JP4947054B2 - ソケットおよびモジュール基板およびそれを用いる検査システム - Google Patents
ソケットおよびモジュール基板およびそれを用いる検査システム Download PDFInfo
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- JP4947054B2 JP4947054B2 JP2008535343A JP2008535343A JP4947054B2 JP 4947054 B2 JP4947054 B2 JP 4947054B2 JP 2008535343 A JP2008535343 A JP 2008535343A JP 2008535343 A JP2008535343 A JP 2008535343A JP 4947054 B2 JP4947054 B2 JP 4947054B2
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- 238000012360 testing method Methods 0.000 claims description 16
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- 229910000679 solder Inorganic materials 0.000 description 60
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- 239000002131 composite material Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 8
- 238000001378 electrochemiluminescence detection Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
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- 230000001965 increasing effect Effects 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 230000005236 sound signal Effects 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 230000001939 inductive effect Effects 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
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- 238000012545 processing Methods 0.000 description 2
- 230000000644 propagated effect Effects 0.000 description 2
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- 239000004065 semiconductor Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Description
以下、本発明の実施の形態1を図面を参照しながら説明する。
以下本発明の実施の形態2を、図面を参照しながら説明する。なお、実施の形態1と同じ構成要素については、同じ符号を付け詳細説明は省略する。
12 第2の回路基板
21 第1のコンポジットシート
41,42,241,242,243,244 検査用端子
43,343 はんだボール
102,233,234 モジュール基板
111,112,113,114,115,116 配線パターン
410 第1の検査部
411,412,421,422 ビア
420 第2の検査部
500 配線基板
501 ソケット
502 蓋
503,517 雄端子
504,506 ピンコンタンクト
505,507 配線
508 サポートプレート
509,520 保持プレート
510 本体
511,515 雌端子
512,514,516 半田ボール
513 接触端子
527 成型部
518 スルーホール
519 孔部
Claims (2)
- モジュール基板を格納するソケットと検査装置と評価基板とからなる検査システムにおいて用いられるソケットであって、
前記モジュール基板は、
上下方向に積層され、各々が配線パターンを有する複数の回路基板と、
前記複数の回路基板のうち少なくとも1つの回路基板上に実装され、前記配線パターンと電気的に接続される電子部品と、
前記複数の回路基板のうち最下部の回路基板の下面に設けられ、前記配線パターンと電気的に接続される第六の端子と、
前記複数の回路基板のうち最上部の回路基板の上面に露出するように設けられ、
前記配線パターンと電気的に接続される第七の端子とを備えるモジュール基板であり、
前記評価基板は、
前記ソケットの第三の端子および前記ソケットの第五の端子を前記検査装置に電気的に接続して検査信号を伝播する評価基板であり、
前記検査システムは、
前記ソケットの孔部に前記モジュール基板を格納して前記ソケットの蓋で挟んで固定した間に、
前記ソケットの第一の端子と前記ソケットの第二の端子が電気的に接続され、
前記ソケットの第一の突起と前記モジュール基板の第七の端子が電気的に接続され、
前記ソケットの第四の端子と前記モジュール基板の第六の端子が電気的に接続され、
前記モジュール基板または前記電子部品の電気信号を前記ソケットの第三の端子および前記ソケットの第五の端子から前記評価基板を通じて検査装置に伝播する検査システムであり、
前記ソケットは、
裏面に前記第一の突起と、前記第一の突起に電気的に接続された前記第一の端子を有した前記蓋と、
上面に前記第二の端子と、裏面に前記第二の端子に電気的に接続された前記第三の端子を有した本体とを備え、
前記第一の端子と前記第二の端子は相対するように配置され、
前記本体は上面に前記モジュール基板を格納する前記孔部を有し、
前記孔部には底面に前記第四の端子と、
前記第四の端子に電気的に接続された前記本体裏面に前記第五の端子を有し、
前記第一の突起は前記孔部の内側に配置され、前記第一の端子および前記第二の端子は前記孔部の外側に配置され、前記第一の突起の直径またはピッチは前記第四の端子の直径またはピッチより小さいソケット。 - 裏面に第一の突起と、前記第一の突起に電気的に接続された第一の端子を有した蓋と、
上面に第二の端子と、裏面に前記第二の端子に電気的に接続された第三の端子を有した本体とを備え、
前記第一の端子と前記第二の端子は相対するように配置され、
前記本体は上面に後述するモジュール基板を格納する孔部を有し、
前記孔部には底面に第四の端子と、
前記第四の端子に電気的に接続された前記本体裏面に第五の端子を有し、
前記第一の突起は前記孔部の内側に配置され、前記第一の端子および前記第二の端子は前記孔部の外側に配置され、前記第一の突起の直径またはピッチは前記第四の端子の直径またはピッチより小さいソケットと、
上下方向に積層され、各々が配線パターンを有する複数の回路基板と、
前記複数の回路基板のうち少なくとも1つの回路基板上に実装され、前記配線パターンと電気的に接続される電子部品と、
前記複数の回路基板のうち最下部の回路基板の下面に設けられ、前記配線パターンと電気的に接続される第六の端子と、
前記複数の回路基板のうち最上部の回路基板の上面に露出するように設けられ、
前記配線パターンと電気的に接続される第七の端子とを備える検査対象であるモジュール基板と、
第三の端子および前記第五の端子を前記検査装置に電気的に接続して検査信号を伝播する評価基板とを有し、
前記本体孔部に前記モジュール基板を格納して前記蓋で挟んで固定した間に、
前記第一の端子と前記第二の端子が電気的に接続され、
前記第一の突起と前記第七の端子が電気的に接続され、
前記第四の端子と前記第六の端子が電気的に接続され、
前記モジュール基板または前記電子部品の電気信号を前記第三の端子および前記第五の端子から前記評価基板を通じて検査装置に伝播する検査システム。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008535343A JP4947054B2 (ja) | 2006-09-19 | 2007-09-18 | ソケットおよびモジュール基板およびそれを用いる検査システム |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006252061 | 2006-09-19 | ||
JP2006252061 | 2006-09-19 | ||
JP2008535343A JP4947054B2 (ja) | 2006-09-19 | 2007-09-18 | ソケットおよびモジュール基板およびそれを用いる検査システム |
PCT/JP2007/068037 WO2008035650A1 (fr) | 2006-09-19 | 2007-09-18 | Douille, carte de module et système d'inspection utilisant la carte de module |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2008035650A1 JPWO2008035650A1 (ja) | 2010-01-28 |
JP4947054B2 true JP4947054B2 (ja) | 2012-06-06 |
Family
ID=39200476
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008535343A Expired - Fee Related JP4947054B2 (ja) | 2006-09-19 | 2007-09-18 | ソケットおよびモジュール基板およびそれを用いる検査システム |
Country Status (5)
Country | Link |
---|---|
US (1) | US7956632B2 (ja) |
EP (1) | EP2071680A4 (ja) |
JP (1) | JP4947054B2 (ja) |
CN (1) | CN101517845B (ja) |
WO (1) | WO2008035650A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2256868A1 (de) * | 2009-05-27 | 2010-12-01 | Siemens Aktiengesellschaft | Automatisierungsgerät mit einem Terminalmodul |
US8441275B1 (en) * | 2010-01-14 | 2013-05-14 | Tapt Interconnect, LLC | Electronic device test fixture |
JP5870493B2 (ja) | 2011-02-24 | 2016-03-01 | セイコーエプソン株式会社 | 半導体装置、センサーおよび電子デバイス |
EP2535926A3 (en) * | 2011-06-17 | 2015-08-05 | BIOTRONIK SE & Co. KG | Semiconductor package |
US8466705B1 (en) | 2012-09-27 | 2013-06-18 | Exatron, Inc. | System and method for analyzing electronic devices having a cab for holding electronic devices |
US9733304B2 (en) * | 2014-09-24 | 2017-08-15 | Micron Technology, Inc. | Semiconductor device test apparatuses |
JP7281250B2 (ja) * | 2018-05-11 | 2023-05-25 | 株式会社アドバンテスト | 試験用キャリア |
CN109738734A (zh) * | 2018-12-28 | 2019-05-10 | 南通同洲电子有限责任公司 | 一种多功能机顶盒自动测试工装治具 |
TWI821525B (zh) * | 2020-02-17 | 2023-11-11 | 日商山一電機股份有限公司 | 檢查用插槽 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01173637A (ja) | 1987-12-26 | 1989-07-10 | Mitsubishi Electric Corp | Icパツケージ用ソケツト |
JPH06232233A (ja) * | 1992-12-23 | 1994-08-19 | Honeywell Inc | 裸ダイの試験装置 |
JP2752038B2 (ja) | 1994-07-19 | 1998-05-18 | ケル株式会社 | Bga−pga変換装置 |
JPH08213128A (ja) * | 1995-02-08 | 1996-08-20 | Texas Instr Japan Ltd | ソケット |
US6181149B1 (en) * | 1996-09-26 | 2001-01-30 | Delaware Capital Formation, Inc. | Grid array package test contactor |
JP3119247B2 (ja) | 1998-08-20 | 2000-12-18 | 日本電気株式会社 | Icパッケージ |
US6819127B1 (en) * | 1999-02-19 | 2004-11-16 | Micron Technology, Inc. | Method for testing semiconductor components using interposer |
JP2000357571A (ja) * | 1999-06-14 | 2000-12-26 | Tokyo Eletec Kk | Icソケット |
JP2001264383A (ja) | 2000-03-21 | 2001-09-26 | Nec Corp | Ic測定用ソケット |
JP4845304B2 (ja) * | 2000-10-25 | 2011-12-28 | 株式会社センサータ・テクノロジーズジャパン | ソケット及びこれを備えた電子部品装着装置 |
DE102004007696B4 (de) * | 2004-02-16 | 2009-01-02 | Infineon Technologies Ag | Testvorrichtung zum Prüfen eines Halbleiterbauteils mit Kontaktflächen auf seiner Oberseite und seiner Unterseite und Verfahren zum Prüfen des Halbleiterbauteils |
US7042240B2 (en) * | 2004-02-27 | 2006-05-09 | Wells-Cti, Llc | Burn-in testing apparatus and method |
US7064567B2 (en) * | 2004-08-12 | 2006-06-20 | Agilent Technologies, Inc. | Interposer probe and method for testing |
JP2006292727A (ja) * | 2005-03-18 | 2006-10-26 | Alps Electric Co Ltd | 半導体搬送トレイ、これを用いたバーンインボード、バーンイン試験用の検査装置及びバーンイン試験方法並びに半導体の製造方法 |
-
2007
- 2007-09-18 EP EP07828238A patent/EP2071680A4/en not_active Withdrawn
- 2007-09-18 CN CN2007800347814A patent/CN101517845B/zh not_active Expired - Fee Related
- 2007-09-18 WO PCT/JP2007/068037 patent/WO2008035650A1/ja active Application Filing
- 2007-09-18 US US12/440,937 patent/US7956632B2/en not_active Expired - Fee Related
- 2007-09-18 JP JP2008535343A patent/JP4947054B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7956632B2 (en) | 2011-06-07 |
EP2071680A1 (en) | 2009-06-17 |
WO2008035650A1 (fr) | 2008-03-27 |
EP2071680A4 (en) | 2012-11-07 |
CN101517845B (zh) | 2012-10-17 |
US20100097085A1 (en) | 2010-04-22 |
JPWO2008035650A1 (ja) | 2010-01-28 |
CN101517845A (zh) | 2009-08-26 |
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