MX2018005179A - Material de terminal de cobre chapado en estaño, terminal, y estructura de parte de terminal de cable. - Google Patents
Material de terminal de cobre chapado en estaño, terminal, y estructura de parte de terminal de cable.Info
- Publication number
- MX2018005179A MX2018005179A MX2018005179A MX2018005179A MX2018005179A MX 2018005179 A MX2018005179 A MX 2018005179A MX 2018005179 A MX2018005179 A MX 2018005179A MX 2018005179 A MX2018005179 A MX 2018005179A MX 2018005179 A MX2018005179 A MX 2018005179A
- Authority
- MX
- Mexico
- Prior art keywords
- terminal
- tin
- layer
- zinc
- part structure
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C18/00—Alloys based on zinc
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
- C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/10—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
- H01R4/18—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping
- H01R4/183—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping for cylindrical elongated bodies, e.g. cables having circular cross-section
- H01R4/184—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping for cylindrical elongated bodies, e.g. cables having circular cross-section comprising a U-shaped wire-receiving portion
- H01R4/185—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping for cylindrical elongated bodies, e.g. cables having circular cross-section comprising a U-shaped wire-receiving portion combined with a U-shaped insulation-receiving portion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
- H01R4/62—Connections between conductors of different materials; Connections between or with aluminium or steel-core aluminium conductors
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/22—Electroplating: Baths therefor from solutions of zinc
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
Landscapes
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Non-Insulated Conductors (AREA)
- Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
Sobre un elemento base 2 hecho de cobre o de una aleación de cobre, una capa de aleación de cinc-níquel 4 que incluye cinc y níquel, y una capa de estaño 5 hecha de una aleación de estaño están laminadas en este orden: la capa de aleación de cinc-níquel 4 tiene un grosor que es de 0.1 um a 5.0 um inclusive y tiene un contenido de níquel que desde el 5% en masa hasta el 50% en masa inclusive, la capa de estaño tiene una concentración de cinc que es desde el 0.6% en masa hasta el 15% en masa inclusive, y por debajo de la capa de óxido 6 misma que es la capa más externa, una capa metálica de cinc 7 teniendo una concentración de cinc que es desde el 5% hasta el 40% inclusive y un grosor que va de 1nm inclusive, en la conversión del SiO2 es formada en la capa de estaño.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015232465 | 2015-11-27 | ||
JP2016066515 | 2016-03-29 | ||
PCT/JP2016/084690 WO2017090638A1 (ja) | 2015-11-27 | 2016-11-24 | 錫めっき付銅端子材及び端子並びに電線端末部構造 |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2018005179A true MX2018005179A (es) | 2018-11-09 |
Family
ID=58763218
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2018005179A MX2018005179A (es) | 2015-11-27 | 2016-11-24 | Material de terminal de cobre chapado en estaño, terminal, y estructura de parte de terminal de cable. |
Country Status (9)
Country | Link |
---|---|
US (1) | US11088472B2 (es) |
EP (1) | EP3382814A4 (es) |
JP (2) | JP6304447B2 (es) |
KR (1) | KR102537039B1 (es) |
CN (1) | CN108352639B (es) |
MX (1) | MX2018005179A (es) |
MY (1) | MY185288A (es) |
TW (1) | TWI704580B (es) |
WO (1) | WO2017090638A1 (es) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6226037B2 (ja) * | 2015-12-15 | 2017-11-08 | 三菱マテリアル株式会社 | 錫めっき付き銅端子材の製造方法 |
JP6743756B2 (ja) * | 2016-05-10 | 2020-08-19 | 三菱マテリアル株式会社 | 錫めっき付銅端子材及び端子並びに電線端末部構造 |
JP6815876B2 (ja) * | 2017-01-20 | 2021-01-20 | 古河電気工業株式会社 | 嵌合型端子 |
MX2019009049A (es) | 2017-01-30 | 2019-11-12 | Mitsubishi Materials Corp | Material de terminal para conectores, terminal y estructura de terminacion de cable electrico. |
JP6686965B2 (ja) | 2017-05-16 | 2020-04-22 | 三菱マテリアル株式会社 | 錫めっき付銅端子材及び端子並びに電線端末部構造 |
JP6930327B2 (ja) * | 2017-06-30 | 2021-09-01 | 三菱マテリアル株式会社 | 防食端子材とその製造方法、及び防食端子並びに電線端末部構造 |
JP6946884B2 (ja) * | 2017-06-30 | 2021-10-13 | 三菱マテリアル株式会社 | 防食端子材とその製造方法、及び防食端子並びに電線端末部構造 |
CN110997984B (zh) * | 2017-07-28 | 2022-04-26 | 三菱综合材料株式会社 | 镀锡铜端子材、端子及电线终端部结构 |
KR102584014B1 (ko) * | 2017-10-30 | 2023-09-27 | 미쓰비시 마테리알 가부시키가이샤 | 방식 단자재 및 방식 단자 그리고 전선 단말부 구조 |
DE102018109059B4 (de) * | 2018-01-15 | 2020-07-23 | Doduco Solutions Gmbh | Elektrischer Einpress-Kontaktstift |
JP2019137894A (ja) * | 2018-02-13 | 2019-08-22 | 三菱マテリアル株式会社 | 防食端子材及びその製造方法並びに防食端子 |
FR3081721B1 (fr) * | 2018-06-01 | 2022-04-15 | Arkema France | Procede de preparation d'un sel de lithium de bis(fluorosulfonyl)imide |
CN109326532B (zh) * | 2018-09-30 | 2019-11-01 | 深圳市创智成功科技有限公司 | 一种半导体制造工艺中焊锡防腐蚀的处理方法 |
JP6876025B2 (ja) * | 2018-10-22 | 2021-05-26 | 矢崎総業株式会社 | 端子金具 |
JP7226210B2 (ja) * | 2019-09-19 | 2023-02-21 | 株式会社オートネットワーク技術研究所 | ピン端子、コネクタ、コネクタ付きワイヤーハーネス、及びコントロールユニット |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000144482A (ja) | 1998-09-11 | 2000-05-26 | Nippon Mining & Metals Co Ltd | 金属材料 |
WO2000015876A1 (fr) * | 1998-09-11 | 2000-03-23 | Nippon Mining & Metals Co., Ltd. | Materiau metallique |
EP1369504A1 (en) * | 2002-06-05 | 2003-12-10 | Hille & Müller | Metal strip for the manufacture of components for electrical connectors |
JP4477295B2 (ja) | 2002-10-10 | 2010-06-09 | 古河電気工業株式会社 | 自動車ワイヤハーネス用アルミ電線 |
JP4402132B2 (ja) * | 2007-05-18 | 2010-01-20 | 日鉱金属株式会社 | リフローSnめっき材及びそれを用いた電子部品 |
JP4940081B2 (ja) * | 2007-09-28 | 2012-05-30 | Jx日鉱日石金属株式会社 | リフローSnめっき材及びそれを用いた電子部品 |
JP4848040B2 (ja) | 2010-04-08 | 2011-12-28 | 株式会社オートネットワーク技術研究所 | ワイヤーハーネスの端末構造 |
KR20130139363A (ko) * | 2011-05-10 | 2013-12-20 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | Ni 도금 금속판, 용접 구조체, 및 전지용 재료의 제조 방법 |
JP2013033656A (ja) | 2011-08-02 | 2013-02-14 | Yazaki Corp | 端子 |
JP5138827B1 (ja) | 2012-03-23 | 2013-02-06 | Jx日鉱日石金属株式会社 | 電子部品用金属材料、それを用いたコネクタ端子、コネクタ及び電子部品 |
JP5817700B2 (ja) * | 2012-04-23 | 2015-11-18 | 株式会社オートネットワーク技術研究所 | 端子および端子付き電線 |
JP6221695B2 (ja) * | 2013-03-25 | 2017-11-01 | 三菱マテリアル株式会社 | 挿抜性に優れた錫めっき銅合金端子材 |
EP2799595A1 (de) * | 2013-05-03 | 2014-11-05 | Delphi Technologies, Inc. | Elektrisches Kontaktelement |
JP5962707B2 (ja) | 2013-07-31 | 2016-08-03 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用銅合金塑性加工材の製造方法、電子・電気機器用部品及び端子 |
JP6012564B2 (ja) * | 2013-08-27 | 2016-10-25 | Jx金属株式会社 | 電子部品用金属材料及びその製造方法、それを用いたコネクタ端子、コネクタ及び電子部品 |
JP2015133306A (ja) | 2014-01-16 | 2015-07-23 | 株式会社オートネットワーク技術研究所 | コネクタ用電気接点材料及びその製造方法 |
JP6740635B2 (ja) * | 2015-03-13 | 2020-08-19 | 三菱マテリアル株式会社 | 錫めっき付銅端子材及びその製造方法並びに電線端末部構造 |
JP6743756B2 (ja) * | 2016-05-10 | 2020-08-19 | 三菱マテリアル株式会社 | 錫めっき付銅端子材及び端子並びに電線端末部構造 |
-
2016
- 2016-11-24 MX MX2018005179A patent/MX2018005179A/es unknown
- 2016-11-24 MY MYPI2018701817A patent/MY185288A/en unknown
- 2016-11-24 EP EP16868581.6A patent/EP3382814A4/en active Pending
- 2016-11-24 WO PCT/JP2016/084690 patent/WO2017090638A1/ja active Application Filing
- 2016-11-24 JP JP2017513159A patent/JP6304447B2/ja active Active
- 2016-11-24 KR KR1020187016681A patent/KR102537039B1/ko active IP Right Grant
- 2016-11-24 US US15/774,402 patent/US11088472B2/en active Active
- 2016-11-24 CN CN201680064882.5A patent/CN108352639B/zh active Active
- 2016-11-25 TW TW105138880A patent/TWI704580B/zh active
-
2017
- 2017-12-05 JP JP2017233041A patent/JP2018078109A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2017090638A1 (ja) | 2017-06-01 |
MY185288A (en) | 2021-04-30 |
TWI704580B (zh) | 2020-09-11 |
US11088472B2 (en) | 2021-08-10 |
CN108352639B (zh) | 2020-05-12 |
JP2018078109A (ja) | 2018-05-17 |
JP6304447B2 (ja) | 2018-04-04 |
CN108352639A (zh) | 2018-07-31 |
KR102537039B1 (ko) | 2023-05-25 |
EP3382814A4 (en) | 2019-09-04 |
US20200259274A1 (en) | 2020-08-13 |
TW201732839A (zh) | 2017-09-16 |
EP3382814A1 (en) | 2018-10-03 |
JPWO2017090638A1 (ja) | 2017-11-30 |
KR20180083379A (ko) | 2018-07-20 |
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