JP2015195717A - 発電装置用等の回転装置 - Google Patents

発電装置用等の回転装置 Download PDF

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JP2015195717A
JP2015195717A JP2015122422A JP2015122422A JP2015195717A JP 2015195717 A JP2015195717 A JP 2015195717A JP 2015122422 A JP2015122422 A JP 2015122422A JP 2015122422 A JP2015122422 A JP 2015122422A JP 2015195717 A JP2015195717 A JP 2015195717A
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幹章 臼間
Mikiaki Usuma
幹章 臼間
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Abstract

【課題】製作が容易で、異音や振動を低減し、偏心回転を可能にした発電装置用の回転装置を提供する。【解決手段】垂直型の真円フライホイール100の回転中心部100cに水平回転駆動軸200を装着し、前記真円フライホイールの両側面の各々における円周方向に等回転角度間隔で且つ半径方向線に沿ってガイド機構500Gにより摺動自在に複数の弾み錘り300を配置し、前記真円フライホイールの両側面間の弾み錘りの相対配置関係は前記等回転角度間隔と同一又は所定回転角度ずらして配置し、前記各弾み錘りの側面にガイドロール400を装着し、前記真円フライホイールの両側面各々に平行に対面して真円の軌条ガイド500を位置固定し、前記真円の軌条ガイドは前記弾み錘りのガイドロールを真円の軌跡で案内し且つ真円の軌条ガイドの中心を真円フライホイールの中心位置から水平に又は斜め下方に所定量偏位させた発電装置用の回転装置。【選択図】図1

Description

本発明は、水力発電、風力発電、太陽光発電等の自然エネルギー発電力を電源を利用して効率よく発電する簡易な発電装置用等の回転装置に関するものである。
発電装置、従来公知のものとして大別して風力発電装置、蒸気力発電装置、水力発電装置、波力発電装置、太陽光発電装置など大掛かりな様々な発電装置が開発されている。
近年、地球温暖化問題が表面化し、二酸化炭素排出規制が声高に叫ばれている。この対策とするクリーンエネルギー技術として、前記の太陽光電池、風力発電等が注目され開発され現在稼動しているが、コスト及びメンテナンス等の問題でなかなか普及していないのが現状である。
そこで過去に特許文献1から特許文献3に記載の偏心回転式発電装置がある。これらは発電装置用の偏心回転装置として地球上の重力を活用し、それを効率よく発電用の回転エネルギーに転換する装置である。 この偏心回転装置は、発電回転用の回転駆動軸を駆動エネルギーとして風力、蒸気力、水力、波力などの自然原動力を用いて回転駆動させるもので電気エネルギー変換効率を大幅に高めた装置である。 この偏心回転装置は、竪型の真円のリング軌条と、真円の磁石ガイド式或いはロールガイド式のリング軌条の円心位置から水平方向に所定量変位させた位置に直交して水平に配置した回転駆動軸と、回転駆動軸に偏心回転ガイドシャフト機構を介して装着し且つリング軌条に沿って永久磁石またはガイドロールを周回可能に設けた被ガイドと、この被ガイドに装着したはずみウエイトとを主構成とする。 縦型の真円のリング軌条は、ガイド用の永久磁石又はロールガイドレールを固定配列し、被ガイドを対面させる。 これで被ガイドは、リング軌条に沿って倣い周回走行可能にしてある。偏心回転シャフト機構は、回転駆動軸の回転半径方向線に沿ってスライド自在にし且つ180度の回転角度の間隔で被ガイドを支持する。回転駆動軸により偏心回転シャフト機構を回転させて、式被ガイドに装着したはずみウエイトを偏心回転させることにより回転駆動軸に回転モーメント(ある決まった回転軸のまわりの力のモーメントをトルクと呼ぶ)を付与して、軽負荷で回転させるものである。
この偏心回転装置は、小型エンジン、水力、風力、波力、その他の自然エネルギー、あるいはこれ等から得た微電力等を用いて前記回転駆動軸を微力で回転駆動して、エネルギーロスを少なくした効率の良い発電力を確保することが最大の目標である。 しかし、左右一対のリング軌条に沿って周回する被ガイドとの回転抵抗の低減、およびはずみウエイトと共動する被ガイドと偏心回転シャフト機構との摺動抵抗の低減、さらに偏心回転シャフト機構にかかる回転中の軸力分布を工夫した接触型及び非接触型であるが、そのいずれもが機構の複雑さおよびそれに伴う回転抵抗と軸力分布に問題がある。
従来の偏心回転装置において、固定永久磁石を配列した縦型で左右一対の磁石リング軌条にガイドされてリング軌条間で回転する偏心回転シャフト機構と永久磁石式被ガイドとはずみウエイトの回転角度位置において、目的とする左回転方向(→正回転方向)に回転するための回転駆動軸に掛かる回転モーメント発生領域と、その逆回転方向に回転モーメントが発生する領域がある。
前記偏心回転装置において、前記一対のリング軌条は、真円にし、前記偏心回転シャフト機構の回転中心位置を、真円のリング軌条の水平直径線の3分の1の位置に偏位してあるため、例えば、偏心回転シャフト機構を直線状にし、その両側にすなわち180°の回転角度間隔をおいた位置に、被ガイドを含んで等重量のはずみウエイトを配置して偏心回転シャフト機構の回転駆動軸を回転させた場合は、一対の被ガイドとそのはずみウエイトが、リング軌条の円心を通る鉛直線から前記偏心回転シャフト機構の回転中心側の単一円弧部に共に存在する領域がある。この領域以外では常に回転駆動軸に目的とする左回転方向に回転するための回転モーメントが掛かる発生領域である。前記領域は左右の回転モーメントが同じニュートラル状態になる二つの位置に挟まれる領域であり、この領域に一対の被ガイドとそのはずみウエイトが位置する間は、回転駆動軸の芯に常に図の右回転方向への逆回転負荷が掛かりエネルギーロスを生じ減速状態となり大きな回転変動を起こし安定しない。
前記逆回転方向に回転モーメントが発生する領域を無くしようとしてリング軌条を卵形にした発明が特許文献4にて紹介され、またリング軌条を半縦楕円形と半横楕円形を合わせた発明が特許文献5にて紹介されている。しかしこの両者の発明は、縦型(鉛直型)で左右一対の複雑な卵形リング軌条や縦・横半楕円形リング軌条共に形状設計及び製作が極めて困難であると共に、従来からの課題、即ち回転駆動軸にかかる軸力分布の改善及び回転抵抗の低減を満足するものではなかった。
特開2010−35393号公報 特開2010068681号公報 特開2010−96170号公報 特開2012−207653号公報 特開2012−207654号公報
本発明は、製作が容易で単純化でありながら堅牢安価構造であり、更に駆動回転駆動軸にかかる軸力分布を改善し且つ回転抵抗を大幅に低減して異音や振動を無くし、しかも回転駆動軸への軸力をより高位に安定した偏心回転を可能にした発電装置用の回転装置を提供するものである。
上記課題を満足させる本発明の基本的な技術構成は、図1〜図3に示す通り次の(1)〜(2)の特徴を有する。
(1)、垂直型の真円フライホイール(100)の回転中心部(100c)に水平回転駆動軸(200)を装着し、前記真円フライホイール(100)又は水平回転駆動軸(200)に回転駆動装置を連結し、水平回転駆動軸(200)に発電装置(EG)を連結し、前記真円フライホイール(100)の両側面の各々における円周方向に等回転角度間隔で且つ半径方向線(R1,R2)に沿ってガイド機構(300G−1.500G−2)により摺動自在に複数の弾み錘り(300−1,300−2)を配置し、前記真円フライホイール(100)の両側面間の弾み錘り(300−1,300−2)の相対配置関係は前記等回転角度間隔と同一又は所定回転角度ずらして配置し、前記各弾み錘り(300−1,300−2)の側面にガイドロール(400−1,400−2)を装着し、前記真円フライホイール(100)の両側面各々に平行に対面して真円の軌条ガイド(500−1,500−2)を位置固定し、前記真円の軌条ガイド(500−1,500−2)は前記弾み錘り(300−1,300−2)のガイドロール(400−1,400−2)を真円の軌跡で案内し且つ真円の案内軌跡(500G−1,500G−2)の中心(500C)を真円フライホイール(100)の中心位置(100C)から水平に又は斜め下方に所定量(Hc、Dc)偏位させたことを特徴とする発電装置用の回転装置。
(2)、前記ガイド機構(300G−1,500G−2)の各々は、真円フライホイール(100)の側面にその半径方向線(R1、R2)に沿って延在させて固定した断面臼型のガイドレール(301)と、前記ガイドレール(301)に跨って前記真円フライホイール(100)の半径方向線(R1,R2)に沿って滑り接触するレール跨り被ガイド(302)とからなり、レール跨り被ガイド(302)に前記弾み錘り(300−1,300−2)を装着したことを特徴とする前記(1)に記載の発電装置用の回転装置。
本発明の発電装置用の回転装置は、水平回転駆動軸200をエンジンにより回転駆動させ、或いは自然エネルギーを利用した太陽光発電器、水力発電器、風力発電器からの電力により回転駆動させるか、或いは真円フライホイール(100)をエンジンや水車、風車により回転駆動させるか、又は図3例に示すように真円フライホイール(100)の外周に永久磁石Mを所定回転角度間隔で配置しその通過部に沿ってホイールの回転起動用の電磁石100EMを接近配して電磁石100EMによる永久磁石Mの磁気回転吸引反発作用により真円フライホイール(100)を回転駆動させよく、これらを適宜組み合わせた駆動装置にしてもよい。
そして一対の軌条ガイド500−1,500−2間に真円フライホイール100を対面配置し、真円フライホイール100の両側面の各々に、相対的に配置位置をずらした前記弾み錘り300−1,300−2とガイド機構300G−1,500G−2の複数組を所定の回転角度間隔で配置した極めて堅牢安価で安定したシンプルな構造にしてありながら、真円フライホイール100を回転さ弾み錘り300−1、300−2を偏心回転させても左右の付加バランスが良好で回転駆動軸に振動や騒音が発生することなく軸力を大幅に増大させるものである。
実施例1に示すように、真円フライホイール100の両側面各々に8個のガイドロール400付設の弾み錘り300−1、300−2とそのガイド機構300G−1,300G−2の組を45度の等回転角度間隔で配置し、両側面間の配置ずれを22.5度にした際に、各ガイド機構300G−1,300G−2と弾み錘り300−1、300−2とガイドロール400−1、400−2を含む重量による回転駆動軸200に与える個々の組の理論上の計算回転モーメントの合成回転モーメント(:トルクkg・m)は強力でありその変化は、全てプラス側にありしかも大きな変動が無く安定している。
本発明の実施例1における、図2の(1)および(2)の矢視A−Aから見た縦断面説明図である。 図1の矢視B−Bからの側面説明図(1)と図1の矢視C−Cから見た側面説明図(2)であり。ガイド機構300G−1(300G−2)と弾み錘り100−1、(100−2)の配置関係を記載してある。但し302:レール跨り被ガイドは省略してある。 図2の(1)(2)に示す真円フライホイール100の、外周に永久磁石100Mを所定回転角度間隔で配置しその通過部に沿ってホイール回転起動用の電磁石100EMを接近配置し、更に真円フライホイール100は外周近傍に回転駆動装置としての小型エンジンEN−2をベルト連結した例である。図1の矢視D−Dから見たガイド機構300G−1(300G−2)の横断面詳細図である。 従来例の課題を示す側面説明図である。
発明を実施するための形態を実施例により詳細に説明する。
図1〜図2に実施例1を示す。
本実施例の発電装置用の回転装置は、水平回転駆動軸200の一方に小型エンジン、水車、風車等の回転駆動装置ENを接続し、他方に発電機GEを接続している。
水平回転駆動軸200には垂直型の真円フライホイール100の中心部を装着して回転駆動させる。
図3には電磁石式の回転駆動装置と小型エンジン式の回転駆動装置を設置した例であるが、これらは両方設置してよく又は何れか一つの回転駆動装置にしてもよい。電磁石式の回転駆動装置は、図2の(1)(2)に示す真円フライホイール(100)の外周に永久磁石Mを所定回転角度間隔で配置しその通過部に沿ってホイールの回転起動用の電磁石100EMを接近配して電磁石100EMによる永久磁石Mの磁気回転吸引反発作用により真円フライホイール(100)を回転駆動させる例である。また図3例の真円フライホイール100は外周近傍に回転駆動装置としての小型エンジンEN−2にベルトVで連結してある。但し図2の(2)と同様の図面は省略してある。
真円フライホイール100の一側面には、図2の(1)に示すように、その一側面の円周方向に45度の等回転角度(θA)間隔で8個の弾み錘り300−1と、弾み錘り300−1を半径方向線R1に沿って摺動可能に案内するガイド機構300G−1と、前記各弾み錘り300−1の側面のガイドロール400−1とを装着してある。
更に、真円フライホイール100の他側面には、図2の(2)に示すようにその他側面の円周方向に45度の等回転角度間隔でしかも前記一側面のガイド機構300G−1と弾み錘り300−1とガイドロール400−1とは、22.5度の回転角度ずらした8個の弾み錘り300−2と、弾み錘り300−2を半径方向線R2に沿って摺動可能に案内するガイド機構300G−2と、前記各弾み錘り300−2の側面ガイドロール400−2とを装着してある。
前記真円フライホイール100の両側面各々に平行に対面して真円の軌条ガイド500−1,500−2を位置固定する。前記真円の軌条ガイド500の各々は、当該弾み錘り300−1、300−2のガイドロール400−1,400−2を真円の軌跡で案内し且つ真円の軌条ガイド500−1,500−2の中心500Cを真円フライホイール100の中心位置100Cから水平直径線HL方向に所定量Hc偏位させてある。
他の例としてに真円の軌条ガイド500−1,500−2の中心500Cを真円フライホイール100の中心位置100Cから斜め下方方向に所定量Dc偏位させてもよい。
この構成により、真円フライホイール100の回転で、当該弾み錘り300−1、300−2は、真円の案内軌跡500k−1,500k−2でありながら、真円フライホイール100の中心に対して偏心回転して回転駆動軸200に円滑で強力な合成回転モーメントを付与して発電機GEを強力に回転して効率の良い発電効果を得るものである。
ガイド機構300G−1,500G−2は、真円フライホイール100の当該側面の半径方向線R1、R2に沿って固定した横断面臼型のガイドレール301と、前記ガイドレール301に跨って円滑に滑り接触するレール跨り被ガイド302とからなり、レール跨り被ガイド302に当該弾み錘り300−1,300−2を装着して安定した低接触作動により真円フライホイール100の側面において当該弾み錘り300−1,300−2の円滑な直線ガイド機能を果たす。またガイドレール301及び/又はレール跨り被ガイド302の摺動面には、摩擦係数の極めて小さい二硫化モリブデン(MoS)、有機モリブデン化合物、グラファイト、PTFE、銅、硬質低摩擦系樹脂等の潤滑材等をコーティング又は鍍金或いは交換可能に貼り付けしてある。
横断面臼型のガイドレール301は横断面の中央部を絞り部とし、真円フライホイール100の側面への装着側とレール跨り被ガイド302との滑り装着側を楔型部にした所謂臼型にしたものである。従って、レール跨り被ガイド302の摺動面は、レール跨り被ガイド302との滑り装着側の楔型部である。
フライホイール100の例えば200RPM回転の際は、異常な振動及び異音も無く所期の効果を得ることができた。
本発明は、前記のように優れた作用効果を呈し、植物栽培ハウスや一般家庭は勿論、自動車産業や各種電力供給産業に広く普及し業界に広く活用される発電装置用の回転装置である。
NE:回転駆動装置
NE−2
GM:発電機
100:垂直型の真円フライホイール
100c:回転中心部
200:水平回転駆動軸
(θA):等回転角度
R1、R2:半径方向線
300−1、300−2:弾み錘り
400−1、400−2:ガイドロール
500−1,500−2:軌条ガイド
500G−1、500G−2:ガイド機構
500c:真円ガイドの中心位置
HL:水平直径線
Hc:所定の偏位量
301:ガイドレール
302:レール跨り被ガイド

Claims (1)

  1. 垂直型の真円フライホイールの回転中心部に水平回転駆動軸を装着し、前記真円フライホイール又は前記水平回転駆動軸に回転駆動装置を連結し、前記水平回転駆動軸に発電装置を連結し、前記真円フライホイールの両側面の各々における円周方向に等回転角度間隔で且つ半径方向線に沿ってガイド機構により摺動自在に複数の弾み錘りを配置し、前記真円フライホイールの両側面間の弾み錘りの相対配置関係は前記等回転角度間隔と同一又は所定回転角度ずらして配置し、前記各弾み錘りの側面にガイドロールを装着し、前記真円フライホイールの両側面各々に平行に対面して真円の軌条ガイドを位置固定し、前記真円の軌条ガイドは前記弾み錘りのガイドロールを真円の軌跡で案内し且つ真円の軌条ガイドの中心を真円フライホイールの中心位置から水平に又は斜め下方に所定量偏位させ、前記ガイド機構の各々は、真円フライホイールの両側面各々に、その半径方向線に沿って延在させて固定した断面臼型のガイドレールと、前記ガイドレールに跨って前記真円フライホイールの半径方向線に沿って滑り接触するレール跨り被ガイドとからなり、レール跨り被ガイドに前記弾み錘りを装着したことを特徴とする発電装置用の回転装置。
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102052367B1 (ko) * 2019-02-20 2020-01-08 김흥필 가변 회전추를 이용한 발전장치
WO2020118151A1 (en) * 2018-12-07 2020-06-11 Oceana Energy Company Orbital magnetic gears, and related systems
US11384726B2 (en) 2018-05-30 2022-07-12 Oceana Energy Company Hydroelectric energy systems and methods

Families Citing this family (114)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8928967B2 (en) 1998-04-08 2015-01-06 Qualcomm Mems Technologies, Inc. Method and device for modulating light
WO1999052006A2 (en) 1998-04-08 1999-10-14 Etalon, Inc. Interferometric modulation of radiation
ATE314726T1 (de) * 1998-10-26 2006-01-15 Studer Professional Audio Gmbh Vorrichtung zur eingabe von werten mit einem bildschirm
TWI289708B (en) * 2002-12-25 2007-11-11 Qualcomm Mems Technologies Inc Optical interference type color display
US7342705B2 (en) 2004-02-03 2008-03-11 Idc, Llc Spatial light modulator with integrated optical compensation structure
JP4554978B2 (ja) * 2004-04-21 2010-09-29 Okiセミコンダクタ株式会社 Memsデバイスの製造方法及びmemsデバイスを製造するための接合基板
US7372613B2 (en) 2004-09-27 2008-05-13 Idc, Llc Method and device for multistate interferometric light modulation
US7349141B2 (en) * 2004-09-27 2008-03-25 Idc, Llc Method and post structures for interferometric modulation
US7944599B2 (en) 2004-09-27 2011-05-17 Qualcomm Mems Technologies, Inc. Electromechanical device with optical function separated from mechanical and electrical function
US7807488B2 (en) 2004-09-27 2010-10-05 Qualcomm Mems Technologies, Inc. Display element having filter material diffused in a substrate of the display element
US20060066586A1 (en) * 2004-09-27 2006-03-30 Gally Brian J Touchscreens for displays
US7561323B2 (en) * 2004-09-27 2009-07-14 Idc, Llc Optical films for directing light towards active areas of displays
DE102005002967B4 (de) * 2005-01-21 2011-03-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Herstellen eines Bauelementes mit einem beweglichen Abschnitt
EP2495212A3 (en) 2005-07-22 2012-10-31 QUALCOMM MEMS Technologies, Inc. Mems devices having support structures and methods of fabricating the same
WO2007014022A1 (en) * 2005-07-22 2007-02-01 Qualcomm Incorporated Mems devices having support structures and methods of fabricating the same
US8043950B2 (en) 2005-10-26 2011-10-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US7630114B2 (en) * 2005-10-28 2009-12-08 Idc, Llc Diffusion barrier layer for MEMS devices
US7795061B2 (en) 2005-12-29 2010-09-14 Qualcomm Mems Technologies, Inc. Method of creating MEMS device cavities by a non-etching process
US7916980B2 (en) 2006-01-13 2011-03-29 Qualcomm Mems Technologies, Inc. Interconnect structure for MEMS device
US7382515B2 (en) * 2006-01-18 2008-06-03 Qualcomm Mems Technologies, Inc. Silicon-rich silicon nitrides as etch stops in MEMS manufacture
US7547568B2 (en) 2006-02-22 2009-06-16 Qualcomm Mems Technologies, Inc. Electrical conditioning of MEMS device and insulating layer thereof
US7450295B2 (en) 2006-03-02 2008-11-11 Qualcomm Mems Technologies, Inc. Methods for producing MEMS with protective coatings using multi-component sacrificial layers
US7711239B2 (en) 2006-04-19 2010-05-04 Qualcomm Mems Technologies, Inc. Microelectromechanical device and method utilizing nanoparticles
US7623287B2 (en) * 2006-04-19 2009-11-24 Qualcomm Mems Technologies, Inc. Non-planar surface structures and process for microelectromechanical systems
WO2007136706A1 (en) * 2006-05-17 2007-11-29 Qualcomm Mems Technologies Inc. Desiccant in a mems device
US7405863B2 (en) * 2006-06-01 2008-07-29 Qualcomm Mems Technologies, Inc. Patterning of mechanical layer in MEMS to reduce stresses at supports
KR101628340B1 (ko) 2006-10-06 2016-06-08 퀄컴 엠이엠에스 테크놀로지스, 인크. 디스플레이 장치 및 디스플레이의 형성 방법
WO2008045207A2 (en) 2006-10-06 2008-04-17 Qualcomm Mems Technologies, Inc. Light guide
US7545552B2 (en) * 2006-10-19 2009-06-09 Qualcomm Mems Technologies, Inc. Sacrificial spacer process and resultant structure for MEMS support structure
US20080124823A1 (en) * 2006-11-24 2008-05-29 United Microdisplay Optronics Corp. Method of fabricating patterned layer using lift-off process
US7706042B2 (en) * 2006-12-20 2010-04-27 Qualcomm Mems Technologies, Inc. MEMS device and interconnects for same
US7916378B2 (en) 2007-03-08 2011-03-29 Qualcomm Mems Technologies, Inc. Method and apparatus for providing a light absorbing mask in an interferometric modulator display
US7733552B2 (en) 2007-03-21 2010-06-08 Qualcomm Mems Technologies, Inc MEMS cavity-coating layers and methods
CN101652317B (zh) * 2007-04-04 2012-12-12 高通Mems科技公司 通过牺牲层中的界面修改来消除释放蚀刻侵蚀
US7719752B2 (en) * 2007-05-11 2010-05-18 Qualcomm Mems Technologies, Inc. MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same
JP5135879B2 (ja) * 2007-05-21 2013-02-06 富士電機株式会社 炭化珪素半導体装置の製造方法
US7625825B2 (en) * 2007-06-14 2009-12-01 Qualcomm Mems Technologies, Inc. Method of patterning mechanical layer for MEMS structures
US8068268B2 (en) * 2007-07-03 2011-11-29 Qualcomm Mems Technologies, Inc. MEMS devices having improved uniformity and methods for making them
US7563720B2 (en) * 2007-07-23 2009-07-21 Honeywell International Inc. Boron doped shell for MEMS device
JP2010534865A (ja) * 2007-07-25 2010-11-11 クォルコム・メムズ・テクノロジーズ・インコーポレーテッド Mems表示装置及び該mems表示装置の製造方法
CN101802985A (zh) * 2007-09-14 2010-08-11 高通Mems科技公司 用于微机电系统生产的蚀刻工艺
WO2009041951A1 (en) * 2007-09-28 2009-04-02 Qualcomm Mems Technologies, Inc. Optimization of desiccant usage in a mems package
WO2009041948A1 (en) * 2007-09-28 2009-04-02 Qualcomm Mems Technologies, Inc. Multicomponent sacrificial structure
US8368100B2 (en) 2007-11-14 2013-02-05 Cree, Inc. Semiconductor light emitting diodes having reflective structures and methods of fabricating same
US8068710B2 (en) 2007-12-07 2011-11-29 Qualcomm Mems Technologies, Inc. Decoupled holographic film and diffuser
JP2011507306A (ja) * 2007-12-17 2011-03-03 クォルコム・メムズ・テクノロジーズ・インコーポレーテッド 干渉裏側マスクを有する光起電力装置
US8697545B2 (en) * 2007-12-28 2014-04-15 The Royal Institution For The Advancement Of Learning/Mcgill University Direct contact heat control of micro structures
DE102008007345B4 (de) 2008-02-04 2016-10-06 Robert Bosch Gmbh Mikromechanisches Bauelement und Verfahren zur Herstellung desselben
US7863079B2 (en) 2008-02-05 2011-01-04 Qualcomm Mems Technologies, Inc. Methods of reducing CD loss in a microelectromechanical device
WO2009142960A1 (en) * 2008-05-22 2009-11-26 Fujifilm Corporation Etching piezoelectric material
US7851239B2 (en) * 2008-06-05 2010-12-14 Qualcomm Mems Technologies, Inc. Low temperature amorphous silicon sacrificial layer for controlled adhesion in MEMS devices
US20100013060A1 (en) * 2008-06-22 2010-01-21 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming a conductive trench in a silicon wafer and silicon wafer comprising such trench
US7782522B2 (en) * 2008-07-17 2010-08-24 Qualcomm Mems Technologies, Inc. Encapsulation methods for interferometric modulator and MEMS devices
US7855826B2 (en) * 2008-08-12 2010-12-21 Qualcomm Mems Technologies, Inc. Method and apparatus to reduce or eliminate stiction and image retention in interferometric modulator devices
US8203776B2 (en) * 2008-11-26 2012-06-19 Texas Instruments Incorporated Planarity of pixel mirrors
US8066893B2 (en) * 2008-12-23 2011-11-29 Hitachi Global Storage Technologies Netherlands B.V. Method for creating a magnetic write pole having a stepped perpendicular pole via CMP-assisted liftoff
US8410690B2 (en) 2009-02-13 2013-04-02 Qualcomm Mems Technologies, Inc. Display device with desiccant
US8722537B2 (en) * 2009-03-19 2014-05-13 Taiwan Semiconductor Manufacturing Company, Ltd. Multi-sacrificial layer and method
US8741715B2 (en) * 2009-04-29 2014-06-03 Cree, Inc. Gate electrodes for millimeter-wave operation and methods of fabrication
WO2010138761A1 (en) 2009-05-29 2010-12-02 Qualcomm Mems Technologies, Inc. Illumination devices and methods of fabrication thereof
TW201102340A (en) * 2009-07-10 2011-01-16 Nat Univ Tsing Hua A method for fabricating a multilayer microstructure with balancing residual stress capability
DE102010000666A1 (de) * 2010-01-05 2011-07-07 Robert Bosch GmbH, 70469 Bauelement mit einer mikromechanischen Mikrofonstruktur und Verfahren zu dessen Herstellung
US8547626B2 (en) * 2010-03-25 2013-10-01 Qualcomm Mems Technologies, Inc. Mechanical layer and methods of shaping the same
CN102834761A (zh) 2010-04-09 2012-12-19 高通Mems科技公司 机电装置的机械层及其形成方法
CN103038567A (zh) 2010-04-16 2013-04-10 弗莱克斯照明第二有限责任公司 包括膜基光导的照明装置
JP6132762B2 (ja) 2010-04-16 2017-05-24 フレックス ライティング 2,エルエルシー フィルムベースのライトガイドを備える前面照射デバイス
US8848294B2 (en) 2010-05-20 2014-09-30 Qualcomm Mems Technologies, Inc. Method and structure capable of changing color saturation
JP5707780B2 (ja) * 2010-08-25 2015-04-30 セイコーエプソン株式会社 波長可変干渉フィルター、光モジュール、及び光分析装置
US9070851B2 (en) 2010-09-24 2015-06-30 Seoul Semiconductor Co., Ltd. Wafer-level light emitting diode package and method of fabricating the same
US20120194897A1 (en) * 2011-01-27 2012-08-02 Qualcomm Mems Technologies, Inc. Backside patterning to form support posts in an electromechanical device
US8461655B2 (en) * 2011-03-31 2013-06-11 Infineon Technologies Ag Micromechanical sound transducer having a membrane support with tapered surface
US9134527B2 (en) 2011-04-04 2015-09-15 Qualcomm Mems Technologies, Inc. Pixel via and methods of forming the same
US8963159B2 (en) 2011-04-04 2015-02-24 Qualcomm Mems Technologies, Inc. Pixel via and methods of forming the same
US9268089B2 (en) 2011-04-21 2016-02-23 Octrolix Bv Layer having a non-linear taper and method of fabrication
US8718432B1 (en) * 2011-04-21 2014-05-06 Octrolix Bv Method for forming a spotsize converter
US8659816B2 (en) 2011-04-25 2014-02-25 Qualcomm Mems Technologies, Inc. Mechanical layer and methods of making the same
CN103620681B (zh) * 2011-06-27 2016-11-02 薄膜电子有限公司 具有横向尺寸改变吸收缓冲层的电子部件及其生产方法
US9134529B2 (en) 2011-07-21 2015-09-15 Pixronix, Inc. Display device with tapered light reflecting layer and manufacturing method for same
JP5879886B2 (ja) * 2011-10-03 2016-03-08 セイコーエプソン株式会社 虚像表示装置及びその製造方法
US8733871B2 (en) * 2011-10-25 2014-05-27 Stmicroelectronics Pte Ltd. AlCu hard mask process
US8803861B2 (en) 2012-02-23 2014-08-12 Qualcomm Mems Technologies, Inc. Electromechanical systems device
US9450141B2 (en) 2012-10-15 2016-09-20 Seoul Viosys Co., Ltd. Method for separating growth substrate, method for light-emitting diode, and light-emitting diode manufactured using methods
US9013012B2 (en) * 2013-03-05 2015-04-21 Stmicroelectronics Pte. Ltd. Self-sealing membrane for MEMS devices
US9176317B2 (en) * 2013-03-13 2015-11-03 Pixtronix, Inc. Display apparatus incorporating dual-level shutters
US9134530B2 (en) 2013-03-13 2015-09-15 Pixtronix, Inc. Display apparatus incorporating dual-level shutters
US9142452B2 (en) * 2013-07-22 2015-09-22 Taiwan Semiconductor Manufacturing Company, Ltd. Hard mask removal scheme
US9510103B2 (en) * 2013-09-09 2016-11-29 Audio Pixels Ltd. Microelectromechanical apparatus for generating a physical effect
US10322481B2 (en) 2014-03-06 2019-06-18 Infineon Technologies Ag Support structure and method of forming a support structure
MY168564A (en) * 2014-05-20 2018-11-13 Univ Kebangsaan Malaysia Ukm Electrodynamics (mems) micro speaker
JP2016139015A (ja) * 2015-01-28 2016-08-04 セイコーエプソン株式会社 ミラーデバイス、ミラーデバイスの製造方法、及び画像表示装置
KR102266707B1 (ko) * 2015-02-04 2021-06-22 삼성디스플레이 주식회사 터치패널 제조방법
US9613848B2 (en) 2015-02-12 2017-04-04 Infineon Technologies Ag Dielectric structures with negative taper and methods of formation thereof
US9715102B2 (en) 2015-06-11 2017-07-25 Snaptrack, Inc. Electromechanical systems device with hinges for reducing tilt instability
WO2017013665A1 (en) * 2015-07-22 2017-01-26 Audio Pixels Ltd. Dsr speaker elements and methods of manufacturing thereof
US9995647B2 (en) * 2015-09-30 2018-06-12 General Monitors, Inc. Ultrasonic gas leak location system and method
CN205944139U (zh) 2016-03-30 2017-02-08 首尔伟傲世有限公司 紫外线发光二极管封装件以及包含此的发光二极管模块
JP6341959B2 (ja) 2016-05-27 2018-06-13 浜松ホトニクス株式会社 ファブリペロー干渉フィルタの製造方法
EP3467567B1 (en) 2016-05-27 2024-02-07 Hamamatsu Photonics K.K. Production method for fabry-perot interference filter
KR102299845B1 (ko) 2016-08-24 2021-09-09 하마마츠 포토닉스 가부시키가이샤 패브리 페로 간섭 필터
US10724902B2 (en) 2016-08-24 2020-07-28 Hamamatsu Photonics K.K. Fabry-Perot interference filter
US10800649B2 (en) 2016-11-28 2020-10-13 Analog Devices International Unlimited Company Planar processing of suspended microelectromechanical systems (MEMS) devices
EP3729020A4 (en) * 2017-12-19 2022-04-13 The University of British Columbia LAYER STRUCTURE AND MANUFACTURING PROCESS THEREOF
CN108892098B (zh) * 2018-06-20 2020-09-29 青岛科技大学 一种偏转可控的mems微型反射镜结构
CN109589798B (zh) * 2018-12-12 2021-05-25 南方科技大学 分离膜的阈通量的测量方法和测量设备
US11256083B2 (en) * 2018-12-27 2022-02-22 Texas Instruments Incorporated MEMS electrostatic actuator with linearized displacements
JP2020112592A (ja) * 2019-01-08 2020-07-27 ソニーセミコンダクタソリューションズ株式会社 光反射素子及び空間光変調器
US10843920B2 (en) 2019-03-08 2020-11-24 Analog Devices International Unlimited Company Suspended microelectromechanical system (MEMS) devices
US11131595B2 (en) * 2019-07-26 2021-09-28 Raytheon Technologies Corporation Pressure sensing device and method for using the same
DE102020213772A1 (de) 2020-11-03 2022-05-05 Robert Bosch Gesellschaft mit beschränkter Haftung Mikromechanisches Bauelement
CN112551475B (zh) * 2021-02-20 2021-04-20 甬矽电子(宁波)股份有限公司 芯片封装结构、其制作方法和电子设备
US20220365339A1 (en) * 2021-05-11 2022-11-17 II-VI Delaware, Inc Optical Package Having Tunable Filter
CN113820852B (zh) * 2021-08-30 2023-10-17 安徽中科米微电子技术有限公司 高占空比mems微镜、微镜阵列及制备方法
CN113820851B (zh) * 2021-08-30 2023-10-17 安徽中科米微电子技术有限公司 双轴垂直梳齿mems微镜、微镜阵列及制备方法
CN113873404A (zh) * 2021-09-29 2021-12-31 瑞声声学科技(深圳)有限公司 一种振膜及其制备方法、mems麦克风

Family Cites Families (498)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1603131A (ja) * 1968-07-05 1971-03-22
US3728030A (en) * 1970-06-22 1973-04-17 Cary Instruments Polarization interferometer
DE2336930A1 (de) 1973-07-20 1975-02-06 Battelle Institut E V Infrarot-modulator (ii.)
US4190488A (en) * 1978-08-21 1980-02-26 International Business Machines Corporation Etching method using noble gas halides
NL8001281A (nl) 1980-03-04 1981-10-01 Philips Nv Weergeefinrichting.
US4377324A (en) * 1980-08-04 1983-03-22 Honeywell Inc. Graded index Fabry-Perot optical filter device
US4592628A (en) 1981-07-01 1986-06-03 International Business Machines Mirror array light valve
NL8103377A (nl) * 1981-07-16 1983-02-16 Philips Nv Weergeefinrichting.
NL8200354A (nl) 1982-02-01 1983-09-01 Philips Nv Passieve weergeefinrichting.
JPS58158914A (ja) * 1982-03-16 1983-09-21 Semiconductor Res Found 半導体製造装置
US4500171A (en) * 1982-06-02 1985-02-19 Texas Instruments Incorporated Process for plastic LCD fill hole sealing
US4482213A (en) 1982-11-23 1984-11-13 Texas Instruments Incorporated Perimeter seal reinforcement holes for plastic LCDs
US4498953A (en) * 1983-07-27 1985-02-12 At&T Bell Laboratories Etching techniques
US4550684A (en) 1983-08-11 1985-11-05 Genus, Inc. Cooled optical window for semiconductor wafer heating
JPS60159731A (ja) * 1984-01-30 1985-08-21 Sharp Corp 液晶表示体
US5633652A (en) * 1984-02-17 1997-05-27 Canon Kabushiki Kaisha Method for driving optical modulation device
US4863245A (en) 1984-02-28 1989-09-05 Exxon Research And Engineering Company Superlattice electrooptic devices
US4550694A (en) * 1984-05-11 1985-11-05 Evans Cooling Associates Process and apparatus for cooling internal combustion engines
US4710732A (en) * 1984-07-31 1987-12-01 Texas Instruments Incorporated Spatial light modulator and method
US4566935A (en) 1984-07-31 1986-01-28 Texas Instruments Incorporated Spatial light modulator and method
US5061049A (en) 1984-08-31 1991-10-29 Texas Instruments Incorporated Spatial light modulator and method
US4560435A (en) 1984-10-01 1985-12-24 International Business Machines Corporation Composite back-etch/lift-off stencil for proximity effect minimization
US5172262A (en) 1985-10-30 1992-12-15 Texas Instruments Incorporated Spatial light modulator and method
GB2186708B (en) 1985-11-26 1990-07-11 Sharp Kk A variable interferometric device and a process for the production of the same
US5835255A (en) * 1986-04-23 1998-11-10 Etalon, Inc. Visible spectrum modulator arrays
GB8610129D0 (en) 1986-04-25 1986-05-29 Secr Defence Electro-optical device
US4786128A (en) 1986-12-02 1988-11-22 Quantum Diagnostics, Ltd. Device for modulating and reflecting electromagnetic radiation employing electro-optic layer having a variable index of refraction
NL8701138A (nl) 1987-05-13 1988-12-01 Philips Nv Electroscopische beeldweergeefinrichting.
US4811493A (en) * 1987-08-05 1989-03-14 Burgio Joseph T Jr Dryer-cooler apparatus
US4900136A (en) 1987-08-11 1990-02-13 North American Philips Corporation Method of metallizing silica-containing gel and solid state light modulator incorporating the metallized gel
US5259883A (en) * 1988-02-16 1993-11-09 Kabushiki Kaisha Toshiba Method of thermally processing semiconductor wafers and an apparatus therefor
US4956619A (en) 1988-02-19 1990-09-11 Texas Instruments Incorporated Spatial light modulator
JPH0242761A (ja) * 1988-04-20 1990-02-13 Matsushita Electric Ind Co Ltd アクティブマトリクス基板の製造方法
US4949783A (en) * 1988-05-18 1990-08-21 Veeco Instruments, Inc. Substrate transport and cooling apparatus and method for same
US4880493A (en) 1988-06-16 1989-11-14 The United States Of America As Represented By The United States Department Of Energy Electronic-carrier-controlled photochemical etching process in semiconductor device fabrication
US5028939A (en) * 1988-08-23 1991-07-02 Texas Instruments Incorporated Spatial light modulator system
JP2700903B2 (ja) * 1988-09-30 1998-01-21 シャープ株式会社 液晶表示装置
JP2731855B2 (ja) * 1989-02-14 1998-03-25 アネルバ株式会社 減圧気相成長装置
US5192946A (en) * 1989-02-27 1993-03-09 Texas Instruments Incorporated Digitized color video display system
US5218472A (en) * 1989-03-22 1993-06-08 Alcan International Limited Optical interference structures incorporating porous films
US4900395A (en) * 1989-04-07 1990-02-13 Fsi International, Inc. HF gas etching of wafers in an acid processor
US5022745A (en) 1989-09-07 1991-06-11 Massachusetts Institute Of Technology Electrostatically deformable single crystal dielectrically coated mirror
US4954789A (en) 1989-09-28 1990-09-04 Texas Instruments Incorporated Spatial light modulator
US5124834A (en) 1989-11-16 1992-06-23 General Electric Company Transferrable, self-supporting pellicle for elastomer light valve displays and method for making the same
US5279990A (en) * 1990-03-02 1994-01-18 Motorola, Inc. Method of making a small geometry contact using sidewall spacers
CH682523A5 (fr) * 1990-04-20 1993-09-30 Suisse Electronique Microtech Dispositif de modulation de lumière à adressage matriciel.
GB9012099D0 (en) 1990-05-31 1990-07-18 Kodak Ltd Optical article for multicolour imaging
US5099353A (en) 1990-06-29 1992-03-24 Texas Instruments Incorporated Architecture and process for integrating DMD with control circuit substrates
US5083857A (en) * 1990-06-29 1992-01-28 Texas Instruments Incorporated Multi-level deformable mirror device
US5142405A (en) * 1990-06-29 1992-08-25 Texas Instruments Incorporated Bistable dmd addressing circuit and method
US5216537A (en) * 1990-06-29 1993-06-01 Texas Instruments Incorporated Architecture and process for integrating DMD with control circuit substrates
US5018256A (en) * 1990-06-29 1991-05-28 Texas Instruments Incorporated Architecture and process for integrating DMD with control circuit substrates
US5526688A (en) * 1990-10-12 1996-06-18 Texas Instruments Incorporated Digital flexure beam accelerometer and method
US5192395A (en) 1990-10-12 1993-03-09 Texas Instruments Incorporated Method of making a digital flexure beam accelerometer
US5044736A (en) 1990-11-06 1991-09-03 Motorola, Inc. Configurable optical filter or display
US5602671A (en) * 1990-11-13 1997-02-11 Texas Instruments Incorporated Low surface energy passivation layer for micromechanical devices
US5233459A (en) 1991-03-06 1993-08-03 Massachusetts Institute Of Technology Electric display device
US5358806A (en) 1991-03-19 1994-10-25 Hitachi, Ltd. Phase shift mask, method of correcting the same and apparatus for carrying out the method
US5226099A (en) * 1991-04-26 1993-07-06 Texas Instruments Incorporated Digital micromirror shutter device
US5287215A (en) 1991-07-17 1994-02-15 Optron Systems, Inc. Membrane light modulation systems
US5168406A (en) 1991-07-31 1992-12-01 Texas Instruments Incorporated Color deformable mirror device and method for manufacture
CH680534A5 (en) 1991-09-16 1992-09-15 Landis & Gyr Betriebs Ag Fabry=perot sensor for optical parameter measurement - uses two opposing mirrors respectively attached to deflected measuring membrane and transparent plate
US5181556A (en) * 1991-09-20 1993-01-26 Intevac, Inc. System for substrate cooling in an evacuated environment
US5233456A (en) 1991-12-20 1993-08-03 Texas Instruments Incorporated Resonant mirror and method of manufacture
US5231532A (en) 1992-02-05 1993-07-27 Texas Instruments Incorporated Switchable resonant filter for optical radiation
US5212582A (en) 1992-03-04 1993-05-18 Texas Instruments Incorporated Electrostatically controlled beam steering device and method
US5312513A (en) 1992-04-03 1994-05-17 Texas Instruments Incorporated Methods of forming multiple phase light modulators
US5190637A (en) * 1992-04-24 1993-03-02 Wisconsin Alumni Research Foundation Formation of microstructures by multiple level deep X-ray lithography with sacrificial metal layers
US5311360A (en) 1992-04-28 1994-05-10 The Board Of Trustees Of The Leland Stanford, Junior University Method and apparatus for modulating a light beam
US6219015B1 (en) * 1992-04-28 2001-04-17 The Board Of Directors Of The Leland Stanford, Junior University Method and apparatus for using an array of grating light valves to produce multicolor optical images
TW245772B (ja) 1992-05-19 1995-04-21 Akzo Nv
JPH06214169A (ja) 1992-06-08 1994-08-05 Texas Instr Inc <Ti> 制御可能な光学的周期的表面フィルタ
US5347377A (en) 1992-06-17 1994-09-13 Eastman Kodak Company Planar waveguide liquid crystal variable retarder
JPH08501900A (ja) 1992-06-17 1996-02-27 ハリス・コーポレーション 結合ウェーハの製法
US5818095A (en) 1992-08-11 1998-10-06 Texas Instruments Incorporated High-yield spatial light modulator with light blocking layer
US5345328A (en) 1992-08-12 1994-09-06 Sandia Corporation Tandem resonator reflectance modulator
US5293272A (en) * 1992-08-24 1994-03-08 Physical Optics Corporation High finesse holographic fabry-perot etalon and method of fabricating
US5737050A (en) * 1992-08-25 1998-04-07 Matsushita Electric Industrial Co., Ltd. Light valve having reduced reflected light, high brightness and high contrast
US5488505A (en) * 1992-10-01 1996-01-30 Engle; Craig D. Enhanced electrostatic shutter mosaic modulator
US5312512A (en) * 1992-10-23 1994-05-17 Ncr Corporation Global planarization using SOG and CMP
US6674562B1 (en) 1994-05-05 2004-01-06 Iridigm Display Corporation Interferometric modulation of radiation
US5461411A (en) * 1993-03-29 1995-10-24 Texas Instruments Incorporated Process and architecture for digital micromirror printer
US5559358A (en) 1993-05-25 1996-09-24 Honeywell Inc. Opto-electro-mechanical device or filter, process for making, and sensors made therefrom
US6199874B1 (en) 1993-05-26 2001-03-13 Cornell Research Foundation Inc. Microelectromechanical accelerometer for automotive applications
US5324683A (en) * 1993-06-02 1994-06-28 Motorola, Inc. Method of forming a semiconductor structure having an air region
US5489952A (en) 1993-07-14 1996-02-06 Texas Instruments Incorporated Method and device for multi-format television
US5673139A (en) 1993-07-19 1997-09-30 Medcom, Inc. Microelectromechanical television scanning device and method for making the same
US5526172A (en) 1993-07-27 1996-06-11 Texas Instruments Incorporated Microminiature, monolithic, variable electrical signal processor and apparatus including same
US5629790A (en) 1993-10-18 1997-05-13 Neukermans; Armand P. Micromachined torsional scanner
US5447431A (en) * 1993-10-29 1995-09-05 Brooks Automation, Inc. Low-gas temperature stabilization system
CN1137296A (zh) * 1993-12-17 1996-12-04 布鲁克斯自动化公司 加热或冷却晶片的设备
US5583688A (en) 1993-12-21 1996-12-10 Texas Instruments Incorporated Multi-level digital micromirror device
US5500761A (en) 1994-01-27 1996-03-19 At&T Corp. Micromechanical modulator
US5665997A (en) 1994-03-31 1997-09-09 Texas Instruments Incorporated Grated landing area to eliminate sticking of micro-mechanical devices
US5690839A (en) 1994-05-04 1997-11-25 Daewoo Electronics Co., Ltd. Method for forming an array of thin film actuated mirrors
US7123216B1 (en) 1994-05-05 2006-10-17 Idc, Llc Photonic MEMS and structures
US20010003487A1 (en) * 1996-11-05 2001-06-14 Mark W. Miles Visible spectrum modulator arrays
US6680792B2 (en) 1994-05-05 2004-01-20 Iridigm Display Corporation Interferometric modulation of radiation
US7297471B1 (en) 2003-04-15 2007-11-20 Idc, Llc Method for manufacturing an array of interferometric modulators
US7776631B2 (en) 1994-05-05 2010-08-17 Qualcomm Mems Technologies, Inc. MEMS device and method of forming a MEMS device
US6040937A (en) 1994-05-05 2000-03-21 Etalon, Inc. Interferometric modulation
US7550794B2 (en) * 2002-09-20 2009-06-23 Idc, Llc Micromechanical systems device comprising a displaceable electrode and a charge-trapping layer
US7460291B2 (en) * 1994-05-05 2008-12-02 Idc, Llc Separable modulator
KR0135391B1 (ko) 1994-05-28 1998-04-22 김광호 자기정렬된 액정표시장치용 박막트랜지스터 및 제조방법
US5454906A (en) 1994-06-21 1995-10-03 Texas Instruments Inc. Method of providing sacrificial spacer for micro-mechanical devices
JPH0822024A (ja) * 1994-07-05 1996-01-23 Mitsubishi Electric Corp アクティブマトリクス基板およびその製法
US5656554A (en) 1994-07-29 1997-08-12 International Business Machines Corporation Semiconductor chip reclamation technique involving multiple planarization processes
US5485304A (en) * 1994-07-29 1996-01-16 Texas Instruments, Inc. Support posts for micro-mechanical devices
US5636052A (en) 1994-07-29 1997-06-03 Lucent Technologies Inc. Direct view display based on a micromechanical modulation
US5561735A (en) * 1994-08-30 1996-10-01 Vortek Industries Ltd. Rapid thermal processing apparatus and method
PT778982E (pt) 1994-09-02 2000-12-29 Dabbaj Rad Hassan Modulador de valvula de luz reflectora
US6053617A (en) 1994-09-23 2000-04-25 Texas Instruments Incorporated Manufacture method for micromechanical devices
US5619059A (en) 1994-09-28 1997-04-08 National Research Council Of Canada Color deformable mirror device having optical thin film interference color coatings
US5526951A (en) * 1994-09-30 1996-06-18 Texas Instruments Incorporated Fabrication method for digital micro-mirror devices using low temperature CVD
JP3435850B2 (ja) 1994-10-28 2003-08-11 株式会社デンソー 半導体力学量センサ及びその製造方法
US5703728A (en) 1994-11-02 1997-12-30 Texas Instruments Incorporated Support post architecture for micromechanical devices
US5650881A (en) 1994-11-02 1997-07-22 Texas Instruments Incorporated Support post architecture for micromechanical devices
US5552924A (en) 1994-11-14 1996-09-03 Texas Instruments Incorporated Micromechanical device having an improved beam
US5474865A (en) 1994-11-21 1995-12-12 Sematech, Inc. Globally planarized binary optical mask using buried absorbers
JPH08153700A (ja) * 1994-11-25 1996-06-11 Semiconductor Energy Lab Co Ltd 導電性被膜の異方性エッチング方法
US5610624A (en) * 1994-11-30 1997-03-11 Texas Instruments Incorporated Spatial light modulator with reduced possibility of an on state defect
US5726480A (en) * 1995-01-27 1998-03-10 The Regents Of The University Of California Etchants for use in micromachining of CMOS Microaccelerometers and microelectromechanical devices and method of making the same
US5535047A (en) 1995-04-18 1996-07-09 Texas Instruments Incorporated Active yoke hidden hinge digital micromirror device
US5835256A (en) 1995-06-19 1998-11-10 Reflectivity, Inc. Reflective spatial light modulator with encapsulated micro-mechanical elements
US6046840A (en) 1995-06-19 2000-04-04 Reflectivity, Inc. Double substrate reflective spatial light modulator with self-limiting micro-mechanical elements
US6969635B2 (en) * 2000-12-07 2005-11-29 Reflectivity, Inc. Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
US6849471B2 (en) 2003-03-28 2005-02-01 Reflectivity, Inc. Barrier layers for microelectromechanical systems
US5578976A (en) 1995-06-22 1996-11-26 Rockwell International Corporation Micro electromechanical RF switch
JP3489273B2 (ja) 1995-06-27 2004-01-19 株式会社デンソー 半導体力学量センサの製造方法
JP3234854B2 (ja) * 1995-08-28 2001-12-04 アルプス電気株式会社 多層膜フィルタ及びその製造方法
US5739945A (en) 1995-09-29 1998-04-14 Tayebati; Parviz Electrically tunable optical filter utilizing a deformable multi-layer mirror
US6324192B1 (en) * 1995-09-29 2001-11-27 Coretek, Inc. Electrically tunable fabry-perot structure utilizing a deformable multi-layer mirror and method of making the same
US5825528A (en) 1995-12-26 1998-10-20 Lucent Technologies Inc. Phase-mismatched fabry-perot cavity micromechanical modulator
JP3799092B2 (ja) 1995-12-29 2006-07-19 アジレント・テクノロジーズ・インク 光変調装置及びディスプレイ装置
US5771321A (en) * 1996-01-04 1998-06-23 Massachusetts Institute Of Technology Micromechanical optical switch and flat panel display
US5638946A (en) 1996-01-11 1997-06-17 Northeastern University Micromechanical switch with insulated switch contact
US5967163A (en) 1996-01-30 1999-10-19 Abbott Laboratories Actuator and method
US5751469A (en) 1996-02-01 1998-05-12 Lucent Technologies Inc. Method and apparatus for an improved micromechanical modulator
US5828485A (en) * 1996-02-07 1998-10-27 Light & Sound Design Ltd. Programmable light beam shape altering device using programmable micromirrors
JPH09237789A (ja) * 1996-02-29 1997-09-09 Toshiba Corp 遮蔽体および熱処理装置および熱処理方法
US6624944B1 (en) 1996-03-29 2003-09-23 Texas Instruments Incorporated Fluorinated coating for an optical element
US5783864A (en) 1996-06-05 1998-07-21 Advanced Micro Devices, Inc. Multilevel interconnect structure of an integrated circuit having air gaps and pillars separating levels of interconnect
US5710656A (en) 1996-07-30 1998-01-20 Lucent Technologies Inc. Micromechanical optical modulator having a reduced-mass composite membrane
US5838484A (en) 1996-08-19 1998-11-17 Lucent Technologies Inc. Micromechanical optical modulator with linear operating characteristic
US5753418A (en) * 1996-09-03 1998-05-19 Taiwan Semiconductor Manufacturing Company Ltd 0.3 Micron aperture width patterning process
FI108581B (fi) * 1996-10-03 2002-02-15 Valtion Teknillinen Sähköisesti säädettävä optinen suodin
US6054684A (en) * 1996-11-05 2000-04-25 Texas Instruments Incorporated Ultra fast temperature ramp up and down in a furnace using interleaving shutters
DE19730715C1 (de) 1996-11-12 1998-11-26 Fraunhofer Ges Forschung Verfahren zum Herstellen eines mikromechanischen Relais
US5683649A (en) 1996-11-14 1997-11-04 Eastman Kodak Company Method for the fabrication of micro-electromechanical ceramic parts
AU736875B2 (en) 1997-01-21 2001-08-02 Georgia Tech Research Corporation Fabrication of a semiconductor device with air gaps for ultra-low capacitance interconnections
JPH10260641A (ja) 1997-03-17 1998-09-29 Nec Corp フラットパネル型表示装置用ドライバicの実装構造
GB2324882B (en) * 1997-04-29 2001-05-23 Daewoo Electronics Co Ltd Array of thin film actuated mirrors and method for the manufacture thereof
EP0877272B1 (en) 1997-05-08 2002-07-31 Texas Instruments Incorporated Improvements in or relating to spatial light modulators
US5896796A (en) 1997-06-06 1999-04-27 Chih; Chen-Keng Device for punching holes in a bicycle rim
US6508977B2 (en) * 1997-06-26 2003-01-21 C. Edward Eckert Reinforced refractory shaft design for fluxing molten metal
US5914803A (en) 1997-07-01 1999-06-22 Daewoo Electronics Co., Ltd. Thin film actuated mirror array in an optical projection system and method for manufacturing the same
US5960158A (en) * 1997-07-11 1999-09-28 Ag Associates Apparatus and method for filtering light in a thermal processing chamber
US5867302A (en) 1997-08-07 1999-02-02 Sandia Corporation Bistable microelectromechanical actuator
US6031653A (en) * 1997-08-28 2000-02-29 California Institute Of Technology Low-cost thin-metal-film interference filters
US6231945B1 (en) * 1997-09-09 2001-05-15 Hitachi, Ltd. Information recording medium
US5978127A (en) 1997-09-09 1999-11-02 Zilog, Inc. Light phase grating device
US5937541A (en) * 1997-09-15 1999-08-17 Siemens Aktiengesellschaft Semiconductor wafer temperature measurement and control thereof using gas temperature measurement
US5994174A (en) 1997-09-29 1999-11-30 The Regents Of The University Of California Method of fabrication of display pixels driven by silicon thin film transistors
US5822170A (en) 1997-10-09 1998-10-13 Honeywell Inc. Hydrophobic coating for reducing humidity effect in electrostatic actuators
US6333556B1 (en) 1997-10-09 2001-12-25 Micron Technology, Inc. Insulating materials
US5972193A (en) 1997-10-10 1999-10-26 Industrial Technology Research Institute Method of manufacturing a planar coil using a transparency substrate
EP1025711A1 (en) * 1997-10-31 2000-08-09 Daewoo Electronics Co., Ltd Method for manufacturing thin film actuated mirror array in an optical projection system
US6008123A (en) 1997-11-04 1999-12-28 Lucent Technologies Inc. Method for using a hardmask to form an opening in a semiconductor substrate
US5945980A (en) 1997-11-14 1999-08-31 Logitech, Inc. Touchpad with active plane for pen detection
US6028690A (en) 1997-11-26 2000-02-22 Texas Instruments Incorporated Reduced micromirror mirror gaps for improved contrast ratio
US5920421A (en) 1997-12-10 1999-07-06 Daewoo Electronics Co., Ltd. Thin film actuated mirror array in an optical projection system and method for manufacturing the same
US6438149B1 (en) * 1998-06-26 2002-08-20 Coretek, Inc. Microelectromechanically tunable, confocal, vertical cavity surface emitting laser and fabry-perot filter
US6340435B1 (en) * 1998-02-11 2002-01-22 Applied Materials, Inc. Integrated low K dielectrics and etch stops
US6660656B2 (en) 1998-02-11 2003-12-09 Applied Materials Inc. Plasma processes for depositing low dielectric constant films
US6689211B1 (en) * 1999-04-09 2004-02-10 Massachusetts Institute Of Technology Etch stop layer system
EP0951068A1 (en) 1998-04-17 1999-10-20 Interuniversitair Micro-Elektronica Centrum Vzw Method of fabrication of a microstructure having an inside cavity
US6097145A (en) 1998-04-27 2000-08-01 Copytele, Inc. Aerogel-based phase transition flat panel display
US5943158A (en) 1998-05-05 1999-08-24 Lucent Technologies Inc. Micro-mechanical, anti-reflection, switched optical modulator array and fabrication method
US6160833A (en) 1998-05-06 2000-12-12 Xerox Corporation Blue vertical cavity surface emitting laser
JP4651193B2 (ja) * 1998-05-12 2011-03-16 イー インク コーポレイション ドローイングデバイス用途のためのマイクロカプセル化した電気泳動性の静電的にアドレスした媒体
US6282010B1 (en) 1998-05-14 2001-08-28 Texas Instruments Incorporated Anti-reflective coatings for spatial light modulators
US6858080B2 (en) * 1998-05-15 2005-02-22 Apollo Diamond, Inc. Tunable CVD diamond structures
US6046659A (en) * 1998-05-15 2000-04-04 Hughes Electronics Corporation Design and fabrication of broadband surface-micromachined micro-electro-mechanical switches for microwave and millimeter-wave applications
US6323982B1 (en) 1998-05-22 2001-11-27 Texas Instruments Incorporated Yield superstructure for digital micromirror device
US6295154B1 (en) 1998-06-05 2001-09-25 Texas Instruments Incorporated Optical switching apparatus
KR100301803B1 (ko) 1998-06-05 2001-09-22 김영환 박막트랜지스터 및 그의 제조방법
EP1087286A4 (en) * 1998-06-08 2007-10-17 Kaneka Corp TOUCH-SENSITIVE RESISTANCE BOARD FOR LIQUID CRYSTAL DISPLAY DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE COMPRISING SUCH A TOUCH-SOUND TABLE
US6100477A (en) 1998-07-17 2000-08-08 Texas Instruments Incorporated Recessed etch RF micro-electro-mechanical switch
US5976902A (en) 1998-08-03 1999-11-02 Industrial Technology Research Institute Method of fabricating a fully self-aligned TFT-LCD
KR100281182B1 (ko) 1998-08-10 2001-04-02 윤종용 반도체 장치의 자기 정렬 콘택 형성 방법
US5943155A (en) 1998-08-12 1999-08-24 Lucent Techonolgies Inc. Mars optical modulators
US6710539B2 (en) * 1998-09-02 2004-03-23 Micron Technology, Inc. Field emission devices having structure for reduced emitter tip to gate spacing
DE19938072A1 (de) 1998-09-09 2000-03-16 Siemens Ag Verfahren zum selbstjustierenden Herstellen von zusätzlichen Strukturen auf Substraten mit vorhandenen ersten Strukturen
US6249039B1 (en) * 1998-09-10 2001-06-19 Bourns, Inc. Integrated inductive components and method of fabricating such components
JP4074714B2 (ja) * 1998-09-25 2008-04-09 富士フイルム株式会社 アレイ型光変調素子及び平面ディスプレイの駆動方法
US6323834B1 (en) * 1998-10-08 2001-11-27 International Business Machines Corporation Micromechanical displays and fabrication method
DE19847455A1 (de) 1998-10-15 2000-04-27 Bosch Gmbh Robert Verfahren zur Bearbeitung von Silizium mittels Ätzprozessen
JP3919954B2 (ja) 1998-10-16 2007-05-30 富士フイルム株式会社 アレイ型光変調素子及び平面ディスプレイの駆動方法
US6171945B1 (en) * 1998-10-22 2001-01-09 Applied Materials, Inc. CVD nanoporous silica low dielectric constant films
US6288824B1 (en) 1998-11-03 2001-09-11 Alex Kastalsky Display device based on grating electromechanical shutter
US6391675B1 (en) * 1998-11-25 2002-05-21 Raytheon Company Method and apparatus for switching high frequency signals
KR100301050B1 (ko) 1998-12-14 2002-06-20 윤종용 콘택을포함하는반도체장치의커패시터제조방법
US6194323B1 (en) * 1998-12-16 2001-02-27 Lucent Technologies Inc. Deep sub-micron metal etch with in-situ hard mask etch
US6284560B1 (en) 1998-12-18 2001-09-04 Eastman Kodak Company Method for producing co-planar surface structures
US6358021B1 (en) * 1998-12-29 2002-03-19 Honeywell International Inc. Electrostatic actuators for active surfaces
US6215221B1 (en) 1998-12-29 2001-04-10 Honeywell International Inc. Electrostatic/pneumatic actuators for active surfaces
EP1173893A4 (en) 1999-01-15 2007-08-01 Univ California POLYCRYSTALLINE SILICON GERMANIUM FILMS FOR THE MANUFACTURE OF MICROELECTROCHEMICAL SYSTEMS
JP3864204B2 (ja) 1999-02-19 2006-12-27 株式会社日立プラズマパテントライセンシング プラズマディスプレイパネル
JP4787412B2 (ja) 1999-03-30 2011-10-05 シチズンホールディングス株式会社 薄膜基板の形成方法およびその方法によって形成された薄膜基板
US6358854B1 (en) 1999-04-21 2002-03-19 Sandia Corporation Method to fabricate layered material compositions
KR100290852B1 (ko) * 1999-04-29 2001-05-15 구자홍 에칭 방법
US6449084B1 (en) 1999-05-10 2002-09-10 Yanping Guo Optical deflector
US6342452B1 (en) 1999-05-20 2002-01-29 International Business Machines Corporation Method of fabricating a Si3N4/polycide structure using a dielectric sacrificial layer as a mask
JP3592136B2 (ja) * 1999-06-04 2004-11-24 キヤノン株式会社 液体吐出ヘッドおよびその製造方法と微小電気機械装置の製造方法
US6201633B1 (en) * 1999-06-07 2001-03-13 Xerox Corporation Micro-electromechanical based bistable color display sheets
US6359673B1 (en) * 1999-06-21 2002-03-19 Eastman Kodak Company Sheet having a layer with different light modulating materials
US6525310B2 (en) * 1999-08-05 2003-02-25 Microvision, Inc. Frequency tunable resonant scanner
WO2001014248A2 (en) 1999-08-24 2001-03-01 Knowles Electronics, Llc Assembly process for delicate silicon structures
KR100307490B1 (ko) 1999-08-31 2001-11-01 한신혁 반도체 장치의 기생 용량 감소 방법
US6322712B1 (en) 1999-09-01 2001-11-27 Micron Technology, Inc. Buffer layer in flat panel display
KR100333482B1 (ko) * 1999-09-15 2002-04-25 오길록 초고속 반도체 광변조기 및 그 제조방법
US6337027B1 (en) * 1999-09-30 2002-01-08 Rockwell Science Center, Llc Microelectromechanical device manufacturing process
WO2003007049A1 (en) 1999-10-05 2003-01-23 Iridigm Display Corporation Photonic mems and structures
US6351329B1 (en) 1999-10-08 2002-02-26 Lucent Technologies Inc. Optical attenuator
US6960305B2 (en) 1999-10-26 2005-11-01 Reflectivity, Inc Methods for forming and releasing microelectromechanical structures
US7041224B2 (en) * 1999-10-26 2006-05-09 Reflectivity, Inc. Method for vapor phase etching of silicon
US6259062B1 (en) * 1999-12-03 2001-07-10 Asm America, Inc. Process chamber cooling
US6552840B2 (en) * 1999-12-03 2003-04-22 Texas Instruments Incorporated Electrostatic efficiency of micromechanical devices
US6674090B1 (en) * 1999-12-27 2004-01-06 Xerox Corporation Structure and method for planar lateral oxidation in active
US20010040675A1 (en) 2000-01-28 2001-11-15 True Randall J. Method for forming a micromechanical device
US20020071169A1 (en) 2000-02-01 2002-06-13 Bowers John Edward Micro-electro-mechanical-system (MEMS) mirror device
US6407851B1 (en) 2000-08-01 2002-06-18 Mohammed N. Islam Micromechanical optical switch
DE10006035A1 (de) 2000-02-10 2001-08-16 Bosch Gmbh Robert Verfahren zur Herstellung eines mikromechanischen Bauelements sowie ein nach dem Verfahren hergestelltes Bauelement
JP2002174721A (ja) * 2000-12-06 2002-06-21 Yokogawa Electric Corp ファブリペローフィルタ
JP2003524215A (ja) 2000-02-24 2003-08-12 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 光導波路を具える表示装置
US6836366B1 (en) * 2000-03-03 2004-12-28 Axsun Technologies, Inc. Integrated tunable fabry-perot filter and method of making same
US7008812B1 (en) * 2000-05-30 2006-03-07 Ic Mechanics, Inc. Manufacture of MEMS structures in sealed cavity using dry-release MEMS device encapsulation
JP2001356701A (ja) 2000-06-15 2001-12-26 Fuji Photo Film Co Ltd 光学素子、光源ユニットおよび表示装置
US6465320B1 (en) 2000-06-16 2002-10-15 Motorola, Inc. Electronic component and method of manufacturing
US6452465B1 (en) 2000-06-27 2002-09-17 M-Squared Filters, Llc High quality-factor tunable resonator
AU2001268742A1 (en) 2000-06-28 2002-01-08 The Regents Of The University Of California Capacitive microelectromechanical switches
TW535024B (en) 2000-06-30 2003-06-01 Minolta Co Ltd Liquid display element and method of producing the same
JP4614027B2 (ja) 2000-07-03 2011-01-19 ソニー株式会社 光学多層構造体および光スイッチング素子、並びに画像表示装置
KR100840827B1 (ko) * 2000-07-03 2008-06-23 소니 가부시끼 가이샤 광학 다층 구조체, 광학 절환 장치 및 화상 디스플레이
JP2002023070A (ja) 2000-07-04 2002-01-23 Sony Corp 光学多層構造体および光スイッチング素子、並びに画像表示装置
JP4830183B2 (ja) 2000-07-19 2011-12-07 ソニー株式会社 光学多層構造体および光スイッチング素子、並びに画像表示装置
CA2352729A1 (en) 2000-07-13 2002-01-13 Creoscitex Corporation Ltd. Blazed micro-mechanical light modulator and array thereof
US6677225B1 (en) 2000-07-14 2004-01-13 Zyvex Corporation System and method for constraining totally released microcomponents
US6795605B1 (en) * 2000-08-01 2004-09-21 Cheetah Omni, Llc Micromechanical optical switch
US6867897B2 (en) 2003-01-29 2005-03-15 Reflectivity, Inc Micromirrors and off-diagonal hinge structures for micromirror arrays in projection displays
US7083997B2 (en) * 2000-08-03 2006-08-01 Analog Devices, Inc. Bonded wafer optical MEMS process
JP4193340B2 (ja) * 2000-08-08 2008-12-10 富士通株式会社 ガルバノマイクロミラーとこれを用いた光ディスク装置
TW471063B (en) * 2000-08-11 2002-01-01 Winbond Electronics Corp Method to form opening in insulator layer using ion implantation
JP2002062490A (ja) 2000-08-14 2002-02-28 Canon Inc 干渉性変調素子
US6635919B1 (en) 2000-08-17 2003-10-21 Texas Instruments Incorporated High Q-large tuning range micro-electro mechanical system (MEMS) varactor for broadband applications
JP4392970B2 (ja) 2000-08-21 2010-01-06 キヤノン株式会社 干渉性変調素子を用いる表示素子
US6376787B1 (en) * 2000-08-24 2002-04-23 Texas Instruments Incorporated Microelectromechanical switch with fixed metal electrode/dielectric interface with a protective cap layer
US7012731B2 (en) * 2000-08-30 2006-03-14 Reflectivity, Inc Packaged micromirror array for a projection display
MY128644A (en) * 2000-08-31 2007-02-28 Georgia Tech Res Inst Fabrication of semiconductor devices with air gaps for ultra low capacitance interconnections and methods of making same
JP4304852B2 (ja) 2000-09-04 2009-07-29 コニカミノルタホールディングス株式会社 非平面液晶表示素子及びその製造方法
US6466354B1 (en) 2000-09-19 2002-10-15 Silicon Light Machines Method and apparatus for interferometric modulation of light
FI111457B (fi) * 2000-10-02 2003-07-31 Nokia Corp Mikromekaaninen rakenne
US6522801B1 (en) 2000-10-10 2003-02-18 Agere Systems Inc. Micro-electro-optical mechanical device having an implanted dopant included therein and a method of manufacture therefor
GB2367788A (en) * 2000-10-16 2002-04-17 Seiko Epson Corp Etching using an ink jet print head
US6775048B1 (en) 2000-10-31 2004-08-10 Microsoft Corporation Microelectrical mechanical structure (MEMS) optical modulator and optical display system
US6519075B2 (en) * 2000-11-03 2003-02-11 Agere Systems Inc. Packaged MEMS device and method for making the same
DE10055421A1 (de) * 2000-11-09 2002-05-29 Bosch Gmbh Robert Verfahren zur Erzeugung einer mikromechanischen Struktur und mikromechanische Struktur
KR100381011B1 (ko) 2000-11-13 2003-04-26 한국전자통신연구원 멤즈소자 제조용 미세구조체를 고착없이 띄우는 방법
US6525352B1 (en) * 2000-11-22 2003-02-25 Network Photonics, Inc. Method to reduce release time of micromachined devices
US6406975B1 (en) 2000-11-27 2002-06-18 Chartered Semiconductor Manufacturing Inc. Method for fabricating an air gap shallow trench isolation (STI) structure
US6647171B1 (en) * 2000-12-01 2003-11-11 Corning Incorporated MEMS optical switch actuator
US6906847B2 (en) * 2000-12-07 2005-06-14 Reflectivity, Inc Spatial light modulators with light blocking/absorbing areas
US7307775B2 (en) * 2000-12-07 2007-12-11 Texas Instruments Incorporated Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
WO2002049199A1 (en) * 2000-12-11 2002-06-20 Rad H Dabbaj Electrostatic device
WO2002061486A1 (en) * 2000-12-19 2002-08-08 Coventor, Incorporated Bulk micromachining process for fabricating an optical mems device with integrated optical aperture
DE10063991B4 (de) * 2000-12-21 2005-06-02 Infineon Technologies Ag Verfahren zur Herstellung von mikromechanischen Bauelementen
JP2002207182A (ja) 2001-01-10 2002-07-26 Sony Corp 光学多層構造体およびその製造方法、光スイッチング素子、並びに画像表示装置
US6947195B2 (en) 2001-01-18 2005-09-20 Ricoh Company, Ltd. Optical modulator, optical modulator manufacturing method, light information processing apparatus including optical modulator, image formation apparatus including optical modulator, and image projection and display apparatus including optical modulator
US6440767B1 (en) 2001-01-23 2002-08-27 Hrl Laboratories, Llc Monolithic single pole double throw RF MEMS switch
US6480320B2 (en) * 2001-02-07 2002-11-12 Transparent Optical, Inc. Microelectromechanical mirror and mirror array
JP3858606B2 (ja) 2001-02-14 2006-12-20 セイコーエプソン株式会社 干渉フィルタの製造方法、干渉フィルタ、波長可変干渉フィルタの製造方法及び波長可変干渉フィルタ
US6620712B2 (en) 2001-02-14 2003-09-16 Intpax, Inc. Defined sacrifical region via ion implantation for micro-opto-electro-mechanical system (MOEMS) applications
US6555904B1 (en) * 2001-03-05 2003-04-29 Analog Devices, Inc. Electrically shielded glass lid for a packaged device
US6768403B2 (en) * 2002-03-12 2004-07-27 Hrl Laboratories, Llc Torsion spring for electro-mechanical switches and a cantilever-type RF micro-electromechanical switch incorporating the torsion spring
US6912078B2 (en) 2001-03-16 2005-06-28 Corning Incorporated Electrostatically actuated micro-electro-mechanical devices and method of manufacture
US20020167072A1 (en) 2001-03-16 2002-11-14 Andosca Robert George Electrostatically actuated micro-electro-mechanical devices and method of manufacture
US6465856B2 (en) 2001-03-19 2002-10-15 Xerox Corporation Micro-fabricated shielded conductors
JP3888075B2 (ja) 2001-03-23 2007-02-28 セイコーエプソン株式会社 光スイッチング素子、光スイッチングデバイス、および画像表示装置
JP4684448B2 (ja) 2001-03-30 2011-05-18 株式会社リコー 光変調装置及びその光変調装置の製造方法並びにその光変調装置を具備する画像形成装置及びその光変調装置を具備する画像投影表示装置
CN1228818C (zh) * 2001-04-02 2005-11-23 华邦电子股份有限公司 在半导体中形成漏斗形介层窗的方法
US6704475B2 (en) * 2001-04-03 2004-03-09 Agere Systems Inc. Mirror for use with a micro-electro-mechanical system (MEMS) optical device and a method of manufacture therefor
US20020171610A1 (en) 2001-04-04 2002-11-21 Eastman Kodak Company Organic electroluminescent display with integrated touch-screen
US20020149850A1 (en) 2001-04-17 2002-10-17 E-Tek Dynamics, Inc. Tunable optical filter
US6525396B2 (en) 2001-04-17 2003-02-25 Texas Instruments Incorporated Selection of materials and dimensions for a micro-electromechanical switch for use in the RF regime
US6756317B2 (en) * 2001-04-23 2004-06-29 Memx, Inc. Method for making a microstructure by surface micromachining
US6600587B2 (en) 2001-04-23 2003-07-29 Memx, Inc. Surface micromachined optical system with reinforced mirror microstructure
US6657832B2 (en) 2001-04-26 2003-12-02 Texas Instruments Incorporated Mechanically assisted restoring force support for micromachined membranes
US6465355B1 (en) 2001-04-27 2002-10-15 Hewlett-Packard Company Method of fabricating suspended microstructures
US6602791B2 (en) 2001-04-27 2003-08-05 Dalsa Semiconductor Inc. Manufacture of integrated fluidic devices
JP2002328313A (ja) 2001-05-01 2002-11-15 Sony Corp 光スイッチング素子およびその製造方法、並びに画像表示装置
US6576489B2 (en) 2001-05-07 2003-06-10 Applied Materials, Inc. Methods of forming microstructure devices
JP4449249B2 (ja) 2001-05-11 2010-04-14 ソニー株式会社 光学多層構造体の駆動方法および表示装置の駆動方法ならびに表示装置
US6424094B1 (en) * 2001-05-15 2002-07-23 Eastman Kodak Company Organic electroluminescent display with integrated resistive touch screen
WO2002095800A2 (en) * 2001-05-22 2002-11-28 Reflectivity, Inc. A method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants
US7106307B2 (en) 2001-05-24 2006-09-12 Eastman Kodak Company Touch screen for use with an OLED display
US6803534B1 (en) * 2001-05-25 2004-10-12 Raytheon Company Membrane for micro-electro-mechanical switch, and methods of making and using it
US6639724B2 (en) 2001-06-05 2003-10-28 Lucent Technologies Inc. Device having a barrier layer located therein and a method of manufacture therefor
DE10127622B4 (de) * 2001-06-07 2009-10-22 Qimonda Ag Verfahren zur Herstellung eines mit HDPCVD-Oxid gefüllten Isolationsgrabens
US6598985B2 (en) 2001-06-11 2003-07-29 Nanogear Optical mirror system with multi-axis rotational control
US6958123B2 (en) * 2001-06-15 2005-10-25 Reflectivity, Inc Method for removing a sacrificial material with a compressed fluid
JP2003001598A (ja) 2001-06-21 2003-01-08 Sony Corp Si膜のエッチング方法
US7005314B2 (en) * 2001-06-27 2006-02-28 Intel Corporation Sacrificial layer technique to make gaps in MEMS applications
US6822628B2 (en) * 2001-06-28 2004-11-23 Candescent Intellectual Property Services, Inc. Methods and systems for compensating row-to-row brightness variations of a field emission display
KR100437825B1 (ko) * 2001-07-06 2004-06-26 엘지.필립스 엘시디 주식회사 액정표시장치용 어레이기판
JP3852306B2 (ja) * 2001-07-06 2006-11-29 ソニー株式会社 Mems素子の製造方法、glvデバイスの製造方法、及びレーザディスプレイの製造方法
US6905613B2 (en) 2001-07-10 2005-06-14 Honeywell International Inc. Use of an organic dielectric as a sacrificial layer
JP4945059B2 (ja) * 2001-07-10 2012-06-06 クアルコム メムス テクノロジーズ インコーポレイテッド フォトニックmems及び構造
JP3740444B2 (ja) 2001-07-11 2006-02-01 キヤノン株式会社 光偏向器、それを用いた光学機器、ねじれ揺動体
KR100452112B1 (ko) * 2001-07-18 2004-10-12 한국과학기술원 정전 구동기
US7057251B2 (en) * 2001-07-20 2006-06-06 Reflectivity, Inc MEMS device made of transition metal-dielectric oxide materials
JP2003059905A (ja) * 2001-07-31 2003-02-28 Applied Materials Inc エッチング方法、キャパシタの製造方法、および半導体装置
US6600201B2 (en) * 2001-08-03 2003-07-29 Hewlett-Packard Development Company, L.P. Systems with high density packing of micromachines
US6632698B2 (en) 2001-08-07 2003-10-14 Hewlett-Packard Development Company, L.P. Microelectromechanical device having a stiffened support beam, and methods of forming stiffened support beams in MEMS
US6778728B2 (en) * 2001-08-10 2004-08-17 Corning Intellisense Corporation Micro-electro-mechanical mirror devices having a high linear mirror fill factor
JP2003057571A (ja) 2001-08-16 2003-02-26 Sony Corp 光学多層構造体および光スイッチング素子、並びに画像表示装置
US6930364B2 (en) * 2001-09-13 2005-08-16 Silicon Light Machines Corporation Microelectronic mechanical system and methods
US20030053078A1 (en) * 2001-09-17 2003-03-20 Mark Missey Microelectromechanical tunable fabry-perot wavelength monitor with thermal actuators
US6940636B2 (en) 2001-09-20 2005-09-06 Analog Devices, Inc. Optical switching apparatus and method of assembling same
WO2003028059A1 (en) * 2001-09-21 2003-04-03 Hrl Laboratories, Llc Mems switches and methods of making same
US6788175B1 (en) 2001-10-04 2004-09-07 Superconductor Technologies, Inc. Anchors for micro-electro-mechanical systems (MEMS) devices
US6936183B2 (en) * 2001-10-17 2005-08-30 Applied Materials, Inc. Etch process for etching microstructures
AUPR846701A0 (en) 2001-10-25 2001-11-15 Microtechnology Centre Management Limited A method of fabrication of micro-devices
US6666979B2 (en) 2001-10-29 2003-12-23 Applied Materials, Inc. Dry etch release of MEMS structures
JP4045090B2 (ja) * 2001-11-06 2008-02-13 オムロン株式会社 静電アクチュエータの調整方法
DE60232471D1 (de) * 2001-11-09 2009-07-09 Wispry Inc Dreischichtige Strahl-MEMS-Einrichtung und diesbezügliche Verfahren
JP2003177336A (ja) * 2001-12-11 2003-06-27 Fuji Photo Film Co Ltd 光変調素子及び光変調素子アレイ並びにそれを用いた露光装置
US6803160B2 (en) * 2001-12-13 2004-10-12 Dupont Photomasks, Inc. Multi-tone photomask and method for manufacturing the same
US20030111439A1 (en) * 2001-12-14 2003-06-19 Fetter Linus Albert Method of forming tapered electrodes for electronic devices
US6782166B1 (en) 2001-12-21 2004-08-24 United States Of America As Represented By The Secretary Of The Air Force Optically transparent electrically conductive charge sheet poling electrodes to maximize performance of electro-optic devices
DE10163214A1 (de) * 2001-12-21 2003-07-10 Philips Intellectual Property Verfahren und Steuersystem zur Sprachsteuerung eines Gerätes
JP3893421B2 (ja) 2001-12-27 2007-03-14 富士フイルム株式会社 光変調素子及び光変調素子アレイ並びにそれを用いた露光装置
US7106491B2 (en) 2001-12-28 2006-09-12 Texas Instruments Incorporated Split beam micromirror
US6791735B2 (en) * 2002-01-09 2004-09-14 The Regents Of The University Of California Differentially-driven MEMS spatial light modulator
KR100439423B1 (ko) * 2002-01-16 2004-07-09 한국전자통신연구원 마이크로전자기계 액튜에이터
US6608268B1 (en) 2002-02-05 2003-08-19 Memtronics, A Division Of Cogent Solutions, Inc. Proximity micro-electro-mechanical system
US6794119B2 (en) 2002-02-12 2004-09-21 Iridigm Display Corporation Method for fabricating a structure for a microelectromechanical systems (MEMS) device
JP3558066B2 (ja) 2002-02-19 2004-08-25 ソニー株式会社 Mems素子とその製造方法、光変調素子、glvデバイスとその製造方法、及びレーザディスプレイ
US6574033B1 (en) 2002-02-27 2003-06-03 Iridigm Display Corporation Microelectromechanical systems device and method for fabricating same
AUPS098002A0 (en) * 2002-03-08 2002-03-28 University Of Western Australia, The Tunable cavity resonator, and method of fabricating same
US7145143B2 (en) 2002-03-18 2006-12-05 Honeywell International Inc. Tunable sensor
US6700770B2 (en) * 2002-03-22 2004-03-02 Turnstone Systems, Inc. Protection of double end exposed systems
US7027200B2 (en) * 2002-03-22 2006-04-11 Reflectivity, Inc Etching method used in fabrications of microstructures
US6965468B2 (en) 2003-07-03 2005-11-15 Reflectivity, Inc Micromirror array having reduced gap between adjacent micromirrors of the micromirror array
JP2003305697A (ja) * 2002-04-12 2003-10-28 Sony Corp 中空構造体の製造方法
US7029829B2 (en) * 2002-04-18 2006-04-18 The Regents Of The University Of Michigan Low temperature method for forming a microcavity on a substrate and article having same
US6954297B2 (en) 2002-04-30 2005-10-11 Hewlett-Packard Development Company, L.P. Micro-mirror device including dielectrophoretic liquid
US20030202264A1 (en) 2002-04-30 2003-10-30 Weber Timothy L. Micro-mirror device
US6791441B2 (en) * 2002-05-07 2004-09-14 Raytheon Company Micro-electro-mechanical switch, and methods of making and using it
US6806110B2 (en) 2002-05-16 2004-10-19 Agilent Technologies, Inc. Monolithic multi-wavelength vertical-cavity surface emitting laser array and method of manufacture therefor
US6953702B2 (en) 2002-05-16 2005-10-11 Agilent Technologies, Inc. Fixed wavelength vertical cavity optical devices and method of manufacture therefor
JP2003340795A (ja) 2002-05-20 2003-12-02 Sony Corp 静電駆動型mems素子とその製造方法、光学mems素子、光変調素子、glvデバイス及びレーザディスプレイ
JP3801099B2 (ja) * 2002-06-04 2006-07-26 株式会社デンソー チューナブルフィルタ、その製造方法、及びそれを使用した光スイッチング装置
US6678085B2 (en) 2002-06-12 2004-01-13 Eastman Kodak Company High-contrast display system with scanned conformal grating device
US20040001258A1 (en) * 2002-06-28 2004-01-01 Mandeep Singh Solid state etalons with low thermally-induced optical path length change
US6741377B2 (en) * 2002-07-02 2004-05-25 Iridigm Display Corporation Device having a light-absorbing mask and a method for fabricating same
US20040058531A1 (en) * 2002-08-08 2004-03-25 United Microelectronics Corp. Method for preventing metal extrusion in a semiconductor structure.
US6822798B2 (en) * 2002-08-09 2004-11-23 Optron Systems, Inc. Tunable optical filter
JP2004106074A (ja) 2002-09-13 2004-04-08 Sony Corp 中空構造体の製造方法、及びmems素子の製造方法
TW544787B (en) * 2002-09-18 2003-08-01 Promos Technologies Inc Method of forming self-aligned contact structure with locally etched gate conductive layer
US7781850B2 (en) 2002-09-20 2010-08-24 Qualcomm Mems Technologies, Inc. Controlling electromechanical behavior of structures within a microelectromechanical systems device
KR100512960B1 (ko) * 2002-09-26 2005-09-07 삼성전자주식회사 플렉서블 mems 트랜스듀서와 그 제조방법 및 이를채용한 플렉서블 mems 무선 마이크로폰
US6872319B2 (en) * 2002-09-30 2005-03-29 Rockwell Scientific Licensing, Llc Process for high yield fabrication of MEMS devices
JP2004130396A (ja) * 2002-10-08 2004-04-30 Sony Corp マイクロマシン
JP2004133281A (ja) 2002-10-11 2004-04-30 Seiko Epson Corp 微小電気機械デバイスの製造方法、プロジェクタ
US6986587B2 (en) * 2002-10-16 2006-01-17 Olympus Corporation Variable-shape reflection mirror and method of manufacturing the same
JP2004141995A (ja) 2002-10-23 2004-05-20 Sony Corp マイクロマシンおよびその製造方法
US6747785B2 (en) * 2002-10-24 2004-06-08 Hewlett-Packard Development Company, L.P. MEMS-actuated color light modulator and methods
FR2846318B1 (fr) 2002-10-24 2005-01-07 Commissariat Energie Atomique Microstructure electromecanique integree comportant des moyens de reglage de la pression dans une cavite scellee et procede de reglage de la pression
JP2004149607A (ja) * 2002-10-29 2004-05-27 Jsr Corp 多層配線間の空洞形成用重合体およびその製造方法
US7370185B2 (en) 2003-04-30 2008-05-06 Hewlett-Packard Development Company, L.P. Self-packaged optical interference display device having anti-stiction bumps, integral micro-lens, and reflection-absorbing layers
US6909589B2 (en) 2002-11-20 2005-06-21 Corporation For National Research Initiatives MEMS-based variable capacitor
US6958846B2 (en) * 2002-11-26 2005-10-25 Reflectivity, Inc Spatial light modulators with light absorbing areas
US6844959B2 (en) 2002-11-26 2005-01-18 Reflectivity, Inc Spatial light modulators with light absorbing areas
US7553686B2 (en) * 2002-12-17 2009-06-30 The Regents Of The University Of Colorado, A Body Corporate Al2O3 atomic layer deposition to enhance the deposition of hydrophobic or hydrophilic coatings on micro-electromechanical devices
US6944008B2 (en) * 2002-12-18 2005-09-13 Lucent Technologies Inc. Charge dissipation in electrostatically driven devices
TWI289708B (en) * 2002-12-25 2007-11-11 Qualcomm Mems Technologies Inc Optical interference type color display
US6872654B2 (en) * 2002-12-26 2005-03-29 Intel Corporation Method of fabricating a bismaleimide (BMI) ASA sacrifical material for an integrated circuit air gap dielectric
TW559686B (en) * 2002-12-27 2003-11-01 Prime View Int Co Ltd Optical interference type panel and the manufacturing method thereof
TW594155B (en) * 2002-12-27 2004-06-21 Prime View Int Corp Ltd Optical interference type color display and optical interference modulator
JP2004212656A (ja) 2002-12-27 2004-07-29 Fuji Photo Film Co Ltd 光変調素子アレイ及び平面ディスプレイ
US6808953B2 (en) * 2002-12-31 2004-10-26 Robert Bosch Gmbh Gap tuning for surface micromachined structures in an epitaxial reactor
US6815234B2 (en) * 2002-12-31 2004-11-09 Infineon Technologies Aktiengesellschaft Reducing stress in integrated circuits
US7002719B2 (en) * 2003-01-15 2006-02-21 Lucent Technologies Inc. Mirror for an integrated device
JP4625639B2 (ja) * 2003-01-17 2011-02-02 富士フイルム株式会社 光変調素子、光変調素子アレイ、画像形成装置、及び平面表示装置
US20040140557A1 (en) * 2003-01-21 2004-07-22 United Test & Assembly Center Limited Wl-bga for MEMS/MOEMS devices
US6943448B2 (en) 2003-01-23 2005-09-13 Akustica, Inc. Multi-metal layer MEMS structure and process for making the same
TW200413810A (en) * 2003-01-29 2004-08-01 Prime View Int Co Ltd Light interference display panel and its manufacturing method
TW557395B (en) * 2003-01-29 2003-10-11 Yen Sun Technology Corp Optical interference type reflection panel and the manufacturing method thereof
US20040157426A1 (en) 2003-02-07 2004-08-12 Luc Ouellet Fabrication of advanced silicon-based MEMS devices
US7459402B2 (en) 2003-02-12 2008-12-02 Texas Instruments Incorporated Protection layers in micromirror array devices
US20040159629A1 (en) 2003-02-19 2004-08-19 Cabot Microelectronics Corporation MEM device processing with multiple material sacrificial layers
US20040166603A1 (en) * 2003-02-25 2004-08-26 Carley L. Richard Micromachined assembly with a multi-layer cap defining a cavity
US7027202B1 (en) * 2003-02-28 2006-04-11 Silicon Light Machines Corp Silicon substrate as a light modulator sacrificial layer
TW200417806A (en) 2003-03-05 2004-09-16 Prime View Int Corp Ltd A structure of a light-incidence electrode of an optical interference display plate
US7289404B2 (en) * 2003-03-13 2007-10-30 Lg Electronics Inc. Write-once recording medium and defective area management method and apparatus for write-once recording medium
US6720267B1 (en) * 2003-03-19 2004-04-13 United Microelectronics Corp. Method for forming a cantilever beam model micro-electromechanical system
US6913942B2 (en) 2003-03-28 2005-07-05 Reflectvity, Inc Sacrificial layers for use in fabrications of microelectromechanical devices
US7128843B2 (en) 2003-04-04 2006-10-31 Hrl Laboratories, Llc Process for fabricating monolithic membrane substrate structures with well-controlled air gaps
US6987432B2 (en) 2003-04-16 2006-01-17 Robert Bosch Gmbh Temperature compensation for silicon MEMS resonator
JP2004314251A (ja) * 2003-04-17 2004-11-11 Fuji Photo Film Co Ltd 薄膜梁及びその成形方法
TWI224235B (en) 2003-04-21 2004-11-21 Prime View Int Co Ltd A method for fabricating an interference display cell
TWI226504B (en) 2003-04-21 2005-01-11 Prime View Int Co Ltd A structure of an interference display cell
TW594360B (en) 2003-04-21 2004-06-21 Prime View Int Corp Ltd A method for fabricating an interference display cell
TW567355B (en) 2003-04-21 2003-12-21 Prime View Int Co Ltd An interference display cell and fabrication method thereof
KR100599083B1 (ko) * 2003-04-22 2006-07-12 삼성전자주식회사 캔틸레버 형태의 압전 박막 공진 소자 및 그 제조방법
US6929969B2 (en) * 2003-04-23 2005-08-16 Taiwan Semiconductor Manufacturing Company Reflective spatial light modulator mirror device manufacturing process and layout method
US6819469B1 (en) 2003-05-05 2004-11-16 Igor M. Koba High-resolution spatial light modulator for 3-dimensional holographic display
TW570896B (en) * 2003-05-26 2004-01-11 Prime View Int Co Ltd A method for fabricating an interference display cell
TW591716B (en) * 2003-05-26 2004-06-11 Prime View Int Co Ltd A structure of a structure release and manufacturing the same
FR2855908B1 (fr) 2003-06-06 2005-08-26 Soitec Silicon On Insulator Procede d'obtention d'une structure comprenant au moins un substrat et une couche ultramince
KR100513696B1 (ko) * 2003-06-10 2005-09-09 삼성전자주식회사 시이소오형 rf용 mems 스위치 및 그 제조방법
US20070064760A1 (en) 2003-06-12 2007-03-22 Soren Kragh Optical amplification in miniaturized polymer cavity resonators
US7221495B2 (en) * 2003-06-24 2007-05-22 Idc Llc Thin film precursor stack for MEMS manufacturing
JP2005028504A (ja) 2003-07-11 2005-02-03 Sony Corp Mems素子及びその製造方法
JP2005051007A (ja) 2003-07-28 2005-02-24 Tokyo Electron Ltd 半導体チップの製造方法
TW200506479A (en) 2003-08-15 2005-02-16 Prime View Int Co Ltd Color changeable pixel for an interference display
TWI305599B (en) * 2003-08-15 2009-01-21 Qualcomm Mems Technologies Inc Interference display panel and method thereof
TWI251712B (en) * 2003-08-15 2006-03-21 Prime View Int Corp Ltd Interference display plate
TWI231865B (en) 2003-08-26 2005-05-01 Prime View Int Co Ltd An interference display cell and fabrication method thereof
TWI230801B (en) 2003-08-29 2005-04-11 Prime View Int Co Ltd Reflective display unit using interferometric modulation and manufacturing method thereof
JP3979982B2 (ja) * 2003-08-29 2007-09-19 シャープ株式会社 干渉性変調器および表示装置
TWI232333B (en) * 2003-09-03 2005-05-11 Prime View Int Co Ltd Display unit using interferometric modulation and manufacturing method thereof
US6982820B2 (en) 2003-09-26 2006-01-03 Prime View International Co., Ltd. Color changeable pixel
TW593126B (en) * 2003-09-30 2004-06-21 Prime View Int Co Ltd A structure of a micro electro mechanical system and manufacturing the same
US6861277B1 (en) * 2003-10-02 2005-03-01 Hewlett-Packard Development Company, L.P. Method of forming MEMS device
US7709285B2 (en) 2003-10-31 2010-05-04 Epcos Ag Method of manufacturing a MEMS device and MEMS device
US7012726B1 (en) * 2003-11-03 2006-03-14 Idc, Llc MEMS devices with unreleased thin film components
DE10352001A1 (de) * 2003-11-07 2005-06-09 Robert Bosch Gmbh Mikromechanisches Bauelement mit einer Membran und Verfahren zur Herstellung eines solchen Bauelements
US20050170670A1 (en) 2003-11-17 2005-08-04 King William P. Patterning of sacrificial materials
US6967757B1 (en) 2003-11-24 2005-11-22 Sandia Corporation Microelectromechanical mirrors and electrically-programmable diffraction gratings based on two-stage actuation
US7056757B2 (en) * 2003-11-25 2006-06-06 Georgia Tech Research Corporation Methods of forming oxide masks with submicron openings and microstructures formed thereby
US20050118832A1 (en) * 2003-12-01 2005-06-02 Korzenski Michael B. Removal of MEMS sacrificial layers using supercritical fluid/chemical formulations
CA2589168A1 (en) * 2003-12-01 2005-06-16 Advanced Technology Materials, Inc. Removal of mems sacrificial layers using supercritical fluid/chemical formulations
US7375404B2 (en) * 2003-12-05 2008-05-20 University Of Maryland Biotechnology Institute Fabrication and integration of polymeric bioMEMS
US7064883B2 (en) * 2003-12-10 2006-06-20 Silicon Light Machines Corporation Two dimensional spatial light modulator
JP4464971B2 (ja) * 2003-12-11 2010-05-19 マイクロニック レーザー システムズ アクチボラゲット 加工物にパターン形成するための方法及び装置、並びにその製造方法
KR100518606B1 (ko) * 2003-12-19 2005-10-04 삼성전자주식회사 실리콘 기판과 식각 선택비가 큰 마스크층을 이용한리세스 채널 어레이 트랜지스터의 제조 방법
US7323217B2 (en) * 2004-01-08 2008-01-29 Qualcomm Mems Technologies, Inc. Method for making an optical interference type reflective panel
JP4466081B2 (ja) 2004-01-08 2010-05-26 ソニー株式会社 Mems素子
TWI235345B (en) 2004-01-20 2005-07-01 Prime View Int Co Ltd A structure of an optical interference display unit
JP4166712B2 (ja) * 2004-01-29 2008-10-15 株式会社デンソー ファブリペローフィルタ
JP4496091B2 (ja) * 2004-02-12 2010-07-07 株式会社東芝 薄膜圧電アクチュエータ
US7041571B2 (en) * 2004-03-01 2006-05-09 International Business Machines Corporation Air gap interconnect structure and method of manufacture
US7119945B2 (en) 2004-03-03 2006-10-10 Idc, Llc Altering temporal response of microelectromechanical elements
TW200530669A (en) 2004-03-05 2005-09-16 Prime View Int Co Ltd Interference display plate and manufacturing method thereof
US6999228B2 (en) 2004-03-05 2006-02-14 Hewlett-Packard Development Company, L.P. Micro mirror device with adjacently suspended spring and method for the same
TWI261683B (en) 2004-03-10 2006-09-11 Qualcomm Mems Technologies Inc Interference reflective element and repairing method thereof
US7256107B2 (en) 2004-05-04 2007-08-14 The Regents Of The University Of California Damascene process for use in fabricating semiconductor structures having micro/nano gaps
US7476327B2 (en) 2004-05-04 2009-01-13 Idc, Llc Method of manufacture for microelectromechanical devices
US7612759B2 (en) 2004-05-12 2009-11-03 Shimano Inc. Cycle computer display apparatus
US7145213B1 (en) * 2004-05-24 2006-12-05 The United States Of America As Represented By The Secretary Of The Air Force MEMS RF switch integrated process
JP2005342808A (ja) 2004-05-31 2005-12-15 Oki Electric Ind Co Ltd Memsデバイスの製造方法
US7042619B1 (en) * 2004-06-18 2006-05-09 Miradia Inc. Mirror structure with single crystal silicon cross-member
CA2575314A1 (en) * 2004-07-29 2006-02-09 Idc, Llc System and method for micro-electromechanical operating of an interferometric modulator
US7273693B2 (en) 2004-07-30 2007-09-25 Hewlett-Packard Development Company, L.P. Method for forming a planar mirror using a sacrificial oxide
US20060037933A1 (en) * 2004-08-23 2006-02-23 Wei-Ya Wang Mirror process using tungsten passivation layer for preventing metal-spiking induced mirror bridging and improving mirror curvature
JP4852835B2 (ja) * 2004-09-02 2012-01-11 ソニー株式会社 回折格子−光変調装置集合体
US7527995B2 (en) 2004-09-27 2009-05-05 Qualcomm Mems Technologies, Inc. Method of making prestructure for MEMS systems
US20060066932A1 (en) * 2004-09-27 2006-03-30 Clarence Chui Method of selective etching using etch stop layer
US7161730B2 (en) * 2004-09-27 2007-01-09 Idc, Llc System and method for providing thermal compensation for an interferometric modulator display
US7429334B2 (en) 2004-09-27 2008-09-30 Idc, Llc Methods of fabricating interferometric modulators by selectively removing a material
US7327510B2 (en) * 2004-09-27 2008-02-05 Idc, Llc Process for modifying offset voltage characteristics of an interferometric modulator
US7692839B2 (en) * 2004-09-27 2010-04-06 Qualcomm Mems Technologies, Inc. System and method of providing MEMS device with anti-stiction coating
US7710636B2 (en) * 2004-09-27 2010-05-04 Qualcomm Mems Technologies, Inc. Systems and methods using interferometric optical modulators and diffusers
US7492502B2 (en) * 2004-09-27 2009-02-17 Idc, Llc Method of fabricating a free-standing microstructure
US7373026B2 (en) * 2004-09-27 2008-05-13 Idc, Llc MEMS device fabricated on a pre-patterned substrate
US7259449B2 (en) 2004-09-27 2007-08-21 Idc, Llc Method and system for sealing a substrate
US7349141B2 (en) * 2004-09-27 2008-03-25 Idc, Llc Method and post structures for interferometric modulation
US7684104B2 (en) 2004-09-27 2010-03-23 Idc, Llc MEMS using filler material and method
US7289259B2 (en) * 2004-09-27 2007-10-30 Idc, Llc Conductive bus structure for interferometric modulator array
US7130104B2 (en) * 2004-09-27 2006-10-31 Idc, Llc Methods and devices for inhibiting tilting of a mirror in an interferometric modulator
US7446926B2 (en) 2004-09-27 2008-11-04 Idc, Llc System and method of providing a regenerating protective coating in a MEMS device
US7369296B2 (en) * 2004-09-27 2008-05-06 Idc, Llc Device and method for modifying actuation voltage thresholds of a deformable membrane in an interferometric modulator
US7309658B2 (en) * 2004-11-22 2007-12-18 Intermolecular, Inc. Molecular self-assembly in substrate processing
US7199916B2 (en) 2004-12-07 2007-04-03 Hewlett-Packard Development Company, L.P. Light modulator device
EP1829126B1 (en) * 2004-12-09 2020-05-27 Wispry, Inc. Micro-electro-mechanical system (mems) capacitors, inductors, and related systems and methods
TW200628877A (en) * 2005-02-04 2006-08-16 Prime View Int Co Ltd Method of manufacturing optical interference type color display
US7502155B2 (en) 2005-03-15 2009-03-10 Texas Instruments Incorporated Antireflective coating for semiconductor devices and method for the same
US20060234412A1 (en) 2005-04-19 2006-10-19 Hewlett-Packard Development Company, L.P. Intellectual Property Administration MEMS release methods
KR20080023313A (ko) * 2005-06-30 2008-03-13 코닌클리케 필립스 일렉트로닉스 엔.브이. Mems 구성요소 제조 방법
JP2009503565A (ja) 2005-07-22 2009-01-29 クアルコム,インコーポレイテッド Memsデバイスのための支持構造、およびその方法
WO2007014022A1 (en) 2005-07-22 2007-02-01 Qualcomm Incorporated Mems devices having support structures and methods of fabricating the same
JP2009503564A (ja) * 2005-07-22 2009-01-29 クアルコム,インコーポレイテッド Memsデバイスのための支持構造、およびその方法
EP2495212A3 (en) * 2005-07-22 2012-10-31 QUALCOMM MEMS Technologies, Inc. Mems devices having support structures and methods of fabricating the same
US7795061B2 (en) * 2005-12-29 2010-09-14 Qualcomm Mems Technologies, Inc. Method of creating MEMS device cavities by a non-etching process
US20070249078A1 (en) * 2006-04-19 2007-10-25 Ming-Hau Tung Non-planar surface structures and process for microelectromechanical systems
US7527996B2 (en) * 2006-04-19 2009-05-05 Qualcomm Mems Technologies, Inc. Non-planar surface structures and process for microelectromechanical systems
US7321457B2 (en) * 2006-06-01 2008-01-22 Qualcomm Incorporated Process and structure for fabrication of MEMS device having isolated edge posts

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11384726B2 (en) 2018-05-30 2022-07-12 Oceana Energy Company Hydroelectric energy systems and methods
WO2020118151A1 (en) * 2018-12-07 2020-06-11 Oceana Energy Company Orbital magnetic gears, and related systems
KR102052367B1 (ko) * 2019-02-20 2020-01-08 김흥필 가변 회전추를 이용한 발전장치

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