JP4858623B2 - 回路接続材料並びに回路端子の接続構造及び接続方法 - Google Patents
回路接続材料並びに回路端子の接続構造及び接続方法 Download PDFInfo
- Publication number
- JP4858623B2 JP4858623B2 JP2010044251A JP2010044251A JP4858623B2 JP 4858623 B2 JP4858623 B2 JP 4858623B2 JP 2010044251 A JP2010044251 A JP 2010044251A JP 2010044251 A JP2010044251 A JP 2010044251A JP 4858623 B2 JP4858623 B2 JP 4858623B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- connection
- connection terminal
- group
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 0 CCC(C)(CC)Oc1ccc(C(C)(C)CC=CCOCC(*)O)cc1 Chemical compound CCC(C)(CC)Oc1ccc(C(C)(C)CC=CCOCC(*)O)cc1 0.000 description 2
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/0804—Manufacture of polymers containing ionic or ionogenic groups
- C08G18/0819—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups
- C08G18/0823—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups containing carboxylate salt groups or groups forming them
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/2805—Compounds having only one group containing active hydrogen
- C08G18/285—Nitrogen containing compounds
- C08G18/2865—Compounds having only one primary or secondary amino group; Ammonia
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
- C08G18/3203—Polyhydroxy compounds
- C08G18/3206—Polyhydroxy compounds aliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/38—Low-molecular-weight compounds having heteroatoms other than oxygen
- C08G18/3819—Low-molecular-weight compounds having heteroatoms other than oxygen having nitrogen
- C08G18/3821—Carboxylic acids; Esters thereof with monohydroxyl compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/67—Unsaturated compounds having active hydrogen
- C08G18/671—Unsaturated compounds having only one group containing active hydrogen
- C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
- C09D175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09D175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
- C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C09J201/06—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1515—Three-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L13/00—Compositions of rubbers containing carboxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L21/00—Compositions of unspecified rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
- C08L9/02—Copolymers with acrylonitrile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04026—Bonding areas specifically adapted for layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01011—Sodium [Na]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01045—Rhodium [Rh]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01052—Tellurium [Te]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01067—Holmium [Ho]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01073—Tantalum [Ta]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01077—Iridium [Ir]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/049—Nitrides composed of metals from groups of the periodic table
- H01L2924/0495—5th Group
- H01L2924/04953—TaN
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31725—Of polyamide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31786—Of polyester [e.g., alkyd, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31935—Ester, halide or nitrile of addition polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Dispersion Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Adhesive Tapes (AREA)
- Non-Insulated Conductors (AREA)
- Combinations Of Printed Boards (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
(1)加熱により遊離ラジカルを発生する硬化剤
(2)カルボキシル基含有エラストマー、エポキシ基含有エラストマー又はラジカル重合性の官能基で変性した分子量10000以上の水酸基含有樹脂
(3)ラジカル重合性物質
ラジカル重合性の官能基はアクリル基であるであることが好ましい。
アクリレート(メタクリレート)の具体例としては、メチルアクリレート、エチルアクリレート、イソプロピルアクリレート、イソブチルアクリレート、エチレングリコールジアクリレート、ジエチレングリコールジアクリレート、トリメチロールプロパントリアクリレート、テトラメチロールメタンテトラアクリレート、2−ヒドロキシ−1,3−ジアクリロキシプロパン、2,2−ビス〔4−(アクリロキシメトキシ)フェニル〕プロパン、2,2−ビス〔4−(アクリロキシポリエトキシ)フェニル〕プロパン、ジシクロペンテニルアクリレート、トリシクロデカニルアクリレート、トリス(アクリロイロキシエチル)イソシアヌレート等がある。これらは単独又は併用して用いることができ、必要によっては、ハイドロキノン、メチルエーテルハイドロキノン類などの重合禁止剤を適宜用いてもよい。また、ジシクロペンテニル基及び/又はトリシクロデカニル基及び/又はトリアジン環を有する場合は、耐熱性が向上するので好ましい。
(ただしnは1〜3の整数である)
フェノキシ樹脂(ユニオンカーバイド株式会社製、商品名PKHC、平均分子量45,000)50gを、重量比でトルエン(沸点110.6℃、SP値8.90)/酢酸エチル(沸点77.1℃、SP値9.10)=50/50の混合溶剤に溶解して、固形分40%の溶液とした。
ラジカル重合性物質としてトリヒドロキシエチルグリコールジメタクリレート、リン酸エステル型アクリレート(共栄社油脂株式会社製、商品名P2m)を用いて、フェノキシ樹脂/トリヒドロキシエチルグリコールジメタクリレート、リン酸エステル型アクリレートの固形重量比を50g/49g/1g(参考例2)、30g/69g/1g(参考例3)、70g/29g/1g(参考例4)としたほかは、参考例1と同様にして回路接続材料を得た。この回路接続材料を用いて、参考例1と同様にして回路を接続した。
硬化剤の配合量を2gとしたほかは、参考例2と同様にして回路接続材料を得た。
硬化剤をt−ブチルパーオキシ2−エチルヘキサノネート(日本油脂株式会社製、商品名パーブチルO)としたほかは、参考例1と同様にして回路接続材料を得た。
平均分子量45,000のフェノキシ樹脂(PKHC)100gに末端カルボキシル基含有ブタジエン−アクリロニトリル共重合体(Hycar CTBNX1009−SP、宇部興産(株)製)25gを一般的方法で反応させて、カルボキシル基含有ブタジエン−アクリロニトリル共重合体で変性したフェノキシ樹脂を作製した。このフェノキシ樹脂を用い、フェノキシ樹脂/トリヒドロキシエチルグリコールジメタクリレート、リン酸エステル型アクリレートの固形重量比を60g/39g/1gとしたほかは参考例1と同様にして回路接続材料を得た。
平均分子量45,000のフェノキシ樹脂(PKHC)100gにエポキシ基含有アクリル共重合体25gで変性したフェノキシ樹脂を作製した。このフェノキシ樹脂を用い、フェノキシ樹脂/トリヒドロキシエチルグリコールジメタクリレート、リン酸エステル型アクリレートの固形重量比を60g/39g/1gとしたほかは参考例1と同様にして回路接続材料を得た。
エポキシ基含有アクリル共重合体(アクリルゴム)を用いフェノキシ樹脂/アクリルゴム/トリヒドロキシエチルグリコールジメタクリレート、リン酸エステル型アクリレートの固形重量比を40g/20g/39g/1gとしたほかは参考例1と同様にして回路接続材料を得た。
平均分子量45,000のフェノキシ樹脂(PKHC)100gに末端にアクリル基を持つモノイソシアネート5gを一般的方法で反応させて、アクリル基で変性したフェノキシ樹脂を作製した。このフェノキシ樹脂を用い、フェノキシ樹脂/トリヒドロキシエチルグリコールジメタクリレート、リン酸エステル型アクリレートの固形重量比を60g/39g/1gとしたほかは参考例1と同様にして回路接続材料を得た。
導電性粒子を平均粒径2μmのNi粒子の表面をAuで被覆(被覆厚み0.08μm)したものを用いて、0.5体積部としたほかは、参考例1と同様にして回路接続材料を得た。
導電性粒子の粒径を5μmとしたほかは、参考例1と同様にして回路接続材料を得た。
ラジカル重合性物質として2,2−ビス{4−(アクリロキシ・ジエトキシ)フェニル}プロパン(新中村化学(株)製、商品名 A−BPE−4)を用い、フェノキシ樹脂/2,2−ビス{4−(アクリロキシ・ジエトキシ)フェニル}プロパン、リン酸エステル型アクリレートの固形重量比を60g/39g/1g他は参考例1と同様にして回路接続材料を得た。
ラジカル重合性物質としてジシクロペンテニルアクリレート(共栄社油脂株式会社製、商品名DCP−A)を用い、フェノキシ樹脂/ジシクロペンテニルアクリレート、リン酸エステル型アクリレートの固形重量比を60g/39g/1gとしたほかは、参考例1と同様にして回路接続材料を得た。
ラジカル重合性物質としてトリス(アクリロイロキシエチル)イソシアヌレートを用い、フェノキシ樹脂/トリス(アクリロイロキシエチル)イソシアヌレート、リン酸エステル型アクリレートの固形重量比を60g/39g/1gとしたほかは、参考例1と同様にして回路接続材料を得た。
ラジカル重合性物質として4,4’−ビスマレイミドジフェニルメタン30gとジアリルビスフェノールA35gを120℃で20分間加熱混合したものとリン酸エステル型アクリレート(共栄社油脂株式会社製、商品名P−2m)を用いた。
ラジカル重合性物質として4,4’−ビスマレイミドジフェニルメタン30gとジアリルビスフェノールA20gを120℃で20分間加熱混合したものを用いたほかは、参考例11と同様にして回路接続材料を得た。
導電性粒子を平均粒径2μmのNi粒子の表面をPdで被覆(被覆厚み0.04μm)したものを用いて、0.5体積%としたほかは、参考例1と同様にして回路接続材料を得た。
フェノキシ樹脂(PKHC)、ビスフェノールA型エポキシ樹脂(YL980、油化シェル株式会社製品名)、イミダゾール系マイクロカプセル型硬化剤(3941HP 株式会社旭化成製商品名)を用いて、フェノキシ樹脂/ビスフェノールA型エポキシ樹脂/イミダゾール系マイクロカプセル型硬化剤の固形重量比を40/20/40とした他は、参考例1と同様にして回路接続材料を得た。
回路の接続後、上記接続部を含むFPCの隣接回路間の抵抗値を、初期と、85℃、85%RHの高温高湿槽中に500時間保持した後にマルチメータで測定した。抵抗値は隣接回路間の抵抗150点の平均(x+3σ)で示した。参考例1で得られた回路接続材料は良好な接続信頼性を示した。また、初期の接続抵抗も低く、高温高湿試験後の抵抗の上昇もわずかであり、高い耐久性を示した。また、実施例1〜3及び参考例2〜15も参考例1と同様に良好な信頼性が得られた。これらに対して、比較例は、硬化反応が不十分であるため接着状態が悪く、初期の接続抵抗が高くなった。
回路の接続後、90度剥離、剥離速度50mm/分で接着力測定を行った。比較例は硬化反応が不十分で、接着強度に200gf/cm程度と接着力が低かったが、実施例1〜3、参考例1〜15では1000gf/cm程度と良好な接着力が得られた。
得られた回路接続材料を30℃の恒温槽で30日間処理し、上記と同様にして回路の接続を行い保存性を評価した。
得られた回路接続材料を用いて、ライン幅50μm、ピッチ100μm、厚み18μmの銅回路を交互に250本配置した櫛形回路を有するプリント基板とライン幅50μm、ピッチ100μm、厚み18μmの銅回路を500本有するフレキシブル回路板(FPC)を160℃、3MPaで10秒間加熱加圧して幅2mmにわたり接続した。この接続体の櫛形回路に100Vの電圧を印加し、85℃85%RH高温高湿試験500時間後の絶縁抵抗値を測定した。
厚み35μm、5mm×5mmの回路用接続材料を用い、これを厚み0.7mm、15mm×15mmのガラスにはさみ、150℃、2MPa、10秒の条件で加熱加圧を行った。初期の面積(A)と加熱加圧後の面積(B)を用いて流動性(B)/(A)の値を求めたところ、参考例1は1.9であり、実施例1〜3、参考例2〜7についても1.3〜3.0の範囲内であった。
参考例1の回路用接続材料の、硬化後の40℃での弾性率を測定したところ1500MPaであった。
得られた回路接続材料を用いて、示差走査熱量計(DSC TAインスツルメント社製 商品名910型)を用いて10℃/分の測定において、発熱反応の立ち上がり温度(Ta)、ピーク温度(Tp)、終了温度(Te)を求めた。
Claims (13)
- 相対峙する回路電極間に介在され、相対向する回路電極を加圧し加圧方向の電極間を電気的に接続するフィルム状異方導電性回路接続材料であって、下記(1)〜(3)の成分を必須とするフィルム状異方導電性回路接続材料。
(1)加熱により遊離ラジカルを発生する硬化剤
(2)カルボキシル基含有エラストマー、エポキシ基含有エラストマー又はラジカル重合性の官能基で変性した分子量10000以上の水酸基含有樹脂
(3)ラジカル重合性物質 - 前記カルボキシル基含有エラストマー又は前記エポキシ基含有エラストマーが、分子末端又は分子鎖中にカルボキシル基又はエポキシ基を有し、ブタジエン系重合体、アクリル重合体、ポリエーテルウレタンゴム、ポリエステルウレタンゴム、ポリアミドウレタンゴム及びシリコーンゴムから選ばれるものである請求項1記載の回路接続材料。
- 前記カルボキシル基含有エラストマーが分子末端又は分子鎖中にカルボキシル基を有するブタジエン−アクリロニトリル共重合体である請求項1又は2に記載の回路接続材料。
- 前記エポキシ基含有エラストマーが、分子末端又は分子鎖中にエポキシ基を有するアクリル重合体である請求項1又は2に記載の回路接続材料。
- 前記ラジカル重合性の官能基がアクリル基である請求項1記載の回路接続材料。
- 前記水酸基含有樹脂が、ポリビニルブチラール、ポリビニルホルマール、ポリアミド、ポリエステル、フェノール樹脂、エポキシ樹脂及びフェノキシ樹脂から選ばれるものである請求項1〜5のいずれか一項に記載の回路接続材料。
- 前記分子量10000以上の水酸基含有樹脂としてフェノキシ樹脂を含有する請求項6に記載の回路接続材料。
- 硬化後の40℃での弾性率が100〜2000MPaである請求項1〜7のいずれか一項に記載の回路接続材料。
- 導電性粒子を含有する請求項1〜8のいずれか一項に記載の回路接続材料。
- 第一の接続端子を有する第一の回路部材と、第二の接続端子を有する第二の回路部材とが、第一の接続端子と第二の接続端子を対向して配置されており、前記対向配置した第一の接続端子と第二の接続端子の間に請求項1〜9のいずれか一項に記載の回路接続材料が介在されており、前記対向配置した第一の接続端子と第二の接続端子が電気的に接続されている回路端子の接続構造。
- 第一の接続端子を有する第一の回路部材と、第二の接続端子を有する第二の回路部材とを、第一の接続端子と第二の接続端子を対向して配置し、前記対向配置した第一の接続端子と第二の接続端子の間に請求項1〜9のいずれか一項に記載の回路接続材料を介在させ、加熱加圧して前記対向配置した第一の接続端子と第二の接続端子を電気的に接続させる回路端子の接続方法。
- 第一の接続端子を有する第一の回路部材と、第二の接続端子を有する第二の回路部材とが、第一の接続端子と第二の接続端子を対向して配置されており、前記対向配置した第一の接続端子と第二の接続端子の間にラジカル重合による硬化性を有する回路接続材料が介在されており、前記接続端子の少なくとも一方の表面が金、銀、錫及び白金族から選ばれる金属であり、前記対向配置した第一の接続端子と第二の接続端子が電気的に接続されており、
ラジカル重合による硬化性を有する回路接続材料が請求項1〜9のいずれか一項に記載の回路接続材料である回路端子の接続構造。 - 第一の接続端子を有する第一の回路部材と、第二の接続端子を有する第二の回路部材とを、第一の接続端子と第二の接続端子を対向して配置し、前記対向配置した第一の接続端子と第二の接続端子の間にラジカル重合による硬化性を有する回路接続材料を介在させ、加熱加圧して前記対向配置した第一の接続端子と第二の接続端子を電気的に接続させる回路端子の接続方法であって、前記接続端子の少なくとも一方の表面が金、銀、錫及び白金族から選ばれる金属であり、ラジカル重合による硬化性を有する回路接続材料を表面が金、銀、錫及び白金族から選ばれる金属である一方の接続端子に形成した後、もう一方の回路電極を位置合わせし加熱、加圧して接続し、
ラジカル重合による硬化性を有する回路接続材料が請求項1〜9のいずれか一項に記載の回路接続材料である回路端子の接続方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010044251A JP4858623B2 (ja) | 1997-03-31 | 2010-03-01 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7942497 | 1997-03-31 | ||
JP1997079422 | 1997-03-31 | ||
JP1997079424 | 1997-03-31 | ||
JP7942297 | 1997-03-31 | ||
JP25293397 | 1997-09-18 | ||
JP1997252933 | 1997-09-18 | ||
JP2010044251A JP4858623B2 (ja) | 1997-03-31 | 2010-03-01 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005116151A Division JP5020476B6 (ja) | 1997-03-31 | 2005-04-13 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010219039A JP2010219039A (ja) | 2010-09-30 |
JP4858623B2 true JP4858623B2 (ja) | 2012-01-18 |
Family
ID=27303011
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP54145798A Expired - Fee Related JP3587859B2 (ja) | 1997-03-31 | 1998-03-31 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
JP2010044251A Expired - Fee Related JP4858623B2 (ja) | 1997-03-31 | 2010-03-01 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
JP2012078289A Expired - Lifetime JP5120514B2 (ja) | 1997-03-31 | 2012-03-29 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
JP2012078290A Expired - Lifetime JP5120515B2 (ja) | 1997-03-31 | 2012-03-29 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP54145798A Expired - Fee Related JP3587859B2 (ja) | 1997-03-31 | 1998-03-31 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012078289A Expired - Lifetime JP5120514B2 (ja) | 1997-03-31 | 2012-03-29 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
JP2012078290A Expired - Lifetime JP5120515B2 (ja) | 1997-03-31 | 2012-03-29 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
Country Status (8)
Country | Link |
---|---|
US (2) | US6777464B1 (ja) |
EP (4) | EP1717851B1 (ja) |
JP (4) | JP3587859B2 (ja) |
KR (1) | KR100333456B1 (ja) |
AU (1) | AU6520798A (ja) |
DE (1) | DE69836078T2 (ja) |
TW (1) | TWI229119B (ja) |
WO (1) | WO1998044067A1 (ja) |
Families Citing this family (102)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7967943B2 (en) * | 1997-03-31 | 2011-06-28 | Hitachi Chemical Company, Ltd. | Circuit-connecting material and circuit terminal connected structure and connecting method |
WO1998044067A1 (en) | 1997-03-31 | 1998-10-08 | Hitachi Chemical Company, Ltd. | Circuit connecting material, and structure and method of connecting circuit terminal |
JP4605184B2 (ja) * | 1999-08-25 | 2011-01-05 | 日立化成工業株式会社 | 配線接続材料及びそれを用いた配線板製造方法 |
CN101906274B (zh) * | 1999-08-25 | 2012-05-30 | 日立化成工业株式会社 | 粘合剂,配线端子的连接方法和配线结构体 |
US6762249B1 (en) * | 1999-08-25 | 2004-07-13 | Hitachi Chemical Company, Ltd. | Wiring-connecting material and process for producing circuit board with the same |
JP3365367B2 (ja) * | 1999-09-14 | 2003-01-08 | ソニーケミカル株式会社 | Cog実装品および接続材料 |
JP4513147B2 (ja) * | 1999-12-02 | 2010-07-28 | 日立化成工業株式会社 | 回路接続方法 |
MY124944A (en) * | 2000-02-09 | 2006-07-31 | Hitachi Chemical Co Ltd | Resin composition, adhesives prepared therewith for bonding circuit members,and circuits boards |
JP2001262078A (ja) | 2000-03-17 | 2001-09-26 | Sony Chem Corp | 接続材料 |
JP3915512B2 (ja) | 2000-04-25 | 2007-05-16 | 日立化成工業株式会社 | 回路接続用接着剤並びにそれを用いた回路接続方法及び回路接続構造体 |
JP2007169632A (ja) * | 2000-04-25 | 2007-07-05 | Hitachi Chem Co Ltd | 回路接続用接着剤並びにそれを用いた回路接続方法及び回路接続構造体 |
JP4788036B2 (ja) * | 2000-11-29 | 2011-10-05 | 日立化成工業株式会社 | 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法 |
JP4852785B2 (ja) * | 2000-11-29 | 2012-01-11 | 日立化成工業株式会社 | 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法 |
JP2002184487A (ja) | 2000-12-15 | 2002-06-28 | Sony Chem Corp | 異方性導電接着剤 |
JP2002201456A (ja) * | 2000-12-28 | 2002-07-19 | Hitachi Chem Co Ltd | 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造 |
JP4696360B2 (ja) * | 2000-12-28 | 2011-06-08 | 日立化成工業株式会社 | 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造 |
JP2002201440A (ja) * | 2000-12-28 | 2002-07-19 | Hitachi Chem Co Ltd | 異方導電性樹脂フィルム状形成物及びそれを用いた回路板の接続方法並びに接続構造体 |
JP2003064332A (ja) * | 2001-08-30 | 2003-03-05 | Hitachi Chem Co Ltd | 回路接続用接着剤及びそれを用いた回路接続構造体 |
JP2002203871A (ja) * | 2000-12-28 | 2002-07-19 | Hitachi Chem Co Ltd | 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造 |
JP4788038B2 (ja) * | 2000-12-28 | 2011-10-05 | 日立化成工業株式会社 | 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造 |
JP4158434B2 (ja) * | 2001-07-05 | 2008-10-01 | 株式会社ブリヂストン | 異方性導電フィルム |
TWI232467B (en) * | 2001-11-30 | 2005-05-11 | Mitsui Chemicals Inc | Paste for circuit connection, anisotropic conductive paste and uses thereof |
JP2005330297A (ja) * | 2003-06-20 | 2005-12-02 | Hitachi Chem Co Ltd | 接着材テープの接着材形成方法 |
JP2004331910A (ja) * | 2003-05-12 | 2004-11-25 | Seiko Epson Corp | 異方導電性接着剤、実装方法、電気光学装置モジュールおよび電子機器 |
JP4293187B2 (ja) * | 2003-06-25 | 2009-07-08 | 日立化成工業株式会社 | 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法 |
JP4720073B2 (ja) * | 2003-08-07 | 2011-07-13 | 日立化成工業株式会社 | 接着剤組成物、回路接続用接着剤組成物、接続体及び半導体装置 |
JP2005194393A (ja) * | 2004-01-07 | 2005-07-21 | Hitachi Chem Co Ltd | 回路接続用接着フィルム及び回路接続構造体 |
JP4655487B2 (ja) * | 2004-02-16 | 2011-03-23 | 日立化成工業株式会社 | 接着剤組成物、それを用いたフィルム状接着剤及び回路接続材料、並びに回路部材の接続構造及びその製造方法 |
JP2005320491A (ja) * | 2004-05-11 | 2005-11-17 | Hitachi Chem Co Ltd | 接着剤組成物、それを用いたフィルム状接着剤及び回路接続材料、並びに回路部材の接続構造及びその製造方法 |
JP2005325312A (ja) * | 2004-05-17 | 2005-11-24 | Hitachi Chem Co Ltd | 接着剤組成物、それを用いたフィルム状接着剤及び回路接続材料、並びに回路部材の接続構造及びその製造方法 |
JP4941804B2 (ja) * | 2005-03-02 | 2012-05-30 | Dic株式会社 | エポキシ樹脂組成物、その硬化物、半導体封止材料、新規フェノール樹脂、および新規エポキシ樹脂 |
DE102005021086A1 (de) * | 2005-05-06 | 2006-11-09 | Basf Coatings Ag | Beschichtungsstoff, Verfahren zu seiner Herstellung und seine Verwendung zur Herstellung haftfester, korrosionshemmender Beschichtungen |
JP4844003B2 (ja) * | 2005-05-10 | 2011-12-21 | 日立化成工業株式会社 | 回路接続材料、回路部材の接続構造及び回路部材の接続方法。 |
US20060286721A1 (en) * | 2005-06-16 | 2006-12-21 | Daoqiang Lu | Breakable interconnects and structures formed thereby |
JP3852858B1 (ja) | 2005-08-16 | 2006-12-06 | 株式会社日立製作所 | 半導体放射線検出器、放射線検出モジュールおよび核医学診断装置 |
KR100673778B1 (ko) * | 2005-08-19 | 2007-01-24 | 제일모직주식회사 | 저온 속경화형 이방성 도전 필름용 조성물, 그로부터제조된 이방성 도전 필름 및 그 제조방법 |
JP5061509B2 (ja) * | 2005-12-01 | 2012-10-31 | 日立化成工業株式会社 | 接着剤組成物並びにこれを用いた接続体及び半導体装置 |
PL2223981T3 (pl) | 2006-07-21 | 2012-08-31 | Hitachi Chemical Co Ltd | Materiał do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów |
EP2053108A4 (en) | 2006-08-04 | 2012-12-12 | Hitachi Chemical Co Ltd | FILM ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING SAME |
EP2257141A3 (en) | 2006-08-22 | 2012-01-18 | Hitachi Chemical Co., Ltd. | Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member |
JP4650456B2 (ja) * | 2006-08-25 | 2011-03-16 | 日立化成工業株式会社 | 回路接続材料、これを用いた回路部材の接続構造及びその製造方法 |
KR100997000B1 (ko) | 2006-08-29 | 2010-11-25 | 히다치 가세고교 가부시끼가이샤 | 이방 도전 테이프 및 그의 제조 방법, 및 그것을 이용한 접속 구조체 및 회로 부재의 접속 방법 |
KR100813355B1 (ko) | 2006-12-13 | 2008-03-12 | 엘에스전선 주식회사 | 이방 도전성 접착제 |
KR100835818B1 (ko) | 2006-12-27 | 2008-06-09 | 제일모직주식회사 | 이방 도전성 필름 조성물 및 그로부터 제조되는 이방도전성 필름 |
US8062469B2 (en) * | 2007-02-06 | 2011-11-22 | Nippon Kasei Chemical Company Limited | Adhesive resin composition and bonding method |
KR100844383B1 (ko) * | 2007-03-13 | 2008-07-07 | 도레이새한 주식회사 | 반도체 칩 적층용 접착 필름 |
US8524816B2 (en) * | 2007-03-15 | 2013-09-03 | Magni Industries, Inc. | Coating resistant to bio-diesel fuels |
JP5222490B2 (ja) * | 2007-04-25 | 2013-06-26 | デクセリアルズ株式会社 | 異方導電性フィルム及び接続構造体 |
KR20100020029A (ko) * | 2007-06-13 | 2010-02-19 | 히다치 가세고교 가부시끼가이샤 | 회로 접속용 필름상 접착제 |
JP5292838B2 (ja) * | 2007-08-30 | 2013-09-18 | 日立化成株式会社 | 接着剤、及び回路部材の接続構造体 |
CN103351829A (zh) * | 2007-09-05 | 2013-10-16 | 日立化成株式会社 | 粘接剂以及使用该粘接剂的连接结构体 |
KR100929593B1 (ko) * | 2007-09-20 | 2009-12-03 | 제일모직주식회사 | 이방 도전성 접착 조성물 및 그를 포함하는 이방 도전성 필름 |
CN101835859B (zh) * | 2007-10-29 | 2015-04-08 | 日立化成株式会社 | 电路连接材料、连接结构体及其制造方法 |
JP5226562B2 (ja) * | 2008-03-27 | 2013-07-03 | デクセリアルズ株式会社 | 異方性導電フィルム、並びに、接合体及びその製造方法 |
KR101371953B1 (ko) | 2008-04-17 | 2014-03-07 | 히타치가세이가부시끼가이샤 | 접착재 테이프 및 접착재 테이프 권중체 |
JP5499448B2 (ja) * | 2008-07-16 | 2014-05-21 | デクセリアルズ株式会社 | 異方性導電接着剤 |
JP4897778B2 (ja) | 2008-11-20 | 2012-03-14 | ソニーケミカル&インフォメーションデバイス株式会社 | 接続フィルム、並びに、接合体及びその製造方法 |
US20110300326A1 (en) | 2009-02-27 | 2011-12-08 | Hitachi Chemical Company, Ltd. | Adhesive material reel |
US20120015126A1 (en) | 2009-03-26 | 2012-01-19 | Hitachi Chemical Company, Ltd. | Adhesive material reel |
JP4930623B2 (ja) * | 2009-04-28 | 2012-05-16 | 日立化成工業株式会社 | 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及び回路部材の接続方法 |
JP4905502B2 (ja) * | 2009-05-21 | 2012-03-28 | 日立化成工業株式会社 | 回路板の製造方法及び回路接続材料 |
JP2010004067A (ja) * | 2009-09-16 | 2010-01-07 | Hitachi Chem Co Ltd | 回路接続材料 |
JP5201181B2 (ja) * | 2009-11-04 | 2013-06-05 | 日立化成株式会社 | 接着剤組成物、回路接続構造体及び半導体装置 |
BR112012026240B1 (pt) | 2010-04-16 | 2021-08-03 | Swimc Llc | Artigo, método, e, composição de revestimento |
JP5504225B2 (ja) * | 2010-08-31 | 2014-05-28 | 積水化学工業株式会社 | 異方性導電材料及び接続構造体 |
JP5387592B2 (ja) * | 2011-02-07 | 2014-01-15 | 日立化成株式会社 | 回路接続材料、及び回路部材の接続構造の製造方法 |
EP3425011B1 (en) | 2011-02-07 | 2021-01-06 | Swimc Llc | Coating compositions for containers and other articles and methods of coating |
WO2012157375A1 (ja) | 2011-05-18 | 2012-11-22 | 日立化成工業株式会社 | 回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法 |
CN108676520A (zh) | 2011-09-06 | 2018-10-19 | 日立化成株式会社 | 各向异性导电粘接剂、粘接剂组合物的应用以及连接体 |
WO2013042203A1 (ja) | 2011-09-20 | 2013-03-28 | 日立化成株式会社 | 接着剤組成物、フィルム状接着剤、接着シート、回路接続体及び回路部材の接続方法 |
KR101381118B1 (ko) | 2011-11-04 | 2014-04-04 | 제일모직주식회사 | 이방 전도성 접착 필름용 조성물 및 이를 이용한 이방 전도성 접착 필름 |
JP5527394B2 (ja) | 2011-12-16 | 2014-06-18 | 日立化成株式会社 | 接着剤組成物、接着シート及び接続構造体 |
KR102152474B1 (ko) | 2011-12-16 | 2020-09-04 | 히타치가세이가부시끼가이샤 | 접착제 조성물, 필름상 접착제, 접착 시트, 접속 구조체 및 접속 구조체의 제조 방법 |
US8497579B1 (en) * | 2012-02-16 | 2013-07-30 | Chipbond Technology Corporation | Semiconductor packaging method and structure thereof |
JP5895585B2 (ja) * | 2012-02-23 | 2016-03-30 | 日立金属株式会社 | 接着剤、接着フィルム、積層フィルム、配線フィルム及び多層配線フィルム |
JP2013206765A (ja) * | 2012-03-29 | 2013-10-07 | Tanaka Kikinzoku Kogyo Kk | ダイボンド用導電性ペースト及び該導電性ペーストによるダイボンド方法 |
JP6107816B2 (ja) | 2012-04-13 | 2017-04-05 | 日立化成株式会社 | 回路接続材料、接続構造体及びその製造方法 |
WO2014025997A1 (en) | 2012-08-09 | 2014-02-13 | Valspar Sourcing, Inc. | Compositions for containers and other articles and methods of using same |
EP2882658B1 (en) | 2012-08-09 | 2021-09-08 | Swimc Llc | Container coating system |
JP6029922B2 (ja) * | 2012-10-05 | 2016-11-24 | デクセリアルズ株式会社 | 回路接続材料及びその製造方法、並びにそれを用いた実装体の製造方法 |
KR101551758B1 (ko) * | 2012-12-11 | 2015-09-09 | 제일모직주식회사 | 이방 도전성 필름용 조성물 및 이방 도전성 필름 |
JP6108232B2 (ja) * | 2012-12-12 | 2017-04-05 | 日立金属株式会社 | 接着剤組成物、接着剤ワニス、接着フィルム、及び配線フィルム |
JP6065604B2 (ja) * | 2013-01-22 | 2017-01-25 | 日立金属株式会社 | 接着剤ワニス、接着フィルム、及び配線フィルム |
JP6123547B2 (ja) | 2013-07-26 | 2017-05-10 | 日立化成株式会社 | 回路接続材料、回路接続構造体、回路接続構造体の製造方法、接着剤組成物、及び接着剤シート |
JP2015098575A (ja) | 2013-10-16 | 2015-05-28 | 日立化成株式会社 | 接着剤組成物及び接続体 |
WO2015068611A1 (ja) * | 2013-11-07 | 2015-05-14 | 東洋インキScホールディングス株式会社 | 導電性接着剤、導電性接着シート、配線デバイス、および配線デバイスの製造方法 |
JP6106148B2 (ja) * | 2013-11-27 | 2017-03-29 | 日東電工株式会社 | 導電性粘着テープ、電子部材及び粘着剤 |
EP3131965B1 (en) | 2014-04-14 | 2024-06-12 | Swimc Llc | Methods of preparing compositions for containers and other articles and methods of using same |
JP2016044222A (ja) | 2014-08-21 | 2016-04-04 | 日立化成株式会社 | 接着剤組成物及び接続構造体 |
US10253210B2 (en) * | 2014-09-17 | 2019-04-09 | Nissan Chemical Industries, Ltd. | Film-forming composition including thermosetting resin |
JP6562614B2 (ja) * | 2014-10-23 | 2019-08-21 | リンテック株式会社 | 接着剤組成物および接着シート |
TWI824740B (zh) * | 2014-10-28 | 2023-12-01 | 日商迪睿合股份有限公司 | 異向性導電膜、連接構造體、及連接構造體之製造方法 |
CN107429143B (zh) | 2015-04-23 | 2019-08-16 | 日立化成株式会社 | 粘接剂组合物和连接结构体 |
JP6645499B2 (ja) | 2015-06-10 | 2020-02-14 | 日立化成株式会社 | 接着剤組成物及び接続体 |
CN107922817B (zh) | 2015-09-04 | 2021-05-28 | 昭和电工材料株式会社 | 粘接剂组合物、各向异性导电性粘接剂组合物、电路连接材料及连接体 |
TWI614275B (zh) | 2015-11-03 | 2018-02-11 | Valspar Sourcing Inc | 用於製備聚合物的液體環氧樹脂組合物 |
JP6237944B1 (ja) * | 2017-02-03 | 2017-11-29 | 東洋インキScホールディングス株式会社 | 熱硬化性接着シート、およびその利用 |
JPWO2018168715A1 (ja) * | 2017-03-13 | 2020-01-16 | リンテック株式会社 | 樹脂組成物及び樹脂シート |
JP2018178064A (ja) * | 2017-04-21 | 2018-11-15 | 株式会社カネカ | アクリル系接着剤組成物 |
CN110603272A (zh) * | 2017-06-12 | 2019-12-20 | 积水化学工业株式会社 | 树脂粒子、导电性粒子、导电材料、粘接剂、连接结构体以及液晶显示元件 |
TWI765028B (zh) * | 2017-06-30 | 2022-05-21 | 日商琳得科股份有限公司 | 樹脂薄片、層合體及樹脂薄片的製造方法 |
WO2023276889A1 (ja) | 2021-07-01 | 2023-01-05 | 昭和電工マテリアルズ株式会社 | 回路接続用接着剤フィルム、回路接続構造体及びその製造方法 |
Family Cites Families (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6023139B2 (ja) | 1974-03-25 | 1985-06-06 | 日本ペイント株式会社 | 熱硬化性アクリル樹脂組成物 |
JPS5233696B2 (ja) | 1974-04-01 | 1977-08-30 | ||
CA1068205A (en) | 1975-03-27 | 1979-12-18 | Yutaka Hori | Heat-curable composite sheet |
JPS5290537A (en) * | 1976-01-23 | 1977-07-29 | Asahi Chem Ind Co Ltd | Polymerizable adhesive composition |
US4212959A (en) * | 1978-05-09 | 1980-07-15 | Mitsubishi Denki Kabushiki Kaisha | Heat resistant resin composition |
JPS58167124A (ja) * | 1982-03-29 | 1983-10-03 | Nippon Oil & Fats Co Ltd | プラスチツクレンズの製造法 |
JPS59159866A (ja) * | 1983-03-02 | 1984-09-10 | Yokohama Rubber Co Ltd:The | 接着剤組成物 |
JPS59221371A (ja) | 1983-05-31 | 1984-12-12 | Yokohama Rubber Co Ltd:The | 導電性接着剤 |
AU572615B2 (en) * | 1983-12-27 | 1988-05-12 | Sony Corporation | Electrically conductive adhesive sheet circuit board and electrical connection structure |
US5158818A (en) * | 1984-01-30 | 1992-10-27 | National Starch And Chemical Investment Holding Corporation | Conductive die attach tape |
JPS60262430A (ja) | 1984-06-08 | 1985-12-25 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
JPS61148277A (ja) | 1984-12-22 | 1986-07-05 | Denki Kagaku Kogyo Kk | 接着剤組成物 |
JPH0638436B2 (ja) | 1985-02-22 | 1994-05-18 | カシオ計算機株式会社 | 半導体ペレツトと基板の接合方法 |
CA1272536A (en) * | 1985-05-28 | 1990-08-07 | Tsutomu Suda | Propylene polymer composition |
JPS61296077A (ja) | 1985-06-25 | 1986-12-26 | Three Bond Co Ltd | 二液接触硬化型導電性接着剤 |
CN1003524B (zh) * | 1985-10-14 | 1989-03-08 | 株式会社日立制作所 | 无电浸镀金溶液 |
JPH0765023B2 (ja) | 1985-12-13 | 1995-07-12 | ソニーケミカル株式会社 | フィルム状導電異方性接着剤 |
US4740657A (en) | 1986-02-14 | 1988-04-26 | Hitachi, Chemical Company, Ltd | Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained |
JP2527166B2 (ja) | 1986-09-27 | 1996-08-21 | 住友ベークライト株式会社 | 接着剤層を有するポリエ−テルイミドフイルム |
US5001542A (en) * | 1988-12-05 | 1991-03-19 | Hitachi Chemical Company | Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips |
JPH03137121A (ja) | 1989-06-19 | 1991-06-11 | Showa Denko Kk | 導電性樹脂接続材 |
JPH04115407A (ja) | 1990-09-03 | 1992-04-16 | Soken Kagaku Kk | 異方導電性接着剤組成物 |
JPH07123179B2 (ja) | 1990-10-05 | 1995-12-25 | 信越ポリマー株式会社 | 異方導電接着剤による回路基板の接続構造 |
US5096962A (en) | 1990-11-29 | 1992-03-17 | Lord Corporation | Acrylic adhesive compositions |
JP2927001B2 (ja) * | 1990-12-17 | 1999-07-28 | 住友電気工業株式会社 | フレキシブル印刷配線板用接着剤組成物 |
WO1993020562A1 (en) * | 1992-04-03 | 1993-10-14 | Thermoset Plastics, Inc. | Conductor-filled thermosetting resin |
US5208266A (en) * | 1992-04-28 | 1993-05-04 | Toshimichi Yamazaki | Lightly crosslinked polymeric foams and process for making same |
JPH05347464A (ja) | 1992-06-16 | 1993-12-27 | Ricoh Co Ltd | 電気回路基板の接続構造および接続方法 |
JPH06295617A (ja) | 1993-04-06 | 1994-10-21 | Fuji Kobunshi Kogyo Kk | 異方導電性接着剤組成物 |
US5395876A (en) | 1993-04-19 | 1995-03-07 | Acheson Industries, Inc. | Surface mount conductive adhesives |
JP3408301B2 (ja) | 1993-12-16 | 2003-05-19 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | 異方性導電膜 |
JPH07326635A (ja) | 1994-05-31 | 1995-12-12 | Hitachi Chem Co Ltd | 接着剤および半導体装置 |
JPH08111124A (ja) | 1994-10-11 | 1996-04-30 | Sony Chem Corp | 異方導電性接着剤フィルム |
JPH08253739A (ja) | 1995-01-19 | 1996-10-01 | Sumitomo Bakelite Co Ltd | 熱硬化性接着テープおよびその製造方法 |
JPH08319461A (ja) | 1995-03-20 | 1996-12-03 | Sumitomo Bakelite Co Ltd | 半導体装置 |
JPH08315885A (ja) * | 1995-05-16 | 1996-11-29 | Hitachi Chem Co Ltd | 回路接続材料 |
JPH08325543A (ja) * | 1995-06-05 | 1996-12-10 | Soken Chem & Eng Co Ltd | 異方導電性接着剤 |
JPH0925394A (ja) | 1995-07-10 | 1997-01-28 | Toyo Electric Mfg Co Ltd | 耐熱性熱硬化性樹脂組成物 |
JPH0955448A (ja) | 1995-08-10 | 1997-02-25 | Mitsui High Tec Inc | 半導体装置の製造方法 |
JPH0995652A (ja) * | 1995-09-28 | 1997-04-08 | Sumitomo Bakelite Co Ltd | 導電性樹脂ペースト |
JP3344886B2 (ja) | 1995-12-20 | 2002-11-18 | 住友ベークライト株式会社 | 異方導電フィルム |
JPH09176309A (ja) | 1995-12-22 | 1997-07-08 | Sumitomo Bakelite Co Ltd | 熱硬化性樹脂組成物および熱硬化性接着テープ |
JPH09291259A (ja) | 1996-04-26 | 1997-11-11 | Sumitomo Bakelite Co Ltd | 低温加熱硬化型異方導電性接着剤 |
TW345727B (en) * | 1996-08-22 | 1998-11-21 | Hitachi Ltd | Resin encapsulated semiconductor device and process for producing the same |
JPH10212364A (ja) * | 1996-11-26 | 1998-08-11 | Ajinomoto Co Inc | 積層板用プリプレグ及びこれを用いたプリント配線板の製造方法 |
US7967943B2 (en) * | 1997-03-31 | 2011-06-28 | Hitachi Chemical Company, Ltd. | Circuit-connecting material and circuit terminal connected structure and connecting method |
WO1998044067A1 (en) | 1997-03-31 | 1998-10-08 | Hitachi Chemical Company, Ltd. | Circuit connecting material, and structure and method of connecting circuit terminal |
JPH10273626A (ja) | 1997-03-31 | 1998-10-13 | Hitachi Chem Co Ltd | 回路接続材料及び回路板の製造法 |
JP3877090B2 (ja) | 1997-03-31 | 2007-02-07 | 日立化成工業株式会社 | 回路接続材料及び回路板の製造法 |
JP4717334B2 (ja) | 1997-03-31 | 2011-07-06 | 日立化成工業株式会社 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
JP4794704B2 (ja) * | 1998-03-31 | 2011-10-19 | 日立化成工業株式会社 | 回路接続材料、回路端子の接続構造および回路端子の接続方法 |
JP4794702B2 (ja) * | 1998-03-31 | 2011-10-19 | 日立化成工業株式会社 | 回路接続材料、回路端子の接続構造および回路端子の接続方法 |
US6762249B1 (en) * | 1999-08-25 | 2004-07-13 | Hitachi Chemical Company, Ltd. | Wiring-connecting material and process for producing circuit board with the same |
CN101906274B (zh) * | 1999-08-25 | 2012-05-30 | 日立化成工业株式会社 | 粘合剂,配线端子的连接方法和配线结构体 |
JP4293187B2 (ja) * | 2003-06-25 | 2009-07-08 | 日立化成工業株式会社 | 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法 |
JP2005194393A (ja) * | 2004-01-07 | 2005-07-21 | Hitachi Chem Co Ltd | 回路接続用接着フィルム及び回路接続構造体 |
-
1998
- 1998-03-31 WO PCT/JP1998/001467 patent/WO1998044067A1/ja active IP Right Grant
- 1998-03-31 KR KR1019997008879A patent/KR100333456B1/ko not_active IP Right Cessation
- 1998-03-31 DE DE69836078T patent/DE69836078T2/de not_active Expired - Lifetime
- 1998-03-31 EP EP20060115661 patent/EP1717851B1/en not_active Expired - Lifetime
- 1998-03-31 US US09/402,274 patent/US6777464B1/en not_active Expired - Lifetime
- 1998-03-31 EP EP98911125A patent/EP0979854B1/en not_active Expired - Lifetime
- 1998-03-31 TW TW87104823A patent/TWI229119B/zh not_active IP Right Cessation
- 1998-03-31 EP EP20040028659 patent/EP1542273B1/en not_active Expired - Lifetime
- 1998-03-31 JP JP54145798A patent/JP3587859B2/ja not_active Expired - Fee Related
- 1998-03-31 AU AU65207/98A patent/AU6520798A/en not_active Abandoned
- 1998-03-31 EP EP20070114390 patent/EP1890324A3/en not_active Withdrawn
-
2004
- 2004-06-04 US US10/860,578 patent/US7629056B2/en not_active Expired - Fee Related
-
2010
- 2010-03-01 JP JP2010044251A patent/JP4858623B2/ja not_active Expired - Fee Related
-
2012
- 2012-03-29 JP JP2012078289A patent/JP5120514B2/ja not_active Expired - Lifetime
- 2012-03-29 JP JP2012078290A patent/JP5120515B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2012184424A (ja) | 2012-09-27 |
JP5120514B2 (ja) | 2013-01-16 |
TWI229119B (en) | 2005-03-11 |
KR20010005805A (ko) | 2001-01-15 |
EP0979854A1 (en) | 2000-02-16 |
EP1717851B1 (en) | 2012-10-17 |
EP0979854A4 (en) | 2000-07-12 |
JP5120515B2 (ja) | 2013-01-16 |
KR100333456B1 (ko) | 2002-04-18 |
EP1542273B1 (en) | 2013-09-25 |
US6777464B1 (en) | 2004-08-17 |
JP3587859B2 (ja) | 2004-11-10 |
EP0979854B1 (en) | 2006-10-04 |
JP2010219039A (ja) | 2010-09-30 |
US20040222408A1 (en) | 2004-11-11 |
US7629056B2 (en) | 2009-12-08 |
JP2012180520A (ja) | 2012-09-20 |
AU6520798A (en) | 1998-10-22 |
DE69836078D1 (de) | 2006-11-16 |
EP1542273A1 (en) | 2005-06-15 |
EP1890324A2 (en) | 2008-02-20 |
DE69836078T2 (de) | 2007-05-10 |
EP1890324A3 (en) | 2008-06-11 |
EP1717851A1 (en) | 2006-11-02 |
WO1998044067A1 (en) | 1998-10-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4858623B2 (ja) | 回路接続材料並びに回路端子の接続構造及び接続方法 | |
US7879956B2 (en) | Circuit-connecting material and circuit terminal connected structure and connecting method | |
JP4289319B2 (ja) | 回路接続材料並びに回路端子の接続構造及び接続方法 | |
JP4916677B2 (ja) | 配線接続材料及びそれを用いた配線板製造方法 | |
JP4016995B2 (ja) | 回路接続材料並びに回路端子の接続構造及び接続方法 | |
JP4717334B2 (ja) | 回路接続材料並びに回路端子の接続構造及び接続方法 | |
JP4265565B2 (ja) | 回路接続材料並びに回路端子の接続構造及び接続方法 | |
JP2007291396A (ja) | 配線接続材料及びそれを用いた配線板製造方法 | |
JP5020476B6 (ja) | 回路接続材料並びに回路端子の接続構造及び接続方法 | |
JP5020476B2 (ja) | 圧電/電歪素子の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20111004 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20111017 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20141111 Year of fee payment: 3 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20141111 Year of fee payment: 3 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
LAPS | Cancellation because of no payment of annual fees |