JP7180102B2 (ja) 2018-03-30 2022-11-30 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー
KR20200134215A (ko) 2018-03-30 2020-12-01 미쓰비시 마테리알 가부시키가이샤 전자·전기 기기용 구리 합금, 전자·전기 기기용 구리 합금판 스트립재, 전자·전기 기기용 부품, 단자, 및 버스바
FI3904549T3 (fi) * 2018-12-26 2023-10-19 Mitsubishi Materials Corp Kupariseoslevy, pinnoitekalvoon liitetty kupariseoslevy, ja menetelmät vastaavasti näiden tuotteiden valmistamiseksi
JP6863409B2 (ja) * 2018-12-26 2021-04-21 三菱マテリアル株式会社 銅合金板、めっき皮膜付銅合金板及びこれらの製造方法

Also Published As

Publication number Publication date
US11920228B2 (en) 2024-03-05
WO2021117698A1 (ja) 2021-06-17
KR20220113408A (ko) 2022-08-12
TW202136530A (zh) 2021-10-01
EP4074848A4 (en) 2024-01-10
US20230047984A1 (en) 2023-02-16
JP7443737B2 (ja) 2024-03-06
CN114641585A (zh) 2022-06-17
EP4074848A1 (en) 2022-10-19
JP2021091931A (ja) 2021-06-17
CN114641585B (zh) 2023-11-17

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