JP2021185388A - 試験用キャリア - Google Patents
試験用キャリア Download PDFInfo
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- JP2021185388A JP2021185388A JP2021149673A JP2021149673A JP2021185388A JP 2021185388 A JP2021185388 A JP 2021185388A JP 2021149673 A JP2021149673 A JP 2021149673A JP 2021149673 A JP2021149673 A JP 2021149673A JP 2021185388 A JP2021185388 A JP 2021185388A
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- 238000012360 testing method Methods 0.000 title claims abstract description 120
- 238000012545 processing Methods 0.000 description 17
- 238000012937 correction Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 9
- 230000006837 decompression Effects 0.000 description 5
- 210000000078 claw Anatomy 0.000 description 4
- 230000003749 cleanliness Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
10…キャリア本体
11…第1の貫通孔
12…中心
13…閉塞部材
20…保持板
201…保持孔
202…段差
203,204…開口
21…ポゴピン
22…プランジャ
221…フランジ
23…本体
231…後端部
232…軸部
24…コイルスプリング
25…開口
30…インタポーザ
31…内部端子
32…外部端子
33…配線パターン
34…開口
40…筒状体
41…内孔
42…凹部
50…二次元バーコード
60…蓋部材
61…本体部
62…プッシャ
63…第2の貫通孔
70…ラッチ
71…シャフト
72…爪部
90…DUT
91…パッド
92,92’…バンプ
100…キャリア組立装置
110…第1の吸着保持部
120…第2の吸着保持部
130…減圧部
140…駆動部
150…カメラ
160…画像処理部
170…リーダ
180…制御部
190…記憶部
Claims (7)
- DUTを収容した状態で搬送される試験用キャリアであって、
前記DUTを保持するキャリア本体と、
前記DUTを覆うと共に前記キャリア本体に固定される蓋部材と、を備え、
前記キャリア本体は、前記DUTに対向するように設けられた位置決め用の第1の貫通孔を有する試験用キャリア。 - 請求項1に記載の試験用キャリアであって、
前記キャリア本体及び前記蓋部材が剛体から構成されている試験用キャリア。 - 請求項1又は2に記載の試験用キャリアであって、
前記第1の貫通孔は、前記キャリア本体に複数設けられている試験用キャリア。 - 請求項1〜3のいずれか一項に記載の試験用キャリアであって、
前記キャリア本体は、前記第1の貫通孔に挿入され、前記第1の貫通孔を閉塞する閉塞部材を有する試験用キャリア。 - 請求項1〜4のいずれか一項に記載の試験用キャリアであって、
前記キャリア本体は、
前記DUTを保持する保持板と、
前記保持板上に設けられ、前記DUTの周囲を囲む筒形状を有する筒状体と、を有している試験用キャリア。 - 請求項5に記載の試験用キャリアであって、
前記蓋部材は、
板状の本体部と、
前記本体部から凸状に突出するプッシャと、を備え、
第1の平面方向において、前記保持板の大きさは、前記本体部の大きさと実質的に同一であり、
前記第1の平面方向は、前記DUTの主面に対して実質的に平行な方向である試験用キャリア。 - 請求項1〜6のいずれか一項に記載の試験用キャリアであって、
前記第1の貫通孔は、前記DUTに形成されたバンプに対向する試験用キャリア。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021149673A JP7281518B2 (ja) | 2018-05-11 | 2021-09-14 | 試験用キャリア |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018091984A JP7281250B2 (ja) | 2018-05-11 | 2018-05-11 | 試験用キャリア |
JP2021149673A JP7281518B2 (ja) | 2018-05-11 | 2021-09-14 | 試験用キャリア |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018091984A Division JP7281250B2 (ja) | 2018-05-11 | 2018-05-11 | 試験用キャリア |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021185388A true JP2021185388A (ja) | 2021-12-09 |
JP7281518B2 JP7281518B2 (ja) | 2023-05-25 |
Family
ID=68464557
Family Applications (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018091984A Active JP7281250B2 (ja) | 2018-05-11 | 2018-05-11 | 試験用キャリア |
JP2021149669A Active JP7162711B2 (ja) | 2018-05-11 | 2021-09-14 | 試験用キャリア |
JP2021149667A Active JP7465854B2 (ja) | 2018-05-11 | 2021-09-14 | 試験用キャリア |
JP2021149673A Active JP7281518B2 (ja) | 2018-05-11 | 2021-09-14 | 試験用キャリア |
JP2021149668A Pending JP2021185386A (ja) | 2018-05-11 | 2021-09-14 | 試験用キャリア、及び、試験用キャリアの組立方法 |
JP2023017023A Pending JP2023052972A (ja) | 2018-05-11 | 2023-02-07 | キャリア組立方法、及び、キャリア組立装置 |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018091984A Active JP7281250B2 (ja) | 2018-05-11 | 2018-05-11 | 試験用キャリア |
JP2021149669A Active JP7162711B2 (ja) | 2018-05-11 | 2021-09-14 | 試験用キャリア |
JP2021149667A Active JP7465854B2 (ja) | 2018-05-11 | 2021-09-14 | 試験用キャリア |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021149668A Pending JP2021185386A (ja) | 2018-05-11 | 2021-09-14 | 試験用キャリア、及び、試験用キャリアの組立方法 |
JP2023017023A Pending JP2023052972A (ja) | 2018-05-11 | 2023-02-07 | キャリア組立方法、及び、キャリア組立装置 |
Country Status (4)
Country | Link |
---|---|
US (5) | US11531043B2 (ja) |
JP (6) | JP7281250B2 (ja) |
KR (1) | KR102146731B1 (ja) |
TW (1) | TWI717700B (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
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JP7281250B2 (ja) * | 2018-05-11 | 2023-05-25 | 株式会社アドバンテスト | 試験用キャリア |
KR102291194B1 (ko) * | 2020-03-09 | 2021-08-20 | 에이엠티 주식회사 | 미세 피치를 갖는 디바이스의 얼라인장치 및 그 방법 |
US11493551B2 (en) | 2020-06-22 | 2022-11-08 | Advantest Test Solutions, Inc. | Integrated test cell using active thermal interposer (ATI) with parallel socket actuation |
US11549981B2 (en) | 2020-10-01 | 2023-01-10 | Advantest Test Solutions, Inc. | Thermal solution for massively parallel testing |
US11821913B2 (en) | 2020-11-02 | 2023-11-21 | Advantest Test Solutions, Inc. | Shielded socket and carrier for high-volume test of semiconductor devices |
US11808812B2 (en) | 2020-11-02 | 2023-11-07 | Advantest Test Solutions, Inc. | Passive carrier-based device delivery for slot-based high-volume semiconductor test system |
US20220155364A1 (en) | 2020-11-19 | 2022-05-19 | Advantest Test Solutions, Inc. | Wafer scale active thermal interposer for device testing |
US11609266B2 (en) | 2020-12-04 | 2023-03-21 | Advantest Test Solutions, Inc. | Active thermal interposer device |
US11573262B2 (en) | 2020-12-31 | 2023-02-07 | Advantest Test Solutions, Inc. | Multi-input multi-zone thermal control for device testing |
US11587640B2 (en) | 2021-03-08 | 2023-02-21 | Advantest Test Solutions, Inc. | Carrier based high volume system level testing of devices with pop structures |
JP2023008202A (ja) * | 2021-07-05 | 2023-01-19 | 株式会社アドバンテスト | 電子部品ハンドリング装置用のキャリアのコア、及び、キャリア、並びに、コアの取外方法 |
JP7143491B1 (ja) * | 2021-07-21 | 2022-09-28 | 株式会社アドバンテスト | 試験用キャリア、及び、電子部品試験装置 |
US11693026B2 (en) | 2021-10-22 | 2023-07-04 | Advantest Corporation | Test carrier |
US11656273B1 (en) | 2021-11-05 | 2023-05-23 | Advantest Test Solutions, Inc. | High current device testing apparatus and systems |
US11835549B2 (en) | 2022-01-26 | 2023-12-05 | Advantest Test Solutions, Inc. | Thermal array with gimbal features and enhanced thermal performance |
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TWI717700B (zh) | 2021-02-01 |
US11531043B2 (en) | 2022-12-20 |
JP7281250B2 (ja) | 2023-05-25 |
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JP7465854B2 (ja) | 2024-04-11 |
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US11906548B2 (en) | 2024-02-20 |
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US20220011343A1 (en) | 2022-01-13 |
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US20190346482A1 (en) | 2019-11-14 |
JP2019197012A (ja) | 2019-11-14 |
JP2021185386A (ja) | 2021-12-09 |
JP2023052972A (ja) | 2023-04-12 |
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US20220011341A1 (en) | 2022-01-13 |
TW201947241A (zh) | 2019-12-16 |
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