JPH11261008A5 - - Google Patents
Info
- Publication number
- JPH11261008A5 JPH11261008A5 JP1998059620A JP5962098A JPH11261008A5 JP H11261008 A5 JPH11261008 A5 JP H11261008A5 JP 1998059620 A JP1998059620 A JP 1998059620A JP 5962098 A JP5962098 A JP 5962098A JP H11261008 A5 JPH11261008 A5 JP H11261008A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- inductance element
- semiconductor substrate
- substrate
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05962098A JP3942264B2 (ja) | 1998-03-11 | 1998-03-11 | 半導体基板上に形成されるインダクタンス素子 |
| US09/175,975 US6225677B1 (en) | 1998-03-11 | 1998-10-21 | Inductance device formed on semiconductor substrate |
| TW087117512A TW401639B (en) | 1998-03-11 | 1998-10-22 | Inductance: device formed on semiconductor substrate |
| KR1019980044696A KR100334041B1 (ko) | 1998-03-11 | 1998-10-24 | 반도체기판상에형성되는인덕턴스소자 |
| FR9814825A FR2776128B1 (fr) | 1998-03-11 | 1998-11-25 | Dispositif a inductance forme sur un substrat semiconducteur |
| US09/791,859 US20010040270A1 (en) | 1998-03-11 | 2001-02-26 | Inductance device formed on semiconductor substrate |
| US10/163,367 US6879022B2 (en) | 1998-03-11 | 2002-06-07 | Inductance device formed on semiconductor substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05962098A JP3942264B2 (ja) | 1998-03-11 | 1998-03-11 | 半導体基板上に形成されるインダクタンス素子 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005068567A Division JP4230468B2 (ja) | 2005-03-11 | 2005-03-11 | 半導体基板上に形成されるインダクタンス素子 |
| JP2006276864A Division JP2007005835A (ja) | 2006-10-10 | 2006-10-10 | 半導体基板状に形成されるインダクタンス素子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH11261008A JPH11261008A (ja) | 1999-09-24 |
| JPH11261008A5 true JPH11261008A5 (enExample) | 2005-09-02 |
| JP3942264B2 JP3942264B2 (ja) | 2007-07-11 |
Family
ID=13118479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP05962098A Expired - Fee Related JP3942264B2 (ja) | 1998-03-11 | 1998-03-11 | 半導体基板上に形成されるインダクタンス素子 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US6225677B1 (enExample) |
| JP (1) | JP3942264B2 (enExample) |
| KR (1) | KR100334041B1 (enExample) |
| FR (1) | FR2776128B1 (enExample) |
| TW (1) | TW401639B (enExample) |
Families Citing this family (45)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000243908A (ja) * | 1999-02-23 | 2000-09-08 | Fujitsu Ltd | 半導体集積回路 |
| GB2353139B (en) * | 1999-08-12 | 2001-08-29 | United Microelectronics Corp | Inductor and method of manufacturing the same |
| JP4776752B2 (ja) | 2000-04-19 | 2011-09-21 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| WO2001093317A1 (en) * | 2000-05-30 | 2001-12-06 | Programmable Silicon Solutions | Integrated inductive circuits |
| US6917095B1 (en) | 2000-05-30 | 2005-07-12 | Altera Corporation | Integrated radio frequency circuits |
| US6441442B1 (en) | 2000-05-30 | 2002-08-27 | Programmable Silicon Solutions | Integrated inductive circuits |
| EP1160842A3 (en) * | 2000-05-30 | 2003-09-17 | Programmable Silicon Solutions | Integrated radio frequency circuits |
| US6455915B1 (en) * | 2000-05-30 | 2002-09-24 | Programmable Silicon Solutions | Integrated inductive circuits |
| US6489663B2 (en) * | 2001-01-02 | 2002-12-03 | International Business Machines Corporation | Spiral inductor semiconducting device with grounding strips and conducting vias |
| DE10136740A1 (de) * | 2001-07-27 | 2002-10-24 | Infineon Technologies Ag | Integriertes, induktives Bauelement |
| JP3754406B2 (ja) * | 2002-09-13 | 2006-03-15 | 富士通株式会社 | 可変インダクタおよびそのインダクタンス調整方法 |
| FR2846792A1 (fr) * | 2002-10-30 | 2004-05-07 | Commissariat Energie Atomique | Composant microelectrique radiofrequence et procede de realisation |
| US20040195650A1 (en) * | 2003-04-04 | 2004-10-07 | Tsung-Ju Yang | High-Q inductor device with a shielding pattern embedded in a substrate |
| US6989578B2 (en) * | 2003-07-31 | 2006-01-24 | Taiwan Semiconductor Manufacturing Company | Inductor Q value improvement |
| CN100461410C (zh) * | 2003-08-28 | 2009-02-11 | 株式会社日立制作所 | 半导体器件以及其制造方法 |
| DE102004014752B4 (de) * | 2004-03-25 | 2008-11-20 | Infineon Technologies Ag | Halbleiterbauelement mit kernlosem Wandler und Halbbrücke |
| US7508280B2 (en) * | 2005-07-19 | 2009-03-24 | Lc Tank Llc | Frequency adjustment techniques in coupled LC tank circuits |
| US7786836B2 (en) * | 2005-07-19 | 2010-08-31 | Lctank Llc | Fabrication of inductors in transformer based tank circuitry |
| US7250826B2 (en) * | 2005-07-19 | 2007-07-31 | Lctank Llc | Mutual inductance in transformer based tank circuitry |
| US7511588B2 (en) * | 2005-07-19 | 2009-03-31 | Lctank Llc | Flux linked LC tank circuits forming distributed clock networks |
| US7279426B2 (en) * | 2005-09-22 | 2007-10-09 | International Business Machines Corporation | Like integrated circuit devices with different depth |
| JP4647484B2 (ja) * | 2005-12-27 | 2011-03-09 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US7402890B2 (en) * | 2006-06-02 | 2008-07-22 | International Business Machines Corporation | Method for symmetric capacitor formation |
| GB2440365A (en) * | 2006-07-21 | 2008-01-30 | X Fab Uk Ltd | A semiconductor device |
| US7948055B2 (en) * | 2006-08-31 | 2011-05-24 | United Microelectronics Corp. | Inductor formed on semiconductor substrate |
| KR100883036B1 (ko) * | 2007-07-25 | 2009-02-09 | 주식회사 동부하이텍 | 반도체 소자용 인덕터 및 그 제조 방법 |
| US20100193904A1 (en) * | 2009-01-30 | 2010-08-05 | Watt Jeffrey T | Integrated circuit inductor with doped substrate |
| GB0918221D0 (en) * | 2009-10-16 | 2009-12-02 | Cambridge Silicon Radio Ltd | Inductor structure |
| KR101121645B1 (ko) * | 2010-03-22 | 2012-02-28 | 삼성전기주식회사 | 평면형 트랜스포머 |
| TWI498928B (zh) * | 2010-08-04 | 2015-09-01 | 立積電子股份有限公司 | 螺旋電感元件 |
| CN102376700A (zh) * | 2010-08-04 | 2012-03-14 | 立积电子股份有限公司 | 电子组件及其制法、螺旋电感组件及其制法 |
| US8686539B1 (en) * | 2010-10-15 | 2014-04-01 | Xilinx, Inc. | Inductor having a deep-well noise isolation shield |
| WO2012121724A1 (en) * | 2011-03-09 | 2012-09-13 | Hewlett-Packard Development Company, L.P. | Flat power coil for wireless charging applications |
| CN102522385A (zh) * | 2011-12-30 | 2012-06-27 | 上海集成电路研发中心有限公司 | 片上集成铜电感 |
| US8878334B1 (en) * | 2012-03-23 | 2014-11-04 | Altera Corporation | Integrated circuit resistors with reduced parasitic capacitance |
| JP6057534B2 (ja) * | 2012-04-18 | 2017-01-11 | 住重試験検査株式会社 | 半導体装置の製造方法 |
| CN103474414B (zh) * | 2012-06-06 | 2016-03-16 | 中芯国际集成电路制造(上海)有限公司 | 电感及其形成方法 |
| JP5719000B2 (ja) * | 2013-09-17 | 2015-05-13 | 学校法人慶應義塾 | 集積回路装置 |
| JP6375872B2 (ja) * | 2014-10-29 | 2018-08-22 | 住友電気工業株式会社 | 超電導マグネットおよび超電導機器 |
| TWI587329B (zh) * | 2014-10-31 | 2017-06-11 | 台灣東電化股份有限公司 | 無線充電印刷電路板線圈結構 |
| JP7056016B2 (ja) * | 2017-06-13 | 2022-04-19 | Tdk株式会社 | コイル部品 |
| JP7169871B2 (ja) * | 2018-12-26 | 2022-11-11 | 住重アテックス株式会社 | 半導体装置の製造方法 |
| JP7430376B2 (ja) * | 2019-12-19 | 2024-02-13 | 三安ジャパンテクノロジー株式会社 | スパイラルインダクタ及びパッシブ集積回路 |
| KR20220102772A (ko) | 2021-01-14 | 2022-07-21 | 주식회사 삼주유니콘 | 환봉의 길이 조절장치 |
| CN113745404A (zh) * | 2021-08-25 | 2021-12-03 | 中国科学院微电子研究所 | 螺旋电感的制备方法、螺旋电感及无源器件模块 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4851257A (en) | 1987-03-13 | 1989-07-25 | Harris Corporation | Process for the fabrication of a vertical contact |
| US5070317A (en) * | 1989-01-17 | 1991-12-03 | Bhagat Jayant K | Miniature inductor for integrated circuits and devices |
| US5206213A (en) * | 1990-03-23 | 1993-04-27 | International Business Machines Corp. | Method of preparing oriented, polycrystalline superconducting ceramic oxides |
| EP0560396B1 (en) * | 1992-03-13 | 2001-11-07 | Kabushiki Kaisha Toshiba | Nuclear magnetic resonance imaging with improved image quality and operation efficiency |
| US5572040A (en) * | 1993-07-12 | 1996-11-05 | Peregrine Semiconductor Corporation | High-frequency wireless communication system on a single ultrathin silicon on sapphire chip |
| US5370766A (en) | 1993-08-16 | 1994-12-06 | California Micro Devices | Methods for fabrication of thin film inductors, inductor networks and integration with other passive and active devices |
| JP3015679B2 (ja) | 1993-09-01 | 2000-03-06 | 株式会社東芝 | 半導体装置およびその製造方法 |
| JP3373267B2 (ja) | 1993-11-01 | 2003-02-04 | 新潟精密株式会社 | Lc素子及び半導体装置 |
| JPH07183468A (ja) | 1993-12-22 | 1995-07-21 | Tokin Corp | 絶縁シリコン基板並びにそれを用いたインダクタおよび分布定数型フィルタ |
| TW267260B (enExample) * | 1993-12-29 | 1996-01-01 | Tif Kk | |
| JP3450408B2 (ja) | 1994-02-21 | 2003-09-22 | 新潟精密株式会社 | Lc複合素子 |
| KR970053797A (ko) * | 1995-12-21 | 1997-07-31 | 양승택 | 공핍층을 이용한 인덕터 |
| JP2904086B2 (ja) * | 1995-12-27 | 1999-06-14 | 日本電気株式会社 | 半導体装置およびその製造方法 |
| SE510443C2 (sv) * | 1996-05-31 | 1999-05-25 | Ericsson Telefon Ab L M | Induktorer för integrerade kretsar |
| KR100314610B1 (ko) * | 1996-08-09 | 2001-12-28 | 윤덕용 | 산화막다공성실리콘기판을이용한초고주파소자 |
| KR100243658B1 (ko) * | 1996-12-06 | 2000-02-01 | 정선종 | 기판 변환기술을 이용한 인덕터 소자 및 그 제조 방법 |
| US5844299A (en) | 1997-01-31 | 1998-12-01 | National Semiconductor Corporation | Integrated inductor |
-
1998
- 1998-03-11 JP JP05962098A patent/JP3942264B2/ja not_active Expired - Fee Related
- 1998-10-21 US US09/175,975 patent/US6225677B1/en not_active Expired - Lifetime
- 1998-10-22 TW TW087117512A patent/TW401639B/zh not_active IP Right Cessation
- 1998-10-24 KR KR1019980044696A patent/KR100334041B1/ko not_active Expired - Fee Related
- 1998-11-25 FR FR9814825A patent/FR2776128B1/fr not_active Expired - Fee Related
-
2001
- 2001-02-26 US US09/791,859 patent/US20010040270A1/en not_active Abandoned
-
2002
- 2002-06-07 US US10/163,367 patent/US6879022B2/en not_active Expired - Fee Related
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