KR100818534B1 - 칩-형 전자 부품 및 그 제조 방법 및 그 제조에 사용하는 유사 웨이퍼 및 그 제조 방법 - Google Patents
칩-형 전자 부품 및 그 제조 방법 및 그 제조에 사용하는 유사 웨이퍼 및 그 제조 방법 Download PDFInfo
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- KR100818534B1 KR100818534B1 KR1020010022004A KR20010022004A KR100818534B1 KR 100818534 B1 KR100818534 B1 KR 100818534B1 KR 1020010022004 A KR1020010022004 A KR 1020010022004A KR 20010022004 A KR20010022004 A KR 20010022004A KR 100818534 B1 KR100818534 B1 KR 100818534B1
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Abstract
Description
도 3은 도 14에 도시된 반도체 웨이퍼(53)로부터 절단된 무-결점 반도체 베어 칩(3)(또는 LSI 칩)만을 갖는 중간 웨이퍼(intermediate wafer)는 오픈/쇼트(open/short) 또는 DC 전압 측정내의 특성에 적용되도록 변형되고, 서로 동일한 거리로 배열되고, 아크릴계 등으로 만들어진 점착 시트(2)를 통해 원형 석영 기판(1)상에 장착된다. 또, 도 4에서, 대형 원형 글래스 기판(19)은 점착 시트(2)를 통해 관련 한정 영역에 접착하기 위해 더 많은 수의 무-결점 칩(3)을 허용하도록 원형의 석영 기판(1) 대신에 이용되고, 그 후의 처리에서 향상된 가격 메리트를 발휘할 수 있도록 한 것이다.
Claims (20)
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- 적어도 전극들이 하나의 표면상에만 형성된 다수 개의 또는 다수의 다른 종류의 칩-형 전자 부품들을 포함하는 유사 웨이퍼(pseudo wafer)로서,상기 다수 개의 또는 상기 다수의 다른 종류의 칩-형 전자 부품들간의 공간들 및 상기 부품들의 하부 표면들이 보호 물질로 연속적으로 덮여 있고 서로 접합되고,상기 유사 웨이퍼상에 배열된 상기 다수 개의 또는 상기 다수의 다른 종류의 반도체 칩들이 상기 다수 개의 반도체 칩들 사이의 상기 보호 물질의 위치에서 절단되고, 실장 기판상에 장착될 다수 개의 또는 다수의 다른 종류의 반도체 칩들을 집적하는 집적 반도체 칩 또는 별개의 칩으로 가공되는, 유사 웨이퍼.
- 제 8 항에 있어서,납땜 범프는 상기 전극상에 형성되는, 유사 웨이퍼.
- 칩-형 전자 부품을 제조하는 방법에 있어서,처리 전에 점착 강도를 유지하고, 상기 처리 이후에는 상기 점착 강도를 잃는 특성을 갖는 점착 물질을 기판상에 접착하는 단계;전극 표면을 아래로 향하게 하여, 다수 개의 또는 다수의 다른 종류의 반도체 칩들을 상기 점착 물질상에 고정하는 단계;상기 다수 개의 또는 상기 다수의 다른 종류의 반도체 칩들 및 그 사이의 공간들을 포함하는 전체 영역을 보호 물질로 코팅하는 단계;상기 보호 물질로 덮여진 상기 다수 개의 또는 상기 다수의 다른 종류의 반도체 칩들을 접합하는 유사 웨이퍼를 박리하기 위해, 상기 점착 물질의 상기 점착 강도가 약해지도록 상기 점착 물질에 미리 결정된 처리를 적용하는 단계; 및상기 다수 개의 또는 상기 다수의 다른 종류의 반도체 칩들을 그 사이의 상기 공간들의 상기 보호 물질을 자름으로써 절단하여, 별개의 반도체 칩 또는 칩-형 전자 부품을 얻는 단계를 포함하는 칩-형 전자 부품 제조 방법.
- 제 10 항에 있어서,상기 기판은 평평한 표면을 갖고;상기 점착 물질은 점착 시트이고;상기 다수 개의 또는 상기 다수의 다른 종류의 반도체 칩들은 무-결점(non-detective)이고;상기 보호 물질은 유기 절연 수지 또는 무기 절연 물질이고, 단단하게 되도록 상기 다수 개의 반도체 칩들의 하부 표면으로부터 상기 다수 개의 반도체 칩들상에 균일하게 코팅되고;상기 미리 결정된 처리는, 상기 다수 개의 반도체 칩들을 접합하는 표면의 반대편인 상기 평평한 기판의 하부 표면으로부터 상기 평평한 기판을 통해 상기 점착 시트상에 자외선을 조사하거나, 또는 화학 용액을 가하거나 또는 가열하는 것을 포함하여, 상기 점착 시트의 점착 강도를 약하게 하여 상기 보호 물질로 덮여서 접합된 상기 다수 개의 또는 다수의 다른 종류의 반도체 칩들을 가진 유사 웨이퍼를 상기 평평한 기판으로부터 박리함으로써, 상기 유사 웨이퍼를 얻고, 전체적으로 무-결점(일치)인 상기 다수 개의 또는 상기 다수의 다른 종류의 반도체 칩들이 전극 표면들이 노출되어 상기 유사 웨이퍼상에 배열되며;상기 다수 개의 반도체 칩 또는 상기 다수의 다른 종류의 반도체 칩 사이에서 상기 유사 웨이퍼는 절단되는, 칩-형 전자 부품 제조 방법.
- 제 10 항에 있어서,상기 유사 웨이퍼는 상기 다수 개의 또는 상기 다수의 다른 종류의 반도체 칩들 사이의 상기 보호 물질의 위치에서 절단되고; 및실장 기판에 장착될 다수 개의 또는 다수의 다른 종류의 반도체 칩들을 집적하는 집적 칩 또는 별개의 반도체 칩이 얻어지는, 칩-형 전자 부품 제조 방법.
- 제 12 항에 있어서,납땜 범프는 상기 전극들상에 있는, 칩-형 전자 부품 제조 방법.
- 제 10 항에 있어서,특성 측정에서 무-결점으로 결정된 상기 다수 개의 반도체 칩들이 상기 기판상에 단단하게 고정되는, 칩-형 전자 부품 제조 방법.
- 제 10 항에 있어서,상기 기판상에 단단하게 고정되고 상기 보호 물질로 접합된 상태의 상기 다수 개의 반도체 칩들의 특성 측정을 수행하는 단계; 및무-결점 반도체 칩들 또는 무-결점 칩-형 전자 부품들을 선택하는 단계를 더 포함하는 칩-형 전자 부품 제조 방법.
- 유사 웨이퍼를 제조하는 방법에 있어서,처리 전에 점착 강도를 유지하고 상기 처리 이후에는 상기 점착 강도를 잃는 특성을 갖는 점착 물질을 기판상에 접착하는 단계;전극 표면들을 아래로 향하게 하여, 다수 개의 또는 다수의 다른 종류의 반도체 칩들을 상기 점착 물질상에 고정하는 단계;상기 다수 개의 또는 상기 다수의 다른 종류의 반도체 칩들 및 그 사이의 공간들을 포함하는 전체 영역을 보호 물질로 코팅하는 단계;상기 점착 물질의 상기 점착 강도를 잃도록, 상기 점착 물질에 미리 결정된 처리를 적용하는 단계; 및상기 유사 웨이퍼상에 고정된 상기 다수 개의 또는 상기 다수의 다른 종류의 반도체 칩들을 갖는 유사 웨이퍼를 박리하는 단계를 포함하는 유사 웨이퍼 제조 방법.
- 제 16 항에 있어서,상기 기판은 평평한 표면을 갖고;상기 점착 물질은 점착 시트이고;상기 다수 개의 또는 상기 다수의 다른 종류의 반도체 칩들은 무-결점이고;상기 보호 물질은 유기 절연 수지 또는 무기 절연 물질이고, 단단하게 되도록 상기 반도체 칩들의 하부 표면들로부터 상기 반도체 칩들상에 균일하게 코팅되고;상기 미리 결정된 처리는, 상기 다수 개의 또는 상기 다수의 다른 종류의 반도체 칩들을 고정하는 상기 기판의 표면의 반대편인 상기 기판의 하부 표면으로부터 상기 기판을 통해 상기 점착 시트상에 자외선을 조사하거나, 또는 화학 용액을 가하거나 또는 가열하는 것을 포함하여, 상기 점착 시트의 점착 강도를 약하게 하여 상기 보호 물질로 접합된 상기 다수 개의 또는 다수의 다른 종류의 반도체 칩들을 가진 유사 웨이퍼를 상기 기판으로부터 박리하고;이에 의해 무-결점이고 전극 표면들을 노출하여 상기 유사 웨이퍼상에 배열된 상기 다수 개의 또는 상기 다수의 다른 종류의 반도체 칩들을 갖는 유사 웨이퍼를 얻는, 유사 웨이퍼 제조 방법.
- 제 16 항에 있어서,상기 납땜 범프는 상기 전극상에 형성되는, 유사 웨이퍼 제조 방법.
- 제 16 항에 있어서,특성 측정에서 무-결점으로 결정된 상기 반도체 칩들이 상기 기판상에 고정되는, 유사 웨이퍼 제조 방법.
- 제 16 항에 있어서,상기 보호 물질로 접합된 상태의 상기 반도체 칩들의 특성 측정을 수행하는 단계; 및무-결점 반도체 칩들 또는 무-결점 칩-형 전자 부품들을 선택하는 단계를 더 포함하는 유사 웨이퍼 부품 제조 방법.
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JP4403631B2 (ja) | 2010-01-27 |
DE60109983D1 (de) | 2005-05-19 |
KR20010098833A (ko) | 2001-11-08 |
EP1150552A3 (en) | 2003-05-28 |
US6936525B2 (en) | 2005-08-30 |
EP1150552B1 (en) | 2005-04-13 |
EP1150552A2 (en) | 2001-10-31 |
JP2001308116A (ja) | 2001-11-02 |
DE60109983T2 (de) | 2006-02-23 |
US20020011655A1 (en) | 2002-01-31 |
TWI239056B (en) | 2005-09-01 |
US20030092252A1 (en) | 2003-05-15 |
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