EP3067444A3 - Abscheidung von dekorativen palladium-eisen-legierungsbeschichtungen auf metallischen substanzen - Google Patents

Abscheidung von dekorativen palladium-eisen-legierungsbeschichtungen auf metallischen substanzen Download PDF

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Publication number
EP3067444A3
EP3067444A3 EP16156476.0A EP16156476A EP3067444A3 EP 3067444 A3 EP3067444 A3 EP 3067444A3 EP 16156476 A EP16156476 A EP 16156476A EP 3067444 A3 EP3067444 A3 EP 3067444A3
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EP
European Patent Office
Prior art keywords
palladium
bath
free
decorative
separation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP16156476.0A
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English (en)
French (fr)
Other versions
EP3067444B1 (de
EP3067444A2 (de
Inventor
Claudia GARHÖFER-ONDREICSKA
Christian GARHÖFER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ing W Garhofer GmbH
Ing W Garhofer Ges Mbh
Original Assignee
Ing W Garhofer GmbH
Ing W Garhofer Ges Mbh
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Publication date
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Publication of EP3067444A2 publication Critical patent/EP3067444A2/de
Publication of EP3067444A3 publication Critical patent/EP3067444A3/de
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Publication of EP3067444B1 publication Critical patent/EP3067444B1/de
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/20—Electroplating: Baths therefor from solutions of iron
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/005—Jewels; Clockworks; Coins
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

Die Erfindung betrifft ein Elektrolytbad für das kathodische Abscheiden von binären Legierungen und/oder Schichtfolgen unter Bildung von weißen, korrosionsbeständigen, rissfreien und (hoch)glänzenden Überzügen auf zumindest an ihrer Oberfläche metallischen bzw. elektrisch leitfähigen oder leitfähig beschichteten Objekten, welches Bad als Legierungsmetalle aus zumindest einer Palladiumverbindung, insbesondere einem Palladiumsalz, als Primärmetall und zumindest einer Eisenverbindung, insbesondere einem Eisensalz als Sekundärmetall besteht.
Die Erfindung ist dadurch gekennzeichnet, dass es - zur Abscheidung einer Pd/Fe-Legierung mit einem Gehalt von 5-15 Gew-% Fe - als wässerige, alkalisch reagierende Lösung, insbesondere mit einem pH-Wert von 7,5 bis 9, vorliegt und außer den Metall-Verbindungen, als wesentliche weitere Komponente zumindest ein Netzmittel, insbesondere aus der Gruppe der amphoteren Tenside, und zusätzlich mindestens einen der in galvanischen Palladiumbädern in üblicher Weise enthaltenen Glanzzusatz sowie Leitsalze, insbesondere pH-Stabilisatoren und insbesondere Spannungsverminderer enthält, wobei das Elektrolytbad frei von Ammoniak und Ammoniumverbindungen ist.
EP16156476.0A 2015-03-09 2016-02-19 Abscheidung von dekorativen palladium-eisen-legierungsbeschichtungen auf metallischen substanzen Active EP3067444B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ATA50188/2015A AT516876B1 (de) 2015-03-09 2015-03-09 Abscheidung von dekorativen Palladium-Eisen-Legierungsbeschichtungen auf metallischen Substanzen

Publications (3)

Publication Number Publication Date
EP3067444A2 EP3067444A2 (de) 2016-09-14
EP3067444A3 true EP3067444A3 (de) 2016-12-07
EP3067444B1 EP3067444B1 (de) 2019-03-27

Family

ID=60153001

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EP16156476.0A Active EP3067444B1 (de) 2015-03-09 2016-02-19 Abscheidung von dekorativen palladium-eisen-legierungsbeschichtungen auf metallischen substanzen

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EP (1) EP3067444B1 (de)
AT (1) AT516876B1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT522158B1 (de) * 2019-05-03 2020-09-15 Iwg Ing W Garhoefer Ges M B H Beschichtungssystem zum Aufbringen durch galvanische Abscheidung auf einen Rohling
US10612149B1 (en) 2019-09-05 2020-04-07 Chow Sang Sang Jewellery Company Limited Platinum electrodeposition bath and uses thereof
AT523922B1 (de) * 2020-09-08 2022-01-15 Iwg Ing W Garhoefer Ges M B H Elektrolytbad für Palladium-Ruthenium-Beschichtungen

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2741347A1 (de) * 1976-09-17 1978-03-23 Parker Ste Continentale Bad und verfahren zur elektrolytischen abscheidung von legierungen auf der basis von palladium
JP2001181887A (ja) * 1999-12-24 2001-07-03 Bikutoria:Kk パラジウム／鉄合金メッキ液及びパラジウム合金メッキ基材
EP1396559A1 (de) * 1999-10-27 2004-03-10 Kojima Chemicals Co., Ltd Palladium-platierungslösung
EP2192210A1 (de) * 2008-11-21 2010-06-02 Umicore Galvanotechnik GmbH Edelmetallhaltige Schichtfolge für dekorative Artikel

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2657925A1 (de) 1976-12-21 1978-06-22 Siemens Ag Ammoniakfreies, waessriges bad zur galvanischen abscheidung von palladium bzw. palladiumlegierungen
DE2906783A1 (de) * 1979-02-22 1980-10-16 Degussa Verfahren zur vorbehandlung von leichtmetallen vor dem galvanisieren
DE19512888A1 (de) * 1995-04-06 1996-10-10 Vacuumschmelze Gmbh Verfahren zur elektrolytischen Beschichtung von Seltene Erden enthaltenden Dauermagneten mit minimaler Oberflächenschädigung
JPH1046384A (ja) 1996-05-10 1998-02-17 Lucent Technol Inc パラジウム合金メッキ浴
US6251249B1 (en) * 1996-09-20 2001-06-26 Atofina Chemicals, Inc. Precious metal deposition composition and process
JP3601005B2 (ja) 1999-10-27 2004-12-15 小島化学薬品株式会社 パラジウムめっき液
KR101234429B1 (ko) * 2006-01-06 2013-02-18 엔쏜 인코포레이티드 무광택 금속층을 침착하기 위한 전해질 및 방법
JP5586587B2 (ja) * 2008-05-07 2014-09-10 ユミコア ガルヴァノテヒニク ゲゼルシャフト ミット ベシュレンクテル ハフツング Ｐｄ電解質浴およびＰｄ−Ｎｉ電解質浴
DE102009055828A1 (de) * 2008-12-19 2010-07-01 Merck Patent Gmbh Verfahren zur Herstellung metallbeschichteter Partikel

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2741347A1 (de) * 1976-09-17 1978-03-23 Parker Ste Continentale Bad und verfahren zur elektrolytischen abscheidung von legierungen auf der basis von palladium
EP1396559A1 (de) * 1999-10-27 2004-03-10 Kojima Chemicals Co., Ltd Palladium-platierungslösung
JP2001181887A (ja) * 1999-12-24 2001-07-03 Bikutoria:Kk パラジウム／鉄合金メッキ液及びパラジウム合金メッキ基材
EP2192210A1 (de) * 2008-11-21 2010-06-02 Umicore Galvanotechnik GmbH Edelmetallhaltige Schichtfolge für dekorative Artikel

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
HERNANDEZ S C ET AL: "Electrodeposition of iron-palladium thin films", ELECTROCHIMICA ACTA, ELSEVIER SCIENCE PUBLISHERS, BARKING, GB, vol. 53, no. 18, 20 July 2008 (2008-07-20), pages 5621 - 5627, XP022655646, ISSN: 0013-4686, [retrieved on 20080318], DOI: 10.1016/J.ELECTACTA.2008.03.001 *

Also Published As

Publication number Publication date
EP3067444B1 (de) 2019-03-27
AT516876B1 (de) 2016-11-15
EP3067444A2 (de) 2016-09-14
AT516876A1 (de) 2016-09-15

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