KR100615019B1 - 반도체 패키지, 멀티칩 모듈 및 그 제조방법 - Google Patents

반도체 패키지, 멀티칩 모듈 및 그 제조방법 Download PDF

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Publication number
KR100615019B1
KR100615019B1 KR1020000002003A KR20000002003A KR100615019B1 KR 100615019 B1 KR100615019 B1 KR 100615019B1 KR 1020000002003 A KR1020000002003 A KR 1020000002003A KR 20000002003 A KR20000002003 A KR 20000002003A KR 100615019 B1 KR100615019 B1 KR 100615019B1
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South Korea
Prior art keywords
insulating substrate
wiring layer
semiconductor chip
substrate
bonding pad
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Expired - Fee Related
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KR1020000002003A
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Korean (ko)
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KR20000053511A (ko
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아사다준이치
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가부시끼가이샤 도시바
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    • H10P72/7402—
    • H10W72/30—
    • H10W74/012—
    • H10W74/111—
    • H10W74/15—
    • H10W90/00—
    • H10P72/7416—
    • H10W46/601—
    • H10W70/60—
    • H10W72/073—
    • H10W72/856—
    • H10W72/90—
    • H10W72/9415—
    • H10W90/722—
    • H10W90/724—
    • H10W90/734—

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  • Wire Bonding (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1020000002003A 1999-01-18 2000-01-17 반도체 패키지, 멀티칩 모듈 및 그 제조방법 Expired - Fee Related KR100615019B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1999-9763 1999-01-18
JP11009763A JP2000208698A (ja) 1999-01-18 1999-01-18 半導体装置

Related Child Applications (1)

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KR10-2003-0020119A Division KR100507300B1 (ko) 1999-01-18 2003-03-31 멀티칩 모듈 및 그 제조방법

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KR20000053511A KR20000053511A (ko) 2000-08-25
KR100615019B1 true KR100615019B1 (ko) 2006-08-25

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KR1020000002003A Expired - Fee Related KR100615019B1 (ko) 1999-01-18 2000-01-17 반도체 패키지, 멀티칩 모듈 및 그 제조방법
KR10-2003-0020119A Expired - Fee Related KR100507300B1 (ko) 1999-01-18 2003-03-31 멀티칩 모듈 및 그 제조방법

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US (2) US6239496B1 (cg-RX-API-DMAC10.html)
JP (1) JP2000208698A (cg-RX-API-DMAC10.html)
KR (2) KR100615019B1 (cg-RX-API-DMAC10.html)

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