CN103124474B - 带粘接层的导体箔、贴有导体的层叠板、印制线路板及多层线路板 - Google Patents
带粘接层的导体箔、贴有导体的层叠板、印制线路板及多层线路板 Download PDFInfo
- Publication number
- CN103124474B CN103124474B CN201310015573.7A CN201310015573A CN103124474B CN 103124474 B CN103124474 B CN 103124474B CN 201310015573 A CN201310015573 A CN 201310015573A CN 103124474 B CN103124474 B CN 103124474B
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- Prior art keywords
- composition
- resin
- adhesive linkage
- conductor
- conductor foil
- Prior art date
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- CDUHDFNXTKLDEU-UHFFFAOYSA-N CC1(CCCCC1)OC Chemical compound CC1(CCCCC1)OC CDUHDFNXTKLDEU-UHFFFAOYSA-N 0.000 description 1
- FJSJGNPUPUFFDP-UHFFFAOYSA-N COC(CC1)CCC1I Chemical compound COC(CC1)CCC1I FJSJGNPUPUFFDP-UHFFFAOYSA-N 0.000 description 1
- 0 COC1CCC(*)CC1 Chemical compound COC1CCC(*)CC1 0.000 description 1
Classifications
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- C—CHEMISTRY; METALLURGY
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- H—ELECTRICITY
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- H05K2201/0335—Layered conductors or foils
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H—ELECTRICITY
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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Abstract
Description
Claims (26)
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006120477 | 2006-04-25 | ||
JP2006-120477 | 2006-04-25 | ||
JP2006288722 | 2006-10-24 | ||
JP2006-288722 | 2006-10-24 | ||
JP2007-089055 | 2007-03-29 | ||
JP2007-088894 | 2007-03-29 | ||
JP2007089055A JP5176069B2 (ja) | 2006-04-25 | 2007-03-29 | 接着層付き金属箔、金属張積層板、印刷配線板及び多層配線板 |
JP2007088894A JP5176068B2 (ja) | 2006-10-24 | 2007-03-29 | 導体張積層板、印刷配線板及び多層配線板 |
CN200780015042.0A CN101432134B (zh) | 2006-04-25 | 2007-04-24 | 带粘接层的导体箔、贴有导体的层叠板、印制线路板及多层线路板 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200780015042.0A Division CN101432134B (zh) | 2006-04-25 | 2007-04-24 | 带粘接层的导体箔、贴有导体的层叠板、印制线路板及多层线路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103124474A CN103124474A (zh) | 2013-05-29 |
CN103124474B true CN103124474B (zh) | 2017-11-28 |
Family
ID=38655448
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KR (1) | KR101122846B1 (zh) |
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TWI432510B (zh) * | 2008-05-26 | 2014-04-01 | Mitsui Mining & Smelting Co | And a resin composition for forming a layer of a multilayer flexible wiring board |
JP5741440B2 (ja) * | 2009-09-30 | 2015-07-01 | 日立化成株式会社 | 樹脂組成物並びにこれを用いたプリプレグ、樹脂付き金属箔、接着フィルム及び金属箔張り積層板 |
EP2720862B1 (en) | 2011-06-17 | 2016-08-24 | Fiberweb, Inc. | Vapor permeable, substantially water impermeable multilayer article |
US10369769B2 (en) | 2011-06-23 | 2019-08-06 | Fiberweb, Inc. | Vapor-permeable, substantially water-impermeable multilayer article |
DK2723568T3 (en) | 2011-06-23 | 2017-10-23 | Fiberweb Llc | Vapor permeable, essentially all water impermeable, multilayer |
US9765459B2 (en) | 2011-06-24 | 2017-09-19 | Fiberweb, Llc | Vapor-permeable, substantially water-impermeable multilayer article |
CN103059790B (zh) * | 2012-12-19 | 2014-10-15 | 郑州大学 | 一种耐热阻燃抗脆裂改性环氧树脂胶粘剂及其制备方法 |
CN103118487B (zh) * | 2013-01-28 | 2016-02-17 | 苏州热驰光电科技有限公司 | 超高导热金属基线路板及其制备方法 |
CN105339166B (zh) * | 2013-05-31 | 2018-06-22 | 住友电气工业株式会社 | 金属-树脂复合体、配线材料、以及金属-树脂复合体的制造方法 |
CN104119685B (zh) * | 2014-07-02 | 2016-09-07 | 深圳市优宝惠新材料科技有限公司 | 导热硅脂组合物 |
CN107771125B (zh) * | 2015-06-09 | 2020-07-28 | 罗杰斯公司 | 电路材料和由其形成的制品 |
CN106626580B (zh) | 2015-10-28 | 2019-12-24 | 财团法人工业技术研究院 | 复合积层板 |
JP6631834B2 (ja) * | 2016-01-26 | 2020-01-15 | パナソニックIpマネジメント株式会社 | 金属張積層板、樹脂付き金属部材、及び配線板 |
TWI721236B (zh) * | 2017-03-28 | 2021-03-11 | 日商京瓷股份有限公司 | 附接著劑之銅箔、銅箔積層板及配線基板 |
JP7215163B2 (ja) * | 2017-12-28 | 2023-01-31 | 日本製鉄株式会社 | 金属-繊維強化樹脂材料複合体 |
CN111868137B (zh) * | 2018-03-28 | 2023-08-15 | 积水化学工业株式会社 | 环氧树脂组合物 |
US10827627B2 (en) * | 2019-03-21 | 2020-11-03 | Intel Corporation | Reduction of insertion loss in printed circuit board signal traces |
CN113748149A (zh) * | 2019-04-26 | 2021-12-03 | Dic株式会社 | 固化性树脂组合物 |
JPWO2021075253A1 (zh) * | 2019-10-16 | 2021-04-22 | ||
US11523502B2 (en) * | 2020-05-06 | 2022-12-06 | Veea Inc. | Method and procedure for miniaturing a multi-layer PCB |
JP2022070515A (ja) * | 2020-10-27 | 2022-05-13 | 出光興産株式会社 | 電子回路基板用積層体 |
WO2024043581A1 (ko) * | 2022-08-24 | 2024-02-29 | 코오롱인더스트리 주식회사 | 절연 필름 및 이를 포함하는 적층체 |
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- 2007-04-24 US US12/298,337 patent/US20090323300A1/en not_active Abandoned
- 2007-04-24 KR KR1020087026205A patent/KR101122846B1/ko active IP Right Grant
- 2007-04-24 WO PCT/JP2007/058863 patent/WO2007125922A1/ja active Application Filing
- 2007-04-24 CN CN201310015573.7A patent/CN103124474B/zh active Active
- 2007-04-25 TW TW96114659A patent/TWI423882B/zh active
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CN1042158A (zh) * | 1988-09-23 | 1990-05-16 | B.F.谷德里奇公司 | 可固化的聚环烯树脂溶液和它在制造印刷电路板中的应用以及由此而制造的印刷电路板 |
CN101432134B (zh) * | 2006-04-25 | 2014-01-22 | 日立化成工业株式会社 | 带粘接层的导体箔、贴有导体的层叠板、印制线路板及多层线路板 |
Also Published As
Publication number | Publication date |
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KR101122846B1 (ko) | 2012-03-21 |
KR20090005070A (ko) | 2009-01-12 |
US20090323300A1 (en) | 2009-12-31 |
WO2007125922A1 (ja) | 2007-11-08 |
TWI423882B (zh) | 2014-01-21 |
TW200808536A (en) | 2008-02-16 |
CN103124474A (zh) | 2013-05-29 |
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