KR100741449B1 - 접착 보조제 부착 금속박, 인쇄 배선판 및 인쇄 배선판의제조 방법 - Google Patents

접착 보조제 부착 금속박, 인쇄 배선판 및 인쇄 배선판의제조 방법 Download PDF

Info

Publication number
KR100741449B1
KR100741449B1 KR1020050007902A KR20050007902A KR100741449B1 KR 100741449 B1 KR100741449 B1 KR 100741449B1 KR 1020050007902 A KR1020050007902 A KR 1020050007902A KR 20050007902 A KR20050007902 A KR 20050007902A KR 100741449 B1 KR100741449 B1 KR 100741449B1
Authority
KR
South Korea
Prior art keywords
metal foil
adhesion
layer
resin
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020050007902A
Other languages
English (en)
Korean (ko)
Other versions
KR20050078228A (ko
Inventor
겐지 다까이
노리오 모리이께
겐이찌 가미야마
다까꼬 와따나베
신 다까네자와
고지 모리따
가쯔유끼 마스다
기요시 하세가와
Original Assignee
히다치 가세고교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004024456A external-priority patent/JP4913328B2/ja
Priority claimed from JP2004116726A external-priority patent/JP4345554B2/ja
Application filed by 히다치 가세고교 가부시끼가이샤 filed Critical 히다치 가세고교 가부시끼가이샤
Publication of KR20050078228A publication Critical patent/KR20050078228A/ko
Application granted granted Critical
Publication of KR100741449B1 publication Critical patent/KR100741449B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B66—HOISTING; LIFTING; HAULING
    • B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
    • B66C3/00—Load-engaging elements or devices attached to lifting or lowering gear of cranes or adapted for connection therewith and intended primarily for transmitting lifting forces to loose materials; Grabs
    • B66C3/02—Bucket grabs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B66—HOISTING; LIFTING; HAULING
    • B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
    • B66C13/00—Other constructional features or details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2804—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020050007902A 2004-01-30 2005-01-28 접착 보조제 부착 금속박, 인쇄 배선판 및 인쇄 배선판의제조 방법 Expired - Lifetime KR100741449B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004024456A JP4913328B2 (ja) 2004-01-30 2004-01-30 接着補助剤付金属箔及びそれを用いたプリント配線板
JPJP-P-2004-00024456 2004-01-30
JP2004116726A JP4345554B2 (ja) 2004-04-12 2004-04-12 絶縁層と絶縁層の間に接着補助層を有するプリント配線板およびその製造方法
JPJP-P-2004-00116726 2004-04-12

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020070026304A Division KR100741615B1 (ko) 2004-01-30 2007-03-16 접착 보조제 부착 금속박, 인쇄 배선판 및 인쇄 배선판의제조 방법

Publications (2)

Publication Number Publication Date
KR20050078228A KR20050078228A (ko) 2005-08-04
KR100741449B1 true KR100741449B1 (ko) 2007-07-23

Family

ID=34921634

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020050007902A Expired - Lifetime KR100741449B1 (ko) 2004-01-30 2005-01-28 접착 보조제 부착 금속박, 인쇄 배선판 및 인쇄 배선판의제조 방법
KR1020070026304A Expired - Lifetime KR100741615B1 (ko) 2004-01-30 2007-03-16 접착 보조제 부착 금속박, 인쇄 배선판 및 인쇄 배선판의제조 방법
KR1020070027999A Expired - Fee Related KR100767177B1 (ko) 2004-01-30 2007-03-22 접착 보조제 부착 금속박, 인쇄 배선판 및 인쇄 배선판의제조 방법

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020070026304A Expired - Lifetime KR100741615B1 (ko) 2004-01-30 2007-03-16 접착 보조제 부착 금속박, 인쇄 배선판 및 인쇄 배선판의제조 방법
KR1020070027999A Expired - Fee Related KR100767177B1 (ko) 2004-01-30 2007-03-22 접착 보조제 부착 금속박, 인쇄 배선판 및 인쇄 배선판의제조 방법

Country Status (4)

Country Link
US (3) US7629045B2 (https=)
KR (3) KR100741449B1 (https=)
CN (1) CN1662120B (https=)
TW (2) TW200721932A (https=)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI410187B (zh) * 2005-12-06 2013-09-21 Isola Usa Corp 用於高速及高頻印刷電路板之層壓板
CN103124474B (zh) * 2006-04-25 2017-11-28 日立化成株式会社 带粘接层的导体箔、贴有导体的层叠板、印制线路板及多层线路板
EP2146355A1 (en) 2007-05-09 2010-01-20 Hitachi Chemical Company, Ltd. Conductor connection member, connection structure, and solar cell module
CN101669258B (zh) * 2007-05-09 2016-04-13 日立化成株式会社 导电体的连接方法、导电体连接用部件、连接结构及太阳能电池模块
US7605460B1 (en) * 2008-02-08 2009-10-20 Xilinx, Inc. Method and apparatus for a power distribution system
TWI461848B (zh) * 2008-03-28 2014-11-21 富士軟片股份有限公司 正型感光性樹脂組成物及使用它的硬化膜形成方法
CN101983126B (zh) * 2008-04-04 2015-07-15 日立化成工业株式会社 双片层合且单面贴有金属箔的层叠板及其制造方法、以及单面印制电路板及其制造方法
US8240036B2 (en) 2008-04-30 2012-08-14 Panasonic Corporation Method of producing a circuit board
TWI347807B (en) * 2008-05-13 2011-08-21 Unimicron Technology Corp Electrically interconnect structure and process thereof and circuit board structure
JP5561279B2 (ja) * 2009-09-02 2014-07-30 パナソニック株式会社 プリント配線板、ビルドアップ多層基板とその製造方法
JP5428667B2 (ja) * 2009-09-07 2014-02-26 日立化成株式会社 半導体チップ搭載用基板の製造方法
EP2496061A4 (en) 2009-10-30 2014-01-08 Panasonic Corp CIRCUIT BOARD AND SEMICONDUCTOR DEVICE WITH A COMPONENT MOUNTED ON A PCB
US9332642B2 (en) * 2009-10-30 2016-05-03 Panasonic Corporation Circuit board
KR101161971B1 (ko) * 2010-07-21 2012-07-04 삼성전기주식회사 다층 회로 기판 및 다층 회로 기판의 제조 방법
US8617990B2 (en) 2010-12-20 2013-12-31 Intel Corporation Reduced PTH pad for enabling core routing and substrate layer count reduction
WO2013115069A1 (ja) * 2012-01-31 2013-08-08 三菱瓦斯化学株式会社 プリント配線板材料用樹脂組成物、並びにそれを用いたプリプレグ、樹脂シート、金属箔張積層板及びプリント配線板
CN102664114B (zh) * 2012-05-28 2015-07-08 山东数智体育设备有限公司 塑胶组合式触板
US10323126B2 (en) * 2012-11-28 2019-06-18 Hitachi Chemical Company, Ltd. Siloxane compound, modified imide resin, thermosetting resin composition, prepreg, film with resin, laminated plate, multilayer printed wiring board, and semiconductor package
KR101397221B1 (ko) * 2013-05-30 2014-05-20 삼성전기주식회사 열전도도 및 전기적 특성이 우수한 인쇄회로기판용 절연 수지 조성물, 절연필름, 프리프레그 및 인쇄회로기판
CN103384453B (zh) * 2013-07-11 2016-05-11 电子科技大学 一种印制电路内层可靠孔和线的加工方法
CN104684265B (zh) * 2013-12-02 2018-01-26 深南电路有限公司 一种电路板表面电镀的方法
TWI667276B (zh) * 2014-05-29 2019-08-01 美商羅傑斯公司 具改良耐燃劑系統之電路物質及由其形成之物件
CN104411093A (zh) * 2014-11-05 2015-03-11 深圳市新宇腾跃电子有限公司 一种单面柔性电路板的生产工艺
JP6184613B2 (ja) * 2014-12-17 2017-08-23 三井化学株式会社 基板中間体、貫通ビア電極基板および貫通ビア電極形成方法
KR101753225B1 (ko) 2015-06-02 2017-07-19 에더트로닉스코리아 (주) Ｌｄｓ 공법을 이용한 적층 회로 제작 방법
WO2017033713A1 (ja) * 2015-08-21 2017-03-02 住友電気工業株式会社 プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法
CN106626580B (zh) 2015-10-28 2019-12-24 财团法人工业技术研究院 复合积层板
US10233365B2 (en) 2015-11-25 2019-03-19 Rogers Corporation Bond ply materials and circuit assemblies formed therefrom
JP6246857B2 (ja) * 2016-05-24 2017-12-13 Ｊｘ金属株式会社 ロール状積層体、ロール状積層体の製造方法、積層体の製造方法、ビルドアップ基板の製造方法、プリント配線板の製造方法、電子機器の製造方法
JPWO2018043682A1 (ja) * 2016-09-01 2019-06-24 Ａｇｃ株式会社 配線基板およびその製造方法
US11317507B2 (en) * 2018-03-09 2022-04-26 Arisawa Mfg. Co., Ltd. Laminate and method for manufacturing the same
US20190287872A1 (en) * 2018-03-19 2019-09-19 Intel Corporation Multi-use package architecture
CN110545625B (zh) * 2018-05-29 2021-11-02 鹏鼎控股(深圳)股份有限公司 柔性电路板及所述柔性电路板的制作方法
KR102109636B1 (ko) * 2018-07-19 2020-05-12 삼성전기주식회사 칩 인덕터 및 그 제조방법
CN109152222A (zh) * 2018-09-19 2019-01-04 中山市瑞宝电子科技有限公司 一种新型褪膜方法
US10827627B2 (en) * 2019-03-21 2020-11-03 Intel Corporation Reduction of insertion loss in printed circuit board signal traces

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01276789A (ja) * 1988-04-28 1989-11-07 Mitsubishi Cable Ind Ltd 金属ベース基板
JPH04207097A (ja) * 1990-11-30 1992-07-29 Nitto Denko Corp フレキシブル配線板
JPH0557835A (ja) * 1991-09-03 1993-03-09 Matsushita Electric Works Ltd 金属箔張り積層板
JPH07329246A (ja) * 1994-06-08 1995-12-19 Hitachi Chem Co Ltd 金属張り積層板及びその製造法
JPH11214844A (ja) * 1998-01-27 1999-08-06 Matsushita Electric Works Ltd 多層板の製造方法

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2897186A (en) * 1956-02-21 1959-07-28 Pharma Chemical Corp Diazoamino dye intermediates
US3661863A (en) * 1970-06-11 1972-05-09 Phillips Petroleum Co Copoly(amide-imide)s comprising the reaction product of a diacid,a triacid and bis(4-aminocyclohexyl)methane
US3827927A (en) * 1971-12-30 1974-08-06 Trw Inc Method of bonding using improved polyimide adhesives
JPH0710967B2 (ja) * 1985-02-04 1995-02-08 日立化成工業株式会社 印刷配線板基板用接着剤
US5212244A (en) * 1987-11-04 1993-05-18 Hitachi, Ltd. Thermosetting resin composition, and prepreg and laminated sheet which use the same
US5153987A (en) * 1988-07-15 1992-10-13 Hitachi Chemical Company, Ltd. Process for producing printed wiring boards
US5053280A (en) * 1988-09-20 1991-10-01 Hitachi-Chemical Co., Ltd. Adhesive composition for printed wiring boards with acrylonitrile-butadiene rubber having carboxyl groups and 20 ppm or less metal ionic impurities; an alkyl phenol resin; an epoxy resin; palladium catalyst, and coupling agent
JPH04182466A (ja) 1990-11-19 1992-06-30 Mitsubishi Gas Chem Co Inc ビストリメリティックイミド類の製造方法
JPH0787270B2 (ja) * 1992-02-19 1995-09-20 日鉱グールド・フォイル株式会社 印刷回路用銅箔及びその製造方法
JP3346495B2 (ja) 1992-08-07 2002-11-18 日立化成工業株式会社 フォトビア形成用感光性エレメント及び多層配線板の製造法
JPH06116517A (ja) 1992-10-02 1994-04-26 Hitachi Chem Co Ltd 導電性ペースト組成物およびその製造法
JP2717911B2 (ja) * 1992-11-19 1998-02-25 日鉱グールド・フォイル株式会社 印刷回路用銅箔及びその製造方法
JP3067512B2 (ja) 1993-03-30 2000-07-17 新神戸電機株式会社 金属箔張り積層板の製造法およびその製造に用いる金属箔
US5622782A (en) * 1993-04-27 1997-04-22 Gould Inc. Foil with adhesion promoting layer derived from silane mixture
TW326423B (en) 1993-08-06 1998-02-11 Gould Inc Metallic foil with adhesion promoting layer
US5419946A (en) * 1993-09-30 1995-05-30 Hitachi Chemical Co., Ltd. Adhesive for printed wiring board and production thereof
JP3534194B2 (ja) 1994-01-31 2004-06-07 日立化成工業株式会社 金属薄層付き絶縁基板の製造法
JPH08302161A (ja) * 1995-05-10 1996-11-19 Hitachi Chem Co Ltd 樹脂組成物及びその樹脂組成物をケミカルエッチングする方法
JP2778569B2 (ja) 1996-01-22 1998-07-23 日立エーアイシー株式会社 多層印刷配線板およびその製造方法
JPH104254A (ja) 1996-06-14 1998-01-06 Ibiden Co Ltd プリント配線板の製造方法
JPH10242635A (ja) 1997-02-25 1998-09-11 Hitachi Chem Co Ltd 金属ベース基板の製造方法
US6515370B2 (en) * 1997-03-10 2003-02-04 Seiko Epson Corporation Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit board
JP3975552B2 (ja) 1997-05-09 2007-09-12 大日本インキ化学工業株式会社 フェノール樹脂組成物及びフェノール樹脂の製造方法
US6596391B2 (en) * 1997-05-14 2003-07-22 Honeywell International Inc. Very ultra thin conductor layers for printed wiring boards
JPH1174641A (ja) 1997-08-29 1999-03-16 Kyocera Corp 多層配線基板
JP3651210B2 (ja) 1997-10-29 2005-05-25 日立化成工業株式会社 シロキサン含有ポリアミドイミド及びそれを含むワニス
US6565954B2 (en) * 1998-05-14 2003-05-20 Matsushita Electric Industrial Co., Ltd. Circuit board and method of manufacturing the same
EP1146101B1 (en) * 1998-12-22 2004-03-31 Hitachi Chemical Company, Ltd. Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same
JP3320670B2 (ja) 1999-03-10 2002-09-03 松下電工株式会社 エポキシ樹脂組成物、その製造方法、および樹脂付き金属箔、ならびにそれを用いた多層プリント配線板
JP3670185B2 (ja) * 2000-01-28 2005-07-13 三井金属鉱業株式会社 プリント配線板用表面処理銅箔の製造方法
JP3714399B2 (ja) 2000-06-19 2005-11-09 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2002012740A (ja) 2000-06-29 2002-01-15 Nippon Kayaku Co Ltd 難燃性エポキシ樹脂組成物及びその用途
US6380633B1 (en) * 2000-07-05 2002-04-30 Siliconware Predision Industries Co., Ltd. Pattern layout structure in substrate
JP2002084073A (ja) 2000-09-07 2002-03-22 Ibiden Co Ltd 多層プリント配線板および多層プリント配線板の製造方法
JP4863032B2 (ja) 2000-11-02 2012-01-25 日立化成工業株式会社 薄板状物品の加工方法とその加工方法を用いた接続基板の製造方法と接続基板と多層配線板の製造方法と多層配線板と半導体パッケージ用基板の製造方法と半導体パッケージ用基板と半導体パッケージの製造方法と半導体パッケージ
CN1195395C (zh) * 2001-01-30 2005-03-30 日鉱金属股份有限公司 积层板用铜合金箔
JP4900631B2 (ja) 2001-02-07 2012-03-21 Ｄｉｃ株式会社 エポキシ樹脂組成物
JP3434808B2 (ja) * 2001-05-31 2003-08-11 三井金属鉱業株式会社 樹脂付銅箔及びその樹脂付銅箔を用いたプリント配線板
KR100683086B1 (ko) * 2001-07-09 2007-02-16 가부시키가이샤 가네카 수지 조성물
WO2003022929A1 (en) * 2001-09-05 2003-03-20 Hitachi Chemical Co., Ltd. Flame-retardant heat-resistant resin composition and adhesive film comprising the same
JP4032712B2 (ja) 2001-11-22 2008-01-16 日立化成工業株式会社 プリント配線板の製造方法
JP2003198122A (ja) 2001-12-28 2003-07-11 Kanegafuchi Chem Ind Co Ltd 配線板の製造方法
JP4370074B2 (ja) 2002-02-04 2009-11-25 日本電解株式会社 プリント配線板用銅箔とその製造方法
JP4241098B2 (ja) 2002-03-05 2009-03-18 日立化成工業株式会社 金属張積層板、これを用いたプリント配線板およびその製造方法
JP2003264373A (ja) 2002-03-08 2003-09-19 Kanegafuchi Chem Ind Co Ltd プリント配線板用積層体
US6815126B2 (en) * 2002-04-09 2004-11-09 International Business Machines Corporation Printed wiring board with conformally plated circuit traces
JP2004014611A (ja) 2002-06-04 2004-01-15 Hitachi Chem Co Ltd 支持体付き絶縁フィルム、多層配線板およびその製造方法
JP4618969B2 (ja) 2002-07-11 2011-01-26 日本電解株式会社 多層プリント配線板の製造方法
JP4576794B2 (ja) 2003-02-18 2010-11-10 日立化成工業株式会社 絶縁樹脂組成物及びその使用
JP3949676B2 (ja) 2003-07-22 2007-07-25 三井金属鉱業株式会社 極薄接着剤層付銅箔及びその極薄接着剤層付銅箔の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01276789A (ja) * 1988-04-28 1989-11-07 Mitsubishi Cable Ind Ltd 金属ベース基板
JPH04207097A (ja) * 1990-11-30 1992-07-29 Nitto Denko Corp フレキシブル配線板
JPH0557835A (ja) * 1991-09-03 1993-03-09 Matsushita Electric Works Ltd 金属箔張り積層板
JPH07329246A (ja) * 1994-06-08 1995-12-19 Hitachi Chem Co Ltd 金属張り積層板及びその製造法
JPH11214844A (ja) * 1998-01-27 1999-08-06 Matsushita Electric Works Ltd 多層板の製造方法

Also Published As

Publication number Publication date
US7862889B2 (en) 2011-01-04
KR20050078228A (ko) 2005-08-04
KR20070036769A (ko) 2007-04-03
US20050202261A1 (en) 2005-09-15
TW200528002A (en) 2005-08-16
CN1662120B (zh) 2011-03-16
CN1662120A (zh) 2005-08-31
TWI282259B (en) 2007-06-01
US7629045B2 (en) 2009-12-08
US20090145766A1 (en) 2009-06-11
US20100051338A1 (en) 2010-03-04
KR100741615B1 (ko) 2007-07-23
TWI330058B (https=) 2010-09-01
KR20070041470A (ko) 2007-04-18
US8815334B2 (en) 2014-08-26
KR100767177B1 (ko) 2007-10-15
TW200721932A (en) 2007-06-01

Similar Documents

Publication Publication Date Title
KR100741615B1 (ko) 접착 보조제 부착 금속박, 인쇄 배선판 및 인쇄 배선판의제조 방법
KR100710119B1 (ko) 금속층의 수지층에의 형성 방법, 인쇄 배선판 및 그의제조 방법
KR100618511B1 (ko) 수지 부착 금속박, 금속 피복 적층판, 그를 이용한 프린트배선판 및 그의 제조 방법
JP4241098B2 (ja) 金属張積層板、これを用いたプリント配線板およびその製造方法
KR100910092B1 (ko) 접착 보조제 부착 금속박 및 이를 이용한 인쇄 배선판
JP4345554B2 (ja) 絶縁層と絶縁層の間に接着補助層を有するプリント配線板およびその製造方法
JP2008258636A (ja) 内層導体回路処理方法
JP4913328B2 (ja) 接着補助剤付金属箔及びそれを用いたプリント配線板
JP5002943B2 (ja) 接着補助剤付金属箔及びそれを用いたプリント配線板
JP2005167173A (ja) 金属上への絶縁樹脂層の形成方法、内層導体回路処理方法、プリント配線板の製造方法及び多層配線板
JP2005167172A (ja) プリント配線板及びその製造方法
JP2005223052A (ja) プリント配線板の製造方法
JP2009188429A5 (https=)
JP2009188429A (ja) プリント配線板及びその製造方法
JP5364972B2 (ja) プリント配線板の製造方法

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

A107 Divisional application of patent
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0107 Divisional application

St.27 status event code: A-0-1-A10-A18-div-PA0107

St.27 status event code: A-0-1-A10-A16-div-PA0107

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

G170 Re-publication after modification of scope of protection [patent]
PG1701 Publication of correction

St.27 status event code: A-5-5-P10-P19-oth-PG1701

Patent document republication publication date: 20080422

Republication note text: Request for Correction Notice (Document Request)

Gazette number: 1007414490000

Gazette reference publication date: 20070723

R17-X000 Change to representative recorded

St.27 status event code: A-5-5-R10-R17-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20130705

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20140707

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20150703

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20160705

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 15

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 16

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 17

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 18

PC1801 Expiration of term

St.27 status event code: N-4-6-H10-H14-oth-PC1801

Not in force date: 20250129

Ip right cessation event data comment text: Termination Category : EXPIRATION_OF_DURATION