|
US20130023129A1
(en)
|
2011-07-20 |
2013-01-24 |
Asm America, Inc. |
Pressure transmitter for a semiconductor processing environment
|
|
US9212099B2
(en)
|
2012-02-22 |
2015-12-15 |
Applied Materials, Inc. |
Heat treated ceramic substrate having ceramic coating and heat treatment for coated ceramics
|
|
US9343289B2
(en)
|
2012-07-27 |
2016-05-17 |
Applied Materials, Inc. |
Chemistry compatible coating material for advanced device on-wafer particle performance
|
|
US10714315B2
(en)
|
2012-10-12 |
2020-07-14 |
Asm Ip Holdings B.V. |
Semiconductor reaction chamber showerhead
|
|
US20160376700A1
(en)
|
2013-02-01 |
2016-12-29 |
Asm Ip Holding B.V. |
System for treatment of deposition reactor
|
|
US9850568B2
(en)
|
2013-06-20 |
2017-12-26 |
Applied Materials, Inc. |
Plasma erosion resistant rare-earth oxide based thin film coatings
|
|
US9711334B2
(en)
|
2013-07-19 |
2017-07-18 |
Applied Materials, Inc. |
Ion assisted deposition for rare-earth oxide based thin film coatings on process rings
|
|
US9583369B2
(en)
|
2013-07-20 |
2017-02-28 |
Applied Materials, Inc. |
Ion assisted deposition for rare-earth oxide based coatings on lids and nozzles
|
|
US20150079370A1
(en)
|
2013-09-18 |
2015-03-19 |
Applied Materials, Inc. |
Coating architecture for plasma sprayed chamber components
|
|
US9440886B2
(en)
|
2013-11-12 |
2016-09-13 |
Applied Materials, Inc. |
Rare-earth oxide based monolithic chamber material
|
|
US9725799B2
(en)
|
2013-12-06 |
2017-08-08 |
Applied Materials, Inc. |
Ion beam sputtering with ion assisted deposition for coatings on chamber components
|
|
US11015245B2
(en)
|
2014-03-19 |
2021-05-25 |
Asm Ip Holding B.V. |
Gas-phase reactor and system having exhaust plenum and components thereof
|
|
US9869013B2
(en)
*
|
2014-04-25 |
2018-01-16 |
Applied Materials, Inc. |
Ion assisted deposition top coat of rare-earth oxide
|
|
US9976211B2
(en)
*
|
2014-04-25 |
2018-05-22 |
Applied Materials, Inc. |
Plasma erosion resistant thin film coating for high temperature application
|
|
US10730798B2
(en)
|
2014-05-07 |
2020-08-04 |
Applied Materials, Inc. |
Slurry plasma spray of plasma resistant ceramic coating
|
|
US10858737B2
(en)
|
2014-07-28 |
2020-12-08 |
Asm Ip Holding B.V. |
Showerhead assembly and components thereof
|
|
US9460898B2
(en)
|
2014-08-08 |
2016-10-04 |
Applied Materials, Inc. |
Plasma generation chamber with smooth plasma resistant coating
|
|
US10941490B2
(en)
|
2014-10-07 |
2021-03-09 |
Asm Ip Holding B.V. |
Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same
|
|
US10276355B2
(en)
|
2015-03-12 |
2019-04-30 |
Asm Ip Holding B.V. |
Multi-zone reactor, system including the reactor, and method of using the same
|
|
US9828672B2
(en)
|
2015-03-26 |
2017-11-28 |
Lam Research Corporation |
Minimizing radical recombination using ALD silicon oxide surface coating with intermittent restoration plasma
|
|
US10458018B2
(en)
|
2015-06-26 |
2019-10-29 |
Asm Ip Holding B.V. |
Structures including metal carbide material, devices including the structures, and methods of forming same
|
|
US10211308B2
(en)
|
2015-10-21 |
2019-02-19 |
Asm Ip Holding B.V. |
NbMC layers
|
|
US11139308B2
(en)
|
2015-12-29 |
2021-10-05 |
Asm Ip Holding B.V. |
Atomic layer deposition of III-V compounds to form V-NAND devices
|
|
US10529554B2
(en)
|
2016-02-19 |
2020-01-07 |
Asm Ip Holding B.V. |
Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches
|
|
US10343920B2
(en)
|
2016-03-18 |
2019-07-09 |
Asm Ip Holding B.V. |
Aligned carbon nanotubes
|
|
US11326253B2
(en)
*
|
2016-04-27 |
2022-05-10 |
Applied Materials, Inc. |
Atomic layer deposition of protective coatings for semiconductor process chamber components
|
|
US10367080B2
(en)
|
2016-05-02 |
2019-07-30 |
Asm Ip Holding B.V. |
Method of forming a germanium oxynitride film
|
|
US11572617B2
(en)
*
|
2016-05-03 |
2023-02-07 |
Applied Materials, Inc. |
Protective metal oxy-fluoride coatings
|
|
US11453943B2
(en)
|
2016-05-25 |
2022-09-27 |
Asm Ip Holding B.V. |
Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor
|
|
US9850573B1
(en)
|
2016-06-23 |
2017-12-26 |
Applied Materials, Inc. |
Non-line of sight deposition of erbium based plasma resistant ceramic coating
|
|
US10612137B2
(en)
|
2016-07-08 |
2020-04-07 |
Asm Ip Holdings B.V. |
Organic reactants for atomic layer deposition
|
|
US9859151B1
(en)
|
2016-07-08 |
2018-01-02 |
Asm Ip Holding B.V. |
Selective film deposition method to form air gaps
|
|
US20180016678A1
(en)
|
2016-07-15 |
2018-01-18 |
Applied Materials, Inc. |
Multi-layer coating with diffusion barrier layer and erosion resistant layer
|
|
US9887082B1
(en)
|
2016-07-28 |
2018-02-06 |
Asm Ip Holding B.V. |
Method and apparatus for filling a gap
|
|
US9812320B1
(en)
|
2016-07-28 |
2017-11-07 |
Asm Ip Holding B.V. |
Method and apparatus for filling a gap
|
|
KR102532607B1
(ko)
|
2016-07-28 |
2023-05-15 |
에이에스엠 아이피 홀딩 비.브이. |
기판 가공 장치 및 그 동작 방법
|
|
US11532757B2
(en)
|
2016-10-27 |
2022-12-20 |
Asm Ip Holding B.V. |
Deposition of charge trapping layers
|
|
US10714350B2
(en)
|
2016-11-01 |
2020-07-14 |
ASM IP Holdings, B.V. |
Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures
|
|
KR102546317B1
(ko)
|
2016-11-15 |
2023-06-21 |
에이에스엠 아이피 홀딩 비.브이. |
기체 공급 유닛 및 이를 포함하는 기판 처리 장치
|
|
KR102762543B1
(ko)
|
2016-12-14 |
2025-02-05 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
|
US11447861B2
(en)
|
2016-12-15 |
2022-09-20 |
Asm Ip Holding B.V. |
Sequential infiltration synthesis apparatus and a method of forming a patterned structure
|
|
US11581186B2
(en)
|
2016-12-15 |
2023-02-14 |
Asm Ip Holding B.V. |
Sequential infiltration synthesis apparatus
|
|
KR102700194B1
(ko)
|
2016-12-19 |
2024-08-28 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
|
US10269558B2
(en)
|
2016-12-22 |
2019-04-23 |
Asm Ip Holding B.V. |
Method of forming a structure on a substrate
|
|
US11390950B2
(en)
|
2017-01-10 |
2022-07-19 |
Asm Ip Holding B.V. |
Reactor system and method to reduce residue buildup during a film deposition process
|
|
US10186400B2
(en)
|
2017-01-20 |
2019-01-22 |
Applied Materials, Inc. |
Multi-layer plasma resistant coating by atomic layer deposition
|
|
US10468261B2
(en)
|
2017-02-15 |
2019-11-05 |
Asm Ip Holding B.V. |
Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures
|
|
US10975469B2
(en)
*
|
2017-03-17 |
2021-04-13 |
Applied Materials, Inc. |
Plasma resistant coating of porous body by atomic layer deposition
|
|
US10529563B2
(en)
|
2017-03-29 |
2020-01-07 |
Asm Ip Holdings B.V. |
Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures
|
|
US10770286B2
(en)
|
2017-05-08 |
2020-09-08 |
Asm Ip Holdings B.V. |
Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures
|
|
US10755900B2
(en)
|
2017-05-10 |
2020-08-25 |
Applied Materials, Inc. |
Multi-layer plasma erosion protection for chamber components
|
|
US12040200B2
(en)
|
2017-06-20 |
2024-07-16 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus and methods for calibrating a semiconductor processing apparatus
|
|
US11306395B2
(en)
|
2017-06-28 |
2022-04-19 |
Asm Ip Holding B.V. |
Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus
|
|
KR20190009245A
(ko)
|
2017-07-18 |
2019-01-28 |
에이에스엠 아이피 홀딩 비.브이. |
반도체 소자 구조물 형성 방법 및 관련된 반도체 소자 구조물
|
|
US11374112B2
(en)
|
2017-07-19 |
2022-06-28 |
Asm Ip Holding B.V. |
Method for depositing a group IV semiconductor and related semiconductor device structures
|
|
US11018002B2
(en)
|
2017-07-19 |
2021-05-25 |
Asm Ip Holding B.V. |
Method for selectively depositing a Group IV semiconductor and related semiconductor device structures
|
|
US10541333B2
(en)
|
2017-07-19 |
2020-01-21 |
Asm Ip Holding B.V. |
Method for depositing a group IV semiconductor and related semiconductor device structures
|
|
US10590535B2
(en)
|
2017-07-26 |
2020-03-17 |
Asm Ip Holdings B.V. |
Chemical treatment, deposition and/or infiltration apparatus and method for using the same
|
|
TWI815813B
(zh)
|
2017-08-04 |
2023-09-21 |
荷蘭商Ａｓｍ智慧財產控股公司 |
用於分配反應腔內氣體的噴頭總成
|
|
US10770336B2
(en)
|
2017-08-08 |
2020-09-08 |
Asm Ip Holding B.V. |
Substrate lift mechanism and reactor including same
|
|
US10692741B2
(en)
|
2017-08-08 |
2020-06-23 |
Asm Ip Holdings B.V. |
Radiation shield
|
|
US11139191B2
(en)
|
2017-08-09 |
2021-10-05 |
Asm Ip Holding B.V. |
Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
|
|
US11769682B2
(en)
|
2017-08-09 |
2023-09-26 |
Asm Ip Holding B.V. |
Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
|
|
US20190136372A1
(en)
*
|
2017-08-14 |
2019-05-09 |
Applied Materials, Inc. |
Atomic layer deposition coatings for high temperature heaters
|
|
US11830730B2
(en)
|
2017-08-29 |
2023-11-28 |
Asm Ip Holding B.V. |
Layer forming method and apparatus
|
|
KR102491945B1
(ko)
|
2017-08-30 |
2023-01-26 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
|
US11056344B2
(en)
|
2017-08-30 |
2021-07-06 |
Asm Ip Holding B.V. |
Layer forming method
|
|
US11295980B2
(en)
|
2017-08-30 |
2022-04-05 |
Asm Ip Holding B.V. |
Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures
|
|
US10658205B2
(en)
|
2017-09-28 |
2020-05-19 |
Asm Ip Holdings B.V. |
Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber
|
|
US10403504B2
(en)
|
2017-10-05 |
2019-09-03 |
Asm Ip Holding B.V. |
Method for selectively depositing a metallic film on a substrate
|
|
CN111213227B
(zh)
*
|
2017-10-19 |
2023-10-13 |
瑞士艾发科技 |
用于处理衬底的方法和设备
|
|
US11279656B2
(en)
|
2017-10-27 |
2022-03-22 |
Applied Materials, Inc. |
Nanopowders, nanoceramic materials and methods of making and use thereof
|
|
US10923344B2
(en)
|
2017-10-30 |
2021-02-16 |
Asm Ip Holding B.V. |
Methods for forming a semiconductor structure and related semiconductor structures
|
|
US11022879B2
(en)
|
2017-11-24 |
2021-06-01 |
Asm Ip Holding B.V. |
Method of forming an enhanced unexposed photoresist layer
|
|
CN111316417B
(zh)
|
2017-11-27 |
2023-12-22 |
阿斯莫Ip控股公司 |
与批式炉偕同使用的用于储存晶圆匣的储存装置
|
|
KR102633318B1
(ko)
|
2017-11-27 |
2024-02-05 |
에이에스엠 아이피 홀딩 비.브이. |
청정 소형 구역을 포함한 장치
|
|
US11761079B2
(en)
|
2017-12-07 |
2023-09-19 |
Lam Research Corporation |
Oxidation resistant protective layer in chamber conditioning
|
|
US10760158B2
(en)
*
|
2017-12-15 |
2020-09-01 |
Lam Research Corporation |
Ex situ coating of chamber components for semiconductor processing
|
|
TWI713961B
(zh)
*
|
2018-01-15 |
2020-12-21 |
美商應用材料股份有限公司 |
針對碳化鎢膜改善附著及缺陷之技術
|
|
US10872771B2
(en)
|
2018-01-16 |
2020-12-22 |
Asm Ip Holding B. V. |
Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures
|
|
TWI799494B
(zh)
|
2018-01-19 |
2023-04-21 |
荷蘭商Ａｓｍ 智慧財產控股公司 |
沈積方法
|
|
KR102695659B1
(ko)
|
2018-01-19 |
2024-08-14 |
에이에스엠 아이피 홀딩 비.브이. |
플라즈마 보조 증착에 의해 갭 충진 층을 증착하는 방법
|
|
US11081345B2
(en)
|
2018-02-06 |
2021-08-03 |
Asm Ip Holding B.V. |
Method of post-deposition treatment for silicon oxide film
|
|
US10896820B2
(en)
|
2018-02-14 |
2021-01-19 |
Asm Ip Holding B.V. |
Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
|
|
US11685991B2
(en)
|
2018-02-14 |
2023-06-27 |
Asm Ip Holding B.V. |
Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
|
|
US10731249B2
(en)
|
2018-02-15 |
2020-08-04 |
Asm Ip Holding B.V. |
Method of forming a transition metal containing film on a substrate by a cyclical deposition process, a method for supplying a transition metal halide compound to a reaction chamber, and related vapor deposition apparatus
|
|
KR102636427B1
(ko)
|
2018-02-20 |
2024-02-13 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법 및 장치
|
|
US10975470B2
(en)
|
2018-02-23 |
2021-04-13 |
Asm Ip Holding B.V. |
Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment
|
|
US11047035B2
(en)
|
2018-02-23 |
2021-06-29 |
Applied Materials, Inc. |
Protective yttria coating for semiconductor equipment parts
|
|
US11473195B2
(en)
|
2018-03-01 |
2022-10-18 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus and a method for processing a substrate
|
|
US11629406B2
(en)
|
2018-03-09 |
2023-04-18 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate
|
|
US11114283B2
(en)
|
2018-03-16 |
2021-09-07 |
Asm Ip Holding B.V. |
Reactor, system including the reactor, and methods of manufacturing and using same
|
|
KR102646467B1
(ko)
|
2018-03-27 |
2024-03-11 |
에이에스엠 아이피 홀딩 비.브이. |
기판 상에 전극을 형성하는 방법 및 전극을 포함하는 반도체 소자 구조
|
|
US11088002B2
(en)
|
2018-03-29 |
2021-08-10 |
Asm Ip Holding B.V. |
Substrate rack and a substrate processing system and method
|
|
US11230766B2
(en)
|
2018-03-29 |
2022-01-25 |
Asm Ip Holding B.V. |
Substrate processing apparatus and method
|
|
US10443126B1
(en)
|
2018-04-06 |
2019-10-15 |
Applied Materials, Inc. |
Zone-controlled rare-earth oxide ALD and CVD coatings
|
|
KR102600229B1
(ko)
|
2018-04-09 |
2023-11-10 |
에이에스엠 아이피 홀딩 비.브이. |
기판 지지 장치, 이를 포함하는 기판 처리 장치 및 기판 처리 방법
|
|
US12025484B2
(en)
|
2018-05-08 |
2024-07-02 |
Asm Ip Holding B.V. |
Thin film forming method
|
|
KR102709511B1
(ko)
|
2018-05-08 |
2024-09-24 |
에이에스엠 아이피 홀딩 비.브이. |
기판 상에 산화물 막을 주기적 증착 공정에 의해 증착하기 위한 방법 및 관련 소자 구조
|
|
US12272527B2
(en)
|
2018-05-09 |
2025-04-08 |
Asm Ip Holding B.V. |
Apparatus for use with hydrogen radicals and method of using same
|
|
KR102596988B1
(ko)
|
2018-05-28 |
2023-10-31 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법 및 그에 의해 제조된 장치
|
|
US11718913B2
(en)
|
2018-06-04 |
2023-08-08 |
Asm Ip Holding B.V. |
Gas distribution system and reactor system including same
|
|
TWI840362B
(zh)
|
2018-06-04 |
2024-05-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
水氣降低的晶圓處置腔室
|
|
US11286562B2
(en)
|
2018-06-08 |
2022-03-29 |
Asm Ip Holding B.V. |
Gas-phase chemical reactor and method of using same
|
|
US11401599B2
(en)
|
2018-06-18 |
2022-08-02 |
Applied Materials, Inc. |
Erosion resistant metal silicate coatings
|
|
US10797133B2
(en)
|
2018-06-21 |
2020-10-06 |
Asm Ip Holding B.V. |
Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures
|
|
KR102568797B1
(ko)
|
2018-06-21 |
2023-08-21 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 시스템
|
|
US11492703B2
(en)
|
2018-06-27 |
2022-11-08 |
Asm Ip Holding B.V. |
Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material
|
|
CN120591748A
(zh)
|
2018-06-27 |
2025-09-05 |
Asm Ip私人控股有限公司 |
用于形成含金属的材料的循环沉积方法及膜和结构
|
|
US10612136B2
(en)
|
2018-06-29 |
2020-04-07 |
ASM IP Holding, B.V. |
Temperature-controlled flange and reactor system including same
|
|
US10388513B1
(en)
|
2018-07-03 |
2019-08-20 |
Asm Ip Holding B.V. |
Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
|
|
US10755922B2
(en)
|
2018-07-03 |
2020-08-25 |
Asm Ip Holding B.V. |
Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
|
|
US11667575B2
(en)
|
2018-07-18 |
2023-06-06 |
Applied Materials, Inc. |
Erosion resistant metal oxide coatings
|
|
US11053591B2
(en)
|
2018-08-06 |
2021-07-06 |
Asm Ip Holding B.V. |
Multi-port gas injection system and reactor system including same
|
|
US11430674B2
(en)
|
2018-08-22 |
2022-08-30 |
Asm Ip Holding B.V. |
Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
|
|
US11024523B2
(en)
|
2018-09-11 |
2021-06-01 |
Asm Ip Holding B.V. |
Substrate processing apparatus and method
|
|
KR102707956B1
(ko)
|
2018-09-11 |
2024-09-19 |
에이에스엠 아이피 홀딩 비.브이. |
박막 증착 방법
|
|
US11049751B2
(en)
|
2018-09-14 |
2021-06-29 |
Asm Ip Holding B.V. |
Cassette supply system to store and handle cassettes and processing apparatus equipped therewith
|
|
CN110970344B
(zh)
|
2018-10-01 |
2024-10-25 |
Asmip控股有限公司 |
衬底保持设备、包含所述设备的系统及其使用方法
|
|
US11232963B2
(en)
|
2018-10-03 |
2022-01-25 |
Asm Ip Holding B.V. |
Substrate processing apparatus and method
|
|
KR102592699B1
(ko)
|
2018-10-08 |
2023-10-23 |
에이에스엠 아이피 홀딩 비.브이. |
기판 지지 유닛 및 이를 포함하는 박막 증착 장치와 기판 처리 장치
|
|
US12371781B2
(en)
|
2018-10-19 |
2025-07-29 |
Lam Research Corporation |
In situ protective coating of chamber components for semiconductor processing
|
|
KR102546322B1
(ko)
|
2018-10-19 |
2023-06-21 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치 및 기판 처리 방법
|
|
KR102605121B1
(ko)
|
2018-10-19 |
2023-11-23 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치 및 기판 처리 방법
|
|
USD948463S1
(en)
|
2018-10-24 |
2022-04-12 |
Asm Ip Holding B.V. |
Susceptor for semiconductor substrate supporting apparatus
|
|
US12378665B2
(en)
*
|
2018-10-26 |
2025-08-05 |
Asm Ip Holding B.V. |
High temperature coatings for a preclean and etch apparatus and related methods
|
|
US11087997B2
(en)
|
2018-10-31 |
2021-08-10 |
Asm Ip Holding B.V. |
Substrate processing apparatus for processing substrates
|
|
KR102748291B1
(ko)
|
2018-11-02 |
2024-12-31 |
에이에스엠 아이피 홀딩 비.브이. |
기판 지지 유닛 및 이를 포함하는 기판 처리 장치
|
|
US11572620B2
(en)
|
2018-11-06 |
2023-02-07 |
Asm Ip Holding B.V. |
Methods for selectively depositing an amorphous silicon film on a substrate
|
|
US11031242B2
(en)
|
2018-11-07 |
2021-06-08 |
Asm Ip Holding B.V. |
Methods for depositing a boron doped silicon germanium film
|
|
US10847366B2
(en)
|
2018-11-16 |
2020-11-24 |
Asm Ip Holding B.V. |
Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process
|
|
US10818758B2
(en)
|
2018-11-16 |
2020-10-27 |
Asm Ip Holding B.V. |
Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures
|
|
US12040199B2
(en)
|
2018-11-28 |
2024-07-16 |
Asm Ip Holding B.V. |
Substrate processing apparatus for processing substrates
|
|
US11217444B2
(en)
|
2018-11-30 |
2022-01-04 |
Asm Ip Holding B.V. |
Method for forming an ultraviolet radiation responsive metal oxide-containing film
|
|
KR102636428B1
(ko)
|
2018-12-04 |
2024-02-13 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치를 세정하는 방법
|
|
US11180847B2
(en)
|
2018-12-06 |
2021-11-23 |
Applied Materials, Inc. |
Atomic layer deposition coatings for high temperature ceramic components
|
|
US11562890B2
(en)
*
|
2018-12-06 |
2023-01-24 |
Applied Materials, Inc. |
Corrosion resistant ground shield of processing chamber
|
|
US11158513B2
(en)
|
2018-12-13 |
2021-10-26 |
Asm Ip Holding B.V. |
Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures
|
|
JP7504584B2
(ja)
|
2018-12-14 |
2024-06-24 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
窒化ガリウムの選択的堆積を用いてデバイス構造体を形成する方法及びそのためのシステム
|
|
TWI866480B
(zh)
|
2019-01-17 |
2024-12-11 |
荷蘭商Ａｓｍ Ｉｐ 私人控股有限公司 |
藉由循環沈積製程於基板上形成含過渡金屬膜之方法
|
|
KR102727227B1
(ko)
|
2019-01-22 |
2024-11-07 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
|
CN111524788B
(zh)
|
2019-02-01 |
2023-11-24 |
Asm Ip私人控股有限公司 |
氧化硅的拓扑选择性膜形成的方法
|
|
US11482533B2
(en)
|
2019-02-20 |
2022-10-25 |
Asm Ip Holding B.V. |
Apparatus and methods for plug fill deposition in 3-D NAND applications
|
|
JP7509548B2
(ja)
|
2019-02-20 |
2024-07-02 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
基材表面内に形成された凹部を充填するための周期的堆積方法および装置
|
|
TWI873122B
(zh)
|
2019-02-20 |
2025-02-21 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
填充一基板之一表面內所形成的一凹槽的方法、根據其所形成之半導體結構、及半導體處理設備
|
|
KR102626263B1
(ko)
|
2019-02-20 |
2024-01-16 |
에이에스엠 아이피 홀딩 비.브이. |
처리 단계를 포함하는 주기적 증착 방법 및 이를 위한 장치
|
|
TWI842826B
(zh)
|
2019-02-22 |
2024-05-21 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
基材處理設備及處理基材之方法
|
|
US11742198B2
(en)
|
2019-03-08 |
2023-08-29 |
Asm Ip Holding B.V. |
Structure including SiOCN layer and method of forming same
|
|
KR102858005B1
(ko)
|
2019-03-08 |
2025-09-09 |
에이에스엠 아이피 홀딩 비.브이. |
실리콘 질화물 층을 선택적으로 증착하는 방법, 및 선택적으로 증착된 실리콘 질화물 층을 포함하는 구조체
|
|
KR102782593B1
(ko)
|
2019-03-08 |
2025-03-14 |
에이에스엠 아이피 홀딩 비.브이. |
SiOC 층을 포함한 구조체 및 이의 형성 방법
|
|
US10858741B2
(en)
|
2019-03-11 |
2020-12-08 |
Applied Materials, Inc. |
Plasma resistant multi-layer architecture for high aspect ratio parts
|
|
KR20200116033A
(ko)
|
2019-03-28 |
2020-10-08 |
에이에스엠 아이피 홀딩 비.브이. |
도어 개방기 및 이를 구비한 기판 처리 장치
|
|
KR102809999B1
(ko)
|
2019-04-01 |
2025-05-19 |
에이에스엠 아이피 홀딩 비.브이. |
반도체 소자를 제조하는 방법
|
|
US11447864B2
(en)
|
2019-04-19 |
2022-09-20 |
Asm Ip Holding B.V. |
Layer forming method and apparatus
|
|
KR20200125453A
(ko)
|
2019-04-24 |
2020-11-04 |
에이에스엠 아이피 홀딩 비.브이. |
기상 반응기 시스템 및 이를 사용하는 방법
|
|
KR102929471B1
(ko)
|
2019-05-07 |
2026-02-20 |
에이에스엠 아이피 홀딩 비.브이. |
딥 튜브가 있는 화학물질 공급원 용기
|
|
KR102869364B1
(ko)
|
2019-05-07 |
2025-10-10 |
에이에스엠 아이피 홀딩 비.브이. |
비정질 탄소 중합체 막을 개질하는 방법
|
|
KR102929472B1
(ko)
|
2019-05-10 |
2026-02-20 |
에이에스엠 아이피 홀딩 비.브이. |
표면 상에 재료를 증착하는 방법 및 본 방법에 따라 형성된 구조
|
|
JP7598201B2
(ja)
|
2019-05-16 |
2024-12-11 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
ウェハボートハンドリング装置、縦型バッチ炉および方法
|
|
JP7612342B2
(ja)
|
2019-05-16 |
2025-01-14 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
ウェハボートハンドリング装置、縦型バッチ炉および方法
|
|
USD975665S1
(en)
|
2019-05-17 |
2023-01-17 |
Asm Ip Holding B.V. |
Susceptor shaft
|
|
USD947913S1
(en)
|
2019-05-17 |
2022-04-05 |
Asm Ip Holding B.V. |
Susceptor shaft
|
|
USD935572S1
(en)
|
2019-05-24 |
2021-11-09 |
Asm Ip Holding B.V. |
Gas channel plate
|
|
USD922229S1
(en)
|
2019-06-05 |
2021-06-15 |
Asm Ip Holding B.V. |
Device for controlling a temperature of a gas supply unit
|
|
KR20200141002A
(ko)
|
2019-06-06 |
2020-12-17 |
에이에스엠 아이피 홀딩 비.브이. |
배기 가스 분석을 포함한 기상 반응기 시스템을 사용하는 방법
|
|
KR102867171B1
(ko)
*
|
2019-06-08 |
2025-09-30 |
어플라이드 머티어리얼스, 인코포레이티드 |
내화학성 표면들을 갖는 rf 컴포넌트들
|
|
KR102918757B1
(ko)
|
2019-06-10 |
2026-01-28 |
에이에스엠 아이피 홀딩 비.브이. |
석영 에피택셜 챔버를 세정하는 방법
|
|
KR20200143254A
(ko)
|
2019-06-11 |
2020-12-23 |
에이에스엠 아이피 홀딩 비.브이. |
개질 가스를 사용하여 전자 구조를 형성하는 방법, 상기 방법을 수행하기 위한 시스템, 및 상기 방법을 사용하여 형성되는 구조
|
|
USD944946S1
(en)
|
2019-06-14 |
2022-03-01 |
Asm Ip Holding B.V. |
Shower plate
|
|
US11557464B2
(en)
*
|
2019-06-20 |
2023-01-17 |
Applied Materials, Inc. |
Semiconductor chamber coatings and processes
|
|
USD931978S1
(en)
|
2019-06-27 |
2021-09-28 |
Asm Ip Holding B.V. |
Showerhead vacuum transport
|
|
KR102911421B1
(ko)
|
2019-07-03 |
2026-01-12 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치용 온도 제어 조립체 및 이를 사용하는 방법
|
|
JP7499079B2
(ja)
|
2019-07-09 |
2024-06-13 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
同軸導波管を用いたプラズマ装置、基板処理方法
|
|
CN112216646B
(zh)
|
2019-07-10 |
2026-02-10 |
Asmip私人控股有限公司 |
基板支撑组件及包括其的基板处理装置
|
|
KR102895115B1
(ko)
|
2019-07-16 |
2025-12-03 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
|
TWI826704B
(zh)
|
2019-07-17 |
2023-12-21 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
自由基輔助引燃電漿系統和方法
|
|
KR102860110B1
(ko)
|
2019-07-17 |
2025-09-16 |
에이에스엠 아이피 홀딩 비.브이. |
실리콘 게르마늄 구조를 형성하는 방법
|
|
US11643724B2
(en)
|
2019-07-18 |
2023-05-09 |
Asm Ip Holding B.V. |
Method of forming structures using a neutral beam
|
|
KR102903090B1
(ko)
|
2019-07-19 |
2025-12-19 |
에이에스엠 아이피 홀딩 비.브이. |
토폴로지-제어된 비정질 탄소 중합체 막을 형성하는 방법
|
|
TWI839544B
(zh)
|
2019-07-19 |
2024-04-21 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
形成形貌受控的非晶碳聚合物膜之方法
|
|
CN112309843B
(zh)
|
2019-07-29 |
2026-01-23 |
Asmip私人控股有限公司 |
实现高掺杂剂掺入的选择性沉积方法
|
|
CN112309899B
(zh)
|
2019-07-30 |
2025-11-14 |
Asmip私人控股有限公司 |
基板处理设备
|
|
US12169361B2
(en)
|
2019-07-30 |
2024-12-17 |
Asm Ip Holding B.V. |
Substrate processing apparatus and method
|
|
CN112309900B
(zh)
|
2019-07-30 |
2025-11-04 |
Asmip私人控股有限公司 |
基板处理设备
|
|
US11587815B2
(en)
|
2019-07-31 |
2023-02-21 |
Asm Ip Holding B.V. |
Vertical batch furnace assembly
|
|
US11587814B2
(en)
|
2019-07-31 |
2023-02-21 |
Asm Ip Holding B.V. |
Vertical batch furnace assembly
|
|
US11227782B2
(en)
|
2019-07-31 |
2022-01-18 |
Asm Ip Holding B.V. |
Vertical batch furnace assembly
|
|
CN112323048B
(zh)
|
2019-08-05 |
2024-02-09 |
Asm Ip私人控股有限公司 |
用于化学源容器的液位传感器
|
|
KR20210018761A
(ko)
|
2019-08-09 |
2021-02-18 |
에이에스엠 아이피 홀딩 비.브이. |
냉각 장치를 포함한 히터 어셈블리 및 이를 사용하는 방법
|
|
USD965044S1
(en)
|
2019-08-19 |
2022-09-27 |
Asm Ip Holding B.V. |
Susceptor shaft
|
|
USD965524S1
(en)
|
2019-08-19 |
2022-10-04 |
Asm Ip Holding B.V. |
Susceptor support
|
|
JP7810514B2
(ja)
|
2019-08-21 |
2026-02-03 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
成膜原料混合ガス生成装置及び成膜装置
|
|
USD979506S1
(en)
|
2019-08-22 |
2023-02-28 |
Asm Ip Holding B.V. |
Insulator
|
|
USD940837S1
(en)
|
2019-08-22 |
2022-01-11 |
Asm Ip Holding B.V. |
Electrode
|
|
USD930782S1
(en)
|
2019-08-22 |
2021-09-14 |
Asm Ip Holding B.V. |
Gas distributor
|
|
USD949319S1
(en)
|
2019-08-22 |
2022-04-19 |
Asm Ip Holding B.V. |
Exhaust duct
|
|
KR20210024423A
(ko)
|
2019-08-22 |
2021-03-05 |
에이에스엠 아이피 홀딩 비.브이. |
홀을 구비한 구조체를 형성하기 위한 방법
|
|
US11286558B2
(en)
|
2019-08-23 |
2022-03-29 |
Asm Ip Holding B.V. |
Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film
|
|
KR102928101B1
(ko)
|
2019-08-23 |
2026-02-13 |
에이에스엠 아이피 홀딩 비.브이. |
비스(디에틸아미노)실란을 사용하여 peald에 의해 개선된 품질을 갖는 실리콘 산화물 막을 증착하기 위한 방법
|
|
KR102868968B1
(ko)
|
2019-09-03 |
2025-10-10 |
에이에스엠 아이피 홀딩 비.브이. |
칼코지나이드 막 및 상기 막을 포함한 구조체를 증착하기 위한 방법 및 장치
|
|
KR102806450B1
(ko)
|
2019-09-04 |
2025-05-12 |
에이에스엠 아이피 홀딩 비.브이. |
희생 캡핑 층을 이용한 선택적 증착 방법
|
|
KR102733104B1
(ko)
|
2019-09-05 |
2024-11-22 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
|
US11976357B2
(en)
|
2019-09-09 |
2024-05-07 |
Applied Materials, Inc. |
Methods for forming a protective coating on processing chamber surfaces or components
|
|
US12469693B2
(en)
|
2019-09-17 |
2025-11-11 |
Asm Ip Holding B.V. |
Method of forming a carbon-containing layer and structure including the layer
|
|
US11562901B2
(en)
|
2019-09-25 |
2023-01-24 |
Asm Ip Holding B.V. |
Substrate processing method
|
|
CN112593212B
(zh)
|
2019-10-02 |
2023-12-22 |
Asm Ip私人控股有限公司 |
通过循环等离子体增强沉积工艺形成拓扑选择性氧化硅膜的方法
|
|
TWI846953B
(zh)
|
2019-10-08 |
2024-07-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
基板處理裝置
|
|
KR102948143B1
(ko)
|
2019-10-08 |
2026-04-07 |
에이에스엠 아이피 홀딩 비.브이. |
활성 종을 이용하기 위한 가스 분배 어셈블리를 포함한 반응기 시스템 및 이를 사용하는 방법
|
|
TW202128273A
(zh)
|
2019-10-08 |
2021-08-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
氣體注入系統、及將材料沉積於反應室內之基板表面上的方法
|
|
TWI846966B
(zh)
|
2019-10-10 |
2024-07-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
形成光阻底層之方法及包括光阻底層之結構
|
|
US12009241B2
(en)
|
2019-10-14 |
2024-06-11 |
Asm Ip Holding B.V. |
Vertical batch furnace assembly with detector to detect cassette
|
|
TWI834919B
(zh)
|
2019-10-16 |
2024-03-11 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
氧化矽之拓撲選擇性膜形成之方法
|
|
US11637014B2
(en)
|
2019-10-17 |
2023-04-25 |
Asm Ip Holding B.V. |
Methods for selective deposition of doped semiconductor material
|
|
KR102845724B1
(ko)
|
2019-10-21 |
2025-08-13 |
에이에스엠 아이피 홀딩 비.브이. |
막을 선택적으로 에칭하기 위한 장치 및 방법
|
|
KR20210050453A
(ko)
|
2019-10-25 |
2021-05-07 |
에이에스엠 아이피 홀딩 비.브이. |
기판 표면 상의 갭 피처를 충진하는 방법 및 이와 관련된 반도체 소자 구조
|
|
US11646205B2
(en)
|
2019-10-29 |
2023-05-09 |
Asm Ip Holding B.V. |
Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same
|
|
KR102890638B1
(ko)
|
2019-11-05 |
2025-11-25 |
에이에스엠 아이피 홀딩 비.브이. |
도핑된 반도체 층을 갖는 구조체 및 이를 형성하기 위한 방법 및 시스템
|
|
US11501968B2
(en)
|
2019-11-15 |
2022-11-15 |
Asm Ip Holding B.V. |
Method for providing a semiconductor device with silicon filled gaps
|
|
KR102861314B1
(ko)
|
2019-11-20 |
2025-09-17 |
에이에스엠 아이피 홀딩 비.브이. |
기판의 표면 상에 탄소 함유 물질을 증착하는 방법, 상기 방법을 사용하여 형성된 구조물, 및 상기 구조물을 형성하기 위한 시스템
|
|
KR20220104779A
(ko)
*
|
2019-11-22 |
2022-07-26 |
램 리써치 코포레이션 |
플라즈마 챔버들을 위한 저온 소결된 (sintered) 코팅들
|
|
US11450529B2
(en)
|
2019-11-26 |
2022-09-20 |
Asm Ip Holding B.V. |
Methods for selectively forming a target film on a substrate comprising a first dielectric surface and a second metallic surface
|
|
CN112951697B
(zh)
|
2019-11-26 |
2025-07-29 |
Asmip私人控股有限公司 |
基板处理设备
|
|
CN120432376A
(zh)
|
2019-11-29 |
2025-08-05 |
Asm Ip私人控股有限公司 |
基板处理设备
|
|
CN112885692B
(zh)
|
2019-11-29 |
2025-08-15 |
Asmip私人控股有限公司 |
基板处理设备
|
|
JP7527928B2
(ja)
|
2019-12-02 |
2024-08-05 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
基板処理装置、基板処理方法
|
|
KR20210070898A
(ko)
|
2019-12-04 |
2021-06-15 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
|
US11885013B2
(en)
|
2019-12-17 |
2024-01-30 |
Asm Ip Holding B.V. |
Method of forming vanadium nitride layer and structure including the vanadium nitride layer
|
|
US11527403B2
(en)
|
2019-12-19 |
2022-12-13 |
Asm Ip Holding B.V. |
Methods for filling a gap feature on a substrate surface and related semiconductor structures
|
|
KR20210089077A
(ko)
|
2020-01-06 |
2021-07-15 |
에이에스엠 아이피 홀딩 비.브이. |
가스 공급 어셈블리, 이의 구성 요소, 및 이를 포함하는 반응기 시스템
|
|
TWI887322B
(zh)
|
2020-01-06 |
2025-06-21 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
反應器系統、抬升銷、及處理方法
|
|
US11993847B2
(en)
|
2020-01-08 |
2024-05-28 |
Asm Ip Holding B.V. |
Injector
|
|
KR102882467B1
(ko)
|
2020-01-16 |
2025-11-05 |
에이에스엠 아이피 홀딩 비.브이. |
고 종횡비 피처를 형성하는 방법
|
|
KR102675856B1
(ko)
|
2020-01-20 |
2024-06-17 |
에이에스엠 아이피 홀딩 비.브이. |
박막 형성 방법 및 박막 표면 개질 방법
|
|
TWI889744B
(zh)
|
2020-01-29 |
2025-07-11 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
污染物捕集系統、及擋板堆疊
|
|
TW202513845A
(zh)
|
2020-02-03 |
2025-04-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
半導體裝置結構及其形成方法
|
|
TWI908758B
(zh)
|
2020-02-04 |
2025-12-21 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
驗證一物品之方法、用於驗證一物品之設備、及用於驗證一反應室之系統
|
|
US11776846B2
(en)
|
2020-02-07 |
2023-10-03 |
Asm Ip Holding B.V. |
Methods for depositing gap filling fluids and related systems and devices
|
|
KR20210103953A
(ko)
|
2020-02-13 |
2021-08-24 |
에이에스엠 아이피 홀딩 비.브이. |
가스 분배 어셈블리 및 이를 사용하는 방법
|
|
KR102916725B1
(ko)
|
2020-02-13 |
2026-01-23 |
에이에스엠 아이피 홀딩 비.브이. |
수광 장치를 포함하는 기판 처리 장치 및 수광 장치의 교정 방법
|
|
US11781243B2
(en)
|
2020-02-17 |
2023-10-10 |
Asm Ip Holding B.V. |
Method for depositing low temperature phosphorous-doped silicon
|
|
TWI895326B
(zh)
|
2020-02-28 |
2025-09-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
專用於零件清潔的系統
|
|
KR102943116B1
(ko)
|
2020-03-04 |
2026-03-23 |
에이에스엠 아이피 홀딩 비.브이. |
반응기 시스템용 정렬 고정구
|
|
KR20210116240A
(ko)
|
2020-03-11 |
2021-09-27 |
에이에스엠 아이피 홀딩 비.브이. |
조절성 접합부를 갖는 기판 핸들링 장치
|
|
US11876356B2
(en)
|
2020-03-11 |
2024-01-16 |
Asm Ip Holding B.V. |
Lockout tagout assembly and system and method of using same
|
|
CN113394086A
(zh)
|
2020-03-12 |
2021-09-14 |
Asm Ip私人控股有限公司 |
用于制造具有目标拓扑轮廓的层结构的方法
|
|
US12173404B2
(en)
|
2020-03-17 |
2024-12-24 |
Asm Ip Holding B.V. |
Method of depositing epitaxial material, structure formed using the method, and system for performing the method
|
|
KR102755229B1
(ko)
|
2020-04-02 |
2025-01-14 |
에이에스엠 아이피 홀딩 비.브이. |
박막 형성 방법
|
|
TWI887376B
(zh)
|
2020-04-03 |
2025-06-21 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
半導體裝置的製造方法
|
|
TWI888525B
(zh)
|
2020-04-08 |
2025-07-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
用於選擇性蝕刻氧化矽膜之設備及方法
|
|
KR20210128343A
(ko)
|
2020-04-15 |
2021-10-26 |
에이에스엠 아이피 홀딩 비.브이. |
크롬 나이트라이드 층을 형성하는 방법 및 크롬 나이트라이드 층을 포함하는 구조
|
|
US11821078B2
(en)
|
2020-04-15 |
2023-11-21 |
Asm Ip Holding B.V. |
Method for forming precoat film and method for forming silicon-containing film
|
|
US11996289B2
(en)
|
2020-04-16 |
2024-05-28 |
Asm Ip Holding B.V. |
Methods of forming structures including silicon germanium and silicon layers, devices formed using the methods, and systems for performing the methods
|
|
TW202143328A
(zh)
|
2020-04-21 |
2021-11-16 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
用於調整膜應力之方法
|
|
KR102934380B1
(ko)
|
2020-04-24 |
2026-03-05 |
에이에스엠 아이피 홀딩 비.브이. |
바나듐 보라이드 및 바나듐 포스파이드 층을 포함한 구조체를 형성하는 방법
|
|
CN113555279A
(zh)
|
2020-04-24 |
2021-10-26 |
Asm Ip私人控股有限公司 |
形成含氮化钒的层的方法及包含其的结构
|
|
KR20210132600A
(ko)
|
2020-04-24 |
2021-11-04 |
에이에스엠 아이피 홀딩 비.브이. |
바나듐, 질소 및 추가 원소를 포함한 층을 증착하기 위한 방법 및 시스템
|
|
KR102866804B1
(ko)
|
2020-04-24 |
2025-09-30 |
에이에스엠 아이피 홀딩 비.브이. |
냉각 가스 공급부를 포함한 수직형 배치 퍼니스 어셈블리
|
|
KR20210132612A
(ko)
|
2020-04-24 |
2021-11-04 |
에이에스엠 아이피 홀딩 비.브이. |
바나듐 화합물들을 안정화하기 위한 방법들 및 장치
|
|
KR102783898B1
(ko)
|
2020-04-29 |
2025-03-18 |
에이에스엠 아이피 홀딩 비.브이. |
고체 소스 전구체 용기
|
|
JP7115582B2
(ja)
*
|
2020-04-30 |
2022-08-09 |
Toto株式会社 |
複合構造物および複合構造物を備えた半導体製造装置
|
|
KR20210134869A
(ko)
|
2020-05-01 |
2021-11-11 |
에이에스엠 아이피 홀딩 비.브이. |
Foup 핸들러를 이용한 foup의 빠른 교환
|
|
JP7726664B2
(ja)
|
2020-05-04 |
2025-08-20 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
基板を処理するための基板処理システム
|
|
JP7736446B2
(ja)
|
2020-05-07 |
2025-09-09 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
同調回路を備える反応器システム
|
|
KR102788543B1
(ko)
|
2020-05-13 |
2025-03-27 |
에이에스엠 아이피 홀딩 비.브이. |
반응기 시스템용 레이저 정렬 고정구
|
|
KR102936676B1
(ko)
|
2020-05-15 |
2026-03-10 |
에이에스엠 아이피 홀딩 비.브이. |
다중 전구체를 사용하여 실리콘 게르마늄 균일도를 제어하기 위한 방법
|
|
TWI911214B
(zh)
|
2020-05-19 |
2026-01-11 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
基材處理設備
|
|
KR20210145079A
(ko)
|
2020-05-21 |
2021-12-01 |
에이에스엠 아이피 홀딩 비.브이. |
기판을 처리하기 위한 플랜지 및 장치
|
|
KR102795476B1
(ko)
|
2020-05-21 |
2025-04-11 |
에이에스엠 아이피 홀딩 비.브이. |
다수의 탄소 층을 포함한 구조체 및 이를 형성하고 사용하는 방법
|
|
KR102702526B1
(ko)
|
2020-05-22 |
2024-09-03 |
에이에스엠 아이피 홀딩 비.브이. |
과산화수소를 사용하여 박막을 증착하기 위한 장치
|
|
KR20210146802A
(ko)
|
2020-05-26 |
2021-12-06 |
에이에스엠 아이피 홀딩 비.브이. |
붕소 및 갈륨을 함유한 실리콘 게르마늄 층을 증착하는 방법
|
|
WO2021241645A1
(ja)
*
|
2020-05-28 |
2021-12-02 |
京セラ株式会社 |
通気性プラグ、基板支持アセンブリおよびシャワープレート
|
|
TWI876048B
(zh)
|
2020-05-29 |
2025-03-11 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
基板處理方法
|
|
TW202212620A
(zh)
|
2020-06-02 |
2022-04-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
處理基板之設備、形成膜之方法、及控制用於處理基板之設備之方法
|
|
KR20210156219A
(ko)
|
2020-06-16 |
2021-12-24 |
에이에스엠 아이피 홀딩 비.브이. |
붕소를 함유한 실리콘 게르마늄 층을 증착하는 방법
|
|
TWI908816B
(zh)
|
2020-06-24 |
2025-12-21 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
形成含矽層之方法
|
|
TWI873359B
(zh)
|
2020-06-30 |
2025-02-21 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
基板處理方法
|
|
US12431354B2
(en)
|
2020-07-01 |
2025-09-30 |
Asm Ip Holding B.V. |
Silicon nitride and silicon oxide deposition methods using fluorine inhibitor
|
|
TW202202649A
(zh)
|
2020-07-08 |
2022-01-16 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
基板處理方法
|
|
TWI864307B
(zh)
|
2020-07-17 |
2024-12-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
用於光微影之結構、方法與系統
|
|
KR20220011092A
(ko)
|
2020-07-20 |
2022-01-27 |
에이에스엠 아이피 홀딩 비.브이. |
전이 금속층을 포함하는 구조체를 형성하기 위한 방법 및 시스템
|
|
TWI878570B
(zh)
|
2020-07-20 |
2025-04-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
用於沉積鉬層之方法及系統
|
|
JP7242612B2
(ja)
*
|
2020-07-22 |
2023-03-20 |
株式会社Kokusai Electric |
基板処理装置、半導体装置の製造方法およびプログラム
|
|
US12322591B2
(en)
|
2020-07-27 |
2025-06-03 |
Asm Ip Holding B.V. |
Thin film deposition process
|
|
KR20220020210A
(ko)
|
2020-08-11 |
2022-02-18 |
에이에스엠 아이피 홀딩 비.브이. |
기판 상에 티타늄 알루미늄 카바이드 막 구조체 및 관련 반도체 구조체를 증착하는 방법
|
|
EP3954804A1
(de)
*
|
2020-08-14 |
2022-02-16 |
Siltronic AG |
Vorrichtung und verfahren zum abscheiden einer schicht aus halbleitermaterial auf einer substratscheibe
|
|
KR102915124B1
(ko)
|
2020-08-14 |
2026-01-19 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법
|
|
US12040177B2
(en)
|
2020-08-18 |
2024-07-16 |
Asm Ip Holding B.V. |
Methods for forming a laminate film by cyclical plasma-enhanced deposition processes
|
|
TWI911263B
(zh)
|
2020-08-25 |
2026-01-11 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
清潔基板的方法、選擇性沉積的方法、及反應器系統
|
|
TW202534193A
(zh)
|
2020-08-26 |
2025-09-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
形成金屬氧化矽層及金屬氮氧化矽層的方法
|
|
TWI911265B
(zh)
|
2020-08-27 |
2026-01-11 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
形成圖案化結構的方法、操控機械特性的方法、及裝置結構
|
|
TWI904232B
(zh)
|
2020-09-10 |
2025-11-11 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
沉積間隙填充流體之方法及相關系統和裝置
|
|
USD990534S1
(en)
|
2020-09-11 |
2023-06-27 |
Asm Ip Holding B.V. |
Weighted lift pin
|
|
KR20220036866A
(ko)
|
2020-09-16 |
2022-03-23 |
에이에스엠 아이피 홀딩 비.브이. |
실리콘 산화물 증착 방법
|
|
USD1012873S1
(en)
|
2020-09-24 |
2024-01-30 |
Asm Ip Holding B.V. |
Electrode for semiconductor processing apparatus
|
|
TWI889903B
(zh)
|
2020-09-25 |
2025-07-11 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
基板處理方法
|
|
US12009224B2
(en)
|
2020-09-29 |
2024-06-11 |
Asm Ip Holding B.V. |
Apparatus and method for etching metal nitrides
|
|
TW202229612A
(zh)
|
2020-10-06 |
2022-08-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
在部件的側壁上形成氮化矽的方法及系統
|
|
KR20220045900A
(ko)
|
2020-10-06 |
2022-04-13 |
에이에스엠 아이피 홀딩 비.브이. |
실리콘 함유 재료를 증착하기 위한 증착 방법 및 장치
|
|
CN114293174A
(zh)
|
2020-10-07 |
2022-04-08 |
Asm Ip私人控股有限公司 |
气体供应单元和包括气体供应单元的衬底处理设备
|
|
KR102855834B1
(ko)
|
2020-10-14 |
2025-09-04 |
에이에스엠 아이피 홀딩 비.브이. |
단차형 구조 상에 재료를 증착하는 방법
|
|
KR102873665B1
(ko)
|
2020-10-15 |
2025-10-17 |
에이에스엠 아이피 홀딩 비.브이. |
반도체 소자의 제조 방법, 및 ether-cat을 사용하는 기판 처리 장치
|
|
KR20220053482A
(ko)
|
2020-10-22 |
2022-04-29 |
에이에스엠 아이피 홀딩 비.브이. |
바나듐 금속을 증착하는 방법, 구조체, 소자 및 증착 어셈블리
|
|
TW202223136A
(zh)
|
2020-10-28 |
2022-06-16 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
用於在基板上形成層之方法、及半導體處理系統
|
|
TW202229620A
(zh)
|
2020-11-12 |
2022-08-01 |
特文特大學 |
沉積系統、用於控制反應條件之方法、沉積方法
|
|
TW202229795A
(zh)
|
2020-11-23 |
2022-08-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
具注入器之基板處理設備
|
|
TW202235649A
(zh)
|
2020-11-24 |
2022-09-16 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
填充間隙之方法與相關之系統及裝置
|
|
KR20220076343A
(ko)
|
2020-11-30 |
2022-06-08 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치의 반응 챔버 내에 배열되도록 구성된 인젝터
|
|
KR20220077875A
(ko)
|
2020-12-02 |
2022-06-09 |
에이에스엠 아이피 홀딩 비.브이. |
샤워헤드 어셈블리용 세정 고정구
|
|
US12255053B2
(en)
|
2020-12-10 |
2025-03-18 |
Asm Ip Holding B.V. |
Methods and systems for depositing a layer
|
|
US12159788B2
(en)
|
2020-12-14 |
2024-12-03 |
Asm Ip Holding B.V. |
Method of forming structures for threshold voltage control
|
|
CN114639584B
(zh)
*
|
2020-12-15 |
2024-12-06 |
中微半导体设备(上海)股份有限公司 |
半导体零部件、等离子体处理装置及形成复合涂层的方法
|
|
CN114639631A
(zh)
|
2020-12-16 |
2022-06-17 |
Asm Ip私人控股有限公司 |
跳动和摆动测量固定装置
|
|
TW202232639A
(zh)
|
2020-12-18 |
2022-08-16 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
具有可旋轉台的晶圓處理設備
|
|
KR20220090438A
(ko)
|
2020-12-22 |
2022-06-29 |
에이에스엠 아이피 홀딩 비.브이. |
전이금속 증착 방법
|
|
KR102390123B1
(ko)
*
|
2020-12-22 |
2022-04-25 |
한국세라믹기술원 |
내플라즈마 세라믹 기판 및 그 제조방법
|
|
TW202226899A
(zh)
|
2020-12-22 |
2022-07-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
具匹配器的電漿處理裝置
|
|
KR20220090435A
(ko)
|
2020-12-22 |
2022-06-29 |
에이에스엠 아이피 홀딩 비.브이. |
전구체 캡슐, 용기 및 방법
|
|
US11702744B2
(en)
|
2021-02-17 |
2023-07-18 |
Applied Materials, Inc. |
Metal oxyfluoride film formation methods
|
|
TW202237397A
(zh)
|
2021-03-29 |
2022-10-01 |
日商Ｔｏｔｏ股份有限公司 |
複合結構物及具備複合結構物之半導體製造裝置
|
|
TW202601767A
(zh)
|
2021-03-29 |
2026-01-01 |
日商Ｔｏｔｏ股份有限公司 |
複合結構物及具備複合結構物之半導體製造裝置
|
|
US11837448B2
(en)
|
2021-04-27 |
2023-12-05 |
Applied Materials, Inc. |
High-temperature chamber and chamber component cleaning and maintenance method and apparatus
|
|
USD980813S1
(en)
|
2021-05-11 |
2023-03-14 |
Asm Ip Holding B.V. |
Gas flow control plate for substrate processing apparatus
|
|
USD1023959S1
(en)
|
2021-05-11 |
2024-04-23 |
Asm Ip Holding B.V. |
Electrode for substrate processing apparatus
|
|
USD980814S1
(en)
|
2021-05-11 |
2023-03-14 |
Asm Ip Holding B.V. |
Gas distributor for substrate processing apparatus
|
|
USD981973S1
(en)
|
2021-05-11 |
2023-03-28 |
Asm Ip Holding B.V. |
Reactor wall for substrate processing apparatus
|
|
KR102872170B1
(ko)
|
2021-07-19 |
2025-10-15 |
삼성전자주식회사 |
반도체 장치의 제조용 장비 및 반도체 장치의 제조 방법
|
|
JP7638813B2
(ja)
*
|
2021-07-19 |
2025-03-04 |
キオクシア株式会社 |
成膜装置および基板支持装置
|
|
CN113698208B
(zh)
*
|
2021-08-24 |
2022-06-14 |
南通三责精密陶瓷有限公司 |
一种等离子刻蚀用碳化硅载盘的制造方法及碳化硅载盘
|
|
USD990441S1
(en)
|
2021-09-07 |
2023-06-27 |
Asm Ip Holding B.V. |
Gas flow control plate
|
|
USD1099184S1
(en)
|
2021-11-29 |
2025-10-21 |
Asm Ip Holding B.V. |
Weighted lift pin
|
|
USD1060598S1
(en)
|
2021-12-03 |
2025-02-04 |
Asm Ip Holding B.V. |
Split showerhead cover
|
|
JP2025505953A
(ja)
|
2022-01-28 |
2025-03-05 |
ラム リサーチ コーポレーション |
基板処理システムのｅｓｃのための下塗り被覆および抵抗制御
|
|
JP2023124884A
(ja)
|
2022-02-26 |
2023-09-07 |
Toto株式会社 |
複合構造物および複合構造物を備えた半導体製造装置
|
|
US11735212B1
(en)
*
|
2022-04-25 |
2023-08-22 |
Sae Magnetics (H.K.) Ltd. |
Thermally assisted magnetic head including a record/read separate protective structure, head gimbal assembly and hard disk drive each having the thermally assisted magnetic head
|
|
US20240093355A1
(en)
*
|
2022-09-21 |
2024-03-21 |
Applied Materials, Inc. |
Glassy Carbon Shutter Disk For Physical Vapor Deposition (PVD) Chamber
|
|
WO2025206256A1
(ja)
*
|
2024-03-29 |
2025-10-02 |
日本碍子株式会社 |
半導体製造装置用部材及びその再生方法
|
|
KR102760863B1
(ko)
|
2024-04-17 |
2025-02-04 |
주식회사 케이에스엠컴포넌트 |
하이브리드 코팅을 포함하는 세라믹 서셉터
|