JP5527394B2 - 接着剤組成物、接着シート及び接続構造体 - Google Patents
接着剤組成物、接着シート及び接続構造体 Download PDFInfo
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- JP5527394B2 JP5527394B2 JP2012273659A JP2012273659A JP5527394B2 JP 5527394 B2 JP5527394 B2 JP 5527394B2 JP 2012273659 A JP2012273659 A JP 2012273659A JP 2012273659 A JP2012273659 A JP 2012273659A JP 5527394 B2 JP5527394 B2 JP 5527394B2
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- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 1
- 125000000250 methylamino group Chemical group [H]N(*)C([H])([H])[H] 0.000 description 1
- ZJBHFQKJEBGFNL-UHFFFAOYSA-N methylsilanetriol Chemical compound C[Si](O)(O)O ZJBHFQKJEBGFNL-UHFFFAOYSA-N 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 125000004573 morpholin-4-yl group Chemical group N1(CCOCC1)* 0.000 description 1
- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 description 1
- OVHHHVAVHBHXAK-UHFFFAOYSA-N n,n-diethylprop-2-enamide Chemical compound CCN(CC)C(=O)C=C OVHHHVAVHBHXAK-UHFFFAOYSA-N 0.000 description 1
- 229940088644 n,n-dimethylacrylamide Drugs 0.000 description 1
- YLGYACDQVQQZSW-UHFFFAOYSA-N n,n-dimethylprop-2-enamide Chemical compound CN(C)C(=O)C=C YLGYACDQVQQZSW-UHFFFAOYSA-N 0.000 description 1
- RQAKESSLMFZVMC-UHFFFAOYSA-N n-ethenylacetamide Chemical compound CC(=O)NC=C RQAKESSLMFZVMC-UHFFFAOYSA-N 0.000 description 1
- ZQXSMRAEXCEDJD-UHFFFAOYSA-N n-ethenylformamide Chemical compound C=CNC=O ZQXSMRAEXCEDJD-UHFFFAOYSA-N 0.000 description 1
- SEEYREPSKCQBBF-UHFFFAOYSA-N n-methylmaleimide Chemical compound CN1C(=O)C=CC1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 1
- XFHJDMUEHUHAJW-UHFFFAOYSA-N n-tert-butylprop-2-enamide Chemical compound CC(C)(C)NC(=O)C=C XFHJDMUEHUHAJW-UHFFFAOYSA-N 0.000 description 1
- CXOYJPWMGYDJNW-UHFFFAOYSA-N naphthalen-2-yl 2-methylprop-2-enoate Chemical compound C1=CC=CC2=CC(OC(=O)C(=C)C)=CC=C21 CXOYJPWMGYDJNW-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- FSAJWMJJORKPKS-UHFFFAOYSA-N octadecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C=C FSAJWMJJORKPKS-UHFFFAOYSA-N 0.000 description 1
- AEIJTFQOBWATKX-UHFFFAOYSA-N octane-1,2-diol Chemical compound CCCCCCC(O)CO AEIJTFQOBWATKX-UHFFFAOYSA-N 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- 125000005474 octanoate group Chemical group 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- WCVRQHFDJLLWFE-UHFFFAOYSA-N pentane-1,2-diol Chemical compound CCCC(O)CO WCVRQHFDJLLWFE-UHFFFAOYSA-N 0.000 description 1
- GLOBUAZSRIOKLN-UHFFFAOYSA-N pentane-1,4-diol Chemical compound CC(O)CCCO GLOBUAZSRIOKLN-UHFFFAOYSA-N 0.000 description 1
- GTCCGKPBSJZVRZ-UHFFFAOYSA-N pentane-2,4-diol Chemical compound CC(O)CC(C)O GTCCGKPBSJZVRZ-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 150000003057 platinum Chemical group 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229940104181 polyflex Drugs 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical class C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- AQHHHDLHHXJYJD-UHFFFAOYSA-N propranolol Chemical compound C1=CC=C2C(OCC(O)CNC(C)C)=CC=CC2=C1 AQHHHDLHHXJYJD-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 229940083082 pyrimidine derivative acting on arteriolar smooth muscle Drugs 0.000 description 1
- JWVCLYRUEFBMGU-UHFFFAOYSA-N quinazoline Chemical compound N1=CN=CC2=CC=CC=C21 JWVCLYRUEFBMGU-UHFFFAOYSA-N 0.000 description 1
- 150000004059 quinone derivatives Chemical class 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000010420 shell particle Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- VNJISVYSDHJQFR-UHFFFAOYSA-N tert-butyl 4,4-dimethylpentaneperoxoate Chemical compound CC(C)(C)CCC(=O)OOC(C)(C)C VNJISVYSDHJQFR-UHFFFAOYSA-N 0.000 description 1
- NMOALOSNPWTWRH-UHFFFAOYSA-N tert-butyl 7,7-dimethyloctaneperoxoate Chemical compound CC(C)(C)CCCCCC(=O)OOC(C)(C)C NMOALOSNPWTWRH-UHFFFAOYSA-N 0.000 description 1
- YBRBMKDOPFTVDT-UHFFFAOYSA-N tert-butylamine Chemical compound CC(C)(C)N YBRBMKDOPFTVDT-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- MXSVLWZRHLXFKH-UHFFFAOYSA-N triphenylborane Chemical compound C1=CC=CC=C1B(C=1C=CC=CC=1)C1=CC=CC=C1 MXSVLWZRHLXFKH-UHFFFAOYSA-N 0.000 description 1
- QLAGHGSFXJZWKY-UHFFFAOYSA-N triphenylborane;triphenylphosphane Chemical compound C1=CC=CC=C1B(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 QLAGHGSFXJZWKY-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- FQLSDFNKTNBQLC-UHFFFAOYSA-N tris(2,3,4,5,6-pentafluorophenyl)phosphane Chemical compound FC1=C(F)C(F)=C(F)C(F)=C1P(C=1C(=C(F)C(F)=C(F)C=1F)F)C1=C(F)C(F)=C(F)C(F)=C1F FQLSDFNKTNBQLC-UHFFFAOYSA-N 0.000 description 1
- LFNXCUNDYSYVJY-UHFFFAOYSA-N tris(3-methylphenyl)phosphane Chemical compound CC1=CC=CC(P(C=2C=C(C)C=CC=2)C=2C=C(C)C=CC=2)=C1 LFNXCUNDYSYVJY-UHFFFAOYSA-N 0.000 description 1
- WXAZIUYTQHYBFW-UHFFFAOYSA-N tris(4-methylphenyl)phosphane Chemical compound C1=CC(C)=CC=C1P(C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 WXAZIUYTQHYBFW-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S30/00—Structural details of PV modules other than those related to light conversion
- H02S30/10—Frame structures
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29199—Material of the matrix
- H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Wire Bonding (AREA)
- Adhesive Tapes (AREA)
- Powder Metallurgy (AREA)
Description
[式(A)中、R1、R2及びR3はそれぞれ独立に、置換基を有していてもよいアリール基を示し、Xは窒素原子を有するアミン化合物、又は、リン原子を有するホスフィン化合物を示す。]
[式(B)中、R4、R5、R6及びR7はそれぞれ独立に、水素原子、ハロゲン原子、アルキル基、アリール基又はアルコキシ基を示す。]
[式(C)中、R8、R9、R10及びR11はそれぞれ独立に、水素原子、ハロゲン原子、アルキル基、アリール基又はアルコキシ基を示す。]
[式(D)中、R12、R13及びR14はそれぞれ独立に、炭素数1〜18のアルキル基、又は、置換基を有してもよいアリール基を示す。]
(測定条件)
装置:東ソー株式会社製 GPC−8020
検出器:東ソー株式会社製 RI−8020
カラム:日立化成工業株式会社製 Gelpack GL−A−160−S+GL−A150
試料濃度:120mg/3ml
溶媒:テトラヒドロフラン
注入量:60μl
圧力:30kgf/cm2
流量:1.00ml/min
(a)熱可塑性樹脂は、加熱により粘度の高い液状状態になって外力により自由に変形し、冷却し外力を取り除くとその形状を保ったままで硬くなり、この過程を繰り返し行える性質を持つ樹脂(高分子)をいう。また、(a)熱可塑性樹脂は、上記の性質を有する反応性官能基を有する樹脂(高分子)であってもよい。(a)熱可塑性樹脂のガラス転移温度(Tg)は、例えば、−30℃以上が好ましく、−25℃以上がより好ましく、−20℃以上が更に好ましい。(a)熱可塑性樹脂のガラス転移温度(Tg)は、例えば、190℃以下が好ましく、170℃以下がより好ましく、150℃以下が更に好ましい。
(b)ラジカル重合性化合物は、ラジカル重合開始剤の作用でラジカル重合を生じる化合物をいうが、光又は熱等の活性化エネルギーを付与することでそれ自体ラジカルを生じる化合物であってもよい。(b)ラジカル重合性化合物としては、例えば、ビニル基、(メタ)アクリロイル基、アリル基、マレイミド基等の活性ラジカルによって重合する官能基を有する化合物を好適に使用可能である。
[式(E)中、R15及びR16はそれぞれ独立に水素原子又はメチル基を示し、a及びbはそれぞれ独立に1〜8の整数を示す。]
[式(F)中、R17及びR18はそれぞれ独立に水素原子又はメチル基を示し、c及びdはそれぞれ独立に0〜8の整数を示す。]
[式(G)中、eは1〜10の整数を示す。]
[式(I)中、R19及びR20はそれぞれ独立に水素原子又はメチル基を示し、fは15〜30の整数を示す。]
[式(J)中、R21及びR22はそれぞれ独立に水素原子又はメチル基を示し、gは15〜30の整数を示す。]
[式(K)中、R23は水素原子又はメチル基を示す。]
[式(L)中、R24は水素原子又はメチル基を示し、hは1〜10の整数を示す。]
[式(M)中、R25は水素原子、若しくは下記一般式(i)又は(ii)で表される有機基を示し、iは1〜10の整数を示す。]
[式(N)中、R26は水素原子、若しくは下記一般式(iii)又は(iv)で表される有機基を示し、jは1〜10の整数を示す。]
[式(O)中、R27は水素原子又はメチル基を示す。]
[式(P)中、R28は水素原子又はメチル基を示す。]
[式(Q)中、R29及びR30はそれぞれ独立に水素原子又はメチル基を示し、R31はエチレン基又はプロピレン基を示し、R32は飽和脂肪族基又は飽和脂環式基を示し、R33は、エステル基を含有する飽和脂肪族基又は飽和脂環式基、若しくは、カーボネート基を含有する飽和脂肪族基又は飽和脂環式基を示し、kは1〜40の整数を示す。なお、式(Q)中、R31同士、R32同士はそれぞれ同一でも異なってもよい。]
[式(R)中、R34は(メタ)アクリロイルオキシ基を示し、R35は水素原子又はメチル基を示し、l及びmはそれぞれ独立に1〜8の整数を示す。なお、式(R)中、R34同士、R35同士、l同士及びm同士はそれぞれ同一でも異なってもよい。]
[式(S)中、R36は(メタ)アクリロイルオキシ基を示し、n、o及びpはそれぞれ独立に1〜8の整数を示す。なお、式(S)中、R36同士、n同士、o同士及びp同士はそれぞれ同一でも異なってもよい。]
[式(T)中、R37は(メタ)アクリロイルオキシ基を示し、R38は水素原子又はメチル基を示し、q及びrはそれぞれ独立に1〜8の整数を示す。]
(c)ラジカル重合開始剤としては、従来から知られている有機過酸化物及びアゾ化合物等、外部からのエネルギーの付与によりラジカルを発生する化合物を用いることができる。(c)ラジカル重合開始剤としては、安定性、反応性、相溶性の観点から、1分間半減期温度が90〜175℃であり且つ重量平均分子量が180〜1000の有機過酸化物が好ましい。1分間半減期温度がこの範囲にあることで、貯蔵安定性に更に優れ、ラジカル重合性も充分に高く、短時間で硬化できる。
(d)ホウ素を含有する錯体は、下記一般式(A)で表される化合物である。(d)錯体が、アリール基を有するホウ素含有化合物と、アミン化合物又はホスフィン化合物とを含む錯体であることで、接着剤組成物の低温硬化性及び貯蔵安定性がバランス良く向上する。
[式(A)中、R1、R2及びR3はそれぞれ独立に、置換基を有していてもよいアリール基を示し、Xは窒素原子を有するアミン化合物、又は、リン原子を有するホスフィン化合物を示す。]
[式(B)中、R4、R5、R6及びR7はそれぞれ独立に、水素原子、ハロゲン原子、アルキル基、アリール基又はアルコキシ基を示す。]
[式(C)中、R8、R9、R10及びR11はそれぞれ独立に、水素原子、ハロゲン原子、アルキル基、アリール基又はアルコキシ基を示す。]
[式(D)中、R12、R13及びR14はそれぞれ独立に、炭素数1〜18のアルキル基、又は、置換基を有してもよいアリール基を示す。]
(e)導電性粒子は、その全体又は表面に導電性を有する粒子であればよいが、接続端子を有する部材の接続に使用する場合は、接続端子間の距離よりも平均粒径が小さい粒子が好ましい。
本実施形態に係る接着剤組成物には、硬化速度の制御のため、及び、貯蔵安定性を更に向上させるために、安定化剤を添加することできる。このような安定化剤としては、特に制限なく公知の化合物を使用することができるが、ベンゾキノン及びハイドロキノン等のキノン誘導体;4−メトキシフェノール及び4−t−ブチルカテコール等のフェノール誘導体;2,2,6,6−テトラメチルピペリジン−1−オキシル及び4−ヒドロキシ−2,2,6,6−テトラメチルピペリジン−1−オキシル等のアミノキシル誘導体;テトラメチルピペリジルメタクリレート等のヒンダードアミン誘導体;などが好ましい。安定化剤は、1種を単独で又は2種以上を混合して用いることができる。
[式(U)中、R39、R40及びR41はそれぞれ独立に、水素原子、炭素数1〜5のアルキル基、炭素数1〜5のアルコキシ基、炭素数1〜5のアルコキシカルボニル基又はアリール基を示し、R42は(メタ)アクリロイル基、ビニル基、イソシアナート基、イミダゾール基、メルカプト基、アミノ基、メチルアミノ基、ジメチルアミノ基、ベンジルアミノ基、フェニルアミノ基、シクロヘキシルアミノ基、モルホリノ基、ピペラジノ基、ウレイド基又はグリシジル基を示し、sは1〜10の整数を示す。]
次に、上述した接着剤組成物を用いた接続構造体及びその製造方法について説明する。本実施形態によれば、第1の基板及び当該第1の基板の主面上に配置された第1の接続端子を有する第1の回路部材と、第2の基板及び当該第2の基板の主面上に配置された第2の接続端子を有する第2の回路部材との間に、接着剤組成物を介在させた状態で当該接着剤組成物を硬化させることにより、第1の接続端子及び第2の接続端子が電気的に接続した状態で第1の回路部材及び第2の回路部材を接着する、接続構造体の製造方法が提供される。また、本実施形態によれば、基板及び当該基板の主面上に配置された接続端子を有する太陽電池セルと、配線部材との間に、接着剤組成物を介在させた状態で当該接着剤組成物を硬化させることにより、接続端子及び配線部材が電気的に接続した状態で太陽電池セル及び配線部材を接着する、接続構造体の製造方法が提供される。
(ポリエステルウレタンの準備)
ポリエステルウレタン樹脂(東洋紡株式会社製、UR−4800(商品名)、重量平均分子量:32000、ガラス転移温度:106℃)をメチルエチルケトンとトルエンの1:1混合溶媒に溶解して樹脂分30質量%の混合溶媒溶解品を準備した。
フェノキシ樹脂(商品名:YP−50(東都化成株式会社製)、重量平均分子量:60000、ガラス転移温度:80℃)40質量部をメチルエチルケトン60質量部に溶解して、固形分40質量%の溶液を準備した。
(ウレタンアクリレート(UA1)の合成)
攪拌機、温度計、塩化カルシウム乾燥管を有する還流冷却管、及び、窒素ガス導入管を備えた反応容器に、数平均分子量1000のポリ(1,6−ヘキサンジオールカーボネート)(商品名:デュラノール T5652、旭化成ケミカルズ株式会社製)2500質量部(2.50mol)と、イソホロンジイソシアネート(シグマアルドリッチ社製)666質量部(3.00mol)とを3時間で均一に滴下し、反応容器に充分に窒素ガスを導入した後、70〜75℃に加熱して反応させた。反応容器に、ハイドロキノンモノメチルエーテル(シグマアルドリッチ社製)0.53質量部と、ジブチルスズジラウレート(シグマアルドリッチ社製)5.53質量部とを添加した後、2−ヒドロキシエチルアクリレート(シグマアルドリッチ社製)238質量部(2.05mol)を加え、空気雰囲気下70℃で6時間反応させ、ウレタンアクリレート(UA1)を得た。ウレタンアクリレートの重量平均分子量は15000であった。
リン酸基を有するビニル化合物として、2−(メタ)アクリロイルオキシエチルホスフェート(商品名:ライトエステルP−2M、共栄社化学株式会社製)を準備した。
(ホウ素含有錯体(TPP−S)の準備)
ホウ素含有錯体として、トリフェニルホスフィントリフェニルボラン(商品名:TPP−S、北興化学工業株式会社製、融点:205℃)を準備した。
100mlのナス型フラスコにおいてテトラフェニルボレートナトリウム塩(アルドリッチ社製)3.4g(10mmol)をテトラヒドロフラン(THF)10g及びトルエン5gの混合溶媒に溶解した後、10%塩酸水溶液3.7g(10mmol)を窒素雰囲気下、25℃で1時間かけて滴下した。滴下終了後、25℃で4時間攪拌した。そして、ベンゾイミダゾール(アルドリッチ社製)1.2g(10mmol)をトルエン10gで希釈した溶液を加え、窒素雰囲気下、25℃で2時間攪拌して反応混合液を得た。反応混合液をトルエンで希釈し、分液ロートで4回水洗いした。さらに、ロータリーエバポレーターで減圧濃縮し、トルエン−メチルエチルケトン混合溶媒で再結晶することでイミダゾール−トリフェニルボラン(ITPB、融点:210℃)を得た。
アミン化合物として、N,N−ジメチルアニリン(略称:DMA、Aldrich社製)を準備した。
ラジカル重合開始剤として、ジベンゾイルパーオキサイド(商品名:ナイパーBW、日油株式会社製)及びジラウロイルパーオキサイド(商品名:パーロイルL、日油株式会社製)を準備した。
(導電性粒子の作製)
ポリスチレンを核とする粒子の表面に厚み0.2μmのニッケル層を設けた後、このニッケル層の外側に厚み0.02μmの金層を設けて、平均粒径10μm、比重2.5の導電性粒子を作製した。
(回路接続用接着剤の作製)
固形質量比で表1に示すように熱可塑性樹脂、ラジカル重合性化合物及びラジカル重合開始剤、並びに、ホウ素含有錯体又はアミン化合物を配合し、さらに、接着剤成分(回路接続用接着剤における導電性粒子を除いた成分)の全体積を基準として導電性粒子を1.5体積%配合分散させて、回路接続用接着剤を得た。得られた回路接続用接着剤を、塗工装置を用いて厚み80μmのフッ素樹脂フィルム上に塗布し、70℃、10分の熱風乾燥によって接着剤層の厚みが20μmのフィルム状回路接続用接着剤を得た。
実施例1〜6及び比較例1〜4の回路接続用接着剤を、ポリイミドフィルム上にライン幅25μm、ピッチ50μm、厚み8μmの銅回路を500本有するフレキシブル回路板(FPC)と、0.2μmのITOの薄層を形成した厚み1.1mmのガラス(ITO、表面抵抗20Ω/□)との間に介在させた。これを、熱圧着装置(加熱方式:コンスタントヒート型、東レエンジニアリング社製)を用いて、120℃、2MPaで10秒間加熱加圧して幅2mmにわたり接続し、接続構造体Aを作製した。この接続構造体Aの隣接回路間の抵抗値を、接続直後と、85℃、85%RHの恒温恒湿槽中に240時間保持した後(高温高湿試験後)とにおいて、マルチメータを用いて測定した。抵抗値は隣接回路間の抵抗37点の平均で示した。
実施例5〜6及び比較例1〜2の回路接続用接着剤を、ガスバリア性容器内(旭化成パックス株式会社製、商品名:ポリフレックスバッグ飛竜、型番:N−9、材質:ナイロン・厚み15μm/PE・厚み60μm、サイズ:200mm×300mm)に入れ、ガスバリア性容器内の空気を除いた後、ヒートシーラーにて密封後、40℃雰囲気下に48時間放置した。上記雰囲気下に放置することによって、−10℃雰囲気下で5ヶ月間放置したことと同等とした。その後、実施例5〜6及び比較例1〜2の回路接続用接着剤を、上記と同様のFPCとITOの薄層を形成したガラスとの間、及び、FPCとAgペーストの薄層を形成したPET基板との間にそれぞれ介在させた。これを、上記接続抵抗及び接着強度の測定の際と同じ方法及び条件で加熱圧着して接続構造体を作製した。この接続構造体の接続抵抗及び接着強度を上記と同様の方法で測定した。
Claims (13)
- (a)熱可塑性樹脂と、(b)ラジカル重合性化合物と、(c)ラジカル重合開始剤と、(d)ホウ素を含有する錯体と、(e)導電性粒子と、を含有し、
前記(d)錯体が、下記一般式(A)で表される化合物である、接着剤組成物。
- 前記(d)錯体として、下記一般式(B)又は下記一般式(C)で表されるアミン化合物を前記化合物Xとして有する錯体を含有する、請求項1に記載の接着剤組成物。
- 前記(d)錯体として、下記一般式(D)で表されるホスフィン化合物を前記化合物Xとして有する錯体を含有する、請求項1又は2に記載の接着剤組成物。
- 前記(b)ラジカル重合性化合物が、リン酸基を有するビニル化合物と、当該ビニル化合物以外のラジカル重合性化合物と、を含む、請求項1〜3のいずれか一項に記載の接着剤組成物。
- 前記(d)錯体の融点が60℃以上300℃以下である、請求項1〜4のいずれか一項に記載の接着剤組成物。
- 前記(a)熱可塑性樹脂が、フェノキシ樹脂、ポリウレタン樹脂、ポリエステルウレタン樹脂、ブチラール樹脂、アクリル樹脂、ポリイミド樹脂及びポリアミド樹脂、並びに、酢酸ビニルを構造単位として有する共重合体からなる群より選ばれる少なくとも1種を含む、請求項1〜5のいずれか一項に記載の接着剤組成物。
- 第1の基板の主面上に配置された第1の接続端子と、第2の基板の主面上に配置された第2の接続端子とを電気的に接続するために用いられる、請求項1〜6のいずれか一項に記載の接着剤組成物。
- 基板の主面上に配置された接続端子を有する太陽電池セルの当該接続端子と、配線部材とを電気的に接続するために用いられる、請求項1〜6のいずれか一項に記載の接着剤組成物。
- 基材と、請求項1〜6のいずれか一項に記載の接着剤組成物を含むフィルム状接着剤とを備え、
前記フィルム状接着剤が前記基材上に配置されている、接着シート。 - 第1の基板及び当該第1の基板の主面上に配置された第1の接続端子を有する第1の回路部材と、
第2の基板及び当該第2の基板の主面上に配置された第2の接続端子を有する第2の回路部材と、
前記第1の回路部材及び前記第2の回路部材の間に配置された接続部材と、を備え、
前記接続部材が、請求項1〜6のいずれか一項に記載の接着剤組成物の硬化物を含有し、
前記第1の接続端子及び前記第2の接続端子が電気的に接続されている、接続構造体。 - 前記第1の基板及び前記第2の基板の少なくとも一方が、ガラス転移温度が200℃以下の熱可塑性樹脂を含む基材から構成されている、請求項10に記載の接続構造体。
- 前記第1の基板及び前記第2の基板の少なくとも一方が、ポリエチレンテレフタレート、ポリカーボネート、ポリエチレンナフタレート及びシクロオレフィンポリマーからなる群より選ばれる少なくとも1種を含む基材から構成されている、請求項10に記載の接続構造体。
- 基板及び当該基板の主面上に配置された接続端子を有する太陽電池セルと、
配線部材と、
前記太陽電池セル及び前記配線部材の間に配置された接続部材と、を備え、
前記接続部材が、請求項1〜6のいずれか一項に記載の接着剤組成物の硬化物を含有し、
前記接続端子及び前記配線部材が電気的に接続されている、接続構造体。
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