EP3070188A3 - Verfahren zur beschichtung eines einpresspins und einpresspin - Google Patents

Verfahren zur beschichtung eines einpresspins und einpresspin Download PDF

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Publication number
EP3070188A3
EP3070188A3 EP16000515.3A EP16000515A EP3070188A3 EP 3070188 A3 EP3070188 A3 EP 3070188A3 EP 16000515 A EP16000515 A EP 16000515A EP 3070188 A3 EP3070188 A3 EP 3070188A3
Authority
EP
European Patent Office
Prior art keywords
press
pin
coating
copper
balance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP16000515.3A
Other languages
English (en)
French (fr)
Other versions
EP3070188A2 (de
Inventor
Uwe Zeigmeister
Christian Buchholzer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Diehl Metal Applications GmbH
Original Assignee
Diehl Metal Applications GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Diehl Metal Applications GmbH filed Critical Diehl Metal Applications GmbH
Publication of EP3070188A2 publication Critical patent/EP3070188A2/de
Publication of EP3070188A3 publication Critical patent/EP3070188A3/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/64—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

Die Erfindung betrifft ein Verfahren zur Beschichtung eines Einpresspins, wobei ein aus Kupfer oder einer Kupferlegierung hergestellter Grundkörper galvanisch aus einem alkalischen-cyanidischer Elektrolyten mit einer Schicht aus einer Silberlegierung beschichtet wird, die mehr als 50 Gew.% Ag, einen Rest aus Sn und unvermeidbaren Verunreinigungen enthält.
EP16000515.3A 2015-03-14 2016-03-03 Verfahren zur beschichtung eines einpresspins und einpresspin Withdrawn EP3070188A3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102015003285.2A DE102015003285A1 (de) 2015-03-14 2015-03-14 Verfahren zur Beschichtung eines Einpresspins und Einpresspin

Publications (2)

Publication Number Publication Date
EP3070188A2 EP3070188A2 (de) 2016-09-21
EP3070188A3 true EP3070188A3 (de) 2016-12-07

Family

ID=55456551

Family Applications (1)

Application Number Title Priority Date Filing Date
EP16000515.3A Withdrawn EP3070188A3 (de) 2015-03-14 2016-03-03 Verfahren zur beschichtung eines einpresspins und einpresspin

Country Status (4)

Country Link
US (1) US20160268709A1 (de)
EP (1) EP3070188A3 (de)
CN (1) CN105970263A (de)
DE (1) DE102015003285A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5939345B1 (ja) * 2015-11-06 2016-06-22 株式会社オートネットワーク技術研究所 端子金具およびコネクタ
CN111149260B (zh) * 2017-09-28 2021-10-08 怡得乐工业有限公司 具有按压装配紧固件的触头
JP2020111796A (ja) * 2019-01-11 2020-07-27 Ｊｘ金属株式会社 表面処理金属材料、表面処理金属材料の製造方法、及び、電子部品
US11456548B2 (en) 2019-09-18 2022-09-27 International Business Machines Corporation Reliability enhancement of press fit connectors

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4224012C1 (de) * 1992-07-21 1993-12-02 Heraeus Gmbh W C Lötfähiges elektrisches Kontaktelement
DE102005055742A1 (de) * 2005-11-23 2007-05-24 Robert Bosch Gmbh Verfahren zum Herstellen einer kontaktgeeigneten Schicht auf einem Metallelement
EP2175460A1 (de) * 2007-03-27 2010-04-14 The Furukawa Electric Co., Ltd. Silberbeschichtetes material für eine bewegliche kontaktkomponente und verfahren zur herstellung eines solchen silberbeschichteten materials
DE102011101602A1 (de) * 2011-05-13 2012-11-15 Enayati GmbH & Co. KG Oberflächen- und Anlagentechnik Einpresspin und Verfahren zu seiner Herstellung
EP2535908A1 (de) * 2010-02-12 2012-12-19 Furukawa Electric Co., Ltd. Silberbeschichtetes verbundmaterial für eine bewegliche kontaktkomponente, verfahren zu ihrer herstellung und bewegliche kontaktkomponente
DE102011088211A1 (de) * 2011-12-12 2013-06-13 Robert Bosch Gmbh Kontaktelement und Verfahren zu seiner Herstellung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE718252C (de) * 1939-06-01 1942-03-07 Degussa Verfahren zur Erzeugung schwefelwasserstoffbestaendiger galvanischer Silberueberzuege
JP2915623B2 (ja) * 1991-06-25 1999-07-05 古河電気工業株式会社 電気接点材料とその製造方法
US6361823B1 (en) 1999-12-03 2002-03-26 Atotech Deutschland Gmbh Process for whisker-free aqueous electroless tin plating
EP2200056A1 (de) * 2007-09-26 2010-06-23 The Furukawa Electric Co., Ltd. Silbermantelverbundmaterial für bewegliche kontakte und herstellungsprozess dafür
WO2009117639A2 (en) 2008-03-20 2009-09-24 Interplex Nas, Inc. Press fit (compliant) terminal and other connectors with tin-silver compound

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4224012C1 (de) * 1992-07-21 1993-12-02 Heraeus Gmbh W C Lötfähiges elektrisches Kontaktelement
DE102005055742A1 (de) * 2005-11-23 2007-05-24 Robert Bosch Gmbh Verfahren zum Herstellen einer kontaktgeeigneten Schicht auf einem Metallelement
EP2175460A1 (de) * 2007-03-27 2010-04-14 The Furukawa Electric Co., Ltd. Silberbeschichtetes material für eine bewegliche kontaktkomponente und verfahren zur herstellung eines solchen silberbeschichteten materials
EP2535908A1 (de) * 2010-02-12 2012-12-19 Furukawa Electric Co., Ltd. Silberbeschichtetes verbundmaterial für eine bewegliche kontaktkomponente, verfahren zu ihrer herstellung und bewegliche kontaktkomponente
DE102011101602A1 (de) * 2011-05-13 2012-11-15 Enayati GmbH & Co. KG Oberflächen- und Anlagentechnik Einpresspin und Verfahren zu seiner Herstellung
DE102011088211A1 (de) * 2011-12-12 2013-06-13 Robert Bosch Gmbh Kontaktelement und Verfahren zu seiner Herstellung

Also Published As

Publication number Publication date
CN105970263A (zh) 2016-09-28
US20160268709A1 (en) 2016-09-15
DE102015003285A1 (de) 2016-09-15
EP3070188A2 (de) 2016-09-21

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