TW401639B - Inductance: device formed on semiconductor substrate - Google Patents
Inductance: device formed on semiconductor substrate Download PDFInfo
- Publication number
- TW401639B TW401639B TW087117512A TW87117512A TW401639B TW 401639 B TW401639 B TW 401639B TW 087117512 A TW087117512 A TW 087117512A TW 87117512 A TW87117512 A TW 87117512A TW 401639 B TW401639 B TW 401639B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- strip
- semiconductor substrate
- conductive film
- shaped conductive
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 91
- 239000004065 semiconductor Substances 0.000 title claims abstract description 42
- 230000001939 inductive effect Effects 0.000 claims description 25
- 238000004804 winding Methods 0.000 claims description 16
- 238000009413 insulation Methods 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 10
- 230000002079 cooperative effect Effects 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 239000002887 superconductor Substances 0.000 claims description 2
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 238000002513 implantation Methods 0.000 claims 1
- 230000001965 increasing effect Effects 0.000 abstract description 4
- 239000012535 impurity Substances 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 60
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000004907 flux Effects 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- -1 oxygen ions Chemical class 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 208000024891 symptom Diseases 0.000 description 1
- 230000035922 thirst Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/20—Inductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Integrated Circuits (AREA)
- Coils Or Transformers For Communication (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05962098A JP3942264B2 (ja) | 1998-03-11 | 1998-03-11 | 半導体基板上に形成されるインダクタンス素子 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW401639B true TW401639B (en) | 2000-08-11 |
Family
ID=13118479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW087117512A TW401639B (en) | 1998-03-11 | 1998-10-22 | Inductance: device formed on semiconductor substrate |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US6225677B1 (enExample) |
| JP (1) | JP3942264B2 (enExample) |
| KR (1) | KR100334041B1 (enExample) |
| FR (1) | FR2776128B1 (enExample) |
| TW (1) | TW401639B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103474414A (zh) * | 2012-06-06 | 2013-12-25 | 中芯国际集成电路制造(上海)有限公司 | 电感及其形成方法 |
Families Citing this family (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000243908A (ja) * | 1999-02-23 | 2000-09-08 | Fujitsu Ltd | 半導体集積回路 |
| GB2353139B (en) * | 1999-08-12 | 2001-08-29 | United Microelectronics Corp | Inductor and method of manufacturing the same |
| JP4776752B2 (ja) * | 2000-04-19 | 2011-09-21 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| WO2001093317A1 (en) * | 2000-05-30 | 2001-12-06 | Programmable Silicon Solutions | Integrated inductive circuits |
| US6441442B1 (en) | 2000-05-30 | 2002-08-27 | Programmable Silicon Solutions | Integrated inductive circuits |
| US6917095B1 (en) | 2000-05-30 | 2005-07-12 | Altera Corporation | Integrated radio frequency circuits |
| US6455915B1 (en) * | 2000-05-30 | 2002-09-24 | Programmable Silicon Solutions | Integrated inductive circuits |
| EP1160842A3 (en) * | 2000-05-30 | 2003-09-17 | Programmable Silicon Solutions | Integrated radio frequency circuits |
| US6489663B2 (en) * | 2001-01-02 | 2002-12-03 | International Business Machines Corporation | Spiral inductor semiconducting device with grounding strips and conducting vias |
| DE10136740A1 (de) * | 2001-07-27 | 2002-10-24 | Infineon Technologies Ag | Integriertes, induktives Bauelement |
| JP3754406B2 (ja) * | 2002-09-13 | 2006-03-15 | 富士通株式会社 | 可変インダクタおよびそのインダクタンス調整方法 |
| FR2846792A1 (fr) * | 2002-10-30 | 2004-05-07 | Commissariat Energie Atomique | Composant microelectrique radiofrequence et procede de realisation |
| US20040195650A1 (en) * | 2003-04-04 | 2004-10-07 | Tsung-Ju Yang | High-Q inductor device with a shielding pattern embedded in a substrate |
| US6989578B2 (en) * | 2003-07-31 | 2006-01-24 | Taiwan Semiconductor Manufacturing Company | Inductor Q value improvement |
| WO2005024949A1 (ja) * | 2003-08-28 | 2005-03-17 | Hitachi, Ltd. | 半導体装置及びその製造方法 |
| DE102004014752B4 (de) * | 2004-03-25 | 2008-11-20 | Infineon Technologies Ag | Halbleiterbauelement mit kernlosem Wandler und Halbbrücke |
| US7511588B2 (en) * | 2005-07-19 | 2009-03-31 | Lctank Llc | Flux linked LC tank circuits forming distributed clock networks |
| US7508280B2 (en) * | 2005-07-19 | 2009-03-24 | Lc Tank Llc | Frequency adjustment techniques in coupled LC tank circuits |
| US7786836B2 (en) * | 2005-07-19 | 2010-08-31 | Lctank Llc | Fabrication of inductors in transformer based tank circuitry |
| US7250826B2 (en) * | 2005-07-19 | 2007-07-31 | Lctank Llc | Mutual inductance in transformer based tank circuitry |
| US7279426B2 (en) * | 2005-09-22 | 2007-10-09 | International Business Machines Corporation | Like integrated circuit devices with different depth |
| JP4647484B2 (ja) * | 2005-12-27 | 2011-03-09 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US7402890B2 (en) * | 2006-06-02 | 2008-07-22 | International Business Machines Corporation | Method for symmetric capacitor formation |
| GB2440365A (en) * | 2006-07-21 | 2008-01-30 | X Fab Uk Ltd | A semiconductor device |
| US7948055B2 (en) * | 2006-08-31 | 2011-05-24 | United Microelectronics Corp. | Inductor formed on semiconductor substrate |
| KR100883036B1 (ko) * | 2007-07-25 | 2009-02-09 | 주식회사 동부하이텍 | 반도체 소자용 인덕터 및 그 제조 방법 |
| US20100193904A1 (en) * | 2009-01-30 | 2010-08-05 | Watt Jeffrey T | Integrated circuit inductor with doped substrate |
| GB0918221D0 (en) * | 2009-10-16 | 2009-12-02 | Cambridge Silicon Radio Ltd | Inductor structure |
| KR101121645B1 (ko) * | 2010-03-22 | 2012-02-28 | 삼성전기주식회사 | 평면형 트랜스포머 |
| TWI498928B (zh) * | 2010-08-04 | 2015-09-01 | 立積電子股份有限公司 | 螺旋電感元件 |
| CN102376700A (zh) * | 2010-08-04 | 2012-03-14 | 立积电子股份有限公司 | 电子组件及其制法、螺旋电感组件及其制法 |
| US8686539B1 (en) * | 2010-10-15 | 2014-04-01 | Xilinx, Inc. | Inductor having a deep-well noise isolation shield |
| US9225392B2 (en) * | 2011-03-09 | 2015-12-29 | Qualcomm Incorporated | Flat power coil for wireless charging applications |
| CN102522385A (zh) * | 2011-12-30 | 2012-06-27 | 上海集成电路研发中心有限公司 | 片上集成铜电感 |
| US8878334B1 (en) * | 2012-03-23 | 2014-11-04 | Altera Corporation | Integrated circuit resistors with reduced parasitic capacitance |
| JP6057534B2 (ja) * | 2012-04-18 | 2017-01-11 | 住重試験検査株式会社 | 半導体装置の製造方法 |
| JP5719000B2 (ja) * | 2013-09-17 | 2015-05-13 | 学校法人慶應義塾 | 集積回路装置 |
| JP6375872B2 (ja) * | 2014-10-29 | 2018-08-22 | 住友電気工業株式会社 | 超電導マグネットおよび超電導機器 |
| TWI587329B (zh) * | 2014-10-31 | 2017-06-11 | 台灣東電化股份有限公司 | 無線充電印刷電路板線圈結構 |
| JP7056016B2 (ja) * | 2017-06-13 | 2022-04-19 | Tdk株式会社 | コイル部品 |
| JP7169871B2 (ja) * | 2018-12-26 | 2022-11-11 | 住重アテックス株式会社 | 半導体装置の製造方法 |
| JP7430376B2 (ja) * | 2019-12-19 | 2024-02-13 | 三安ジャパンテクノロジー株式会社 | スパイラルインダクタ及びパッシブ集積回路 |
| KR20220102772A (ko) | 2021-01-14 | 2022-07-21 | 주식회사 삼주유니콘 | 환봉의 길이 조절장치 |
| CN113745404A (zh) * | 2021-08-25 | 2021-12-03 | 中国科学院微电子研究所 | 螺旋电感的制备方法、螺旋电感及无源器件模块 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4851257A (en) | 1987-03-13 | 1989-07-25 | Harris Corporation | Process for the fabrication of a vertical contact |
| US5070317A (en) * | 1989-01-17 | 1991-12-03 | Bhagat Jayant K | Miniature inductor for integrated circuits and devices |
| US5206213A (en) * | 1990-03-23 | 1993-04-27 | International Business Machines Corp. | Method of preparing oriented, polycrystalline superconducting ceramic oxides |
| DE69331072T2 (de) * | 1992-03-13 | 2002-06-20 | Kabushiki Kaisha Toshiba, Kawasaki | Bilderzeugung mittels magnetischer Kernresonanz mit verbesserter Bildqualität und Betriebsweise |
| US5572040A (en) * | 1993-07-12 | 1996-11-05 | Peregrine Semiconductor Corporation | High-frequency wireless communication system on a single ultrathin silicon on sapphire chip |
| US5370766A (en) | 1993-08-16 | 1994-12-06 | California Micro Devices | Methods for fabrication of thin film inductors, inductor networks and integration with other passive and active devices |
| JP3015679B2 (ja) | 1993-09-01 | 2000-03-06 | 株式会社東芝 | 半導体装置およびその製造方法 |
| JP3373267B2 (ja) | 1993-11-01 | 2003-02-04 | 新潟精密株式会社 | Ｌｃ素子及び半導体装置 |
| JPH07183468A (ja) | 1993-12-22 | 1995-07-21 | Tokin Corp | 絶縁シリコン基板並びにそれを用いたインダクタおよび分布定数型フィルタ |
| TW267260B (enExample) * | 1993-12-29 | 1996-01-01 | Tif Kk | |
| JP3450408B2 (ja) | 1994-02-21 | 2003-09-22 | 新潟精密株式会社 | Ｌｃ複合素子 |
| KR970053797A (ko) * | 1995-12-21 | 1997-07-31 | 양승택 | 공핍층을 이용한 인덕터 |
| JP2904086B2 (ja) * | 1995-12-27 | 1999-06-14 | 日本電気株式会社 | 半導体装置およびその製造方法 |
| SE510443C2 (sv) * | 1996-05-31 | 1999-05-25 | Ericsson Telefon Ab L M | Induktorer för integrerade kretsar |
| KR100314610B1 (ko) * | 1996-08-09 | 2001-12-28 | 윤덕용 | 산화막다공성실리콘기판을이용한초고주파소자 |
| KR100243658B1 (ko) * | 1996-12-06 | 2000-02-01 | 정선종 | 기판 변환기술을 이용한 인덕터 소자 및 그 제조 방법 |
| US5844299A (en) | 1997-01-31 | 1998-12-01 | National Semiconductor Corporation | Integrated inductor |
-
1998
- 1998-03-11 JP JP05962098A patent/JP3942264B2/ja not_active Expired - Fee Related
- 1998-10-21 US US09/175,975 patent/US6225677B1/en not_active Expired - Lifetime
- 1998-10-22 TW TW087117512A patent/TW401639B/zh not_active IP Right Cessation
- 1998-10-24 KR KR1019980044696A patent/KR100334041B1/ko not_active Expired - Fee Related
- 1998-11-25 FR FR9814825A patent/FR2776128B1/fr not_active Expired - Fee Related
-
2001
- 2001-02-26 US US09/791,859 patent/US20010040270A1/en not_active Abandoned
-
2002
- 2002-06-07 US US10/163,367 patent/US6879022B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103474414A (zh) * | 2012-06-06 | 2013-12-25 | 中芯国际集成电路制造(上海)有限公司 | 电感及其形成方法 |
| CN103474414B (zh) * | 2012-06-06 | 2016-03-16 | 中芯国际集成电路制造(上海)有限公司 | 电感及其形成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100334041B1 (ko) | 2002-09-25 |
| FR2776128B1 (fr) | 2005-04-15 |
| FR2776128A1 (fr) | 1999-09-17 |
| US6879022B2 (en) | 2005-04-12 |
| US20020149088A1 (en) | 2002-10-17 |
| US20010040270A1 (en) | 2001-11-15 |
| JP3942264B2 (ja) | 2007-07-11 |
| JPH11261008A (ja) | 1999-09-24 |
| KR19990076525A (ko) | 1999-10-15 |
| US6225677B1 (en) | 2001-05-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |