KR100334041B1 - 반도체기판상에형성되는인덕턴스소자 - Google Patents

반도체기판상에형성되는인덕턴스소자 Download PDF

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Publication number
KR100334041B1
KR100334041B1 KR1019980044696A KR19980044696A KR100334041B1 KR 100334041 B1 KR100334041 B1 KR 100334041B1 KR 1019980044696 A KR1019980044696 A KR 1019980044696A KR 19980044696 A KR19980044696 A KR 19980044696A KR 100334041 B1 KR100334041 B1 KR 100334041B1
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KR
South Korea
Prior art keywords
substrate
inductance element
conductive film
shaped conductive
semiconductor substrate
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Expired - Fee Related
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KR1019980044696A
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English (en)
Korean (ko)
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KR19990076525A (ko
Inventor
오사무 고바야시
Original Assignee
후지쯔 가부시끼가이샤
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Publication of KR19990076525A publication Critical patent/KR19990076525A/ko
Application granted granted Critical
Publication of KR100334041B1 publication Critical patent/KR100334041B1/ko
Anticipated expiration legal-status Critical
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/20Inductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type
    • H01F17/0006Printed inductances
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1019980044696A 1998-03-11 1998-10-24 반도체기판상에형성되는인덕턴스소자 Expired - Fee Related KR100334041B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP59620 1998-03-11
JP05962098A JP3942264B2 (ja) 1998-03-11 1998-03-11 半導体基板上に形成されるインダクタンス素子

Publications (2)

Publication Number Publication Date
KR19990076525A KR19990076525A (ko) 1999-10-15
KR100334041B1 true KR100334041B1 (ko) 2002-09-25

Family

ID=13118479

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019980044696A Expired - Fee Related KR100334041B1 (ko) 1998-03-11 1998-10-24 반도체기판상에형성되는인덕턴스소자

Country Status (5)

Country Link
US (3) US6225677B1 (enExample)
JP (1) JP3942264B2 (enExample)
KR (1) KR100334041B1 (enExample)
FR (1) FR2776128B1 (enExample)
TW (1) TW401639B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220102772A (ko) 2021-01-14 2022-07-21 주식회사 삼주유니콘 환봉의 길이 조절장치

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000243908A (ja) * 1999-02-23 2000-09-08 Fujitsu Ltd 半導体集積回路
GB2353139B (en) * 1999-08-12 2001-08-29 United Microelectronics Corp Inductor and method of manufacturing the same
JP4776752B2 (ja) * 2000-04-19 2011-09-21 ルネサスエレクトロニクス株式会社 半導体装置
WO2001093317A1 (en) * 2000-05-30 2001-12-06 Programmable Silicon Solutions Integrated inductive circuits
US6441442B1 (en) 2000-05-30 2002-08-27 Programmable Silicon Solutions Integrated inductive circuits
US6917095B1 (en) 2000-05-30 2005-07-12 Altera Corporation Integrated radio frequency circuits
US6455915B1 (en) * 2000-05-30 2002-09-24 Programmable Silicon Solutions Integrated inductive circuits
EP1160842A3 (en) * 2000-05-30 2003-09-17 Programmable Silicon Solutions Integrated radio frequency circuits
US6489663B2 (en) * 2001-01-02 2002-12-03 International Business Machines Corporation Spiral inductor semiconducting device with grounding strips and conducting vias
DE10136740A1 (de) * 2001-07-27 2002-10-24 Infineon Technologies Ag Integriertes, induktives Bauelement
JP3754406B2 (ja) * 2002-09-13 2006-03-15 富士通株式会社 可変インダクタおよびそのインダクタンス調整方法
FR2846792A1 (fr) * 2002-10-30 2004-05-07 Commissariat Energie Atomique Composant microelectrique radiofrequence et procede de realisation
US20040195650A1 (en) * 2003-04-04 2004-10-07 Tsung-Ju Yang High-Q inductor device with a shielding pattern embedded in a substrate
US6989578B2 (en) * 2003-07-31 2006-01-24 Taiwan Semiconductor Manufacturing Company Inductor Q value improvement
WO2005024949A1 (ja) * 2003-08-28 2005-03-17 Hitachi, Ltd. 半導体装置及びその製造方法
DE102004014752B4 (de) * 2004-03-25 2008-11-20 Infineon Technologies Ag Halbleiterbauelement mit kernlosem Wandler und Halbbrücke
US7511588B2 (en) * 2005-07-19 2009-03-31 Lctank Llc Flux linked LC tank circuits forming distributed clock networks
US7508280B2 (en) * 2005-07-19 2009-03-24 Lc Tank Llc Frequency adjustment techniques in coupled LC tank circuits
US7786836B2 (en) * 2005-07-19 2010-08-31 Lctank Llc Fabrication of inductors in transformer based tank circuitry
US7250826B2 (en) * 2005-07-19 2007-07-31 Lctank Llc Mutual inductance in transformer based tank circuitry
US7279426B2 (en) * 2005-09-22 2007-10-09 International Business Machines Corporation Like integrated circuit devices with different depth
JP4647484B2 (ja) * 2005-12-27 2011-03-09 ルネサスエレクトロニクス株式会社 半導体装置
US7402890B2 (en) * 2006-06-02 2008-07-22 International Business Machines Corporation Method for symmetric capacitor formation
GB2440365A (en) * 2006-07-21 2008-01-30 X Fab Uk Ltd A semiconductor device
US7948055B2 (en) * 2006-08-31 2011-05-24 United Microelectronics Corp. Inductor formed on semiconductor substrate
KR100883036B1 (ko) * 2007-07-25 2009-02-09 주식회사 동부하이텍 반도체 소자용 인덕터 및 그 제조 방법
US20100193904A1 (en) * 2009-01-30 2010-08-05 Watt Jeffrey T Integrated circuit inductor with doped substrate
GB0918221D0 (en) * 2009-10-16 2009-12-02 Cambridge Silicon Radio Ltd Inductor structure
KR101121645B1 (ko) * 2010-03-22 2012-02-28 삼성전기주식회사 평면형 트랜스포머
TWI498928B (zh) * 2010-08-04 2015-09-01 立積電子股份有限公司 螺旋電感元件
CN102376700A (zh) * 2010-08-04 2012-03-14 立积电子股份有限公司 电子组件及其制法、螺旋电感组件及其制法
US8686539B1 (en) * 2010-10-15 2014-04-01 Xilinx, Inc. Inductor having a deep-well noise isolation shield
US9225392B2 (en) * 2011-03-09 2015-12-29 Qualcomm Incorporated Flat power coil for wireless charging applications
CN102522385A (zh) * 2011-12-30 2012-06-27 上海集成电路研发中心有限公司 片上集成铜电感
US8878334B1 (en) * 2012-03-23 2014-11-04 Altera Corporation Integrated circuit resistors with reduced parasitic capacitance
JP6057534B2 (ja) * 2012-04-18 2017-01-11 住重試験検査株式会社 半導体装置の製造方法
CN103474414B (zh) * 2012-06-06 2016-03-16 中芯国际集成电路制造(上海)有限公司 电感及其形成方法
JP5719000B2 (ja) * 2013-09-17 2015-05-13 学校法人慶應義塾 集積回路装置
JP6375872B2 (ja) * 2014-10-29 2018-08-22 住友電気工業株式会社 超電導マグネットおよび超電導機器
TWI587329B (zh) * 2014-10-31 2017-06-11 台灣東電化股份有限公司 無線充電印刷電路板線圈結構
JP7056016B2 (ja) * 2017-06-13 2022-04-19 Tdk株式会社 コイル部品
JP7169871B2 (ja) * 2018-12-26 2022-11-11 住重アテックス株式会社 半導体装置の製造方法
JP7430376B2 (ja) * 2019-12-19 2024-02-13 三安ジャパンテクノロジー株式会社 スパイラルインダクタ及びパッシブ集積回路
CN113745404A (zh) * 2021-08-25 2021-12-03 中国科学院微电子研究所 螺旋电感的制备方法、螺旋电感及无源器件模块

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970053797A (ko) * 1995-12-21 1997-07-31 양승택 공핍층을 이용한 인덕터
KR19980014335A (ko) * 1996-08-09 1998-05-25 윤덕용 산화막 다공성 실리콘 기판을 이용한 초고주파 소자

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4851257A (en) 1987-03-13 1989-07-25 Harris Corporation Process for the fabrication of a vertical contact
US5070317A (en) * 1989-01-17 1991-12-03 Bhagat Jayant K Miniature inductor for integrated circuits and devices
US5206213A (en) * 1990-03-23 1993-04-27 International Business Machines Corp. Method of preparing oriented, polycrystalline superconducting ceramic oxides
DE69331072T2 (de) * 1992-03-13 2002-06-20 Kabushiki Kaisha Toshiba, Kawasaki Bilderzeugung mittels magnetischer Kernresonanz mit verbesserter Bildqualität und Betriebsweise
US5572040A (en) * 1993-07-12 1996-11-05 Peregrine Semiconductor Corporation High-frequency wireless communication system on a single ultrathin silicon on sapphire chip
US5370766A (en) 1993-08-16 1994-12-06 California Micro Devices Methods for fabrication of thin film inductors, inductor networks and integration with other passive and active devices
JP3015679B2 (ja) 1993-09-01 2000-03-06 株式会社東芝 半導体装置およびその製造方法
JP3373267B2 (ja) 1993-11-01 2003-02-04 新潟精密株式会社 Lc素子及び半導体装置
JPH07183468A (ja) 1993-12-22 1995-07-21 Tokin Corp 絶縁シリコン基板並びにそれを用いたインダクタおよび分布定数型フィルタ
TW267260B (enExample) * 1993-12-29 1996-01-01 Tif Kk
JP3450408B2 (ja) 1994-02-21 2003-09-22 新潟精密株式会社 Lc複合素子
JP2904086B2 (ja) * 1995-12-27 1999-06-14 日本電気株式会社 半導体装置およびその製造方法
SE510443C2 (sv) * 1996-05-31 1999-05-25 Ericsson Telefon Ab L M Induktorer för integrerade kretsar
KR100243658B1 (ko) * 1996-12-06 2000-02-01 정선종 기판 변환기술을 이용한 인덕터 소자 및 그 제조 방법
US5844299A (en) 1997-01-31 1998-12-01 National Semiconductor Corporation Integrated inductor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970053797A (ko) * 1995-12-21 1997-07-31 양승택 공핍층을 이용한 인덕터
KR19980014335A (ko) * 1996-08-09 1998-05-25 윤덕용 산화막 다공성 실리콘 기판을 이용한 초고주파 소자

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220102772A (ko) 2021-01-14 2022-07-21 주식회사 삼주유니콘 환봉의 길이 조절장치

Also Published As

Publication number Publication date
FR2776128B1 (fr) 2005-04-15
FR2776128A1 (fr) 1999-09-17
US6879022B2 (en) 2005-04-12
US20020149088A1 (en) 2002-10-17
US20010040270A1 (en) 2001-11-15
JP3942264B2 (ja) 2007-07-11
JPH11261008A (ja) 1999-09-24
KR19990076525A (ko) 1999-10-15
US6225677B1 (en) 2001-05-01
TW401639B (en) 2000-08-11

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