JP6049971B2 - エンドエフェクタを備えたロボット及びその運転方法 - Google Patents
エンドエフェクタを備えたロボット及びその運転方法 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/20—Control lever and linkage systems
- Y10T74/20207—Multiple controlling elements for single controlled element
- Y10T74/20305—Robotic arm
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Description
Claims (13)
- ロボットのアームに装着されるように構成されたエンドエフェクタにおいて、
各々が基板を保持できるように構成された複数のブレード部材であって、前記複数のブレード部材のうちの少なくとも1つのブレード部材が他のブレード部材に対して移動可能に構成されている、複数のブレード部材と、
前記複数のブレード部材を支持するブレード支持部であって、前記ロボットによって前記複数のブレード部材と一体的に駆動されるブレード支持部と、
前記少なくとも1つのブレード部材を前記他のブレード部材に対して移動させるブレード駆動手段であって、前記ブレード部材に保持された前記基板の表面に対して垂直な基板垂線方向において、前記少なくとも1つのブレード部材の基板保持面が前記他のブレード部材の基板保持面よりも基板保持側に位置する状態と、前記他のブレード部材の前記基板保持面が前記少なくとも1つのブレード部材の前記基板保持面よりも基板保持側に位置する状態とを切り換えるブレード駆動手段と、を備え、
前記複数のブレード部材の各々が、前記基板を搬送する際に前記ブレード部材から前記基板が離脱しないように前記基板を固定する固定手段を有し、
前記固定手段は、前記基板の縁部に解放可能に当接される可動当接部を有するエッジガイド機構を含み、
前記複数のブレード部材の各々の前記エッジガイド機構は、互いに独立に駆動されるように構成されている、エンドエフェクタ。 - 前記複数のブレード部材が、前記基板垂線方向に見たときに互いに重ならないように構成されている、請求項1記載のエンドエフェクタ。
- 前記ブレード駆動手段による前記ブレード部材の移動方向が、前記基板垂線方向である、請求項1又は2に記載のエンドエフェクタ。
- 前記少なくとも1つのブレード部材の前記基板保持面と前記他のブレード部材の前記基板保持面との間の前記基板垂線方向における最大距離が、前記基板の複数段載置部における基板配置ピッチの範囲内である、請求項1乃至3のいずれか一項に記載のエンドエフェクタ。
- 前記基板垂線方向における前記複数のブレード部材の全体の最大厚さが、前記基板の複数段載置部における隣接する載置部の間のブレード存在可能厚さ以下である、請求項1乃至4のいずれか一項に記載のエンドエフェクタ。
- 請求項1乃至5のいずれか一項に記載のエンドエフェクタと、前記エンドエフェクタが装着されたアームと、を備えたことを特徴とするロボット。
- 前記アームには、前記エンドエフェクタに加えて、前記エンドエフェクタとは独立して駆動可能な追加のエンドエフェクタが設けられている、請求項6記載のロボット。
- 前記エンドエフェクタの前記ブレード部材の前記基板保持面と前記追加のエンドエフェクタのブレード部材の基板保持面との間隔が、前記基板の複数段載置部における基板配置ピッチである、請求項7記載のロボット。
- 前記追加のエンドエフェクタは、請求項1乃至5のいずれか一項に記載のエンドエフェクタである、請求項7記載のロボット。
- 前記追加のエンドエフェクタは、各々が前記基板を保持できるように構成された複数のブレード部材を有し、前記追加のエンドエフェクタの前記ブレード部材同士の間隔が固定されている、請求項7に記載のロボット。
- 請求項7乃至10のいずれか一項に記載のロボットの運転方法であって、
前記エンドエフェクタ及び前記追加のエンドエフェクタの両方を用いて複数の前記基板を同時に搬送する工程と、
前記エンドエフェクタ又は前記追加のエンドエフェクタのいずれか一方を用いて1枚又は複数の前記基板を搬送する工程と、を備えたことを特徴とするロボットの運転方法。 - 請求項6記載のロボットの運転方法であって、
前記少なくとも1つのブレード部材と前記他のブレード部材とで適用条件を変えることを特徴とするロボットの運転方法。 - 前記適用条件が、クリーン用と非クリーン用との使い分け、及び/又は、高温用と低温用との使い分けに関するものである、請求項12記載のロボットの運転方法。
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US20257909P | 2009-03-13 | 2009-03-13 | |
US61/202,579 | 2009-03-13 |
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JP2015167250A JP2015167250A (ja) | 2015-09-24 |
JP6049971B2 true JP6049971B2 (ja) | 2016-12-21 |
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JP2011503747A Active JP5506108B2 (ja) | 2009-03-13 | 2010-01-29 | エンドエフェクタを備えたロボット及びその運転方法 |
JP2013213748A Pending JP2014042049A (ja) | 2009-03-13 | 2013-10-11 | エンドエフェクタを備えたロボット及びその運転方法 |
JP2014053755A Active JP5976709B2 (ja) | 2009-03-13 | 2014-03-17 | エンドエフェクタを備えたロボット及びその運転方法 |
JP2015094947A Active JP6049971B2 (ja) | 2009-03-13 | 2015-05-07 | エンドエフェクタを備えたロボット及びその運転方法 |
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JP2013213748A Pending JP2014042049A (ja) | 2009-03-13 | 2013-10-11 | エンドエフェクタを備えたロボット及びその運転方法 |
JP2014053755A Active JP5976709B2 (ja) | 2009-03-13 | 2014-03-17 | エンドエフェクタを備えたロボット及びその運転方法 |
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US (2) | US9254566B2 (ja) |
EP (2) | EP2408004A4 (ja) |
JP (4) | JP5506108B2 (ja) |
KR (4) | KR20140057400A (ja) |
CN (2) | CN102349144B (ja) |
SG (1) | SG174360A1 (ja) |
TW (1) | TWI520821B (ja) |
WO (1) | WO2010103876A1 (ja) |
Families Citing this family (115)
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