JP7281250B2 - 試験用キャリア - Google Patents
試験用キャリア Download PDFInfo
- Publication number
- JP7281250B2 JP7281250B2 JP2018091984A JP2018091984A JP7281250B2 JP 7281250 B2 JP7281250 B2 JP 7281250B2 JP 2018091984 A JP2018091984 A JP 2018091984A JP 2018091984 A JP2018091984 A JP 2018091984A JP 7281250 B2 JP7281250 B2 JP 7281250B2
- Authority
- JP
- Japan
- Prior art keywords
- dut
- test carrier
- carrier
- test
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
10…キャリア本体
11…第1の貫通孔
12…中心
13…閉塞部材
20…保持板
201…保持孔
202…段差
203,204…開口
21…ポゴピン
22…プランジャ
221…フランジ
23…固定部
231…後端部
232…軸部
24…コイルスプリング
25…開口
30…インタポーザ
31…内部端子
32…外部端子
33…配線パターン
34…開口
40…筒状体
41…内孔
42…凹部
50…二次元バーコード
60…蓋部材
61…本体部
62…プッシャ
63…第2の貫通孔
70…ラッチ
71…シャフト
72…爪部
90…DUT
91…パッド
92,92’…バンプ
100…キャリア組立装置
110…第1の吸着保持部
120…第2の吸着保持部
130…減圧部
140…駆動部
150…カメラ
160…画像処理部
170…リーダ
180…制御部
190…記憶部
Claims (8)
- DUTを収容した状態で搬送される試験用キャリアであって、
前記DUTを保持するキャリア本体と、
前記DUTを覆うと共に前記キャリア本体に固定される蓋部材と、を備え、
前記キャリア本体は、
前記DUTの第1の端子に対応するように設けられ、前記第1の端子に接触する複数の接触子と、
前記接触子に電気的に接続された複数の外部端子と、
前記DUTに対向するように設けられ、前記DUTを前記試験用キャリアに対して位置決めするための位置決め用の複数の第1の貫通孔と、を有しており、
それぞれの前記第1の貫通孔は、外部から前記第1の貫通孔を介して前記DUTの特徴点を見ることが可能なように、前記キャリア本体を貫通しており、
前記特徴点は、前記DUTが有し、前記第1の端子とは異なる第2の端子を含み、
前記第2の端子は、前記接触子と接触しない端子であり、
外部から前記第1の貫通孔を介して前記DUTの特徴点を見た場合に、前記接触子が前記第1の貫通孔の中に位置していない試験用キャリア。
- 請求項1に記載の試験用キャリアであって、
前記試験用キャリアは、前記第1の貫通孔を閉塞する透明な閉塞部材をさらに備えた試験用キャリア。
- 請求項1又は2に記載の試験用キャリアであって、
前記外部端子のピッチは、前記接触子のピッチよりも広い試験用キャリア。
- 請求項1~3のいずれか一項に記載の試験用キャリアであって、
前記接触子は、前記DUTの第1の端子を押圧するポゴピンを含み、
前記DUTは、前記ポゴピンの押圧力によって、前記ポゴピンと前記蓋部材との間に挟持される試験用キャリア。
- 請求項1~4のいずれか一項に記載の試験用キャリアであって、
前記キャリア本体は、
前記接触子を保持する保持板と、
前記保持板に重ねられたインタポーザと、を含み、
前記インタポーザは、
前記外部端子と、
前記接触子に対向するように設けられた内部端子と、
前記内部端子と前記外部端子とを接続する配線パターンと、を有する試験用キャリア。
- 請求項1~5のいずれか一項に記載の試験用キャリアであって、
前記試験用キャリアは、前記蓋部材を前記キャリア本体に着脱可能に固定するラッチ機構を備えた試験用キャリア。
- 請求項1~6のいずれか一項に記載の試験用キャリアであって、
前記試験用キャリアは、個体を識別するための識別子を備えた試験用キャリア。
- 請求項7に記載の試験用キャリアであって、
前記蓋部材は、前記DUTに対向するように設けられ、前記蓋部材を貫通しており、キャリア組立装置の吸着保持部により前記DUTを吸着保持するためのDUT吸着用の第2の貫通孔を有する試験用キャリア。
Priority Applications (13)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018091984A JP7281250B2 (ja) | 2018-05-11 | 2018-05-11 | 試験用キャリア |
KR1020190024553A KR102146731B1 (ko) | 2018-05-11 | 2019-03-04 | 시험용 캐리어 및 캐리어 조립장치 |
TW108107191A TWI717700B (zh) | 2018-05-11 | 2019-03-05 | 試驗用載具以及載具組裝裝置 |
US16/351,348 US11531043B2 (en) | 2018-05-11 | 2019-03-12 | Test carrier and carrier assembling apparatus |
JP2021149667A JP7465854B2 (ja) | 2018-05-11 | 2021-09-14 | 試験用キャリア |
JP2021149669A JP7162711B2 (ja) | 2018-05-11 | 2021-09-14 | 試験用キャリア |
JP2021149673A JP7281518B2 (ja) | 2018-05-11 | 2021-09-14 | 試験用キャリア |
JP2021149668A JP2021185386A (ja) | 2018-05-11 | 2021-09-14 | 試験用キャリア、及び、試験用キャリアの組立方法 |
US17/484,493 US11906548B2 (en) | 2018-05-11 | 2021-09-24 | Test carrier and carrier assembling apparatus |
US17/484,560 US20220011343A1 (en) | 2018-05-11 | 2021-09-24 | Test carrier and carrier assembling apparatus |
US17/484,368 US20220011341A1 (en) | 2018-05-11 | 2021-09-24 | Test carrier and carrier assembling apparatus |
US17/484,355 US20220011340A1 (en) | 2018-05-11 | 2021-09-24 | Test carrier and carrier assembling apparatus |
JP2023017023A JP7507908B2 (ja) | 2018-05-11 | 2023-02-07 | キャリア組立方法、及び、キャリア組立装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018091984A JP7281250B2 (ja) | 2018-05-11 | 2018-05-11 | 試験用キャリア |
Related Child Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021149667A Division JP7465854B2 (ja) | 2018-05-11 | 2021-09-14 | 試験用キャリア |
JP2021149673A Division JP7281518B2 (ja) | 2018-05-11 | 2021-09-14 | 試験用キャリア |
JP2021149669A Division JP7162711B2 (ja) | 2018-05-11 | 2021-09-14 | 試験用キャリア |
JP2021149668A Division JP2021185386A (ja) | 2018-05-11 | 2021-09-14 | 試験用キャリア、及び、試験用キャリアの組立方法 |
JP2023017023A Division JP7507908B2 (ja) | 2018-05-11 | 2023-02-07 | キャリア組立方法、及び、キャリア組立装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019197012A JP2019197012A (ja) | 2019-11-14 |
JP7281250B2 true JP7281250B2 (ja) | 2023-05-25 |
Family
ID=68464557
Family Applications (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018091984A Active JP7281250B2 (ja) | 2018-05-11 | 2018-05-11 | 試験用キャリア |
JP2021149667A Active JP7465854B2 (ja) | 2018-05-11 | 2021-09-14 | 試験用キャリア |
JP2021149673A Active JP7281518B2 (ja) | 2018-05-11 | 2021-09-14 | 試験用キャリア |
JP2021149668A Pending JP2021185386A (ja) | 2018-05-11 | 2021-09-14 | 試験用キャリア、及び、試験用キャリアの組立方法 |
JP2021149669A Active JP7162711B2 (ja) | 2018-05-11 | 2021-09-14 | 試験用キャリア |
JP2023017023A Active JP7507908B2 (ja) | 2018-05-11 | 2023-02-07 | キャリア組立方法、及び、キャリア組立装置 |
Family Applications After (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021149667A Active JP7465854B2 (ja) | 2018-05-11 | 2021-09-14 | 試験用キャリア |
JP2021149673A Active JP7281518B2 (ja) | 2018-05-11 | 2021-09-14 | 試験用キャリア |
JP2021149668A Pending JP2021185386A (ja) | 2018-05-11 | 2021-09-14 | 試験用キャリア、及び、試験用キャリアの組立方法 |
JP2021149669A Active JP7162711B2 (ja) | 2018-05-11 | 2021-09-14 | 試験用キャリア |
JP2023017023A Active JP7507908B2 (ja) | 2018-05-11 | 2023-02-07 | キャリア組立方法、及び、キャリア組立装置 |
Country Status (4)
Country | Link |
---|---|
US (5) | US11531043B2 (ja) |
JP (6) | JP7281250B2 (ja) |
KR (1) | KR102146731B1 (ja) |
TW (1) | TWI717700B (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7281250B2 (ja) | 2018-05-11 | 2023-05-25 | 株式会社アドバンテスト | 試験用キャリア |
US11971320B2 (en) * | 2019-09-30 | 2024-04-30 | Mitsubishi Electric Corporation | Inspection jig |
KR102291194B1 (ko) * | 2020-03-09 | 2021-08-20 | 에이엠티 주식회사 | 미세 피치를 갖는 디바이스의 얼라인장치 및 그 방법 |
US11493551B2 (en) | 2020-06-22 | 2022-11-08 | Advantest Test Solutions, Inc. | Integrated test cell using active thermal interposer (ATI) with parallel socket actuation |
US11549981B2 (en) | 2020-10-01 | 2023-01-10 | Advantest Test Solutions, Inc. | Thermal solution for massively parallel testing |
US11821913B2 (en) | 2020-11-02 | 2023-11-21 | Advantest Test Solutions, Inc. | Shielded socket and carrier for high-volume test of semiconductor devices |
US11808812B2 (en) | 2020-11-02 | 2023-11-07 | Advantest Test Solutions, Inc. | Passive carrier-based device delivery for slot-based high-volume semiconductor test system |
US20220155364A1 (en) | 2020-11-19 | 2022-05-19 | Advantest Test Solutions, Inc. | Wafer scale active thermal interposer for device testing |
US11567119B2 (en) | 2020-12-04 | 2023-01-31 | Advantest Test Solutions, Inc. | Testing system including active thermal interposer device |
US11573262B2 (en) | 2020-12-31 | 2023-02-07 | Advantest Test Solutions, Inc. | Multi-input multi-zone thermal control for device testing |
US11587640B2 (en) | 2021-03-08 | 2023-02-21 | Advantest Test Solutions, Inc. | Carrier based high volume system level testing of devices with pop structures |
JP2023008202A (ja) * | 2021-07-05 | 2023-01-19 | 株式会社アドバンテスト | 電子部品ハンドリング装置用のキャリアのコア、及び、キャリア、並びに、コアの取外方法 |
JP7143491B1 (ja) | 2021-07-21 | 2022-09-28 | 株式会社アドバンテスト | 試験用キャリア、及び、電子部品試験装置 |
CN113759235A (zh) * | 2021-09-10 | 2021-12-07 | 北京中电华大电子设计有限责任公司 | 一种非接触智能卡健壮性测试的装置 |
US11693026B2 (en) * | 2021-10-22 | 2023-07-04 | Advantest Corporation | Test carrier |
US11656273B1 (en) | 2021-11-05 | 2023-05-23 | Advantest Test Solutions, Inc. | High current device testing apparatus and systems |
US11835549B2 (en) | 2022-01-26 | 2023-12-05 | Advantest Test Solutions, Inc. | Thermal array with gimbal features and enhanced thermal performance |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001033520A (ja) | 1999-07-26 | 2001-02-09 | Advantest Corp | Icハンドラ装置のicコンタクト部 |
JP2001102418A (ja) | 1999-09-29 | 2001-04-13 | Tokyo Electron Ltd | 高速測定対応プローブ装置 |
JP2001208795A (ja) | 2000-01-28 | 2001-08-03 | Ando Electric Co Ltd | キャリア識別システム、キャリア識別方法および記憶媒体 |
JP2004152495A (ja) | 2002-10-28 | 2004-05-27 | Yamaichi Electronics Co Ltd | 狭ピッチicパッケージ用icソケット |
WO2004074858A1 (ja) | 2003-02-21 | 2004-09-02 | Nhk Spring Co., Ltd. | チップ実装用テープの検査方法及び検査に用いるプローブユニット |
Family Cites Families (99)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3963315A (en) * | 1975-04-07 | 1976-06-15 | Lockhead Missiles & Space Company, Inc. | Semiconductor chip carrier and testing fixture |
US4700473A (en) | 1986-01-03 | 1987-10-20 | Motorola Inc. | Method of making an ultra high density pad array chip carrier |
US4940935A (en) * | 1989-08-28 | 1990-07-10 | Ried Ashman Manufacturing | Automatic SMD tester |
US5074798A (en) * | 1989-10-24 | 1991-12-24 | Wells Electronics, Inc. | Modular socket for an integrated circuit |
JPH04162382A (ja) * | 1990-10-25 | 1992-06-05 | Canon Inc | Icソケット |
US5367253A (en) * | 1991-06-04 | 1994-11-22 | Micron Semiconductor, Inc. | Clamped carrier for testing of semiconductor dies |
US5224263A (en) * | 1991-06-28 | 1993-07-06 | Digital Equipment Corporation | Gentle package extraction tool and method |
US5171290A (en) * | 1991-09-03 | 1992-12-15 | Microelectronics And Computer Technology Corporation | Testing socket for tab tape |
US5247250A (en) * | 1992-03-27 | 1993-09-21 | Minnesota Mining And Manufacturing Company | Integrated circuit test socket |
US5387120A (en) * | 1993-02-19 | 1995-02-07 | Wells Electronics, Inc. | Latching IC connector |
US6025732A (en) * | 1993-07-09 | 2000-02-15 | Aehr Test Systems | Reusable die carrier for burn-in and burn-in process |
US5828224A (en) | 1994-03-18 | 1998-10-27 | Fujitsu, Limited | Test carrier for semiconductor integrated circuit and method of testing semiconductor integrated circuit |
US5986459A (en) | 1994-03-18 | 1999-11-16 | Fujitsu Limited | Semiconductor device testing carrier and method of fixing semiconductor device to testing carrier |
JP3491700B2 (ja) | 1994-03-18 | 2004-01-26 | 富士通株式会社 | 半導体集積回路装置の試験用キャリア |
WO1995034825A1 (fr) * | 1994-06-15 | 1995-12-21 | Advantest Corporation | Sabot pour manipulateur de circuits integres |
KR960014952A (ko) * | 1994-10-14 | 1996-05-22 | 가즈오 가네코 | 반도체 웨이퍼의 번인 및 테스트방법과 그것에 사용되는 번인보드 |
US5808474A (en) * | 1994-11-30 | 1998-09-15 | Lsi Logic Corporation | Test socket for testing integrated circuit packages |
SG90713A1 (en) * | 1995-07-28 | 2002-08-20 | Advantest Corp | Semiconductor device testing apparatus and semiconductor device testing system having a plurality of semiconductor device testing apparatus |
US5926027A (en) * | 1995-09-28 | 1999-07-20 | Bumb, Jr.; Frank E. | Apparatus and method for testing a device |
US6046597A (en) | 1995-10-04 | 2000-04-04 | Oz Technologies, Inc. | Test socket for an IC device |
US5647756A (en) * | 1995-12-19 | 1997-07-15 | Minnesota Mining And Manufacturing | Integrated circuit test socket having toggle clamp lid |
WO1997027492A1 (fr) | 1996-01-22 | 1997-07-31 | Hitachi, Ltd. | Procede pour fixer des puces nues et support de puces nues |
JP3519534B2 (ja) * | 1996-02-19 | 2004-04-19 | 株式会社東芝 | ベアチッププローバ装置及びベアチップハンドリング方法 |
JP4060329B2 (ja) | 1996-06-21 | 2008-03-12 | 富士通株式会社 | 試験用キャリア、及び試験用キャリアへの半導体装置の取付方法 |
US5982185A (en) * | 1996-07-01 | 1999-11-09 | Micron Technology, Inc. | Direct connect carrier for testing semiconductor dice and method of fabrication |
US5788526A (en) * | 1996-07-17 | 1998-08-04 | Minnesota Mining And Manufacturing Company | Integrated circuit test socket having compliant lid and mechanical advantage latch |
US5869976A (en) * | 1996-12-13 | 1999-02-09 | Cirrus Logic, Inc. | Fine alignment IC handler and method for assembling same |
KR100293590B1 (ko) * | 1998-03-17 | 2001-07-12 | 장 흥 순 | 반도체소자검사장치용캐리어모듈 |
JPH11271392A (ja) * | 1998-03-25 | 1999-10-08 | Machine Active Contact:Kk | キャリアソケット構造体 |
JP3951436B2 (ja) | 1998-04-01 | 2007-08-01 | 株式会社アドバンテスト | Ic試験装置 |
KR100270888B1 (ko) * | 1998-04-08 | 2000-12-01 | 윤종용 | 노운 굿 다이 제조장치 |
JPH11326499A (ja) | 1998-05-20 | 1999-11-26 | Mitsubishi Electric Corp | 距離測定装置及びこれを利用した車両用制御装置 |
TW432221B (en) * | 1998-05-29 | 2001-05-01 | Advantest Corp | Tray for electronic device, the transporting apparatus of tray for electronic device and testing apparatus for electronic device |
JP3648455B2 (ja) | 1998-12-04 | 2005-05-18 | フォームファクター,インコーポレイテッド | 電子部品の実装方法 |
US6627483B2 (en) * | 1998-12-04 | 2003-09-30 | Formfactor, Inc. | Method for mounting an electronic component |
JP2000193720A (ja) | 1998-12-29 | 2000-07-14 | Ando Electric Co Ltd | キャリアを識別する水平搬送式オ―トハンドラ |
US6285202B1 (en) | 1999-02-19 | 2001-09-04 | Micron Technology, Inc. | Test carrier with force applying mechanism guide and terminal contact protector |
JP2000304809A (ja) | 1999-04-21 | 2000-11-02 | Advantest Corp | Ic試験装置 |
US6297654B1 (en) * | 1999-07-14 | 2001-10-02 | Cerprobe Corporation | Test socket and method for testing an IC device in a dead bug orientation |
JP3813772B2 (ja) * | 1999-09-27 | 2006-08-23 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
US6592434B1 (en) * | 2000-11-16 | 2003-07-15 | Motorola, Inc. | Wafer carrier and method of material removal from a semiconductor wafer |
DE10064580C1 (de) * | 2000-12-18 | 2002-01-31 | Infineon Technologies Ag | Opto-elektronische Baugruppe zum Empfangen optischer Signale |
JP2002328150A (ja) * | 2001-05-01 | 2002-11-15 | Mitsubishi Electric Corp | チップキャリア |
KR100391264B1 (ko) * | 2001-07-31 | 2003-07-12 | 삼성전자주식회사 | 웨이퍼 절단 장치 |
US6792365B2 (en) * | 2001-08-10 | 2004-09-14 | Micron Technology, Inc. | Sequential unique marking |
JP3706333B2 (ja) * | 2001-11-12 | 2005-10-12 | 山一電機株式会社 | Kgdキャリアのラッチロック機構 |
WO2003075025A1 (fr) | 2002-03-07 | 2003-09-12 | Advantest Corporation | Dispositif d'essai de composants electroniques |
TW545582U (en) * | 2002-05-07 | 2003-08-01 | Via Tech Inc | Testing assembly for BGA IC devices |
AU2002349395A1 (en) * | 2002-12-04 | 2004-06-23 | Advantest Corporation | Pressing member and electronic component handling device |
JP3803099B2 (ja) | 2002-12-17 | 2006-08-02 | 山一電機株式会社 | 半導体装置用ソケット |
US7195507B2 (en) * | 2003-08-06 | 2007-03-27 | Yamaichi Electronics U.S.A., Inc. | Socket apparatus with actuation via pivotal motion |
US6982551B2 (en) * | 2004-01-26 | 2006-01-03 | Yates Alan G | Integrated circuit test device |
US7061101B2 (en) * | 2004-03-11 | 2006-06-13 | Mirae Corporation | Carrier module |
US6873169B1 (en) * | 2004-03-11 | 2005-03-29 | Mirae Corporation | Carrier module for semiconductor device test handler |
US7208936B2 (en) * | 2004-04-12 | 2007-04-24 | Intel Corporation | Socket lid and test device |
JP4493657B2 (ja) | 2004-07-09 | 2010-06-30 | 株式会社アドバンテスト | 押圧部材および電子部品ハンドリング装置 |
US7108517B2 (en) * | 2004-09-27 | 2006-09-19 | Wells-Cti, Llc | Multi-site chip carrier and method |
JP4068610B2 (ja) | 2004-10-01 | 2008-03-26 | 山一電機株式会社 | 半導体装置用キャリアユニットおよびそれを備える半導体装置用ソケット |
US7005872B1 (en) * | 2005-02-08 | 2006-02-28 | Rf Micro Devices, Inc. | System for removing debris from a test socket |
KR101117789B1 (ko) * | 2005-03-11 | 2012-03-13 | 가부시끼가이샤 니혼 마이크로닉스 | Ic 캐리어, ic 소켓트 및 ic 디바이스의 시험방법 |
JP2006300926A (ja) | 2005-03-25 | 2006-11-02 | Yamaichi Electronics Co Ltd | 半導体装置用キャリアユニット、および、半導体装置用ソケット |
KR100710185B1 (ko) * | 2005-11-14 | 2007-04-20 | 동부일렉트로닉스 주식회사 | 반도체 소자의 검사장치 |
US20100147088A1 (en) * | 2006-01-17 | 2010-06-17 | Advantest Corporation | Electronic device test apparatus and method of testing electronic devices |
KR100681156B1 (ko) * | 2006-01-25 | 2007-02-09 | 삼성전자주식회사 | 전기적 검사 장치용 소켓 |
CN200941459Y (zh) * | 2006-07-14 | 2007-08-29 | 富士康(昆山)电脑接插件有限公司 | 电连接器组件 |
US20080018353A1 (en) * | 2006-07-24 | 2008-01-24 | Francis Rapheal Thamarayoor | Methods and apparatus for releasably mounting a semiconductor device to a printed circuit board |
EP2071680A4 (en) * | 2006-09-19 | 2012-11-07 | Panasonic Corp | SOCKET, MODULE PLATE AND INSPECTION SYSTEM WITH MODULE PLATE |
US20080238460A1 (en) * | 2007-03-30 | 2008-10-02 | Lothar Kress | Accurate alignment of semiconductor devices and sockets |
TWM324868U (en) * | 2007-05-07 | 2008-01-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
WO2008139579A1 (ja) * | 2007-05-09 | 2008-11-20 | Advantest Corporation | 電子部品試験装置、電子部品試験システム及び電子部品の試験方法 |
TWM333699U (en) * | 2007-10-22 | 2008-06-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
TWI364809B (en) * | 2008-02-14 | 2012-05-21 | Chipmos Technologies Inc | A wafer testing system integrated with rfid techniques and testing method thereof |
US7863890B2 (en) * | 2008-08-19 | 2011-01-04 | Kia Silverbrook | Apparatus for testing integrated circuitry |
JPWO2010097907A1 (ja) * | 2009-02-25 | 2012-08-30 | セイコーインスツル株式会社 | パッケージの製造方法、並びにパッケージ、圧電振動子、発振器、電子機器及び電波時計 |
JP4457180B1 (ja) * | 2009-08-07 | 2010-04-28 | 株式会社アドバンテスト | ウエハトレイおよび試験装置 |
JP5616047B2 (ja) * | 2009-10-19 | 2014-10-29 | 株式会社アドバンテスト | 製造装置、試験装置、製造方法および集積回路パッケージ |
JP2011086880A (ja) * | 2009-10-19 | 2011-04-28 | Advantest Corp | 電子部品実装装置および電子部品の実装方法 |
JP5368290B2 (ja) | 2009-12-18 | 2013-12-18 | 株式会社アドバンテスト | キャリア組立装置 |
JP2011163807A (ja) * | 2010-02-05 | 2011-08-25 | Advantest Corp | 電子部品試験装置 |
JP2011237260A (ja) | 2010-05-10 | 2011-11-24 | Advantest Corp | キャリア分解装置及びキャリア分解方法 |
JP5314634B2 (ja) | 2010-05-17 | 2013-10-16 | 株式会社アドバンテスト | 試験装置、試験方法、およびデバイスインターフェイス |
WO2012029130A1 (ja) | 2010-08-31 | 2012-03-08 | 株式会社アドバンテスト | ウェハトレイ、半導体ウェハ試験装置、及び半導体ウェハの試験方法 |
TWI454001B (zh) | 2010-09-06 | 2014-09-21 | Giga Byte Tech Co Ltd | 主機板及其插座 |
TW201221988A (en) * | 2010-11-18 | 2012-06-01 | Askey Computer Corp | Inspection fixture for light emitting diode array |
KR101798440B1 (ko) * | 2011-03-08 | 2017-11-16 | 삼성전자주식회사 | 반도체 장치의 검사 장치 및 반도체 장치의 검사 방법 |
KR101217205B1 (ko) * | 2011-09-23 | 2012-12-31 | 하이콘 주식회사 | 아이씨 테스트용 소켓장치 |
JP2013079860A (ja) * | 2011-10-04 | 2013-05-02 | Advantest Corp | ソケット及び電子部品試験装置 |
WO2013169728A2 (en) * | 2012-05-07 | 2013-11-14 | Flextronics Ap, Llc | Universal device multi-function test apparatus |
TW201411149A (zh) * | 2012-05-31 | 2014-03-16 | Advantest Corp | 電子元件測試裝置、電子元件收容裝置、電子元件取出裝置以及電子元件之測試方法 |
TW201409046A (zh) | 2012-05-31 | 2014-03-01 | Advantest Corp | 載具分解裝置、電子元件收容裝置、電子元件取出裝置以及電子元件測試裝置 |
US9270251B2 (en) * | 2013-03-15 | 2016-02-23 | Adaptive Methods, Inc. | Carrier for mounting a piezoelectric device on a circuit board and method for mounting a piezoelectric device on a circuit board |
US20150168450A1 (en) * | 2013-12-17 | 2015-06-18 | Tim WOODEN | Coaxial Impedance-Matched Test Socket |
TWI603096B (zh) * | 2015-06-19 | 2017-10-21 | Seiko Epson Corp | Electronic parts conveying apparatus and electronic parts inspection apparatus |
US10768206B2 (en) * | 2015-06-24 | 2020-09-08 | Integrated Technology Corporation | Loop-back probe test and verification method |
KR102332339B1 (ko) * | 2015-07-08 | 2021-12-01 | 삼성전자주식회사 | 진공 소켓 및 이를 포함하는 반도체 검사 장비 |
CN108738355B (zh) * | 2015-11-25 | 2020-11-06 | 佛姆法克特股份有限公司 | 用于测试插座的浮动嵌套 |
US10168384B2 (en) * | 2016-07-18 | 2019-01-01 | Xilinx, Inc. | Modular testing system with versatile robot |
JP7068578B2 (ja) * | 2018-03-30 | 2022-05-17 | 山一電機株式会社 | 検査用ソケット |
JP7281250B2 (ja) | 2018-05-11 | 2023-05-25 | 株式会社アドバンテスト | 試験用キャリア |
-
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- 2018-05-11 JP JP2018091984A patent/JP7281250B2/ja active Active
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001033520A (ja) | 1999-07-26 | 2001-02-09 | Advantest Corp | Icハンドラ装置のicコンタクト部 |
JP2001102418A (ja) | 1999-09-29 | 2001-04-13 | Tokyo Electron Ltd | 高速測定対応プローブ装置 |
JP2001208795A (ja) | 2000-01-28 | 2001-08-03 | Ando Electric Co Ltd | キャリア識別システム、キャリア識別方法および記憶媒体 |
JP2004152495A (ja) | 2002-10-28 | 2004-05-27 | Yamaichi Electronics Co Ltd | 狭ピッチicパッケージ用icソケット |
WO2004074858A1 (ja) | 2003-02-21 | 2004-09-02 | Nhk Spring Co., Ltd. | チップ実装用テープの検査方法及び検査に用いるプローブユニット |
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