PL2223981T3 - Materiał do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów - Google Patents

Materiał do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów

Info

Publication number
PL2223981T3
PL2223981T3 PL10156276T PL10156276T PL2223981T3 PL 2223981 T3 PL2223981 T3 PL 2223981T3 PL 10156276 T PL10156276 T PL 10156276T PL 10156276 T PL10156276 T PL 10156276T PL 2223981 T3 PL2223981 T3 PL 2223981T3
Authority
PL
Poland
Prior art keywords
circuit
circuit member
connection material
connecting structure
board
Prior art date
Application number
PL10156276T
Other languages
English (en)
Inventor
Motohiro Arifuku
Nichiomi Mochizuki
Takashi Nakazawa
Kouji Kobayashi
Tohru Fujinawa
Takashi Tatsuzawa
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of PL2223981T3 publication Critical patent/PL2223981T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/4205—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups
    • C08G18/4208—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups
    • C08G18/4211—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups derived from aromatic dicarboxylic acids and dialcohols
    • C08G18/4213—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups derived from aromatic dicarboxylic acids and dialcohols from terephthalic acid and dialcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/671—Unsaturated compounds having only one group containing active hydrogen
    • C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/20—Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C08L75/06—Polyurethanes from polyesters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Conductive Materials (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
PL10156276T 2006-07-21 2006-07-21 Materiał do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów PL2223981T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP06768353A EP2046104B1 (en) 2006-07-21 2006-07-21 Circuit connection material, circuit member connecting structure and method of connecting circuit member
EP10156276A EP2223981B1 (en) 2006-07-21 2006-07-21 Circuit connection material, circuit member connecting structure and method of connecting circuit member
PCT/JP2006/314475 WO2008010294A1 (fr) 2006-07-21 2006-07-21 Matériau de connexion, structure de connexion d'éléments de circuits et procédé de connexion de circuits.

Publications (1)

Publication Number Publication Date
PL2223981T3 true PL2223981T3 (pl) 2012-08-31

Family

ID=38956630

Family Applications (5)

Application Number Title Priority Date Filing Date
PL10156277T PL2223982T3 (pl) 2006-07-21 2006-07-21 Materiał do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów
PL11189685T PL2440023T3 (pl) 2006-07-21 2006-07-21 Zastosowanie materiału do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów
PL11180866T PL2429269T3 (pl) 2006-07-21 2006-07-21 Materiał do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów
PL06768353T PL2046104T3 (pl) 2006-07-21 2006-07-21 Materiał do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów
PL10156276T PL2223981T3 (pl) 2006-07-21 2006-07-21 Materiał do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów

Family Applications Before (4)

Application Number Title Priority Date Filing Date
PL10156277T PL2223982T3 (pl) 2006-07-21 2006-07-21 Materiał do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów
PL11189685T PL2440023T3 (pl) 2006-07-21 2006-07-21 Zastosowanie materiału do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów
PL11180866T PL2429269T3 (pl) 2006-07-21 2006-07-21 Materiał do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów
PL06768353T PL2046104T3 (pl) 2006-07-21 2006-07-21 Materiał do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów

Country Status (8)

Country Link
US (3) US8497431B2 (pl)
EP (5) EP2223982B1 (pl)
JP (1) JP4924609B2 (pl)
KR (3) KR101121616B1 (pl)
CN (1) CN101502188B (pl)
AT (2) ATE540426T1 (pl)
PL (5) PL2223982T3 (pl)
WO (1) WO2008010294A1 (pl)

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JP5602743B2 (ja) * 2009-08-26 2014-10-08 積水化学工業株式会社 異方性導電材料、接続構造体及び接続構造体の製造方法
JP4673931B2 (ja) * 2009-08-26 2011-04-20 積水化学工業株式会社 異方性導電材料及び接続構造体
JP4673933B2 (ja) * 2009-08-26 2011-04-20 積水化学工業株式会社 異方性導電材料及び接続構造体
JP4673932B2 (ja) * 2009-08-26 2011-04-20 積水化学工業株式会社 接続構造体の製造方法及び異方性導電材料
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JP5855459B2 (ja) * 2010-07-26 2016-02-09 日立化成株式会社 回路部材の接続構造体
WO2021212480A1 (zh) * 2020-04-24 2021-10-28 庆鼎精密电子（淮安）有限公司 软硬结合电路板及其制作方法

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Also Published As

Publication number Publication date
CN101502188B (zh) 2011-03-23
EP2223981B1 (en) 2012-03-21
CN101502188A (zh) 2009-08-05
EP2223981A3 (en) 2011-03-02
US8558118B2 (en) 2013-10-15
US20100108365A1 (en) 2010-05-06
EP2046104A4 (en) 2010-05-05
EP2046104B1 (en) 2012-01-18
JP4924609B2 (ja) 2012-04-25
PL2046104T3 (pl) 2012-06-29
ATE550401T1 (de) 2012-04-15
WO2008010294A1 (fr) 2008-01-24
EP2223982B1 (en) 2012-01-04
KR20100024520A (ko) 2010-03-05
EP2440023A1 (en) 2012-04-11
KR101065870B1 (ko) 2011-09-19
KR101121616B1 (ko) 2012-03-13
US20100212943A1 (en) 2010-08-26
KR101108777B1 (ko) 2012-02-15
JPWO2008010294A1 (ja) 2009-12-17
PL2223982T3 (pl) 2012-06-29
KR20090033488A (ko) 2009-04-03
US8497431B2 (en) 2013-07-30
PL2429269T3 (pl) 2013-06-28
US8541688B2 (en) 2013-09-24
EP2440023B1 (en) 2013-03-06
KR20100024519A (ko) 2010-03-05
US20100208444A1 (en) 2010-08-19
EP2429269B1 (en) 2013-01-16
EP2223981A2 (en) 2010-09-01
PL2440023T3 (pl) 2013-06-28
EP2223982A3 (en) 2010-11-17
EP2429269A1 (en) 2012-03-14
ATE540426T1 (de) 2012-01-15
EP2223982A2 (en) 2010-09-01
EP2046104A1 (en) 2009-04-08

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