JP5176069B2 - 接着層付き金属箔、金属張積層板、印刷配線板及び多層配線板 - Google Patents
接着層付き金属箔、金属張積層板、印刷配線板及び多層配線板 Download PDFInfo
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- JP5176069B2 JP5176069B2 JP2007089055A JP2007089055A JP5176069B2 JP 5176069 B2 JP5176069 B2 JP 5176069B2 JP 2007089055 A JP2007089055 A JP 2007089055A JP 2007089055 A JP2007089055 A JP 2007089055A JP 5176069 B2 JP5176069 B2 JP 5176069B2
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- metal foil
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- resin
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- 229910052751 metal Inorganic materials 0.000 title claims description 174
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- 238000002156 mixing Methods 0.000 claims description 20
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 16
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- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 7
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- CDFCBRMXZKAKKI-UHFFFAOYSA-N 2-hydroxybenzaldehyde;phenol Chemical compound OC1=CC=CC=C1.OC1=CC=CC=C1C=O CDFCBRMXZKAKKI-UHFFFAOYSA-N 0.000 claims description 6
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- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 7
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- 230000004888 barrier function Effects 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- LQBGYTOYWFTTCF-UHFFFAOYSA-N bis(but-1-enoxy)phosphorylbenzene Chemical compound CCC=COP(=O)(OC=CCC)C1=CC=CC=C1 LQBGYTOYWFTTCF-UHFFFAOYSA-N 0.000 description 1
- YSRMRWIQPVDQBV-UHFFFAOYSA-N bis(prop-2-enoxy)phosphorylbenzene Chemical compound C=CCOP(=O)(OCC=C)C1=CC=CC=C1 YSRMRWIQPVDQBV-UHFFFAOYSA-N 0.000 description 1
- RNWMOSZLRHZXRD-UHFFFAOYSA-N bis[4-(4-aminocyclohexyl)oxycyclohexyl]methanone Chemical compound C1CC(N)CCC1OC1CCC(C(=O)C2CCC(CC2)OC2CCC(N)CC2)CC1 RNWMOSZLRHZXRD-UHFFFAOYSA-N 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- WJVGUJSDVKTDIX-UHFFFAOYSA-M butyl(trimethyl)azanium;chloride Chemical compound [Cl-].CCCC[N+](C)(C)C WJVGUJSDVKTDIX-UHFFFAOYSA-M 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- MZUPWNMULGRONZ-UHFFFAOYSA-N cyclohexylsulfonylcyclohexane Chemical compound C1CCCCC1S(=O)(=O)C1CCCCC1 MZUPWNMULGRONZ-UHFFFAOYSA-N 0.000 description 1
- NHADDZMCASKINP-HTRCEHHLSA-N decarboxydihydrocitrinin Natural products C1=C(O)C(C)=C2[C@H](C)[C@@H](C)OCC2=C1O NHADDZMCASKINP-HTRCEHHLSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- RAABOESOVLLHRU-UHFFFAOYSA-N diazene Chemical compound N=N RAABOESOVLLHRU-UHFFFAOYSA-N 0.000 description 1
- 229910000071 diazene Inorganic materials 0.000 description 1
- GRTGGSXWHGKRSB-UHFFFAOYSA-N dichloromethyl methyl ether Chemical compound COC(Cl)Cl GRTGGSXWHGKRSB-UHFFFAOYSA-N 0.000 description 1
- BGRWYRAHAFMIBJ-UHFFFAOYSA-N diisopropylcarbodiimide Natural products CC(C)NC(=O)NC(C)C BGRWYRAHAFMIBJ-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- CIJWIJSYZZLMGD-UHFFFAOYSA-N diphenylphosphoryloxybenzene Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)(=O)OC1=CC=CC=C1 CIJWIJSYZZLMGD-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- XTAZYLNFDRKIHJ-UHFFFAOYSA-N n,n-dioctyloctan-1-amine Chemical compound CCCCCCCCN(CCCCCCCC)CCCCCCCC XTAZYLNFDRKIHJ-UHFFFAOYSA-N 0.000 description 1
- 125000004957 naphthylene group Chemical group 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000005515 organic divalent group Chemical group 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 125000004043 oxo group Chemical group O=* 0.000 description 1
- MUMZUERVLWJKNR-UHFFFAOYSA-N oxoplatinum Chemical compound [Pt]=O MUMZUERVLWJKNR-UHFFFAOYSA-N 0.000 description 1
- OOSUVFMPZZUMMJ-UHFFFAOYSA-N oxoplatinum oxorhodium Chemical compound O=[Rh].O=[Pt] OOSUVFMPZZUMMJ-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 150000003008 phosphonic acid esters Chemical class 0.000 description 1
- XZTOTRSSGPPNTB-UHFFFAOYSA-N phosphono dihydrogen phosphate;1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(N)=N1.OP(O)(=O)OP(O)(O)=O XZTOTRSSGPPNTB-UHFFFAOYSA-N 0.000 description 1
- XFZRQAZGUOTJCS-UHFFFAOYSA-N phosphoric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OP(O)(O)=O.NC1=NC(N)=NC(N)=N1 XFZRQAZGUOTJCS-UHFFFAOYSA-N 0.000 description 1
- 235000014786 phosphorus Nutrition 0.000 description 1
- UHZYTMXLRWXGPK-UHFFFAOYSA-N phosphorus pentachloride Chemical compound ClP(Cl)(Cl)(Cl)Cl UHZYTMXLRWXGPK-UHFFFAOYSA-N 0.000 description 1
- FAIAAWCVCHQXDN-UHFFFAOYSA-N phosphorus trichloride Chemical compound ClP(Cl)Cl FAIAAWCVCHQXDN-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910003446 platinum oxide Inorganic materials 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000001205 polyphosphate Substances 0.000 description 1
- 235000011176 polyphosphates Nutrition 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- MOVRCMBPGBESLI-UHFFFAOYSA-N prop-2-enoyloxysilicon Chemical compound [Si]OC(=O)C=C MOVRCMBPGBESLI-UHFFFAOYSA-N 0.000 description 1
- HKJYVRJHDIPMQB-UHFFFAOYSA-N propan-1-olate;titanium(4+) Chemical compound CCCO[Ti](OCCC)(OCCC)OCCC HKJYVRJHDIPMQB-UHFFFAOYSA-N 0.000 description 1
- LVTJOONKWUXEFR-FZRMHRINSA-N protoneodioscin Natural products O(C[C@@H](CC[C@]1(O)[C@H](C)[C@@H]2[C@]3(C)[C@H]([C@H]4[C@@H]([C@]5(C)C(=CC4)C[C@@H](O[C@@H]4[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@@H](O)[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@H](CO)O4)CC5)CC3)C[C@@H]2O1)C)[C@H]1[C@H](O)[C@H](O)[C@H](O)[C@@H](CO)O1 LVTJOONKWUXEFR-FZRMHRINSA-N 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000012783 reinforcing fiber Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical class CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical class CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 125000005628 tolylene group Chemical group 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 125000005270 trialkylamine group Chemical group 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- NTUUXNCVRZQBFX-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-5-yl)ethyl]silane Chemical compound CO[Si](OC)(OC)CCC1CCCC2OC12 NTUUXNCVRZQBFX-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- KOWVWXQNQNCRRS-UHFFFAOYSA-N tris(2,4-dimethylphenyl) phosphate Chemical compound CC1=CC(C)=CC=C1OP(=O)(OC=1C(=CC(C)=CC=1)C)OC1=CC=C(C)C=C1C KOWVWXQNQNCRRS-UHFFFAOYSA-N 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Description
[接着層付き金属箔]
金属箔10としては、従来プリント配線板等の導電層に適用されるものであれば特に限定されず、例えば、銅箔、ニッケル箔、アルミ箔等を適用することができる。なかでも、電界銅箔又は圧延銅箔が好ましい。また、金属箔10は、その防錆性、耐薬品性、耐熱性等を向上させる観点から、ニッケル、錫、亜鉛、クロム、モリブデン、コバルト等によるバリアー層形成処理が施されていると好ましい。また、絶縁層との接着性を向上させる観点からは、表面粗化処理やシランカップリング剤による処理等の表面処理が施されていると好ましい。
接着層付き金属箔1における接着層20は、(A)成分;多官能エポキシ樹脂、(B)成分;多官能フェノール樹脂、及び、(C)成分;ポリアミドイミドを含有する硬化性樹脂組成物からなる層である。この接着層20の厚さは、0.1〜5μmであると好ましい。この厚さが0.1μm未満であると、後述する金属張積層板等において、十分な金属箔等の引き剥がし強さを得るのが困難となる傾向にある。一方、5μmを超えると、金属張積層板による高周波伝送特性が低下する傾向にある。以下、接着層20を構成する硬化性樹脂組成物の各成分について説明する。
[式(1a)及び(1b)中、L1は、ハロゲン置換されていてもよい炭素数1〜3の2価の脂肪族炭化水素基、スルホニル基、オキシ基、カルボニル基、単結合又は下記式(2a)又は(2b)で表される2価の基を示し、L2はハロゲン置換されていてもよい炭素数1〜3の2価の脂肪族炭化水素基、スルホニル基、オキシ基又はカルボニル基を示し、R5、R6及びR7は、それぞれ独立に、水素原子、水酸基、メトキシ基、ハロゲン置換されていてもよいメチル基を示す。
ただし、式(2a)中、L3は、ハロゲン置換されていてもよい炭素数1〜3の2価の脂肪族炭化水素基、スルホニル基、オキシ基、カルボニル基又は単結合を示す。]
[式(3)中、L4はメチレン基、スルホニル基、オキソ基、カルボニル基又は単結合を示し、R8及びR9は、それぞれ独立に、水素原子、アルキル基又は置換基を有していてもよいフェニル基を示し、kは1〜50の整数を示す。]
[接着層付き金属箔の製造方法]
[金属張積層板]
金属箔100が積層されたものを例示したが、これに限られず、本発明の金属張積層板は、接着層付き金属箔が絶縁性樹脂膜の片面にのみ積層されたものであってもよい。また、絶縁樹脂層40は、複数の層からなる積層構造を有していたが、これに限定されず、単層構造を有するものであってもよい。
[プリント配線板]
[多層配線板]
まず、ディーンスターク還流冷却器、温度計、撹拌器を備えた1Lのセパラブルフラスコに、飽和脂環式炭化水素基を有するジアミン化合物Aとして(4、4’−ジアミノ)ジシクロヘキシルメタン(ワンダミンHM(WHM)、新日本理化社製、商品名)45mmol、シロキサンジアミン化合物Bとして反応性シリコーンオイル(X−22−161−B、信越化学工業社製、アミン当量:1500、商品名)5mmol、無水トリメリット酸(TMA)105mmol、非プロトン性極性溶媒としてN−メチル−2−ピロリドン(NMP)145gを入れ、フラスコ内の温度を80℃に設定して30分間撹拌した。
まず、ディーンスターク還流冷却器、温度計、撹拌器を備えた1Lのセパラブルフラスコに、飽和脂肪族炭化水素基を有するジアミン化合物CとしてジェファーミンD−2000(サンテクノケミカル社製、商品名)30mmol、芳香族ジアミン化合物Dとして(4、4’−ジアミノ)ジフェニルメタン(DDM)120mmol、無水トリメリット酸(TMA)315mmol、非プロトン性極性溶媒としてN−メチル−2−ピロリドン(NMP)442gを入れ、フラスコ内の温度を80℃に設定して30分間撹拌した。
MDI量を50mmolに変更したこと以外は、合成例1と同様にしてポリアミドイミドのNMP溶液を得た。なお、このNMP溶液のMwをゲルパーミエーションクロマトグラフィーにより測定したところ、23000であった。
MDI量を190mmolに変更し、反応時間を3時間に変更したこと以外は、合成例2と同様にしてポリアミドイミドのNMP溶液を得た。このNMP溶液のMwをゲルパーミエーションクロマトグラフィーにより測定したところ、270000であった。
[接着層用樹脂ワニス(硬化性樹脂組成物)の調製]
(A)成分であるクレゾールノボラック型エポキシ樹脂(YDCN−500、東都化成社製、商品名)5.0gに、(B)成分であるノボラック型フェノール樹脂(MEH7500、明和化成社製、商品名)3.1g、及び、(C)成分である合成例1で得られたポリアミドイミドのNMP溶液18g配合し、更に硬化促進剤として2−エチル−4−メチルイミダゾール(2E4MZ、四国化成工業社製、商品名)0.025gを添加した後、N−メチル−2−ピロリドン28g及びメチルエチルケトン13gを配合して、調製例1の接着層用樹脂ワニス(固形分濃度約20質量%)を調製した。
(A)成分であるビフェニル構造を有するノボラック型エポキシ樹脂(NC−3000H、日本化薬社製、商品名)5.0gに、(B)成分であるビスフェノールAノボラック樹脂(YLH129、ジャパンエポキシレジン社製、商品名)2.0g、(C)成分である合成例2で得られたポリアミドイミドのNMP溶液38g、及び、(D)成分であるカルボン酸変性ポリビニルアセタール樹脂(KS−23Z、積水化学工業株式会社製、商品名)0.8gを配合し、更に硬化促進剤として2−エチル−4−メチルイミダゾール(2E4MZ、四国化成工業社製、商品名)0.025gを添加した後、N−メチル−2−ピロリドン35g及びメチルエチルケトン13gを配合して、調製例2の接着層用樹脂ワニス(固形分濃度約20質量%)を調製した。
(A)成分であるフェノールノボラック型エポキシ樹脂(N−770、大日本インキ化学工業社製、商品名)5.0gに、(B)成分であるクレゾールノボラック型フェノール樹脂(KA−1163、大日本インキ化学工業社製、商品名)3.9g、(C)成分である合成例2で得られたポリアミドイミドのNMP溶液55g、及び、(D)成分であるカルボン酸変性アクリロニトリルブタジエンゴム粒子(XER−91SE−15、JSR株式会社製、商品名、固形分濃度15質量%)を8.5g配合し、更に硬化促進剤として2−エチル−4−メチルイミダゾール(2E4MZ、四国化成工業社製、商品名)0.025gを添加した後、N−メチル−2−ピロリドン39g及びメチルエチルケトン20gを配合して、調製例3の接着層用樹脂ワニス(固形分濃度約20質量%)を調製した。
ビスフェノールA型エポキシ樹脂(DER−331L、ダウケミカル日本社製、商品名
)5.0gに、クレゾールノボラック型フェノール樹脂(KA−1163、大日本インキ
化学工業社製、商品名)3.2g、及び、合成例2で得られたポリアミドイミドのNMP溶液50gを配合し、更に硬化促進剤として2−エチル−4−メチルイミダゾール(2E4MZ、四国化成工業社製、商品名)0.025gを添加した後、N−メチル−2−ピロリドン46g及びメチルエチルケトン15gを配合して、調製例4の接着層用樹脂ワニス(固形分濃度約20質量%)を調製した。
ポリアミドイミドのNMP溶液として、合成例2で得られたものに代え、比較合成例1で得られたものを用いたこと以外は、調製例2と同様にして接着層用樹脂ワニスを調製した。
ポリアミドイミドのNMP溶液として、合成例2で得られたものに代え、比較合成例2で得られたものを用いたこと以外は、調製例2と同様にして接着層用樹脂ワニスを調製した。
[絶縁樹脂層用プリプレグの作製]
(作製例1)
(作製例2)
(作製例3)
[実施例1〜4、比較例1〜2]
調製例1〜4及び比較調製例1〜2で得られた接着層用樹脂ワニスを、厚さ12μmの電解銅箔(F0−WS−12、ロープロファイル銅箔、古河電気工業社製)のM面(表面粗さ(Rz)=0.8μm)にそれぞれ自然流延塗布した後、150℃で5分間乾燥させて、実施例1〜4及び比較例1〜2の接着層付き金属箔を作製した。乾燥後の接着層の厚さは3μmであった。なお、調製例1〜4のワニスを用いた場合がそれぞれ実施例1〜4に該当し、また比較調整例1〜2のワニスを用いた場合がそれぞれ比較例1〜2に該当する。
上述の作製例1〜3のいずれかの絶縁樹脂層用プリプレグ4枚を重ねてなる基材の両面に、実施例1〜4及び比較例1〜2の接着層付き金属箔を、それぞれの接着層が接するように被着させた後、200℃、3.0MPa、70分のプレス条件で加熱加圧成形して、実施例1〜4、比較例1〜2の接着層付き金属箔を用いた両面銅張積層板(厚さ:0.55mm)をそれぞれ作製した。各実施例又は比較例における接着層付き金属箔と絶縁層用プリプレグとの組み合わせは、表1に示す通りとした。
まず、上記と同様に、実施例1〜4及び比較例1〜2の接着層付き金属箔をそれぞれ用いた両面銅張積層板を形成し、これらの銅箔部分を完全にエッチングにより除去した。その後、銅張積層板の作製時に使用した絶縁樹脂層用プリプレグと同一のプリプレグを、銅箔除去後の両面銅張積層板の両面に1枚ずつ配置し、その外側に接着層を設けていない厚さ12μmの電解銅箔(GTS−12、一般銅箔、古河電気工業社製、M面表面粗さ(Rz)=8μm、商品名)を、そのM面が接するように被着させた後、200℃、3.0MPa、70分のプレス条件で加熱加圧成形して、多層基板を作製した。なお、実施例1〜4及び比較例1〜2の接着層付き金属箔と、作製例1〜3の絶縁樹脂層用プリプレグとの組み合わせについては、表1に示す。
[比較例3〜4]
[銅張積層板における銅箔引き剥がし強さの測定]
・試験方法:90℃方向引張試験
・引張速度:50mm/分
・測定装置:島津製作所製オートグラフAG−100C
なお、この銅箔引き剥がし強さについて、表中「−」で示したものは、PCT中で保持した後に、すでに銅箔が剥離していたため、銅箔引き剥がし強さを測定できなかったことを意味する。
[銅張積層板及び多層基板のはんだ耐熱性の評価]
[銅張積層板の伝送損失の評価]
Claims (11)
- 金属箔と、該金属箔上に設けられた接着層と、を備える接着層付き金属箔であって、
前記接着層は、(A)成分;多官能エポキシ樹脂、(B)成分;多官能フェノール樹脂、及び、(C)成分;ポリアミドイミドを含有する硬化性樹脂組成物からなり、
前記(C)成分は、その重量平均分子量が5万以上25万以下である、接着層付き金属箔。 - 前記(A)成分及び前記(B)成分は、これらの混合物の硬化後のガラス転移温度が150℃以上となるものである、請求項1記載の接着層付き金属箔。
- 前記(A)成分が、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、臭素化フェノールノボラック型エポキシ樹脂、ビスフェノールAノボラック型エポキシ樹脂、ビフェニル型エポキシ樹脂、ナフタレン骨格含有エポキシ樹脂、アラルキレン骨格含有エポキシ樹脂、ビフェニル−アラルキレン骨格含有エポキシ樹脂、フェノールサリチルアルデヒドノボラック型エポキシ樹脂、低級アルキル基置換フェノールサリチルアルデヒドノボラック型エポキシ樹脂、ジシクロペンタジエン骨格含有エポキシ樹脂、多官能グリシジルアミン型エポキシ樹脂及び多官能脂環式エポキシ樹脂からなる群より選ばれる少なくとも1種の多官能エポキシ樹脂を含有する、請求項1又は2記載の接着層付き金属箔。
- 前記(B)成分が、アラルキル型フェノール樹脂、ジシクロペンタジエン型フェノール樹脂、サリチルアルデヒド型フェノール樹脂、ベンズアルデヒド型フェノール樹脂とアラルキル型フェノール樹脂との共重合型樹脂、及び、ノボラック型フェノール樹脂からなる群より選ばれる少なくとも1種の多官能フェノール樹脂を含有する、請求項1〜3のいずれか一項に記載の接着層付き金属箔。
- 前記(C)成分が、飽和炭化水素からなる構造単位を含む、請求項1〜4のいずれか一項に記載の接着層付き金属箔。
- 前記(C)成分の配合割合が、前記(A)成分及び前記(B)成分の合計100質量部に対して10〜400質量部である、請求項1〜5のいずれか一項に記載の接着層付き金属箔。
- 前記硬化性樹脂組成物が、(D)成分として、架橋ゴム粒子及び/又はポリビニルアセタール樹脂を更に含有する、請求項1〜6のいずれか一項に記載の接着層付き金属箔。
- 前記(D)成分が、アクリロニトリルブタジエンゴム粒子、カルボン酸変性アクリロニトリルブタジエンゴム粒子、カルボン酸変性アクリロニトリルブタジエンゴム粒子、ブタジエンゴム−アクリル樹脂のコアシェル粒子からなる群より選ばれる少なくとも1種の架橋ゴム粒子である、請求項7記載の接着層付き金属箔。
- 前記接着層が、前記硬化性樹脂組成物及び前記溶媒を含有する樹脂ワニスを、前記金属箔の表面上に塗布して樹脂ワニス層を形成した後、前記樹脂ワニス層から前記溶媒を除去することにより得られたものである、請求項1〜8のいずれか一項に記載の接着層付き金属箔。
- 前記接着層の膜厚が、0.1〜5μmである、請求項1〜9のいずれか一項に記載の接着層付き金属箔。
- 前記金属箔の前記接着層が形成される側の面の十点平均粗さ(Rz)が2μm以下である、請求項1〜10のいずれか一項に記載の接着層付き金属箔。
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US12/298,337 US20090323300A1 (en) | 2006-04-25 | 2007-04-24 | Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printed Wiring Board and Multilayer Wiring Board |
CN200780015042.0A CN101432134B (zh) | 2006-04-25 | 2007-04-24 | 带粘接层的导体箔、贴有导体的层叠板、印制线路板及多层线路板 |
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