JP5371932B2 - モジュール基板 - Google Patents
モジュール基板 Download PDFInfo
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- JP5371932B2 JP5371932B2 JP2010256257A JP2010256257A JP5371932B2 JP 5371932 B2 JP5371932 B2 JP 5371932B2 JP 2010256257 A JP2010256257 A JP 2010256257A JP 2010256257 A JP2010256257 A JP 2010256257A JP 5371932 B2 JP5371932 B2 JP 5371932B2
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Description
(a)構成
図1は、第1の実施の形態に係るモジュール基板を示す外観斜視図である。なお、図1においては、位置関係を明確にするために互いに直交するX方向、Y方向およびZ方向を示す矢印を付している。X方向およびY方向は水平面内で互いに直交し、Z方向は鉛直方向に相当する。また、後述する図2および図4〜図13においても、同様にX方向、Y方向およびZ方向を示す矢印を付している。
以上のように、本実施の形態においては、第3の基板13上に検査用端子41,42が設けられている。この場合、モジュール基板100を外部基板に実装した状態においても、検査用端子41,42を用いて、モジュール基板100内に実装されている各電子部品(LSI32,35およびメモリ33,34)の内部回路の検査および各電子部品の信号の検査を行うことができる。それにより、モジュール基板100の各電子部品の不良を確実に検出することができる。
なお、検査用端子41,42の配置形状は図1の例に限定されず、例えば、複数の検査用端子41,42を第3の基板13の周縁部に沿うように配置してもよい。この場合も、第1〜第3の基板11〜13の中央部に、電子部品を実装するための領域および配線パターンを形成するための領域を十分に確保することができる。
第2の実施の形態に係るモジュール基板が第1の実施の形態に係るモジュール基板100(図1〜図3)と異なるのは以下の点である。
第3の実施の形態に係るモジュール基板が第1の実施の形態に係るモジュール基板100(図1〜図3)と異なるのは以下の点である。
第4の実施の形態に係るモジュール基板が第3の実施の形態に係るモジュール基板102(図6および図7)と異なるのは以下の点である。
第5の実施の形態に係るモジュール基板が第1の実施の形態に係るモジュール基板100(図1〜図3)と異なるのは以下の点である。
第6の実施の形態に係るモジュール基板が第5の実施の形態に係るモジュール基板104(図10)と異なるのは以下の点である。
第7の実施の形態に係るモジュール基板が第6の実施の形態に係るモジュール基板105(図11)と異なるのは以下の点である。
第8の実施の形態に係るモジュール基板が第5の実施の形態に係るモジュール基板104(図10)と異なるのは以下の点である。
上記実施の形態においては、第1の基板11上でLSI32およびメモリ33,34が電気的に接続されている場合について説明したが、第1の基板11に実装される複数の電子部品がそれぞれ電気的に独立して実装されてもよい。
以下、請求項の各構成要素と実施の形態の各部との対応の例について説明するが、本発明は下記の例に限定されない。
Claims (17)
- 上下方向に積層され、各々が配線パターンを有する複数の回路基板と、
前記複数の回路基板のうち少なくとも1つの回路基板上に実装され、前記配線パターンと電気的に接続される1または複数の電子部品と、
前記複数の回路基板のうち最下部の回路基板の下面に設けられ、前記配線パターンと電気的に接続される第1の端子と、
前記複数の回路基板のうちいずれかの回路基板の上面に露出するように設けられ、前記配線パターンと電気的に接続される第2の端子とを備え、
前記第2の端子は、前記いずれかの回路基板の少なくとも1辺に沿った領域に配置される、モジュール基板。 - 前記第1および第2の端子はそれぞれ複数設けられ、前記複数の第2の端子間のピッチは、前記複数の第1の端子間のピッチよりも小さい、請求項1記載のモジュール基板。
- 前記複数の回路基板のうち最上部の回路基板の部品、配線および前記第2の端子を除く上面領域に、さらに接地導体層が設けられた、請求項1または2記載のモジュール基板。
- 前記第2の端子は、前記最上部の回路基板を貫通する導体を通して前記配線パターンに電気的に接続される、請求項1から3のいずれかに記載のモジュール基板。
- 前記1または複数の電子部品は、第1および第2の電子部品を含み、
前記第1および第2の電子部品は、前記複数の回路基板のうち少なくとも1つの回路基板に形成される配線パターンによって相互に電気的に接続され、
前記第2の端子は、当該第1および第2の電子部品を電気的に接続する配線パターンに電気的に接続される、請求項1記載のモジュール基板。 - 前記第2の端子は、いずれかの電子部品を検査するための複数の検査用端子を含む、請求項1から5のいずれかに記載のモジュール基板。
- 前記第2の端子は、前記電子部品を検査する装置を接続するための端子である、請求項6記載のモジュール基板。
- 上下方向に積層され、各々が配線パターンを有する複数の回路基板と、
前記複数の回路基板のうち少なくとも1つの回路基板上に実装され、前記配線パターンと電気的に接続される1または複数の電子部品と、
前記複数の回路基板のうち最下部の回路基板の下面に設けられ、前記配線パターンと電気的に接続される第1の端子と、
前記複数の回路基板のうち最上部の回路基板を除くいずれかの回路基板の上面の一部領域に設けられ、前記配線パターンと電気的に接続される第2の端子とを備え、
前記いずれかの回路基板の上方に位置する他の1または複数の回路基板は、前記第2の端子が露出するように切り欠き部または開口部を有するモジュール基板。 - 前記複数の回路基板のうち少なくとも2つの回路基板間に設けられた絶縁層をさらに備え、
前記第2の端子は前記絶縁層よりも下方の回路基板の上面の一部領域に形成され、
前記第2の端子が露出するように前記絶縁層が切り欠き部または開口部を有する、請求項8記載のモジュール基板。 - 前記第1および第2の端子はそれぞれ複数設けられ、前記複数の第2の端子間のピッチは、前記複数の第1の端子間のピッチよりも小さい、請求項8記載のモジュール基板。
- 前記第2の端子は、前記いずれかの回路基板の中央部に配置される、請求項8記載のモジュール基板。
- 前記1または複数の電子部品は、第1および第2の電子部品を含み、
前記第1および第2の電子部品は、前記複数の回路基板のうち少なくとも1つの回路基板に形成される配線パターンによって相互に電気的に接続され、
前記第2の端子は、当該第1および第2の電子部品を電気的に接続する配線パターンに電気的に接続される、請求項8記載のモジュール基板。 - 前記第2の端子は、いずれかの電子部品を検査するための複数の検査用端子を含む、請求項8から12のいずれかに記載のモジュール基板。
- 前記第2の端子は、前記電子部品を検査する装置を接続するための端子である、請求項13に記載のモジュール基板。
- 上下方向に積層され、各々が配線パターンを有する複数の回路基板と、
前記複数の回路基板のうち少なくとも1つの回路基板上に実装され、前記配線パターンと電気的に接続される複数の電子部品と、
前記複数の回路基板のうち最下部の回路基板の下面に設けられ、前記配線パターンと電気的に接続される第1の端子と、
前記複数の回路基板のうちいずれかの回路基板の上面の一部領域に設けられ、前記配線パターンと電気的に接続される第2の端子とを備え、
前記複数の電子部品および前記配線パターンは、所定の機能を達成する回路を構成し、
前記複数の電子部品は、第1の電子部品と、複数の第2の電子部品とを含み、
前記配線パターンは、前記第1の電子部品に接続される第1の配線部と、前記第1の配線部から分岐して前記複数の第2の電子部品にそれぞれ接続される複数の第2の配線部とを含み、
前記複数の第2の端子は前記複数の第2の配線部に接続され、
前記複数の第2の電子部品は同一の回路基板上に実装され、前記第1の配線部から前記複数の第2の配線部への分岐点は前記複数の第2の電子部品と同一の回路基板上に形成され、
前記分岐点から前記複数の第2の端子までにおける前記複数の第2の配線部の長さは等しい、モジュール基板。 - 前記複数の第2の端子は、前記いずれかの回路基板の上面に露出するように設けられる、請求項15記載のモジュール基板。
- 前記複数の第2の端子は、前記回路またはいずれかの電子部品を検査するための複数の検査用端子を含む、請求項15記載のモジュール基板。
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KR101084788B1 (ko) | 2009-08-25 | 2011-11-21 | 삼성에스디아이 주식회사 | 이차전지 |
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WO2013153742A1 (ja) * | 2012-04-11 | 2013-10-17 | パナソニック株式会社 | 半導体装置 |
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EP1863087A1 (en) | 2007-12-05 |
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US20120063110A1 (en) | 2012-03-15 |
CN101142678A (zh) | 2008-03-12 |
CN101142678B (zh) | 2010-05-19 |
US8675369B2 (en) | 2014-03-18 |
US8077478B2 (en) | 2011-12-13 |
US20080205016A1 (en) | 2008-08-28 |
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WO2006098364A1 (ja) | 2006-09-21 |
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