WO2021212480A1 - 软硬结合电路板及其制作方法 - Google Patents

软硬结合电路板及其制作方法 Download PDF

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Publication number
WO2021212480A1
WO2021212480A1 PCT/CN2020/086740 CN2020086740W WO2021212480A1 WO 2021212480 A1 WO2021212480 A1 WO 2021212480A1 CN 2020086740 W CN2020086740 W CN 2020086740W WO 2021212480 A1 WO2021212480 A1 WO 2021212480A1
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WO
WIPO (PCT)
Prior art keywords
circuit
layer
opening
substrate
rigid
Prior art date
Application number
PCT/CN2020/086740
Other languages
English (en)
French (fr)
Inventor
李卫祥
Original Assignee
庆鼎精密电子（淮安）有限公司
鹏鼎控股(深圳)股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 庆鼎精密电子（淮安）有限公司, 鹏鼎控股(深圳)股份有限公司 filed Critical 庆鼎精密电子（淮安）有限公司
Priority to CN202080063699.XA priority Critical patent/CN114375615A/zh
Priority to PCT/CN2020/086740 priority patent/WO2021212480A1/zh
Priority to TW109114225A priority patent/TWI778356B/zh
Publication of WO2021212480A1 publication Critical patent/WO2021212480A1/zh
Priority to US17/706,011 priority patent/US20220225511A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Definitions

  • the invention relates to a circuit board and a manufacturing method thereof, in particular to a soft-hard combined circuit board and a manufacturing method thereof.
  • Rigid-Flexible Printed Circuit Board refers to a printed circuit board that contains one or more rigid areas and one or more flexible areas. It also has a rigid printed circuit board (RPCB, The durability of rigid circuit boards and the flexibility of flexible printed circuit boards (FPCB, flexible circuit boards), which have the characteristics of light, thin, compact and resistant to harsh application environments, especially suitable for portable electronic products, medical electronic products, military Precision electronic applications such as equipment.
  • the manufacturing process of the rigid-flex board includes the following steps: first, the flexible circuit substrate is made; then, the rigid circuit substrate is pressed onto the flexible circuit substrate to form a circuit on the rigid circuit substrate; finally, the rigid circuit substrate A first opening is formed in the predetermined area of the flexible circuit board, so that part of the flexible circuit board can be exposed from the first opening on the rigid circuit board to form a flexible area, and the remaining flexible circuit board and the rigid circuit board together form a rigid area, thereby forming a rigid area with Rigid-flex board in flexible area and rigid area.
  • the above-mentioned method is relatively complicated, and there is a need to provide a method for manufacturing a rigid-flex board with a simpler process.
  • a method for manufacturing a soft-hard combined circuit board which includes the following steps:
  • each flexible single-sided metal foil substrate includes a first metal layer, an insulating base material layer, and an adhesive layer stacked in sequence;
  • the above-mentioned flexible single-sided metal foil substrate, the circuit substrate, and another flexible single-sided metal foil substrate are sequentially stacked and laminated along the penetrating direction of the opening to form an intermediate body, wherein each of the flexible single-sided The metal foil substrate is combined with the circuit substrate through the adhesive layer, and in the intermediate, the adhesive layers of the two flexible single-sided metal foil substrates fill the opening and are bonded to each other; and
  • At least one conductive hole is formed on the intermediate body to electrically connect the two first metal layers and the circuit substrate, and circuit fabrication is performed so that the two first metal layers form two outer conductive circuit layers corresponding to each other.
  • a rigid-flex circuit board includes a circuit substrate, an adhesive layer and two outer conductive circuit layers.
  • the circuit substrate is provided with at least one opening penetrating the circuit substrate, and the two outer conductive circuit layers extend along the The penetrating directions of the openings are respectively laminated on opposite sides of the circuit substrate, and the adhesive layer is bonded between the circuit substrate and each of the outer conductive circuit layers and fills the openings.
  • the manufacturing method of the rigid-flex circuit board of the present invention is simple and easy to operate, and the area corresponding to the opening of the rigid-flex circuit board is the flexible board area of the rigid-flex circuit board.
  • the manufacturing method of the board does not need to open the cover, which simplifies the manufacturing process and avoids problems such as damage or pollution to the circuit board due to the cover being opened.
  • FIG. 1 is a schematic cross-sectional view of a circuit board according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view of a flexible single-sided metal foil substrate according to an embodiment of the present invention.
  • FIG. 3 is a schematic cross-sectional view of an intermediate body after laminating the circuit substrate shown in FIG. 1 and the flexible single-sided metal foil substrate shown in FIG. 2.
  • FIG. 4 is a schematic cross-sectional view of forming conductive holes and outer conductive lines on the intermediate body shown in FIG. 3.
  • Fig. 5 is a schematic cross-sectional view of forming a solder mask on the outer conductive circuit shown in Fig. 4.
  • Fig. 6 is a schematic cross-sectional view of a double-sided copper foil substrate according to an embodiment of the present invention.
  • FIG. 7 is a schematic cross-sectional view of forming a through hole on the double-sided copper foil substrate shown in FIG. 6.
  • FIG. 8 is a schematic cross-sectional view of forming conductive holes and conductive layers on the double-sided copper foil substrate shown in FIG. 7.
  • Fig. 9 is a schematic cross-sectional view of a circuit board according to an embodiment of the present invention.
  • FIG. 10 is a schematic cross-sectional view of a rigid-flex circuit board according to an embodiment of the present invention.
  • FIG. 11 is a schematic cross-sectional view of a rigid-flex circuit board according to another embodiment of the present invention.
  • Soft and hard circuit board 100 Circuit board 10 Opening 101 Insulation 11 Inner conductive circuit layer 13 Flexible single-sided metal foil substrate 30 Insulating substrate layer 31 First metal layer 33 Adhesive layer 35 Single-sided copper clad laminate 30a Intermediate 40 Conductive hole 41, 15 Outer conductive circuit layer 330 Solder mask 50 Double-sided copper foil substrate 10a Bottom copper layer 13a
  • the method for manufacturing a rigid-flex circuit board 100 includes the following steps:
  • Step S1 referring to FIG. 1, a circuit substrate 10 is provided, and at least one opening 101 penetrating the circuit substrate 10 is opened on the circuit substrate 10 to divide the circuit substrate 10.
  • the opening 101 can be formed by, but not limited to, mechanical cutting, laser cutting or etching.
  • the circuit substrate 10 is a double-sided circuit substrate, which includes an insulating layer 11 and an inner conductive circuit layer 13 bonded to two opposite surfaces of the insulating layer 11.
  • the opening penetrates the insulating layer 11 and the two inner conductive circuit layers 13.
  • the material of the insulating layer 11 can be selected from but not limited to polyimide, Teflon, polythiamine, polymethylmethacrylate, polycarbonate, polyethylene terephthalate or polyimide- Polyethylene-terephthalate copolymer or its composition, etc.
  • the insulating layer 11 can also protrude from the inner wall of the opening 101 compared to the two inner conductive circuit layers 13 so that at the opening 101, the insulating layer 11 is connected to each other.
  • An inner conductive circuit layer 13 is stepped.
  • Step S2 please refer to FIG. 2 to provide two flexible single-sided metal foil substrates 30, wherein each flexible single-sided metal foil substrate 30 includes an insulating substrate layer 31, a first metal layer 33, and an adhesive layer 35 .
  • the first metal layer 33 and the adhesive layer 35 are disposed on two opposite surfaces of the insulating substrate layer 31.
  • a single-sided copper clad laminate 30a may be provided first.
  • the single-sided copper clad laminate 30a includes an insulating base layer 31 and a copper layer as the first metal layer 33 that are stacked.
  • an adhesive layer 35 is attached to the surface of the insulating substrate layer 31 away from the copper layer.
  • the material of the adhesive layer 35 is a thermoplastic adhesive material, which can be selected from but not limited to at least one of thermoplastic polyimide, polyether ether ketone, and the like.
  • the adhesive layer 35 may also be formed on the surface of the insulating substrate layer 31 away from the copper layer by coating, spraying or printing.
  • Step S3 referring to FIG. 3, the above-mentioned flexible single-sided metal foil substrate 30, the above-mentioned circuit substrate 10, and the other flexible single-sided metal foil substrate 30 are sequentially stacked and laminated along the penetration direction of the opening 101 and formed by pressing One intermediate 40.
  • the flexible single-sided metal foil substrate 30 is combined with the circuit substrate 10 through the adhesive layer 35, and after pressing, the adhesive layers 35 of the two flexible single-sided metal foil substrates 30 fill the opening 101 And bond each other.
  • the area of the flexible single-sided metal foil substrate 30 corresponding to the opening 101 may also be recessed toward the first opening 101 to be tightly combined with the side wall of the opening 101.
  • the two flexible single-sided metal foil substrates 30 are respectively attached to the two inner conductive circuit layers 13 through the adhesive layer 35.
  • the adhesive layer 35 has increased heat fluidity. Therefore, the adhesive layer 35 fills the gap between the circuit substrate 10 and the insulating base material layer 31 and the opening 101, so that the The flexible single-sided metal foil substrate 30 is tightly combined with the circuit substrate 10. Compared with the two inner conductive circuit layers 13 protruding from the opening 101, the insulating layer 11 can further improve the firmness of the bonding when the adhesive layer 35 fills the opening 101.
  • Step S4 referring to FIG. 4, at least one conductive hole 41 is formed on the intermediate body 40 to electrically connect the two first metal layers 33 and the circuit substrate 10, and a circuit is made to make the two first metal layers 33
  • the metal layer 33 correspondingly forms two outer conductive circuit layers 330.
  • the manufacturing method of the above-mentioned rigid-flex circuit board 100 is simple and easy to operate.
  • the area corresponding to the opening 101 of the rigid-flex circuit board 100 is the flexible board area of the rigid-flex circuit board 100.
  • the manufacturing method of the circuit board 100 does not need to perform the lid opening step, which simplifies the manufacturing process and avoids problems such as damage or pollution to the circuit board caused by the lid opening.
  • the manufacturing method of the rigid-flex circuit board 100 may further include a step S5, referring to FIG. 5, the outer conductive circuit layer 330 is away from the circuit substrate 10 A solder mask 50 is formed on the surface, and the solder mask 50 fills the gaps on the outer conductive circuit layer 330 and the conductive holes 41.
  • the circuit substrate 10 can be manufactured through the following steps:
  • a double-sided copper foil substrate 10 a which includes an insulating layer 11 and two bottom copper layers 13 a bonded to two opposite surfaces of the insulating layer 11.
  • Step two referring to FIG. 7, first through holes 130 are respectively opened on the two bottom copper layers 13a of the double-sided copper foil substrate 10a to expose the insulating layer 11, and on the two bottom copper layers 13a
  • the first through holes 130 are arranged opposite to each other.
  • the first through hole 130 is formed by mechanical drilling.
  • Step three referring to FIG. 8, a conductive hole 15 is formed to electrically connect the two bottom copper layers 13a, and a conductive layer 13b is respectively deposited on the two bottom copper layers 13a, the bottom copper layer 13a and the bottom copper layer 13a
  • the conductive layer 13b on the layer 13a constitutes the second metal layer 13c.
  • a connecting hole 15a penetrating the two second metal layers 13a and the insulating layer 11 can be formed on the double-sided copper foil substrate 10a by laser, and the scum in the connecting hole 15a can be removed;
  • the connecting hole 15a corresponds to the conductive hole 15, and a conductive layer 13b is deposited on the two bottom copper layers 13a, respectively.
  • Step 4 referring to FIG. 9, the two second metal layers 13c are fabricated to form two inner conductive circuit layers 13 correspondingly, and a first through hole 130 is formed at the position of the insulating layer 11 corresponding to the first through hole 130.
  • Two through holes 110, the second through hole 110 communicates with the two first through holes 130 and forms an opening 101 with the two first through holes 130.
  • the size of the second through hole 110 is smaller than the size of the first through hole 130, so that the insulating layer 11 protrudes compared to the two inner conductive circuit layers 13, which can avoid forming the second through hole.
  • the inner conductive circuit layer 13 is damaged during the through hole 110.
  • the second metal layer 13c may also be thinned before the circuit is fabricated.
  • the circuit substrate 10 can also be manufactured in other ways.
  • the circuit substrate 10 may also be a multilayer circuit substrate, that is, a layer build-up is performed on the above-mentioned double-layer circuit substrate.
  • the present invention also provides a rigid-flex circuit board 100 according to an embodiment, which includes a circuit substrate 10, an adhesive layer 35 and two outer conductive circuit layers 330.
  • the circuit substrate 10 has at least one opening 101 penetrating the circuit substrate 10 to divide the circuit substrate 10.
  • the two outer conductive circuit layers 330 are laminated on opposite sides of the circuit substrate 10 along the penetrating direction of the opening 101, and the adhesive layer 35 is bonded to the circuit substrate 10 and each of the outer layers. Between the conductive circuit layers 330 and fill the opening 101.
  • the area corresponding to the opening 101 of the rigid-flex circuit board 100 is a soft board area, and the area corresponding to the circuit substrate 10 is a hard board area.
  • the area of the outer conductive circuit layer 330 corresponding to the opening 101 may also be recessed toward the first opening 101 so as to be tightly combined with the sidewall of the opening 101.
  • the circuit substrate 10 may be a double-sided circuit substrate or a multilayer circuit board.
  • the circuit substrate 10 is a double-sided circuit substrate, which includes an insulating layer 11 and an inner conductive circuit layer 13 bonded to two opposite surfaces of the insulating layer 11.
  • the opening 101 penetrates the insulating layer 11 and the two inner conductive circuit layers 13.
  • the insulating layer 11 can also protrude from the inner wall of the opening 101 compared to the two inner conductive circuit layers 13.
  • the material of the insulating layer 11 can be selected from but not limited to polyimide, Teflon, polythiamine, polymethylmethacrylate, polycarbonate, polyethylene terephthalate or polyimide- Polyethylene-terephthalate copolymer or its composition, etc.
  • the material of the adhesive layer 35 is a thermoplastic adhesive material, which can be selected from but not limited to at least one of thermoplastic polyimide (TPI), polyether ether ketone and the like.
  • TPI thermoplastic polyimide
  • polyether ether ketone polyether ether ketone
  • the rigid-flex circuit board 100 further includes conductive holes (such as 41 ), and the conductive holes electrically connect the circuit substrate 10 and the outer conductive circuit layer 330.
  • the rigid-flex circuit board 100 further includes an insulating substrate layer 31, and the insulating substrate layer 31 is located between the adhesive layer 35 and each outer conductive circuit layer 330.
  • the rigid-flex circuit board 100 may further include a solder resist layer 50 disposed on the surface of the outer conductive circuit layer 330 away from the circuit substrate 10.
  • the solder mask 50 can also fill the conductive holes 41.

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  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

一种软硬结合电路板（100），包括线路基板（10）、胶粘层（35）以及两外层导电线路层（330），所述线路基板（10）上开设至少一贯穿所述线路基板（10）的开口（101），两所述外层导电线路层（330）沿所述开口（101）的贯穿方向分别层叠于所述线路基板（10）的相对两侧，所述胶粘层（35）粘结于所述线路基板（10）和每一所述外层导电线路层（330）之间并填充所述开口（101），所述软硬结合电路板（100）便于制作。还包括一种软硬结合电路板（100）的制作方法。

Description

软硬结合电路板及其制作方法 技术领域
本发明涉及一种电路板及其制作方法，尤其涉及一种软硬结合电路板及其制作方法。
背景技术
软硬结合板(Rigid-Flexible Printed Circuit Board,R-F PCB)是指包含一个或多个刚性区以及一个或多个柔性区的印制电路板，其兼具硬板(Rigid Printed Circuit Board,RPCB，硬性电路板)的耐久性和软板(Flexible Printed Circuit Board,FPCB，软性电路板)的柔性，从而具有轻薄紧凑以及耐恶劣应用环境等特点，特别适合在便携式电子产品、医疗电子产品、军事设备等精密电子方面的应用。
通常，软硬结合板的制作工艺包括以下步骤：首先，制作软性电路基板；然后，将硬性电路基板压合在软性电路基板上，在硬性电路基板上形成电路；最后，在硬性电路基板的预定区域形成第一开口，使得部分软性电路基板可从硬性电路基板上的第一开口露出从而形成柔性区，而其余部分的软性电路基板与硬性电路基板一起形成刚性区，从而形成具有柔性区和刚性区的软硬结合板。上述方法较为复杂，现需提供一种工艺更为简单的软硬结合板的制作方法。
发明内容
有鉴于此，有必要提供一种解决上述问题的软硬结合电路板的制作方法。
还有必要一种软硬结合电路板，以便于简化制作工艺。
一种软硬结合电路板的制作方法，其包括以下步骤：
提供线路基板，并在线路基板上开设至少一贯穿所述线路基板的开 口；
提供两个柔性单面金属箔基板，每一柔性单面金属箔基板包括依次层叠设置的第一金属层、绝缘基材层和胶粘层；
将一上述柔性单面金属箔基板、所述线路基板和另一柔性单面金属箔基板沿所述开口的贯穿方向依次层叠设置并压合形成一中间体，其中，每一所述柔性单面金属箔基板通过所述胶粘层与所述线路基板结合，且在所述中间体中，两所述柔性单面金属箔基板的所述胶粘层填充所述开口并相互粘结；以及
在所述中间体上形成至少一导电孔以电连接两所述第一金属层和所述线路基板，并进行线路制作以使两所述第一金属层对应形成两外层导电线路层。
一种软硬结合电路板，包括线路基板、胶粘层以及两外层导电线路层，所述线路基板上开设至少一贯穿所述线路基板的开口，两所述外层导电线路层沿所述开口的贯穿方向分别层叠于所述线路基板的相对两侧，所述胶粘层粘结于所述线路基板和每一所述外层导电线路层之间并填充所述开口。
本发明的软硬结合电路板的制作方法简单易操作，且所述软硬结合电路板与所述开口对应的区域即为所述软硬结合电路板的软板区，所述软硬结合电路板的制作方法无需再进行开盖步骤，简化了制作工艺，也避免了因开盖对电路板带来的损伤或污染等问题。
附图说明
图1是本发明一实施方式的线路基板的截面示意图。
图2是本发明一实施方式的柔性单面金属箔基板的截面示意图。
图3是将图1所示的线路基板和图2所示的柔性单面金属箔基板层叠压合后的中间体的截面示意图。
图4是在图3所示的中间体上形成导电孔及外层导电线路的截面示意图。
图5是在图4所示的外层导电线路上形成防焊层的截面示意图。
图6是本发明一实施方式的双面铜箔基板的截面示意图。
图7是在图6所示的双面铜箔基板上形成通孔的截面示意图。
图8是在图7所示的双面铜箔基板上形成导电孔和导电层的截面示意图。
图9是本发明一实施方式的线路基板的截面示意图。
图10是本发明一实施方式的软硬结合电路板的截面示意图。
图11是本发明另一实施方式的软硬结合电路板的截面示意图。
主要元件符号说明
软硬结合电路板 100
线路基板 10
开口 101
绝缘层 11
内层导电线路层 13
柔性单面金属箔基板 30
绝缘基材层 31
第一金属层 33
胶粘层 35
单面覆铜板 30a
中间体 40
导电孔 41、15
外层导电线路层 330
防焊层 50
双面铜箔基板 10a
底铜层 13a
第一通孔 130
导电层 13b
第二金属层 13c
连通孔 15a
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。
下面结合附图，对本发明的一些实施方式作详细说明。在不冲突的情况下，下述的实施例及实施例中的特征可以相互组合。
请结合参阅图1至图4，本发明一实施方式的软硬结合电路板100的制作方法，其包括以下步骤：
步骤S1，请参见图1，提供一个线路基板10，并在所述线路基板10上开设至少一贯穿所述线路基板10的开口101以对所述线路基板10进行分割。
本实施方式中，所述开口101可通过但不仅限于机械切割、镭射切割或者蚀刻等方式形成。
在本实施方式中，请参阅图1，所述线路基板10为一双面线路基板，其包括一绝缘层11以及结合于所述绝缘层11两相对表面的内层导电线路层13。所述开口贯穿所述绝缘层11和两内层导电线路层13。
所述绝缘层11的材质可选自但不仅限于聚酰亚胺、铁氟龙、聚硫胺、聚甲基丙烯酸甲酯、聚碳酸脂、聚乙烯对苯二酸酯或聚酰亚胺-聚乙烯-对苯二甲酯共聚物或其组合物等。在本实施方式中，所述绝缘层11还可相较于 两所述内层导电线路层13从所述开口101的内壁凸伸，使得在所述开口101处，所述绝缘层11与每一内层导电线路层13之间呈台阶状。
步骤S2，请参阅图2，提供两个柔性单面金属箔基板30，其中，每一柔性单面金属箔基板30包括一绝缘基材层31、一第一金属层33和一胶粘层35。所述第一金属层33和所述胶粘层35设置于所述绝缘基材层31的相对两表面。
在本实施方式中，可先提供单面覆铜板30a，所述单面覆铜板30a包括层叠设置的绝缘基材层31和作为第一金属层33的铜层。而后将一胶粘层35贴设于所述绝缘基材层31背离所述铜层的表面。所述胶粘层35的材质为热塑性胶材，可选自但不仅限于热塑性聚酰亚胺、聚醚醚酮等中的至少一种。
在其他实施方式中，所述胶粘层35还可通过涂布、喷涂或印刷的方式形成于所述绝缘基材层31背离所述铜层的表面。
步骤S3，请参阅图3，将一上述柔性单面金属箔基板30、一上述线路基板10以及另一柔性单面金属箔基板30沿所述开口101的贯穿方向依次层叠设置并进行压合形成一中间体40。其中，所述柔性单面金属箔基板30通过所述胶粘层35与所述线路基板10结合，压合后，两所述柔性单面金属箔基板30的胶粘层35填充所述开口101并相互粘结。
具体的，所述柔性单面金属箔基板30与所述开口101对应的区域还可朝所述第一开口101凹陷，以与所述开口101的侧壁紧密结合。
在本实施方式中，压合前，两所述柔性单面金属箔基板30通过所述胶粘层35分别贴设于两所述内层导电线路层13上。
在压合时，所述胶粘层35受热流动性增加，因此，所述胶粘层35填充所述线路基板10与所述绝缘基材层31之间的空隙以及所述开口101，使得所述柔性单面金属箔基板30与所述线路基板10紧密结合。而所述绝缘层11相较于两所述内层导电线路层13从所述开口101凸伸，则能够在所述胶粘层35填充所述开口101时进一步地提高粘结的牢固性。
步骤S4，请参阅图4，在所述中间体40上形成至少一导电孔41以电连 接两所述第一金属层33和所述线路基板10，并进行线路制作以使两所述第一金属层33对应形成两外层导电线路层330。
上述软硬结合电路板100的制作方法简单易操作，所述软硬结合电路板100与所述开口101对应的区域即为所述软硬结合电路板100的软板区，所述软硬结合电路板100的制作方法无需再进行开盖步骤，简化了制作工艺，也避免了因开盖对电路板带来的损伤或污染等问题。
在一些实施方式中，在上述步骤S5后，所述软硬结合电路板100的制作方法还可包括步骤S5，请参阅图5，在所述外层导电线路层330背离所述线路基板10的表面形成防焊层50，且所述防焊层50填充所述外层导电线路层330上的空隙以及所述导电孔41。
本实施方式中，所述线路基板10可通过以下步骤制作而成：
步骤一，请参阅图6，提供一双面铜箔基板10a，其包括一绝缘层11以及结合于所述绝缘层11两相对表面的两底铜层13a。
步骤二，请参阅图7，在所述双面铜箔基板10a的两所述底铜层13a上分别开设第一通孔130以露出所述绝缘层11，且两所述底铜层13a上的第一通孔130相对设置。
本实施方式中，所述第一通孔130通过机械钻孔的方式形成。
步骤三，请参阅图8，形成导电孔15以电连接两所述底铜层13a，并在两所述底铜层13a上分别沉积导电层13b，所述底铜层13a和所述底铜层13a上的导电层13b构成第二金属层13c。
具体的，可通过激光在所述双面铜箔基板10a上形成贯穿两所述第二金属层13a和绝缘层11的连通孔15a，并去除所述连通孔15a内的胶渣；电镀使得所述连通孔15a对应形成所述导电孔15，两所述底铜层13a上分别沉积导电层13b。
步骤四，请参阅图9，对两所述第二金属层13c进行线路制作以对应形成两内层导电线路层13，并在所述绝缘层11对应所述第一通孔130的位置开设第二通孔110，所述第二通孔110连通两所述第一通孔130，并和两所 述第一通孔130构成开口101。
在本实施方式中，所述第二通孔110的尺寸小于第一通孔130的尺寸，使得所述绝缘层11相较于两内层导电线路层13凸伸，可避免形成所述第二通孔110时损伤内层导电线路层13。
具体的，在一些实施方式中，在进行线路制作前还可对所述第二金属层13c进行减薄处理。
在其他实施方式中，所述线路基板10还可通过其他方式制作而成。在其他实施方式中，所述线路基板10还可为多层线路基板，即在上述双层线路基板上进行增层。
请参阅图10，本发明还提供一实施方式的软硬结合电路板100，其包括线路基板10、胶粘层35以及两外层导电线路层330。所述线路基板10上开设至少一贯穿所述线路基板10的开口101以对所述线路基板10进行分割。两所述外层导电线路层330沿所述开口101的贯穿方向层叠于所述线路基板10的相对两侧，所述胶粘层35粘结于所述线路基板10和每一所述外层导电线路层330之间，并填充所述开口101。所述软硬结合电路板100与所述开口101对应的区域为软板区，与所述线路基板10对应的区域的硬板区。
具体的，请参阅图11，所述外层导电线路层330与所述开口101对应的区域还可朝所述第一开口101凹陷，以与所述开口101的侧壁紧密结合。
所述线路基板10可为双面线路基板或多层线路板。在本实施方式中，所述线路基板10为双面线路基板，其包括一绝缘层11以及结合于所述绝缘层11两相对表面的内层导电线路层13。其中，所述开口101贯穿所述绝缘层11和两内层导电线路层13。在本实施方式中，所述绝缘层11还可相较于两所述内层导电线路层13从所述开口101的内壁凸伸。
所述绝缘层11的材质可选自但不仅限于聚酰亚胺、铁氟龙、聚硫胺、聚甲基丙烯酸甲酯、聚碳酸脂、聚乙烯对苯二酸酯或聚酰亚胺-聚乙烯-对苯二甲酯共聚物或其组合物等。
所述胶粘层35的材质为热塑性胶材，可选自但不仅限于热塑性聚酰亚 胺(TPI)、聚醚醚酮等中的至少一种。
所述软硬结合电路板100还包括导电孔(如41)，所述导电孔电连接所述线路基板10与所述外层导电线路层330。
所述软硬结合电路板100还包括绝缘基材层31，所述绝缘基材层31位于所述胶粘层35与每一外层导电线路层330之间。
所述软硬结合电路板100还可包括防焊层50，所述防焊层50设置于所述外层导电线路层330背离所述线路基板10的表面。所述防焊层50还可填充所述导电孔41。
以上所述，仅是本发明的较佳实施方式而已，并非对本发明任何形式上的限制，虽然本发明已是较佳实施方式揭露如上，并非用以限定本发明，任何熟悉本专业的技术人员，在不脱离本发明技术方案范围内，当可利用上述揭示的技术内容做出些许更动或修饰为等同变化的等效实施方式，但凡是未脱离本发明技术方案内容，依据本发明的技术实质对以上实施方式所做的任何简单修改、等同变化与修饰，均仍属于本发明技术方案的范围内。

Claims (10)

  1. 一种软硬结合电路板的制作方法，其包括以下步骤：
    提供线路基板，并在线路基板上开设至少一贯穿所述线路基板的开口；
    提供两个柔性单面金属箔基板，每一柔性单面金属箔基板包括依次层叠设置的第一金属层、绝缘基材层和胶粘层；
    将一上述柔性单面金属箔基板、所述线路基板和另一柔性单面金属箔基板沿所述开口的贯穿方向依次层叠设置并压合形成一中间体，其中，每一所述柔性单面金属箔基板通过所述胶粘层与所述线路基板结合，且在所述中间体中，两所述柔性单面金属箔基板的所述胶粘层填充所述开口并相互粘结；以及
    在所述中间体上形成至少一导电孔以电连接两所述第一金属层和所述线路基板，并进行线路制作以使两所述第一金属层对应形成两外层导电线路层。
  2. 如权利要求1所述的软硬结合电路板的制作方法，其特征在于，所述线路基板为双面线路基板或多层线路基板。
  3. 如权利要求2所述的软硬结合电路板的制作方法，其特征在于，所述线路基板包括绝缘层以及结合于所述绝缘层两相对表面的内层导电线路层，所述开口贯穿所述绝缘层和两内层导电线路层，其中，所述绝缘层相较于两所述内层导电线路层从所述开口的内壁凸伸。
  4. 如权利要求1所述的软硬结合电路板的制作方法，其特征在于，在所述中间体中，所述第一金属层与所述开口对应的区域朝所述第一开口凹陷。
  5. 如权利要求1所述的软硬结合电路板的制作方法，其特征在于，所述软硬结合电路板的制作方法还包括：
    在所述外层导电线路层背离所述线路基板的表面形成防焊层，且所述防焊层填充所述外层导电线路层上的空隙以及所述导电孔。
  6. 一种软硬结合电路板，包括线路基板、胶粘层以及两外层导电线路层，其特征在于，所述线路基板上开设至少一贯穿所述线路基板的开口，两所述外层导电线路层沿所述开口的贯穿方向分别层叠于所述线路基板的相对两侧，所述胶粘层粘结于所述线路基板和每一所述外层导电线路层之间并填充所述开口。
  7. 如权利要求6所述的软硬结合电路板，其特征在于，所述线路基板为双面线路基板或多层线路基板。
  8. 如权利要求7所述的软硬结合电路板，其特征在于，所述线路基板包括绝缘层以及结合于所述绝缘层两相对表面的内层导电线路层，所述开口贯穿所述绝缘层和两内层导电线路层，其中，所述绝缘层相较于两所述内层导电线路层从所述开口的内壁凸伸。
  9. 如权利要求6所述的软硬结合电路板，其特征在于，所述外层导电线路层与所述开口对应的区域朝所述第一开口凹陷。
  10. 如权利要求6所述的软硬结合电路板，其特征在于，所述软硬结合电路板还包括防焊层，所述防焊层设置于所述外层导电线路层背离所述线路基板的表面，且所述防焊层填充所述外层导电线路层上的空隙以及所述导电孔。
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