JP5506108B2 - エンドエフェクタを備えたロボット及びその運転方法 - Google Patents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/20—Control lever and linkage systems
- Y10T74/20207—Multiple controlling elements for single controlled element
- Y10T74/20305—Robotic arm
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- Engineering & Computer Science (AREA)
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- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Description
Claims (24)
- ロボットのアームに装着されるように構成されたエンドエフェクタにおいて、
各々が基板を保持できるように構成された複数のブレード部材であって、前記ブレード部材同士のブレード間隔を変更可能に構成された複数のブレード部材と、
前記複数のブレード部材を支持するブレード支持部であって、前記ロボットによって前記複数のブレード部材と一体的に駆動されるブレード支持部と、
前記複数のブレード部材のうちの少なくとも1つを他のブレード部材に対して移動させて前記ブレード間隔を変更するブレード駆動手段と、を備え、
前記ブレード部材に前記基板が保持された場合に、その基板と前記ブレード部材とが上から見て重なる範囲において、前記複数のブレード部材が、前記ブレード部材に保持された前記基板の表面に対して垂直な基板垂線方向に見たときに互いに重ならないように構成されている、ことを特徴とするエンドエフェクタ。 - 前記基板の搬送中に、前記ブレード部材同士、または前記ブレード部材と前記ブレード支持部が、上から見て互いに重ならないように構成されている、請求項1記載のエンドエフェクタ。
- 前記ブレード間隔が、前記ブレード部材に保持された前記基板の表面に対して垂直な基板垂線方向における間隔である、請求項1又は2に記載のエンドエフェクタ。
- 前記ブレード駆動手段による前記ブレード部材の移動方向が、前記基板垂線方向である、請求項3記載のエンドエフェクタ。
- 前記複数のブレード部材の各々は、前記基板が当接される基板保持部を有し、
前記ブレード駆動手段によって前記ブレード間隔を縮めることにより、前記複数のブレード部材の基板保持部同士が略面一になるように構成されている、請求項1乃至4のいずれか一項に記載のエンドエフェクタ。 - 前記ブレード駆動手段によって前記ブレード間隔を縮めることにより、前記基板の表面に対して垂直な基板垂線方向における前記複数のブレード部材の全体の厚さが所定の厚さよりも小さくなるように構成されている、請求項1乃至5のいずれか一項に記載のエンドエフェクタ。
- 前記所定の厚さは、前記基板の複数段載置部における基板配置ピッチに対応する、請求項6記載のエンドエフェクタ。
- 前記所定の厚さは、前記基板の複数段載置部における隣接する載置部の間のブレード存在可能厚さである、請求項6記載のエンドエフェクタ。
- 前記ブレード駆動手段は、前記ブレード間隔について最大間隔と最小間隔のいずれかを選択的に規定するように構成されている、請求項1乃至8のいずれか一項に記載のエンドエフェクタ。
- 前記ブレード駆動手段は、流体圧シリンダを含む、請求項9記載のエンドエフェクタ。
- 前記ブレード駆動手段は、前記ブレード間隔について最大間隔と最小間隔との間で任意に規定できるように構成されている、請求項1乃至8のいずれか一項に記載のエンドエフェクタ。
- 前記ブレード駆動手段は、サーボモータを含む、請求項11記載のエンドエフェクタ。
- 前記複数のブレード部材は、少なくとも3つのブレード部材を含み、前記最大間隔は、隣接する一対の前記ブレード部材の組によって異なる、請求項9乃至12のいずれか一項に記載のエンドエフェクタ。
- 隣接する前記ブレード部材同士の間隔が前記最大間隔にある場合、隣接する前記ブレード部材同士の間隔をDとし、前記基板の複数段載置部における基板配置ピッチをPとすると、nP<D<(n+1)P(nは0を含む自然数)である、請求項9乃至13のいずれか一項に記載のエンドエフェクタ。
- 前記複数のブレード部材の各々が、前記基板を搬送する際に前記ブレード部材から前記基板が離脱しないように前記基板を固定する固定手段を有する、請求項1乃至14のいずれか一項に記載のエンドエフェクタ。
- 前記固定手段は、前記基板の縁部に解放可能に当接される可動当接部を有するエッジガイド機構を含む、請求項15記載のエンドエフェクタ。
- 前記ブレード駆動手段は、前記ブレード間隔について最大間隔と最小間隔のいずれかを選択的に規定するように構成されており、
隣接する前記ブレード部材の前記可動当接部同士の間隔が前記最大間隔にあわせて設定されている、請求項16記載のエンドエフェクタ。 - 前記固定手段は、前記基板を真空吸着する吸着部を含む吸着機構を有する、請求項15記載のエンドエフェクタ。
- 請求項1乃至18のいずれか一項に記載のエンドエフェクタと、前記エンドエフェクタが装着されたアームと、を備えたことを特徴とするロボット。
- 前記アームには、前記エンドエフェクタに加えて、前記エンドエフェクタとは独立して駆動可能な追加のエンドエフェクタが設けられている、請求項19記載のロボット。
- 前記追加のエンドエフェクタは、請求項1乃至18のいずれか一項に記載のエンドエフェクタである、請求項20に記載のロボット。
- 前記追加のエンドエフェクタは、各々が前記基板を保持できるように構成された複数のブレード部材を有し、前記追加のエンドエフェクタの前記ブレード部材同士の間隔が固定されている、請求項20に記載のロボット。
- 請求項19記載のロボットの運転方法であって、
前記エンドエフェクタの2つ以上のブレード部材を用いて2枚以上の前記基板を同時に搬送する工程と、
前記ブレード駆動手段によって前記ブレード間隔を縮めた状態で、前記エンドエフェクタによって1枚の前記基板を搬送する工程と、を備えたことを特徴とするロボットの運転方法。 - 請求項20乃至22のいずれか一項に記載のロボットの運転方法であって、
前記エンドエフェクタ及び前記追加のエンドエフェクタの両方を用いて複数の前記基板を同時に搬送する工程と、
前記エンドエフェクタ又は前記追加のエンドエフェクタのいずれか一方を用いて1枚又は複数の前記基板を搬送する工程と、を備えたことを特徴とするロボットの運転方法。
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US20257909P | 2009-03-13 | 2009-03-13 | |
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PCT/JP2010/051224 WO2010103876A1 (ja) | 2009-03-13 | 2010-01-29 | エンドエフェクタを備えたロボット及びその運転方法 |
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JP2013213748A Pending JP2014042049A (ja) | 2009-03-13 | 2013-10-11 | エンドエフェクタを備えたロボット及びその運転方法 |
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KR (4) | KR20150052329A (ja) |
CN (2) | CN102349144B (ja) |
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EP2018528B1 (en) * | 2006-05-19 | 2015-10-21 | Marel A/S | A method and a system for batching of objects |
JP4770856B2 (ja) * | 2008-03-21 | 2011-09-14 | トヨタ自動車株式会社 | 移送用ロボット |
JP5456287B2 (ja) * | 2008-09-05 | 2014-03-26 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
JP5071514B2 (ja) * | 2010-04-21 | 2012-11-14 | 株式会社安川電機 | 水平多関節ロボットおよびそれを備えた基板搬送システム |
JP5620172B2 (ja) * | 2010-07-16 | 2014-11-05 | キヤノンアネルバ株式会社 | 基板搬送装置、電子デバイスの製造システムおよび電子デバイスの製造方法 |
KR102060544B1 (ko) * | 2010-11-10 | 2019-12-30 | 브룩스 오토메이션 인코퍼레이티드 | 이중 아암 로봇 |
US8567837B2 (en) * | 2010-11-24 | 2013-10-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Reconfigurable guide pin design for centering wafers having different sizes |
JP5243569B2 (ja) * | 2011-03-07 | 2013-07-24 | 東京エレクトロン株式会社 | 基板搬送装置、基板搬送方法及びその基板搬送方法を実行させるためのプログラムを記録した記録媒体 |
JPWO2012141067A1 (ja) * | 2011-04-15 | 2014-07-28 | タツモ株式会社 | ウエハ交換装置およびウエハ支持用ハンド |
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US20160107317A1 (en) | 2016-04-21 |
EP2408004A1 (en) | 2012-01-18 |
US9616577B2 (en) | 2017-04-11 |
EP3163603B1 (en) | 2021-06-30 |
JP2015167250A (ja) | 2015-09-24 |
KR20110118155A (ko) | 2011-10-28 |
KR20140057400A (ko) | 2014-05-12 |
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