JP4495752B2 - 基板処理装置及び塗布装置 - Google Patents

基板処理装置及び塗布装置 Download PDF

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Publication number
JP4495752B2
JP4495752B2 JP2007288238A JP2007288238A JP4495752B2 JP 4495752 B2 JP4495752 B2 JP 4495752B2 JP 2007288238 A JP2007288238 A JP 2007288238A JP 2007288238 A JP2007288238 A JP 2007288238A JP 4495752 B2 JP4495752 B2 JP 4495752B2
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substrate
unit
stage
transport
pad
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Japanese (ja)
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JP2009117571A (ja
Inventor
賢哉 篠崎
慶崇 大塚
孝志 中満
池本　　大輔
陽介 三根
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2007288238A priority Critical patent/JP4495752B2/ja
Priority to TW097138433A priority patent/TWI385712B/zh
Priority to CN2008101747863A priority patent/CN101431008B/zh
Priority to KR1020080109151A priority patent/KR101351155B1/ko
Publication of JP2009117571A publication Critical patent/JP2009117571A/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2007288238A 2007-11-06 2007-11-06 基板処理装置及び塗布装置 Active JP4495752B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007288238A JP4495752B2 (ja) 2007-11-06 2007-11-06 基板処理装置及び塗布装置
TW097138433A TWI385712B (zh) 2007-11-06 2008-10-06 基板處理裝置及塗布裝置及塗布方法
CN2008101747863A CN101431008B (zh) 2007-11-06 2008-11-05 基板处理装置和涂敷装置以及涂敷方法
KR1020080109151A KR101351155B1 (ko) 2007-11-06 2008-11-05 기판 처리 장치 및 도포 장치 및 도포 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007288238A JP4495752B2 (ja) 2007-11-06 2007-11-06 基板処理装置及び塗布装置

Publications (2)

Publication Number Publication Date
JP2009117571A JP2009117571A (ja) 2009-05-28
JP4495752B2 true JP4495752B2 (ja) 2010-07-07

Family

ID=40646308

Family Applications (1)

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JP2007288238A Active JP4495752B2 (ja) 2007-11-06 2007-11-06 基板処理装置及び塗布装置

Country Status (4)

Country Link
JP (1) JP4495752B2 (ko)
KR (1) KR101351155B1 (ko)
CN (1) CN101431008B (ko)
TW (1) TWI385712B (ko)

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JP5553532B2 (ja) * 2009-06-04 2014-07-16 パナソニック株式会社 光学検査装置
JP5387156B2 (ja) * 2009-06-17 2014-01-15 凸版印刷株式会社 基板搬送装置及び基板検査装置
JP4916035B2 (ja) * 2009-08-28 2012-04-11 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法
KR101143321B1 (ko) * 2009-10-28 2012-05-09 (주)엠피기술산업 슬라이딩 운반장치
KR101138314B1 (ko) * 2009-11-23 2012-04-25 주식회사 나래나노텍 부상 방식의 필름 코팅 장치 및 방법, 및 이를 구비한 부상 방식의 필름 코팅 시스템
TWI661505B (zh) * 2010-02-17 2019-06-01 日商尼康股份有限公司 Transfer device, transfer method, exposure device, and component manufacturing method
JP5254269B2 (ja) * 2010-03-29 2013-08-07 大日本スクリーン製造株式会社 基板処理装置および移載方法
JP2011213435A (ja) * 2010-03-31 2011-10-27 Toray Eng Co Ltd 搬送装置及び塗布システム
TW201134778A (en) * 2010-04-08 2011-10-16 Tae Sung Eng Co Ltd Apparatus for transferring of glass panel
KR101303461B1 (ko) * 2010-09-03 2013-09-05 주식회사 케이씨텍 약액의 얼룩을 방지하는 인라인 타입의 기판 코터 장치 및 그 방법
JP5933920B2 (ja) * 2010-12-24 2016-06-15 東京応化工業株式会社 塗布装置及び塗布方法
JP5570464B2 (ja) * 2011-03-24 2014-08-13 東京エレクトロン株式会社 浮上式塗布装置
KR101296202B1 (ko) * 2011-05-31 2013-08-13 정진영 평판부재 이송장비의 흡착식 클램핑장치
CN103065998A (zh) * 2011-10-21 2013-04-24 东京毅力科创株式会社 处理台装置及使用该处理台装置的涂布处理装置
JP5681952B2 (ja) * 2012-05-31 2015-03-11 パナソニックＩｐマネジメント株式会社 塗布装置
CN104227569A (zh) * 2013-06-17 2014-12-24 株式会社太星技研 钢化玻璃板加工系统及利用它的钢化玻璃板加工方法
KR101521788B1 (ko) * 2013-10-04 2015-05-20 주식회사 케이씨텍 기판 코터 장치 및 코팅 방법
JP6339341B2 (ja) * 2013-10-11 2018-06-06 平田機工株式会社 処理システム及び処理方法
KR102219882B1 (ko) 2013-10-24 2021-02-24 세메스 주식회사 기판처리장치 및 방법
KR20160136439A (ko) * 2014-03-25 2016-11-29 가부시키가이샤 알박 성막 장치 및 성막 방법
KR102218382B1 (ko) * 2014-08-21 2021-02-23 세메스 주식회사 반송 유닛, 이를 포함하는 기판 처리 장치 및 방법
KR101645433B1 (ko) * 2014-12-29 2016-08-04 주식회사 케이씨텍 기판 처리 장치
JP5983810B1 (ja) * 2015-04-02 2016-09-06 ウシオ電機株式会社 光照射装置
CN104862685B (zh) * 2015-04-23 2017-06-16 西安四方超轻材料有限公司 一种镁锂合金表面处理装置
KR102315660B1 (ko) 2015-05-29 2021-10-22 세메스 주식회사 기판 처리 장치 및 방법
CN105346968B (zh) * 2015-12-07 2017-11-21 重庆艾布特家具有限公司 木板装夹输送装置
JP6651392B2 (ja) * 2016-03-22 2020-02-19 東レエンジニアリング株式会社 基板浮上搬送装置
JP6659422B2 (ja) * 2016-03-29 2020-03-04 アルバック成膜株式会社 塗布装置、マスクブランクの製造方法
US10689209B2 (en) * 2016-06-21 2020-06-23 Core Flow Ltd. Noncontact support platform with edge lifting
CN106183580B (zh) * 2016-07-08 2019-01-18 青岛理工大学 一种分区域可控的双面真空吸附装置、系统及方法
CN107628306A (zh) * 2016-07-18 2018-01-26 上海沃迪自动化装备股份有限公司 一种多工位往复式输送机
JP6881468B2 (ja) * 2016-11-18 2021-06-02 東京電力ホールディングス株式会社 Ａｃｍセンサー設置方法
JP6846943B2 (ja) 2017-02-10 2021-03-24 東京エレクトロン株式会社 塗布装置、および塗布方法
JP6987206B2 (ja) * 2017-02-10 2021-12-22 東京エレクトロン株式会社 塗布装置、および塗布方法
JP6805017B2 (ja) * 2017-02-10 2020-12-23 東京エレクトロン株式会社 塗布装置、および塗布方法
CN107193142A (zh) * 2017-07-19 2017-09-22 武汉华星光电技术有限公司 配向膜固化系统
CN108646517B (zh) * 2018-05-29 2021-06-08 江西维易尔半导体设备有限公司 一种光刻机用晶圆片匀胶装置
CN108803252B (zh) * 2018-06-27 2020-10-16 合肥泰沃达智能装备有限公司 一种导光板生产加工工艺及其涂布曝光设备
KR102076593B1 (ko) 2018-08-21 2020-02-12 세메스 주식회사 기판처리장치
JP7101583B2 (ja) * 2018-10-04 2022-07-15 東京エレクトロン株式会社 基板処理装置および基板処理方法
KR102215123B1 (ko) * 2018-11-26 2021-02-16 주식회사 탑 엔지니어링 기판 검사 장치 및 기판 검사 방법
TWI798367B (zh) * 2019-02-26 2023-04-11 日商東麗工程股份有限公司 塗布裝置
JP7201808B2 (ja) * 2019-06-28 2023-01-10 Hoya株式会社 ガラス板の製造方法および磁気ディスクの製造方法
CN110314791A (zh) * 2019-07-30 2019-10-11 李开词 一种定制用瓦楞纸板自动定位喷涂机
CN110293016A (zh) * 2019-07-30 2019-10-01 李开词 一种瓦楞纸板自动定位辅助喷涂机构
JP7299790B2 (ja) * 2019-08-05 2023-06-28 東レエンジニアリング株式会社 基板浮上搬送装置及び基板浮上搬送装置の基板位置補正方法
JP2021067925A (ja) * 2019-10-21 2021-04-30 キヤノン株式会社 支持装置、投影光学系、露光装置、支持装置の調整方法および物品製造方法
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JPWO2022202396A1 (ko) * 2021-03-25 2022-09-29
TW202306651A (zh) * 2021-03-31 2023-02-16 日商東京威力科創股份有限公司 基板搬送裝置、塗佈處理裝置及基板搬送方法
CN113600884B (zh) * 2021-09-01 2022-04-22 安徽金元素复合材料有限公司 一种金属复合板表面铣削装置
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JP2002181714A (ja) * 2000-12-19 2002-06-26 Ishikawajima Harima Heavy Ind Co Ltd 薄板検査装置
JP2005132626A (ja) * 2003-10-06 2005-05-26 Sumitomo Heavy Ind Ltd 搬送装置、塗布システム、及び検査システム
JP2005223119A (ja) * 2004-02-05 2005-08-18 Tokyo Electron Ltd 塗布膜形成装置および塗布膜形成方法
JP2005228881A (ja) * 2004-02-12 2005-08-25 Tokyo Electron Ltd 浮上式基板搬送処理方法及びその装置
JP2005244155A (ja) * 2004-01-30 2005-09-08 Tokyo Electron Ltd 浮上式基板搬送処理装置
JP2006237482A (ja) * 2005-02-28 2006-09-07 Tokyo Electron Ltd 基板処理装置及び基板処理方法及び基板処理プログラム
JP2006332378A (ja) * 2005-05-26 2006-12-07 Sharp Corp 物品の位置決め方法および位置決め装置、並びに半導体装置の製造方法および半導体装置の製造装置
JP2007088201A (ja) * 2005-09-22 2007-04-05 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP2007150280A (ja) * 2005-11-04 2007-06-14 Dainippon Printing Co Ltd 基板支持装置、基板支持方法、基板加工装置、基板加工方法、表示装置構成部材の製造方法
JP2007178819A (ja) * 2005-12-28 2007-07-12 Ushio Inc 支持機構及び支持機構を使ったマスクステージ
JP2007250871A (ja) * 2006-03-16 2007-09-27 Olympus Corp 基板搬送装置
JP2008060278A (ja) * 2006-08-30 2008-03-13 Hitachi High-Technologies Corp 位置決め装置、ステージおよび検査または処理の装置
JP2008132422A (ja) * 2006-11-28 2008-06-12 Tokyo Electron Ltd 塗布方法及び塗布装置

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JP2006173246A (ja) 2004-12-14 2006-06-29 Tokyo Electron Ltd 塗布装置及び塗布方法及び塗布処理プログラム
JP4571525B2 (ja) 2005-03-10 2010-10-27 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Patent Citations (13)

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JP2002181714A (ja) * 2000-12-19 2002-06-26 Ishikawajima Harima Heavy Ind Co Ltd 薄板検査装置
JP2005132626A (ja) * 2003-10-06 2005-05-26 Sumitomo Heavy Ind Ltd 搬送装置、塗布システム、及び検査システム
JP2005244155A (ja) * 2004-01-30 2005-09-08 Tokyo Electron Ltd 浮上式基板搬送処理装置
JP2005223119A (ja) * 2004-02-05 2005-08-18 Tokyo Electron Ltd 塗布膜形成装置および塗布膜形成方法
JP2005228881A (ja) * 2004-02-12 2005-08-25 Tokyo Electron Ltd 浮上式基板搬送処理方法及びその装置
JP2006237482A (ja) * 2005-02-28 2006-09-07 Tokyo Electron Ltd 基板処理装置及び基板処理方法及び基板処理プログラム
JP2006332378A (ja) * 2005-05-26 2006-12-07 Sharp Corp 物品の位置決め方法および位置決め装置、並びに半導体装置の製造方法および半導体装置の製造装置
JP2007088201A (ja) * 2005-09-22 2007-04-05 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP2007150280A (ja) * 2005-11-04 2007-06-14 Dainippon Printing Co Ltd 基板支持装置、基板支持方法、基板加工装置、基板加工方法、表示装置構成部材の製造方法
JP2007178819A (ja) * 2005-12-28 2007-07-12 Ushio Inc 支持機構及び支持機構を使ったマスクステージ
JP2007250871A (ja) * 2006-03-16 2007-09-27 Olympus Corp 基板搬送装置
JP2008060278A (ja) * 2006-08-30 2008-03-13 Hitachi High-Technologies Corp 位置決め装置、ステージおよび検査または処理の装置
JP2008132422A (ja) * 2006-11-28 2008-06-12 Tokyo Electron Ltd 塗布方法及び塗布装置

Also Published As

Publication number Publication date
TWI385712B (zh) 2013-02-11
CN101431008B (zh) 2010-10-13
KR101351155B1 (ko) 2014-01-27
JP2009117571A (ja) 2009-05-28
CN101431008A (zh) 2009-05-13
KR20090046719A (ko) 2009-05-11
TW200942973A (en) 2009-10-16

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