JP5279403B2 - 不揮発性半導体記憶装置及びその製造方法 - Google Patents
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- H10B43/23—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
- H10B43/27—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
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- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0688—Integrated circuits having a three-dimensional layout
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66833—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a charge trapping gate insulator, e.g. MNOS transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
- H01L29/7926—Vertical transistors, i.e. transistors having source and drain not in the same horizontal plane
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/10—EEPROM devices comprising charge-trapping gate insulators characterised by the top-view layout
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/20—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
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Description
(tb+tc)×2<S<(tb+tc+tt)×2
(tb+tc)×2<S<(tb+tc+tt)×2
先ず、本発明の第1の実施形態について説明する。
図1は、本実施形態に係る不揮発性半導体記憶装置を例示する斜視図であり、
図2は、本実施形態に係る不揮発性半導体記憶装置を例示する平面図であり、
図3は、図2に示すA−A’線による断面図である。
なお、図1においては、図を見易くするために、導電部分のみを示し、絶縁部分は図示を省略している。
(tb+tc)×2<S<(tb+tc+tt)×2 (1)
本実施形態に係る装置1においては、シリコンピラーSPの中央部がチャネルとして機能し、電極膜WLがコントロールゲートとして機能することにより、シリコンピラーSPと電極膜WLとの各交差部分に、メモリセルとなるSGT(Surrounding Gate Transistor:サラウンディングゲートトランジスタ)が形成される。SGTとは、チャネルの周囲をゲート電極が取り囲んだ構造のトランジスタである。そして、各メモリセルにおいて、電荷蓄積層26内の電子トラップに電子が捕らえられて蓄積されることにより、情報が記憶される。
上述の如く、本実施形態に係る不揮発性半導体記憶装置1においては、電極膜WL間に貫通ホール17に連通した隙間18が形成されており、電荷蓄積層26が隙間18の内面に沿って形成されているため、電荷蓄積層26における電荷が蓄積される部分26a間の実効的な距離が長い。これにより、ある部分26aに注入された電荷が、他の部分26aに移動する際の拡散距離が長く、隣り合うメモリセル間の干渉が抑制される。このため、メモリセルにデータを保持する際の信頼性が高い。
図4は、本比較例に係る不揮発性半導体記憶装置を例示する断面図である。
図4に示すように、本比較例においては、電極膜WL間に隙間18が形成されておらず、Z方向に平行な断面において、貫通ホール17の内面は直線状である。このため、この断面においては、電荷蓄積層26も直線状に形成されており、部分26a間の最短経路に沿って、部分26bが設けられている。
図5は、本実施形態に係る不揮発性半導体記憶装置を例示する平面図であり、
図6は、図5に示すB−B’線による断面図である。
図7は、本実施形態に係る不揮発性半導体記憶装置を例示する斜視図であり、
図8は、本実施形態に係る不揮発性半導体記憶装置を例示する平面図である。
本実施形態は、不揮発性半導体記憶装置の製造方法の実施形態である。
図9乃至図19は、本実施形態に係る不揮発性半導体記憶装置の製造方法を例示する工程断面図である。
(tb+tc)×2<S (2)
S<(tb+tc+tt)×2 (3)
Claims (4)
- それぞれ複数の絶縁膜及び電極膜が交互に積層され、積層方向に延びる貫通ホールが形成された積層体と、
前記貫通ホールの内部に埋設された半導体ピラーと、
前記電極膜と前記半導体ピラーとの間に設けられた電荷蓄積層と、
前記電極膜と前記電荷蓄積層との間に設けられた絶縁性のブロック層と、
前記半導体ピラーと前記電荷蓄積層との間に設けられた絶縁性のトンネル絶縁層と、
を備え、
前記電極膜間には、前記貫通ホールに連通した隙間が形成されており、前記電荷蓄積層は、前記隙間の内面に沿って形成されており、前記電極膜間の距離をSとし、前記ブロック層の厚さをtbとし、前記電荷蓄積層の厚さをtcとし、前記トンネル絶縁層の厚さをttとするとき、下記数式を満たすことを特徴とする不揮発性半導体記憶装置。
(tb+tc)×2<S<(tb+tc+tt)×2 - 一の前記貫通ホールに連通された前記隙間は、他の前記貫通ホールには連通されていないことを特徴とする請求項1記載の不揮発性半導体記憶装置。
- 複数の前記貫通ホールが前記隙間を介して連通されていることを特徴とする請求項1記載の不揮発性半導体記憶装置。
- それぞれ複数の絶縁膜及び電極膜を交互に積層させて積層体を形成する工程と、
前記積層体に積層方向に延びる貫通ホールを形成する工程と、
前記貫通ホールを介して前記絶縁膜をエッチングすることにより、前記電極膜間に隙間を形成する工程と、
前記貫通ホールの側面及び前記隙間の内面に沿って絶縁性のブロック層を形成する工程と、
前記ブロック層上に電荷蓄積層を形成する工程と、
前記電荷蓄積層上に絶縁性のトンネル絶縁層を形成する工程と、
前記貫通ホールの内部に半導体ピラーを埋設する工程と、
を備え、
前記電極膜間の距離をSとし、前記ブロック層の厚さをtbとし、前記電荷蓄積層の厚さをtcとし、前記トンネル絶縁層の厚さをttとするとき、下記数式を満たすことを特徴とする不揮発性半導体記憶装置の製造方法。
(tb+tc)×2<S<(tb+tc+tt)×2
Priority Applications (7)
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JP2008210109A JP5279403B2 (ja) | 2008-08-18 | 2008-08-18 | 不揮発性半導体記憶装置及びその製造方法 |
KR1020090075617A KR101067561B1 (ko) | 2008-08-18 | 2009-08-17 | 불휘발성 반도체 메모리 디바이스 및 그 제조 방법 |
TW098127627A TWI435442B (zh) | 2008-08-18 | 2009-08-17 | 非揮發性半導體記憶裝置及其製造方法 |
TW106101303A TWI617010B (zh) | 2008-08-18 | 2009-08-17 | 非揮發性半導體記憶裝置及其製造方法 |
US12/542,276 US8193571B2 (en) | 2008-08-18 | 2009-08-17 | Stacked type nonvolatile semiconductor memory device and method of manufacturing same |
TW103101851A TWI576995B (zh) | 2008-08-18 | 2009-08-17 | 非揮發性半導體記憶裝置及其製造方法 |
KR1020110050775A KR101121297B1 (ko) | 2008-08-18 | 2011-05-27 | 불휘발성 반도체 메모리 디바이스 |
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JP2008210109A JP5279403B2 (ja) | 2008-08-18 | 2008-08-18 | 不揮発性半導体記憶装置及びその製造方法 |
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JP5279403B2 true JP5279403B2 (ja) | 2013-09-04 |
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US (1) | US8193571B2 (ja) |
JP (1) | JP5279403B2 (ja) |
KR (2) | KR101067561B1 (ja) |
TW (3) | TWI576995B (ja) |
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JP5380190B2 (ja) * | 2009-07-21 | 2014-01-08 | 株式会社東芝 | 不揮発性半導体記憶装置及びその製造方法 |
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JP2012038865A (ja) * | 2010-08-05 | 2012-02-23 | Toshiba Corp | 不揮発性半導体記憶装置および不揮発性半導体記憶装置の製造方法 |
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CN112437984B (zh) * | 2020-10-19 | 2023-04-04 | 长江存储科技有限责任公司 | 半导体器件及其形成方法 |
US11637178B2 (en) | 2020-10-23 | 2023-04-25 | Micron Technology, Inc. | Microelectronic devices including isolation structures neighboring staircase structures, and related memory devices, electronic systems, and methods |
US11488975B2 (en) * | 2020-10-27 | 2022-11-01 | Sandisk Technologies Llc | Multi-tier three-dimensional memory device with nested contact via structures and methods for forming the same |
US11476276B2 (en) * | 2020-11-24 | 2022-10-18 | Macronix International Co., Ltd. | Semiconductor device and method for fabricating the same |
JP2022096716A (ja) * | 2020-12-18 | 2022-06-30 | キオクシア株式会社 | 不揮発性半導体記憶装置 |
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JP3963664B2 (ja) | 2001-06-22 | 2007-08-22 | 富士雄 舛岡 | 半導体記憶装置及びその製造方法 |
US20040132245A1 (en) * | 2003-01-06 | 2004-07-08 | Pi-Chun Juan | Method of fabricating a dram cell |
US7098116B2 (en) * | 2004-01-08 | 2006-08-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Shallow trench isolation method for reducing oxide thickness variations at different pattern densities |
JP5016832B2 (ja) * | 2006-03-27 | 2012-09-05 | 株式会社東芝 | 不揮発性半導体記憶装置及びその製造方法 |
KR100707217B1 (ko) * | 2006-05-26 | 2007-04-13 | 삼성전자주식회사 | 리세스-타입 제어 게이트 전극을 구비하는 반도체 메모리소자 및 그 제조 방법 |
JP5100080B2 (ja) * | 2006-10-17 | 2012-12-19 | 株式会社東芝 | 不揮発性半導体記憶装置及びその製造方法 |
JP5118347B2 (ja) * | 2007-01-05 | 2013-01-16 | 株式会社東芝 | 半導体装置 |
JP2008244293A (ja) * | 2007-03-28 | 2008-10-09 | Toshiba Corp | 半導体装置の設計方法及び製造方法並びにソフトウエア |
KR100866966B1 (ko) | 2007-05-10 | 2008-11-06 | 삼성전자주식회사 | 비휘발성 메모리 소자, 그 제조 방법 및 반도체 패키지 |
JP5230274B2 (ja) * | 2008-06-02 | 2013-07-10 | 株式会社東芝 | 不揮発性半導体記憶装置 |
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US10707227B2 (en) | 2018-03-02 | 2020-07-07 | Toshiba Memory Corporation | Semiconductor device and method for manufacturing the same |
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JP2010045314A (ja) | 2010-02-25 |
TW201434138A (zh) | 2014-09-01 |
KR101067561B1 (ko) | 2011-09-27 |
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TWI576995B (zh) | 2017-04-01 |
TW201721843A (zh) | 2017-06-16 |
US20100038699A1 (en) | 2010-02-18 |
KR101121297B1 (ko) | 2012-03-22 |
KR20100021981A (ko) | 2010-02-26 |
TWI617010B (zh) | 2018-03-01 |
TW201011900A (en) | 2010-03-16 |
KR20110080134A (ko) | 2011-07-12 |
US8193571B2 (en) | 2012-06-05 |
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