KR20100024520A - 회로 접속 재료, 회로 부재의 접속 구조 및 회로 부재의 접속 방법 - Google Patents
회로 접속 재료, 회로 부재의 접속 구조 및 회로 부재의 접속 방법 Download PDFInfo
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/67—Unsaturated compounds having active hydrogen
- C08G18/671—Unsaturated compounds having only one group containing active hydrogen
- C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
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- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
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- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/20—Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
- C08L75/06—Polyurethanes from polyesters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
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- Polymers & Plastics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
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Abstract
Description
도 2는 본 발명에 따른 회로 부재의 접속 구조의 일 실시 형태를 나타내는 단면도이다.
도 3은 본 발명에 따른 회로 부재의 접속 구조의 다른 실시 형태를 나타내는 단면도이다.
1a: 회로 접속 부재
5: 도전성 입자
10: 제1 회로 부재
11: 제1 기판
12: 접착제층
13: 제1 회로 전극
20: 제2 회로 부재
21: 제2 기판
23: 제2 회로 전극
101: 회로 부재의 접속 구조
102: 회로 부재의 접속 구조
Claims (14)
- 빛 또는 열에 의해 경화되는 접착제 조성물과,
우레탄기 및 에스테르기를 갖는 유기 화합물을 함유하고,
상기 유기 화합물의 유리 전이 온도가 50℃ 이상인,
기판 및 이것의 주요면 상에 형성된 회로 전극을 갖는 회로 부재끼리를 접속시키기 위한 회로 접속 재료. - 제1항에 있어서, 상기 접착제 조성물이 라디칼 중합성 화합물 및 가열 또는 빛에 의해 라디칼을 발생시키는 라디칼 개시제를 함유하는, 회로 접속 재료.
- 제2항에 있어서, 상기 라디칼 중합성 화합물이 아크릴레이트기 또는 메타크릴레이트기를 갖는 인산 에스테르 화합물을 포함하는, 회로 접속 재료.
- 제1항 내지 제3항 중 어느 한 항에 있어서, 상기 유기 화합물의 유리 전이 온도가 50℃ 내지 105℃인, 회로 접속 재료.
- 제1항 내지 제3항 중 어느 한 항에 있어서, 상기 유기 화합물이 방향족기 및 환상 지방족 기 중 적어도 한쪽을 갖는, 회로 접속 재료.
- 제1항 내지 제3항 중 어느 한 항에 있어서, 도전성 입자를 함유하는 회로 접속 재료.
- 제1 기판 및 이것의 주요면 상에 형성된 제1 회로 전극을 갖는 제1 회로 부재와,
제2 기판 및 이것의 주요면 상에 형성된 제2 회로 전극을 갖는 제2 회로 부재가
제1항 내지 제3항 중 어느 한 항에 기재된 회로 접속 재료의 경화물을 포함하고 상기 제1 및 제2 회로 부재 사이에 설치된 회로 접속 부재에 의해, 상기 제1 회로 전극과 상기 제2 회로 전극이 대치함과 동시에 전기적으로 접속되도록 접속된 회로 부재의 접속 구조. - 제7항에 있어서, 상기 제1 및 제2 회로 전극 중 적어도 한쪽은 그의 표면이 금, 은, 주석, 백금족의 금속 및 인듐-주석 산화물로 이루어진 군으로부터 선택되는 1종 이상을 포함하는 재료로 이루어지는, 회로 부재의 접속 구조.
- 제7항에 있어서, 상기 제1 및 제2 기판 중 적어도 한쪽이 폴리에틸렌테레프탈레이트, 폴리에테르술폰, 에폭시 수지, 아크릴 수지, 폴리이미드 수지 및 유리로 이루어진 군으로부터 선택되는 1종 이상을 포함하는 재료로 이루어지는 기판인, 회로 부재의 접속 구조.
- 제7항에 있어서, 상기 제1 및 제2 회로 부재 중 적어도 한쪽과 상기 회로 접속 부재와의 사이에, 실리콘 수지, 아크릴 수지 및 폴리이미드 수지로 이루어진 군으로부터 선택되는 1종 이상을 포함하는 층이 형성되어 있는, 회로 부재의 접속 구조.
- 제1 기판 및 이것의 주요면 상에 형성된 제1 회로 전극을 갖는 제1 회로 부재와,
제1항 내지 제3항 중 어느 한 항에 기재된 회로 접속 재료를 포함하는 층과,
제2 기판 및 이것의 주요면 상에 형성된 제2 회로 전극을 갖는 제2 회로 부재를
상기 제1 회로 전극과 상기 제2 회로 전극이 대치하도록 이 순서로 적층한 적층체를 가열 및 가압함으로써, 상기 제1 회로 전극과 상기 제2 회로 전극이 전기적으로 접속되도록 상기 제1 회로 부재와 상기 제2 회로 부재를 접속하는, 회로 부재의 접속 방법. - 제11항에 있어서, 상기 제1 및 제2 회로 전극 중 적어도 한쪽은 그의 표면이 금, 은, 주석, 백금족의 금속 및 인듐-주석 산화물로 이루어진 군으로부터 선택되는 1종 이상을 포함하는 재료로 이루어지는, 회로 부재의 접속 방법.
- 제11항에 있어서, 상기 제1 및 제2 기판 중 적어도 한쪽이 폴리에틸렌테레프탈레이트, 폴리에테르술폰, 에폭시 수지, 아크릴 수지, 폴리이미드 수지 및 유리로 이루어진 군으로부터 선택되는 1종 이상을 포함하는 재료에 의해 형성된 기판인, 회로 부재의 접속 방법.
- 제11항에 있어서, 상기 제1 및 제2 회로 부재 중 적어도 한쪽과 상기 회로 접속 재료로 이루어진 층과의 사이에, 실리콘 수지, 아크릴 수지 및 폴리이미드 수지로 이루어진 군으로부터 선택되는 1종 이상을 포함하는 층이 형성되어 있는, 회로 부재의 접속 방법.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/JP2006/314475 WO2008010294A1 (fr) | 2006-07-21 | 2006-07-21 | Matériau de connexion, structure de connexion d'éléments de circuits et procédé de connexion de circuits. |
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KR1020097003597A Division KR101121616B1 (ko) | 2006-07-21 | 2006-07-21 | 회로 접속 재료, 회로 부재의 접속 구조 및 회로 부재의 접속 방법 |
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KR20100024520A true KR20100024520A (ko) | 2010-03-05 |
KR101108777B1 KR101108777B1 (ko) | 2012-02-15 |
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KR1020107003374A KR101108777B1 (ko) | 2006-07-21 | 2006-07-21 | 회로 접속 재료, 회로 부재의 접속 구조 및 회로 부재의 접속 방법 |
KR1020107003373A KR101065870B1 (ko) | 2006-07-21 | 2006-07-21 | 회로 접속 재료, 회로 부재의 접속 구조 및 회로 부재의 접속 방법 |
KR1020097003597A KR101121616B1 (ko) | 2006-07-21 | 2006-07-21 | 회로 접속 재료, 회로 부재의 접속 구조 및 회로 부재의 접속 방법 |
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KR1020107003373A KR101065870B1 (ko) | 2006-07-21 | 2006-07-21 | 회로 접속 재료, 회로 부재의 접속 구조 및 회로 부재의 접속 방법 |
KR1020097003597A KR101121616B1 (ko) | 2006-07-21 | 2006-07-21 | 회로 접속 재료, 회로 부재의 접속 구조 및 회로 부재의 접속 방법 |
Country Status (8)
Country | Link |
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US (3) | US8497431B2 (ko) |
EP (5) | EP2046104B1 (ko) |
JP (1) | JP4924609B2 (ko) |
KR (3) | KR101108777B1 (ko) |
CN (1) | CN101502188B (ko) |
AT (2) | ATE550401T1 (ko) |
PL (5) | PL2223982T3 (ko) |
WO (1) | WO2008010294A1 (ko) |
Families Citing this family (8)
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US6356485B1 (en) * | 1999-02-13 | 2002-03-12 | Integrated Device Technology, Inc. | Merging write cycles by comparing at least a portion of the respective write cycle addresses |
ATE550401T1 (de) | 2006-07-21 | 2012-04-15 | Hitachi Chemical Co Ltd | Materiau de connexion de circuit, structure de connexion d'element de circuit et procede de connexion de l'element de circuit |
KR101538834B1 (ko) * | 2009-08-26 | 2015-07-22 | 세키스이가가쿠 고교가부시키가이샤 | 이방성 도전 재료, 접속 구조체 및 접속 구조체의 제조 방법 |
JP4673931B2 (ja) * | 2009-08-26 | 2011-04-20 | 積水化学工業株式会社 | 異方性導電材料及び接続構造体 |
JP4673932B2 (ja) * | 2009-08-26 | 2011-04-20 | 積水化学工業株式会社 | 接続構造体の製造方法及び異方性導電材料 |
JP4673933B2 (ja) * | 2009-08-26 | 2011-04-20 | 積水化学工業株式会社 | 異方性導電材料及び接続構造体 |
DE102009029476B4 (de) | 2009-09-15 | 2012-11-08 | Lisa Dräxlmaier GmbH | Elektronische Vorrichtung zum Schalten von Strömen und Herstellungsverfahren für dieselbe |
KR20130042017A (ko) * | 2010-07-26 | 2013-04-25 | 히타치가세이가부시끼가이샤 | 접착제 조성물, 접속 구조체, 및 접속 구조체의 제조 방법 |
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US4223115A (en) | 1978-04-24 | 1980-09-16 | Lord Corporation | Structural adhesive formulations |
DE3112123A1 (de) * | 1981-03-27 | 1982-10-07 | Basf Ag, 6700 Ludwigshafen | Lagerstabile dispersionen von aromatischen polyestern in polyhydroxylverbindungen, verfahren zu deren herstellung und deren verwendung zur herstellung von gegebenenfalls zelligen polyurethan- und/oder polyisocyanurat-kunststoffen |
JPS6147760A (ja) | 1984-08-16 | 1986-03-08 | Shin Etsu Polymer Co Ltd | 異方導電接着剤 |
JPH01135639A (ja) | 1987-11-24 | 1989-05-29 | Nippon Sheet Glass Co Ltd | ポリエステル積層物 |
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