JP4933031B2 - テープおよびその製造方法 - Google Patents
テープおよびその製造方法 Download PDFInfo
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- JP4933031B2 JP4933031B2 JP2004045563A JP2004045563A JP4933031B2 JP 4933031 B2 JP4933031 B2 JP 4933031B2 JP 2004045563 A JP2004045563 A JP 2004045563A JP 2004045563 A JP2004045563 A JP 2004045563A JP 4933031 B2 JP4933031 B2 JP 4933031B2
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 136
- 239000000463 material Substances 0.000 claims abstract description 44
- 238000000151 deposition Methods 0.000 claims abstract description 15
- 238000001514 detection method Methods 0.000 claims abstract description 7
- 238000012360 testing method Methods 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 45
- 239000000919 ceramic Substances 0.000 claims description 13
- 239000000945 filler Substances 0.000 claims description 12
- 229910010293 ceramic material Inorganic materials 0.000 claims description 9
- 230000005290 antiferromagnetic effect Effects 0.000 claims description 7
- 238000007689 inspection Methods 0.000 claims description 3
- 238000005137 deposition process Methods 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 72
- 229910052751 metal Inorganic materials 0.000 description 48
- 239000002184 metal Substances 0.000 description 48
- 230000008018 melting Effects 0.000 description 33
- 238000002844 melting Methods 0.000 description 33
- 239000004593 Epoxy Substances 0.000 description 25
- 238000005304 joining Methods 0.000 description 16
- 239000010409 thin film Substances 0.000 description 16
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 15
- 229920000642 polymer Polymers 0.000 description 13
- 238000001465 metallisation Methods 0.000 description 11
- 239000011521 glass Substances 0.000 description 9
- 239000011888 foil Substances 0.000 description 8
- 230000008021 deposition Effects 0.000 description 7
- 238000013461 design Methods 0.000 description 7
- 239000007791 liquid phase Substances 0.000 description 7
- 238000005498 polishing Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 6
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 230000001052 transient effect Effects 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 238000003491 array Methods 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 229910000765 intermetallic Inorganic materials 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000002885 antiferromagnetic material Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000013017 mechanical damping Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2437—Piezoelectric probes
- G01N29/245—Ceramic probes, e.g. lead zirconate titanate [PZT] probes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2475—Embedded probes, i.e. probes incorporated in objects to be inspected
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
- H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N39/00—Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/028—Material parameters
- G01N2291/02827—Elastic parameters, strength or force
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/26—Scanned objects
- G01N2291/269—Various geometry objects
- G01N2291/2694—Wings or other aircraft parts
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Immunology (AREA)
- Manufacturing & Machinery (AREA)
- General Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Pathology (AREA)
- Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Mechanical Engineering (AREA)
- Ceramic Engineering (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
Description
Claims (8)
- 可撓性のある検出検査テープであって、
少なくとも部分的に可撓性のある第1の導電層が形成された第1のテープ部と、
少なくとも部分的に可撓性があり、前記第1の導電層に対向して配置される第2の導電層が形成された第2のテープ部と、
前記第1の導電層と前記第2の導電層との間に配置され、前記各導電層に接合されるセンサ、アクチュエータ、またはトランスデューサのうちの少なくとも1つからなり、互いの間にギャップをあけて配置された複数の素子と、
前記第1の導電層と前記第2の導電層とに電力および制御信号を印加する電気接点網と、
を含み、
前記第1の導電層及び前記第2の導電層は、前記複数の素子に対して電気的に接続されたテープ。 - 請求項1に記載のテープにおいて、
前記複数の素子間の前記ギャップに挿入された絶縁用のフィラー材を有するテープ。 - 請求項1又は2に記載のテープにおいて、
前記複数のセンサ、アクチュエータ、またはトランスデューサは、分類されグループとして制御されるテープ。 - 請求項1又は2に記載のテープにおいて、
前記センサ、アクチュエータ、またはトランスデューサのうちの少なくとも1つは、多様な異なる幾何学的形状に形成されるテープ。 - 請求項1又は2に記載のテープにおいて、
前記センサ、アクチュエータ、またはトランスデューサのうちの少なくとも1つは、前記センサ、アクチュエータ、またはトランスデューサの密度が不均一となるように前記テープ上に配置された複数のセンサ、アクチュエータ、またはトランスデューサであるテープ。 - 請求項1又は2に記載のテープにおいて、
前記センサ、アクチュエータ、またはトランスデューサの少なくとも1つのうち、ある素子は圧電素子を含む1つの機能セラミック材料から構成され、他の素子は1つ以上の他の機能セラミック材料から構成されるテープ。 - 請求項1又は2に記載のテープにおいて、
前記複数のアクチュエータ、センサ、またはトランスデューサは、堆積工程によって形成した反強磁性、電歪、または磁歪素子構造を含む複数の他の機能セラミック材料であり、
前記反強磁性またはその他の機能セラミック素子構造の第1の表面上に第1の電極が堆積され、前記反強磁性またはその他の機能セラミック素子構造の第2の表面上に第2の電極が堆積されるテープ。 - 可撓性のある検出検査テープの製造方法であって、
少なくとも1つの第1の基板表面上に材料を堆積して複数の素子構造を形成するステップと、
前記複数の素子構造の第1の表面上に第1の電極を堆積するステップと、
前記素子構造の前記第1の表面と第2の基板とを接合するステップであって、前記第2の基板は導電層を有し、かつ可撓性がありキャリアプレート上に支持されるステップと、
前記少なくとも1つの第1の基板を前記素子構造から取外すステップと、
前記複数の素子構造の第2の表面上に第2の電極を堆積するステップと、
前記素子構造の前記第2の表面と他の基板とを接合するステップであって、前記他の基板は導電層を有し、かつ可撓性があるステップと、
前記キャリアプレートを取外すステップと、
を含む方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/376,527 | 2003-02-25 | ||
US10/376,527 US6964201B2 (en) | 2003-02-25 | 2003-02-25 | Large dimension, flexible piezoelectric ceramic tapes |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004260176A JP2004260176A (ja) | 2004-09-16 |
JP4933031B2 true JP4933031B2 (ja) | 2012-05-16 |
Family
ID=32771496
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004045563A Expired - Fee Related JP4933031B2 (ja) | 2003-02-25 | 2004-02-23 | テープおよびその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US6964201B2 (ja) |
EP (3) | EP2270865A3 (ja) |
JP (1) | JP4933031B2 (ja) |
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EP2270865A3 (en) | 2012-04-18 |
EP1808896A1 (en) | 2007-07-18 |
EP1453103B1 (en) | 2013-09-04 |
EP1453103A2 (en) | 2004-09-01 |
US6964201B2 (en) | 2005-11-15 |
EP2270865A2 (en) | 2011-01-05 |
US20060211217A1 (en) | 2006-09-21 |
JP2004260176A (ja) | 2004-09-16 |
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