JP6834946B2 - 接着剤組成物及び接続構造体 - Google Patents
接着剤組成物及び接続構造体 Download PDFInfo
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- JP6834946B2 JP6834946B2 JP2017514209A JP2017514209A JP6834946B2 JP 6834946 B2 JP6834946 B2 JP 6834946B2 JP 2017514209 A JP2017514209 A JP 2017514209A JP 2017514209 A JP2017514209 A JP 2017514209A JP 6834946 B2 JP6834946 B2 JP 6834946B2
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
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Description
(測定条件)
装置:東ソー株式会社製 GPC−8020
検出器:東ソー株式会社製 RI−8020
カラム:日立化成株式会社製 Gelpack GL−A−160−S+GL−A150
試料濃度:120mg/3ml
溶媒:テトラヒドロフラン
注入量:60μl
圧力:30kgf/cm2
流量:1.00ml/min
本実施形態に係る接着剤組成物は、(a)熱可塑性樹脂と、(b)ラジカル重合性化合物と、(c)ラジカル重合開始剤と、(d)ホウ素を含有する錯体と、を含有している。
(a)熱可塑性樹脂とは、加熱により粘度の高い液状状態になって外力により自由に変形し、冷却し外力を取り除くとその形状を保ったままで硬くなり、この過程を繰り返し行える性質を持つ樹脂(高分子)をいう。また、(a)熱可塑性樹脂は、上記の性質を有する反応性官能基を有する樹脂(高分子)であってもよい。(a)熱可塑性樹脂のガラス転移温度(Tg)は、−30℃以上が好ましく、−25℃以上がより好ましく、−20℃以上が更に好ましい。(a)熱可塑性樹脂のガラス転移温度は、190℃以下が好ましく、170℃以下がより好ましく、150℃以下が更に好ましく、130℃以下が特に好ましく、110℃以下が極めて好ましい。
(b)ラジカル重合性化合物とは、ラジカル重合開始剤の作用でラジカル重合を生じる化合物をいう。(b)ラジカル重合性化合物は、光又は熱等の活性化エネルギーを付与することでそれ自体ラジカルを生じる化合物であってもよい。(b)ラジカル重合性化合物としては、例えば、活性ラジカルによって重合する官能基(ビニル基、(メタ)アクリロイル基、アリル基、マレイミド基等)を有する化合物を好適に使用可能である。
(c)ラジカル重合開始剤としては、従来から知られている有機過酸化物及びアゾ化合物等のように、外部からのエネルギーの付与によりラジカルを発生する化合物を用いることができる。(c)ラジカル重合開始剤としては、安定性、反応性及び相溶性に優れる観点から、1分間半減期温度が90〜175℃であり且つ重量平均分子量が180〜1000の有機過酸化物が好ましい。1分間半減期温度がこの範囲にあることで、貯蔵安定性に更に優れ、ラジカル重合性も充分に高く、短時間で硬化できる。
(d)ホウ素を含有する錯体(以下「(d)成分」という)は、下記一般式(A)で表される化合物である。(d)成分は、ホウ素化合物と、ホウ素化合物に対する塩基性物質としてアンモニア又はアミン化合物とを含んでいる。
(e)導電性粒子は、その全体又は表面に導電性を有する粒子であればよいが、接続端子を有する部材の接続に使用する場合は、接続端子間の距離よりも平均粒径が小さい粒子が好ましい。
本実施形態に係る接着剤組成物は、硬化速度の制御のため、及び、貯蔵安定性を更に向上させるために、安定化剤を含有することができる。このような安定化剤としては、特に制限なく公知の化合物を使用することができるが、ベンゾキノン及びハイドロキノン等のキノン誘導体;4−メトキシフェノール及び4−t−ブチルカテコール等のフェノール誘導体;2,2,6,6−テトラメチルピペリジン−1−オキシル及び4−ヒドロキシ−2,2,6,6−テトラメチルピペリジン−1−オキシル等のアミノキシル誘導体;テトラメチルピペリジルメタクリレート等のヒンダードアミン誘導体などが好ましい。安定化剤は、1種を単独で又は2種以上を混合して用いることができる。
次に、上述した接着剤組成物を用いた接続構造体及びその製造方法について説明する。本実施形態によれば、第1の基板及び当該第1の基板の主面上に配置された第1の接続端子を有する第1の回路部材と、第2の基板及び当該第2の基板の主面上に配置された第2の接続端子を有する第2の回路部材との間に、接着剤組成物を介在させた状態で当該接着剤組成物を硬化させることにより、第1の接続端子及び第2の接続端子が電気的に接続した状態で第1の回路部材及び第2の回路部材を接着する、接続構造体の製造方法が提供される。また、本実施形態によれば、基板及び当該基板の主面上に配置された接続端子を有する太陽電池セルと、配線部材との間に、接着剤組成物を介在させた状態で当該接着剤組成物を硬化させることにより、接続端子及び配線部材が電気的に接続した状態で太陽電池セル及び配線部材を接着する、接続構造体の製造方法が提供される。
(ポリエステルウレタン樹脂の準備)
ポリエステルウレタン樹脂(商品名:UR−4800、東洋紡株式会社製、重量平均分子量:32000、ガラス転移温度:106℃)をメチルエチルケトンとトルエンとの1:1混合溶媒に溶解して樹脂分30質量%の混合溶媒溶解品を準備した。
フェノキシ樹脂(商品名:YP−50、新日鉄住金化学株式会社製、重量平均分子量:60000、ガラス転移温度:80℃)40質量部をメチルエチルケトン60質量部に溶解して、固形分40質量%の溶液を準備した。
(ウレタンアクリレート(UA1)の合成)
攪拌機、温度計、塩化カルシウム乾燥管を有する還流冷却管、及び、窒素ガス導入管を備えた反応容器に、数平均分子量1000のポリ(1,6−ヘキサンジオールカーボネート)(商品名:デュラノール T5652、旭化成ケミカルズ株式会社製)2500質量部(2.50mol)と、イソホロンジイソシアネート(シグマアルドリッチ社製)666質量部(3.00mol)とを3時間で均一に滴下し、反応容器に充分に窒素ガスを導入した後、70〜75℃に加熱して反応させた。反応容器に、ハイドロキノンモノメチルエーテル(シグマアルドリッチ社製)0.53質量部と、ジブチルスズジラウレート(シグマアルドリッチ社製)5.53質量部とを添加した後、2−ヒドロキシエチルアクリレート(シグマアルドリッチ社製)238質量部(2.05mol)を加え、空気雰囲気下70℃で6時間反応させ、ウレタンアクリレート(UA1)を得た。ウレタンアクリレートの重量平均分子量は15000であった。
リン酸基を有するビニル化合物として、2−(メタ)アクリロイルオキシエチルホスフェート(商品名:ライトエステルP−2M、共栄社化学株式会社製)を準備した。
(トリエチルボラン1,3−ジアミノプロパン(TEB−DAP)の合成)
攪拌器、冷却器、温度計及び窒素ガス導入管を含む3口フラスコに14.8g(0.20mol)の1,3−プロピレンジアミンを加え、13.1g(0.13mol)のトリエチルホウ素を100mlのテトラヒドロフラン(THF)に溶解させた溶液を約40℃以下に保ちながら滴下した。滴下終了後、この混合物を約0.5時間攪拌することで、トリエチルボラン1,3−ジアミノプロパン(TEB−DAP)を得た。
攪拌器、冷却器、温度計及び窒素ガス導入管を含む3口フラスコに20.6g(0.20mol)のN−(2−アミノエチル)エタン−1,2−ジアミンを加え、13.1g(0.13mol)のトリエチルホウ素を100mlのテトラヒドロフラン(THF)に溶解させた溶液を約40℃以下に保ちながら滴下した。滴下終了後、この混合物を約0.5時間攪拌することで、トリエチルボランN−(2−アミノエチル)エタン−1,2−ジアミン(TEB−DETA)を得た。
攪拌器、冷却器、温度計及び窒素ガス導入管を含む3口フラスコに17.8g(0.20mol)の3−メトキシ−1−アミンプロパンを加え、23.7g(0.13mol)のトリ−n−ブチルホウ素を100mlのテトラヒドロフラン(THF)に溶解させた溶液を約40℃以下に保ちながら滴下した。滴下終了後、この混合物を約0.5時間攪拌することで、トリ−n−ブチルボラン3−メトキシ−1−アミンプロパン(TnBB−MOPA)を得た。
アミン化合物として、N,N−ジメチルアニリン(略称:DMA、シグマアルドリッチ社製)を準備した。
ジラウロイルパーオキサイド(商品名:パーロイルL、日油株式会社製)を準備した。
(導電性粒子の作製)
ポリスチレンを核とする粒子の表面に厚み0.2μmのニッケル層を設けた後、このニッケル層の外側に厚み0.02μmの金層を設けて、平均粒径10μm、比重2.5の導電性粒子を作製した。
(回路接続用接着剤の作製)
固形質量比で表1に示すように熱可塑性樹脂、ラジカル重合性化合物及びラジカル重合開始剤、並びに、ホウ素を含有する錯体又はアミン化合物を配合し、さらに、接着剤成分(回路接続用接着剤における導電性粒子を除いた成分)の全体積を基準として導電性粒子を1.5体積%配合分散させて、回路接続用接着剤を得た。得られた回路接続用接着剤を、塗工装置を用いて厚み80μmのフッ素樹脂フィルム上に塗布し、70℃、10分の熱風乾燥によって、接着剤層の厚みが20μmのフィルム状回路接続用接着剤を得た。
実施例1〜6及び比較例1〜4のフィルム状回路接続用接着剤を、ポリイミドフィルム上にライン幅25μm、ピッチ50μm、厚み8μmの銅回路を500本有するフレキシブル回路板(FPC)と、厚み0.2μmのITOの薄層を形成した厚み1.1mmのガラス(ITO、表面抵抗20Ω/□)との間に介在させた。これを、熱圧着装置(加熱方式:コンスタントヒート型、東レエンジニアリング株式会社製)を用いて、120℃、2MPaで10秒間加熱加圧して幅2mmにわたり接続し、接続構造体A(FPC/ITO)を作製した。この接続構造体Aの隣接回路間の抵抗値を、接続直後と、85℃、85%RHの恒温恒湿槽中に240時間保持した後(高温高湿試験後)とにおいて、マルチメータを用いて測定した。抵抗値は隣接回路間の抵抗37点の平均で示した。
実施例1〜2及び比較例1〜2のフィルム状回路接続用接着剤を、ガスバリア性容器(旭化成パックス株式会社製、商品名:ポリフレックスバッグ飛竜、型番:N−9、材質:ナイロン(厚み15μm)/PE(厚み60μm)、サイズ:200mm×300mm)内に入れた後、ガスバリア性容器内の空気を除いた。次に、ヒートシーラーにて密封後、40℃雰囲気下に48時間放置した。上記雰囲気下に放置することによって、−10℃雰囲気下で5ヶ月間放置したことと同等とした。その後、実施例1〜2及び比較例1〜2のフィルム状回路接続用接着剤を、上記と同様のFPCとITOの薄層を形成したガラスとの間、及び、FPCとAgペーストの薄層を形成したPET基板との間にそれぞれ介在させた。これを、上記接続抵抗及び接着強度の測定の際と同じ方法及び条件で加熱圧着して接続構造体を作製した。この接続構造体の接続抵抗及び接着強度を上記と同様の方法で測定した。
Claims (12)
- (a)熱可塑性樹脂と、(b)ラジカル重合性化合物と、(c)ラジカル重合開始剤と、(d)ホウ素を含有する錯体と、を含有し、
前記(d)ホウ素を含有する錯体が、下記一般式(A)で表される化合物であり、
前記(d)ホウ素を含有する錯体が、下記一般式(a1)で表される有機基を有するアミン又は下記一般式(a2)で表される有機基を有するアミンを含む、フィルム状接着剤組成物。
[式(A)中、R1、R2及びR3はそれぞれ独立に、水素原子、炭素数1〜18のアルキル基又はアリール基を示し、R4、R5及びR6はそれぞれ独立に、水素原子、炭素数1〜18のアルキル基、下記一般式(a1)で表される有機基、又は、下記一般式(a2)で表される有機基を示す。]
[式(a1)中、R7aは、水素原子又は炭素数1〜6のアルキル基を示し、R7bは、水素原子、アミノ基、アルコキシ基又は炭素数1〜10のアルキル基を示す。また、s及びtはそれぞれ独立に、1〜10の整数を示す。]
[式(a2)中、R8は、炭素数1〜10のアルキル基を示す。また、uは、1〜10の整数を示す。] - 前記(b)ラジカル重合性化合物が、リン酸基を有するビニル化合物と、当該ビニル化合物以外のラジカル重合性化合物と、を含む、請求項1に記載のフィルム状接着剤組成物。
- 前記(a)熱可塑性樹脂が、フェノキシ樹脂、ポリウレタン樹脂、ブチラール樹脂、(メタ)アクリル樹脂、ポリイミド樹脂及びポリアミド樹脂、並びに、酢酸ビニル由来の構造単位を有する共重合体からなる群より選ばれる少なくとも1種を含む、請求項1又は2に記載のフィルム状接着剤組成物。
- 前記(a)熱可塑性樹脂が、ポリエステルウレタン樹脂を含む、請求項1又は2に記載のフィルム状接着剤組成物。
- (e)導電性粒子を更に含有する、請求項1〜4のいずれか一項に記載のフィルム状接着剤組成物。
- 第1の基板の主面上に配置された第1の接続端子と、第2の基板の主面上に配置された第2の接続端子とを電気的に接続するために用いられる、請求項1〜5のいずれか一項に記載のフィルム状接着剤組成物。
- 基板の主面上に配置された接続端子を有する太陽電池セルの当該接続端子と、配線部材とを電気的に接続するために用いられる、請求項1〜5のいずれか一項に記載のフィルム状接着剤組成物。
- 第1の基板及び当該第1の基板の主面上に配置された第1の接続端子を有する第1の回路部材と、
第2の基板及び当該第2の基板の主面上に配置された第2の接続端子を有する第2の回路部材と、
前記第1の回路部材及び前記第2の回路部材の間に配置された接続部材と、を備え、
前記接続部材が、請求項1〜5のいずれか一項に記載のフィルム状接着剤組成物の硬化物を含有し、
前記第1の接続端子及び前記第2の接続端子が電気的に接続されている、接続構造体。 - 前記第1の基板及び前記第2の基板の少なくとも一方が、ガラス転移温度が200℃以下の熱可塑性樹脂を含む基材から構成されている、請求項8に記載の接続構造体。
- 前記第1の基板及び前記第2の基板の少なくとも一方が、ポリエチレンテレフタレート、ポリカーボネート及びポリエチレンナフタレートからなる群より選ばれる少なくとも1種を含む基材から構成されている、請求項8に記載の接続構造体。
- 前記第1の基板が、ポリエチレンテレフタレート、ポリカーボネート及びポリエチレンナフタレートからなる群より選ばれる少なくとも1種を含む基材から構成されており、
前記第2の基板が、ポリイミド樹脂及びポリエチレンテレフタレートからなる群より選ばれる少なくとも1種を含む基材から構成されている、請求項8に記載の接続構造体。 - 基板及び当該基板の主面上に配置された接続端子を有する太陽電池セルと、
配線部材と、
前記太陽電池セル及び前記配線部材の間に配置された接続部材と、を備え、
前記接続部材が、請求項1〜5のいずれか一項に記載のフィルム状接着剤組成物の硬化物を含有し、
前記接続端子及び前記配線部材が電気的に接続されている、接続構造体。
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