JP4924609B2 - 回路接続材料、回路部材の接続構造及び回路部材の接続方法 - Google Patents
回路接続材料、回路部材の接続構造及び回路部材の接続方法 Download PDFInfo
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- JP4924609B2 JP4924609B2 JP2008525772A JP2008525772A JP4924609B2 JP 4924609 B2 JP4924609 B2 JP 4924609B2 JP 2008525772 A JP2008525772 A JP 2008525772A JP 2008525772 A JP2008525772 A JP 2008525772A JP 4924609 B2 JP4924609 B2 JP 4924609B2
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- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description
また、本発明の回路接続材料は、第一の基板及びこれの主面上に形成された第一の回路電極を有する第一の回路部材と、第二の基板及びこれの主面上に形成された第二の回路電極を有する第二の回路部材とを第一の回路電極及び第二の回路電極が対峙するように接続すると共に第一及び第二の回路部材の間に設けられる硬化物を形成するための回路接続材料であって、光又は熱によって硬化する接着剤組成物と、ウレタン基及びエステル基を有する有機化合物と、を含有し、第一及び第二の回路部材のうち少なくとも一方と硬化物との間には、シリコーン樹脂、アクリル樹脂及びポリイミド樹脂からなる群より選ばれる少なくとも一種を含む層が形成されている。
料の保存安定性が低下する傾向にある。
ジカルボン酸とジオールとの反応により得られたポリエステルポリオールをメチルエチルケトンに溶解した溶液を、撹拌機、温度計、コンデンサーおよび真空発生装置と窒素ガス導入管を具備したヒーター付きステンレススチール製オートクレーブに投入した。次いで、イソシアネートを所定量投入し、触媒としてジブチル錫ラウレートをポリエステルポリオール100重量部に対して0.02重量部となる量投入し、75℃で10時間反応させた後、40℃まで冷却した。さらに、ピペラジンを加えて30分反応させることにより鎖延長した後、トリエチルアミンで中和させた。
(ポリエステルウレタン樹脂Aの合成)
ジガルボン酸としてのテレフタル酸、ジオールとしてのプロピレングリコール、イソシアネートにとしての4,4’−ジフェニルメタンジイソシアネートを、テレフタル酸/プロピレングリコール/4,4’−ジフェニルメタンジイソシアネートのモル比が1.0/1.3/0.25となるような量で用い、上記手順に従ってポリエステルウレタン樹脂Aを得た。ポリエステルウレタン樹脂Aの重量分子量をゲル浸透クロマトグラフィーによって測定したところ、27000であった。
重量平均分子量800のポリカプロラクトンジオール400重量部、2−ヒドロキシプロピルアクリレート131重量部、触媒としてのジブチル錫ジラウレート0.5重量部及び重合禁止剤としてのハイドロキノンモノメチルエーテル1.0重量部を、50℃に加熱しながら攪拌して混合した。次いで、イソホロンジイソシアネート222重量部を滴下し、更に攪拌しながら80℃に昇温してウレタン化反応を進行させた。イソシアネート基の反応率が99%以上になったことを確認後、温度を下げて、ラジカル重合性化合物としてのウレタンアクリレートを得た。
ジガルボン酸としてのイソフタル酸、テレフタル酸及びアジピン酸、ジオールとしてのエチレングリコール、ネオペンチルグリコール及び1、6−ヘキサンジオール、ジイソシアネートとしての4,4’−ジフェニルメタンジイソシアネートを、イソフタル酸/テレフタル酸/アジピン酸/エチレングリコール/ネオペンチルグリコール/1,6−ヘキサンジオール/4,4’−ジフェニルメタンジイソシアネートのモル比が0.21/0.21/0.58/0.19/0.55/0.46/0.3となるような量で用いて、上記手順に従ってポリエステルウレタン樹脂Bを合成した。ポリエステルウレタン樹脂Bの重量分子量をゲル浸透クロマトグラフィーによって測定したところ、60000であった。また、ポリエステルウレタン樹脂Bのガラス転移温度を実施例1と同様にして測定したところ、−3℃であった。
ポリエステルウレタン樹脂B50gのうち20gをフェノキシ樹脂(ユニオンカーバイド株式会社製、商品名「PKHC」、重量平均分子量45000)に置き換えた以外は実施例2と同様にして、フィルム状の回路接続材料を作製した。
ポリエステルウレタン樹脂Aに代えて、ポリエステルウレタン樹脂Aの合成の際に用いたポリエステルポリオール(ガラス転移温度:85℃)を用いた他は実施例1と同様にして、フィルム状の回路接続材料を作製した。
ポリエステルウレタン樹脂Bに代えて、ポリエステルウレタン樹脂Bの合成の際に用いたポリエステルポリオール(ガラス転移温度:−5℃)を用いた他は実施例2と同様にして、フィルム状の回路接続材料を作製した。
ポリエステルウレタン樹脂Bに代えて、ポリエステルウレタン樹脂Bの合成の際に用いたポリエステルポリオール(ガラス転移温度:−5℃)を用いた他は実施例3と同様にして、フィルム状の回路接続材料を作製した。
ポリエステルウレタン樹脂Aに代えて、エステル基を有しないポリウレタン樹脂(DICバイエルポリマー株式会社製、商品名「パンデックスT−8175」)(ガラス転移温度:−30℃)を用いた他は実施例1と同様にして、フィルム状の回路接続材料を作製した。
回路電極としてのクロム回路(ライン幅50μm、ピッチ100μm、厚み0.4μm)500本がガラス基板(コーニング社製、商品名「#1737」)上に形成された回路部材を準備した。この回路部材上に、実施例1で作製したフィルム状の回路接続材料を貼り付け、70℃、0.5MPaで5秒間加熱及び加圧してこれを仮接着した。
作製した回路部材の接続構造について、対峙している回路電極間の抵抗値(接続抵抗)をマルチメータを用いて測定した。測定は、初期、及び85℃、85%RHの高温高湿槽中に500時間保持する高温高湿処理後について行った。表1に、抵抗値150点の平均値(x+3σ)を接続抵抗として示した。
作製した回路部材の接続構造について、90°で剥離するときの接着強度を、剥離速度50mm/minで測定した。測定は、初期、及び上記と同様の高温高湿処理後について行った。
Claims (8)
- 第一の基板及びこれの主面上に形成された第一の回路電極を有する第一の回路部材と、第二の基板及びこれの主面上に形成された第二の回路電極を有する第二の回路部材とを前記第一の回路電極と前記第二の回路電極とが対峙するように接続するための回路接続材料であって、
光又は熱によって硬化する接着剤組成物と、
ウレタン基及びエステル基を有するポリエステルウレタン樹脂と、を含有し、
前記接着剤組成物がウレタン(メタ)アクリレートオリゴマーを含有し、
前記ポリエステルウレタン樹脂が芳香族基を有し、
前記第一及び第二の基板のうち少なくとも一方が、ポリイミド樹脂及びガラスからなる群より選ばれる少なくとも一種を含む材料からなる基板である、回路接続材料。 - 前記接着剤組成物が、ラジカル重合性化合物及び加熱又は光によってラジカルを発生するラジカル開始剤を含有する、請求項1記載の回路接続材料。
- 前記ラジカル重合性化合物が、アクリレート基又はメタクリレート基を有するリン酸エステル化合物を含む、請求項2記載の回路接続材料。
- 導電性粒子を含有する、請求項1〜3の何れか一項に記載の回路接続材料。
- 前記第一の回路部材と前記第二の回路部材とが、請求項1〜4の何れか一項に記載の回路接続材料の硬化物からなり前記第一及び第二の回路部材の間に設けられた回路接続部材によって、前記第一の回路電極と前記第二の回路電極とが対峙するとともに電気的に接続されるように接続された回路部材の接続構造。
- 前記第一及び第二の回路電極のうち少なくとも一方は、その表面が金、銀、錫、白金族の金属及びインジウム−錫酸化物からなる群より選ばれる少なくとも一種を含む材料からなる、請求項5記載の回路部材の接続構造。
- 前記第一の回路部材と、請求項1〜4の何れか一項に記載の回路接続材料からなる層と、前記第二の回路部材とを、前記第一の回路電極と前記第二の回路電極とが対峙するようにこの順に積層した積層体を加熱及び加圧することにより、前記第一の回路電極と前記第二の回路電極とが電気的に接続されるように前記第一の回路部材と前記第二の回路部材とを接続する、回路部材の接続方法。
- 前記第一及び第二の回路電極のうち少なくとも一方は、その表面が金、銀、錫、白金族の金属及びインジウム−錫酸化物からなる群より選ばれる少なくとも一種を含む材料からなる、請求項7記載の回路部材の接続方法。
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PCT/JP2006/314475 WO2008010294A1 (fr) | 2006-07-21 | 2006-07-21 | Matériau de connexion, structure de connexion d'éléments de circuits et procédé de connexion de circuits. |
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US (3) | US8497431B2 (ja) |
EP (5) | EP2046104B1 (ja) |
JP (1) | JP4924609B2 (ja) |
KR (3) | KR101108777B1 (ja) |
CN (1) | CN101502188B (ja) |
AT (2) | ATE550401T1 (ja) |
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