JP4188598B2 - 停止化合物を伴う研磨系及びその使用方法 - Google Patents

停止化合物を伴う研磨系及びその使用方法 Download PDF

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Publication number
JP4188598B2
JP4188598B2 JP2001517629A JP2001517629A JP4188598B2 JP 4188598 B2 JP4188598 B2 JP 4188598B2 JP 2001517629 A JP2001517629 A JP 2001517629A JP 2001517629 A JP2001517629 A JP 2001517629A JP 4188598 B2 JP4188598 B2 JP 4188598B2
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JP
Japan
Prior art keywords
polishing
substrate
layer
abrasive
acid
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Expired - Lifetime
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JP2001517629A
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English (en)
Japanese (ja)
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JP2003507896A (ja
JP2003507896A5 (enExample
Inventor
ワン，シュミン
カウフマン，ブラスタ ブラシック
ケー． グランバイン，スティーブン
ケー． ケリアン，アイザック
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CMC Materials LLC
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Cabot Microelectronics Corp
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Publication of JP2003507896A5 publication Critical patent/JP2003507896A5/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2001517629A 1999-08-13 2000-08-10 停止化合物を伴う研磨系及びその使用方法 Expired - Lifetime JP4188598B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14881399P 1999-08-13 1999-08-13
US60/148,813 1999-08-13
PCT/US2000/021952 WO2001012741A1 (en) 1999-08-13 2000-08-10 Polishing system with stopping compound and method of its use

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006104616A Division JP4723409B2 (ja) 1999-08-13 2006-04-05 研磨組成物、研磨系及び研磨方法

Publications (3)

Publication Number Publication Date
JP2003507896A JP2003507896A (ja) 2003-02-25
JP2003507896A5 JP2003507896A5 (enExample) 2008-09-04
JP4188598B2 true JP4188598B2 (ja) 2008-11-26

Family

ID=22527505

Family Applications (5)

Application Number Title Priority Date Filing Date
JP2001517629A Expired - Lifetime JP4188598B2 (ja) 1999-08-13 2000-08-10 停止化合物を伴う研磨系及びその使用方法
JP2001517628A Expired - Lifetime JP4391715B2 (ja) 1999-08-13 2000-08-10 化学機械的研磨系
JP2005349782A Expired - Lifetime JP4851174B2 (ja) 1999-08-13 2005-12-02 研磨系
JP2006104616A Expired - Lifetime JP4723409B2 (ja) 1999-08-13 2006-04-05 研磨組成物、研磨系及び研磨方法
JP2009102674A Expired - Lifetime JP5384994B2 (ja) 1999-08-13 2009-04-21 停止化合物を伴う化学機械的研磨系及びその使用方法

Family Applications After (4)

Application Number Title Priority Date Filing Date
JP2001517628A Expired - Lifetime JP4391715B2 (ja) 1999-08-13 2000-08-10 化学機械的研磨系
JP2005349782A Expired - Lifetime JP4851174B2 (ja) 1999-08-13 2005-12-02 研磨系
JP2006104616A Expired - Lifetime JP4723409B2 (ja) 1999-08-13 2006-04-05 研磨組成物、研磨系及び研磨方法
JP2009102674A Expired - Lifetime JP5384994B2 (ja) 1999-08-13 2009-04-21 停止化合物を伴う化学機械的研磨系及びその使用方法

Country Status (14)

Country Link
US (1) US6852632B2 (enExample)
EP (3) EP1226220B1 (enExample)
JP (5) JP4188598B2 (enExample)
KR (2) KR100590664B1 (enExample)
CN (2) CN100335580C (enExample)
AT (2) ATE360051T1 (enExample)
AU (2) AU6537000A (enExample)
CA (2) CA2378793A1 (enExample)
DE (2) DE60019142T2 (enExample)
HK (2) HK1046423A1 (enExample)
IL (2) IL147236A0 (enExample)
MY (2) MY139997A (enExample)
TW (2) TW500784B (enExample)
WO (2) WO2001012741A1 (enExample)

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CN1370207A (zh) 2002-09-18
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CA2378790A1 (en) 2001-02-22
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