JP4667756B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP4667756B2
JP4667756B2 JP2004058883A JP2004058883A JP4667756B2 JP 4667756 B2 JP4667756 B2 JP 4667756B2 JP 2004058883 A JP2004058883 A JP 2004058883A JP 2004058883 A JP2004058883 A JP 2004058883A JP 4667756 B2 JP4667756 B2 JP 4667756B2
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JP
Japan
Prior art keywords
impurity region
field plates
semiconductor layer
insulating film
field
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004058883A
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English (en)
Japanese (ja)
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JP2005251903A5 (enExample
JP2005251903A (ja
Inventor
和宏 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2004058883A priority Critical patent/JP4667756B2/ja
Priority to TW093136871A priority patent/TWI277208B/zh
Priority to TW095115890A priority patent/TWI283926B/zh
Priority to US11/002,803 priority patent/US7327007B2/en
Priority to DE102004063523A priority patent/DE102004063523B4/de
Priority to CNB2005100047850A priority patent/CN100388493C/zh
Priority to KR1020050016473A priority patent/KR100710433B1/ko
Priority to IT000127A priority patent/ITTO20050127A1/it
Publication of JP2005251903A publication Critical patent/JP2005251903A/ja
Publication of JP2005251903A5 publication Critical patent/JP2005251903A5/ja
Application granted granted Critical
Publication of JP4667756B2 publication Critical patent/JP4667756B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/65—Lateral DMOS [LDMOS] FETs
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
    • E02D17/00—Excavations; Bordering of excavations; Making embankments
    • E02D17/20—Securing of slopes or inclines
    • E02D17/205—Securing of slopes or inclines with modular blocks, e.g. pre-fabricated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/149—Source or drain regions of field-effect devices
    • H10D62/151—Source or drain regions of field-effect devices of IGFETs 
    • H10D62/156—Drain regions of DMOS transistors
    • H10D62/157—Impurity concentrations or distributions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/111—Field plates
    • H10D64/112—Field plates comprising multiple field plate segments
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
    • E02D2600/00—Miscellaneous
    • E02D2600/20—Miscellaneous comprising details of connection between elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126—Top-view geometrical layouts of the regions or the junctions
    • H10D62/127—Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311—Gate electrodes for field-effect devices
    • H10D64/411—Gate electrodes for field-effect devices for FETs
    • H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/514—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the insulating layers
    • H10D64/516—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the insulating layers the thicknesses being non-uniform

Landscapes

  • Engineering & Computer Science (AREA)
  • Mining & Mineral Resources (AREA)
  • General Engineering & Computer Science (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Paleontology (AREA)
  • Civil Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Structural Engineering (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Element Separation (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2004058883A 2004-03-03 2004-03-03 半導体装置 Expired - Lifetime JP4667756B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2004058883A JP4667756B2 (ja) 2004-03-03 2004-03-03 半導体装置
TW093136871A TWI277208B (en) 2004-03-03 2004-11-30 Semiconductor device
TW095115890A TWI283926B (en) 2004-03-03 2004-11-30 Semiconductor device
US11/002,803 US7327007B2 (en) 2004-03-03 2004-12-03 Semiconductor device with high breakdown voltage
DE102004063523A DE102004063523B4 (de) 2004-03-03 2004-12-30 Halbleitervorrichtung
CNB2005100047850A CN100388493C (zh) 2004-03-03 2005-01-26 半导体器件
KR1020050016473A KR100710433B1 (ko) 2004-03-03 2005-02-28 반도체장치
IT000127A ITTO20050127A1 (it) 2004-03-03 2005-02-28 Dispositivo a semiconduzione

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004058883A JP4667756B2 (ja) 2004-03-03 2004-03-03 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010167025A Division JP5172907B2 (ja) 2010-07-26 2010-07-26 半導体装置

Publications (3)

Publication Number Publication Date
JP2005251903A JP2005251903A (ja) 2005-09-15
JP2005251903A5 JP2005251903A5 (enExample) 2006-09-21
JP4667756B2 true JP4667756B2 (ja) 2011-04-13

Family

ID=34879837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004058883A Expired - Lifetime JP4667756B2 (ja) 2004-03-03 2004-03-03 半導体装置

Country Status (7)

Country Link
US (1) US7327007B2 (enExample)
JP (1) JP4667756B2 (enExample)
KR (1) KR100710433B1 (enExample)
CN (1) CN100388493C (enExample)
DE (1) DE102004063523B4 (enExample)
IT (1) ITTO20050127A1 (enExample)
TW (2) TWI283926B (enExample)

Families Citing this family (33)

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JP4906281B2 (ja) * 2005-03-30 2012-03-28 オンセミコンダクター・トレーディング・リミテッド 半導体装置
JP4863665B2 (ja) * 2005-07-15 2012-01-25 三菱電機株式会社 半導体装置およびその製造方法
JP4914589B2 (ja) * 2005-08-26 2012-04-11 三菱電機株式会社 半導体製造装置、半導体製造方法および半導体装置
JP4973238B2 (ja) * 2007-02-28 2012-07-11 三菱電機株式会社 半導体装置
US7719076B2 (en) * 2007-08-10 2010-05-18 United Microelectronics Corp. High-voltage MOS transistor device
US20090096039A1 (en) * 2007-10-10 2009-04-16 United Microelectronics Corp. High-voltage device and manufacturing method of top layer in high-voltage device
JP2011029466A (ja) * 2009-07-28 2011-02-10 Hitachi Ltd 半導体装置
US9029866B2 (en) * 2009-08-04 2015-05-12 Gan Systems Inc. Gallium nitride power devices using island topography
US9818857B2 (en) 2009-08-04 2017-11-14 Gan Systems Inc. Fault tolerant design for large area nitride semiconductor devices
WO2011014951A1 (en) * 2009-08-04 2011-02-10 John Roberts Island matrixed gallium nitride microwave and power switching transistors
JP5594515B2 (ja) * 2010-03-26 2014-09-24 日本電気株式会社 半導体装置、電子装置、半導体装置の製造方法、および半導体装置の動作方法
CN102893392B (zh) 2010-04-13 2015-08-05 Gan系统公司 采用孤岛拓扑结构的高密度氮化镓器件
US8546889B2 (en) 2010-06-04 2013-10-01 Fuji Electric Co., Ltd. Semiconductor device and driving circuit
US8629513B2 (en) * 2011-01-14 2014-01-14 Taiwan Semiconductor Manufacturing Company, Ltd. HV interconnection solution using floating conductors
DE102011108651B4 (de) * 2011-07-26 2019-10-17 Austriamicrosystems Ag Hochvolttransistorbauelement und Herstellungsverfahren
US9373619B2 (en) * 2011-08-01 2016-06-21 Taiwan Semiconductor Manufacturing Company, Ltd. High voltage resistor with high voltage junction termination
CN102856356B (zh) * 2012-09-28 2015-09-09 中国科学院微电子研究所 用于半导体功率器件的终端
JP6009341B2 (ja) * 2012-12-13 2016-10-19 ルネサスエレクトロニクス株式会社 半導体装置
EP2757580A1 (en) * 2013-01-22 2014-07-23 Nxp B.V. Bipolar cmos dmos (bcd) processes
JP6228428B2 (ja) 2013-10-30 2017-11-08 ルネサスエレクトロニクス株式会社 半導体装置
US9570437B2 (en) * 2014-01-09 2017-02-14 Nxp B.V. Semiconductor die, integrated circuits and driver circuits, and methods of maufacturing the same
JP6210913B2 (ja) * 2014-03-20 2017-10-11 ルネサスエレクトロニクス株式会社 半導体装置
JP6185440B2 (ja) * 2014-09-16 2017-08-23 株式会社東芝 半導体装置
CN105789051A (zh) * 2014-12-24 2016-07-20 北大方正集团有限公司 一种ldmos晶体管及制作方法
CN105070756B (zh) * 2015-08-18 2018-06-19 上海华虹宏力半导体制造有限公司 超高压ldmos器件结构
CN107949915B (zh) * 2016-03-14 2021-04-27 富士电机株式会社 半导体装置及制造方法
JP6693805B2 (ja) * 2016-05-17 2020-05-13 ローム株式会社 半導体装置
JP6590076B2 (ja) 2016-09-13 2019-10-16 三菱電機株式会社 半導体装置
JP6996247B2 (ja) * 2017-11-17 2022-01-17 富士電機株式会社 半導体集積回路装置
JP7407590B2 (ja) 2019-12-25 2024-01-04 三菱電機株式会社 半導体装置および集積回路
JP7608226B2 (ja) * 2021-03-19 2025-01-06 株式会社東芝 半導体装置
US20230097805A1 (en) * 2021-09-24 2023-03-30 Intel Corporation Complex field-shaping by fine variation of local material density or properties
GB2639824A (en) * 2024-03-21 2025-10-08 X Fab Global Services Gmbh Improved field plate

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JP3425131B2 (ja) * 1999-12-17 2003-07-07 松下電器産業株式会社 高耐圧半導体装置
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JP3654872B2 (ja) * 2001-06-04 2005-06-02 松下電器産業株式会社 高耐圧半導体装置

Also Published As

Publication number Publication date
DE102004063523A1 (de) 2005-09-22
US20050194656A1 (en) 2005-09-08
KR20060043235A (ko) 2006-05-15
CN1665028A (zh) 2005-09-07
TW200629558A (en) 2006-08-16
US7327007B2 (en) 2008-02-05
ITTO20050127A1 (it) 2005-09-04
TWI283926B (en) 2007-07-11
DE102004063523B4 (de) 2008-05-29
TW200531275A (en) 2005-09-16
CN100388493C (zh) 2008-05-14
JP2005251903A (ja) 2005-09-15
TWI277208B (en) 2007-03-21
KR100710433B1 (ko) 2007-04-24

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