MY168564A - Electrodynamics (mems) micro speaker - Google Patents
Electrodynamics (mems) micro speakerInfo
- Publication number
- MY168564A MY168564A MYPI2014701301A MYPI2014701301A MY168564A MY 168564 A MY168564 A MY 168564A MY PI2014701301 A MYPI2014701301 A MY PI2014701301A MY PI2014701301 A MYPI2014701301 A MY PI2014701301A MY 168564 A MY168564 A MY 168564A
- Authority
- MY
- Malaysia
- Prior art keywords
- wafer
- silicon wafer
- electrodynamics
- mems
- micro
- Prior art date
Links
- 230000005520 electrodynamics Effects 0.000 title abstract 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 5
- 229910052710 silicon Inorganic materials 0.000 abstract 5
- 239000010703 silicon Substances 0.000 abstract 5
- 239000004642 Polyimide Substances 0.000 abstract 3
- 229920001721 polyimide Polymers 0.000 abstract 3
- 239000004593 Epoxy Substances 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 238000001312 dry etching Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000013022 venting Methods 0.000 abstract 1
- 238000001039 wet etching Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Micromachines (AREA)
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
Abstract
The present invention provides a method for fabrication of an electrodynamics microelectromechanical systems (MEMS) micro speaker (100). Accordingly, the method includes: a) forming a first silicon wafer, i.e. wafer 1 (200), having a moving parts that serves a actuator system, said moving part includes flexible polyimide diaphragm (204) and micro coil or voice coil (202); b) forming a second silicon wafer, i.e. wafer 2 (300), with back cavity (306) for a seating or supporting a permanent magnet (302); said second silicon wafer includes venting or acoustic hole (304) on its back chamber (206); c) bonding the permanent magnet (302) to the second silicon wafer using adhesive epoxy bonding followed by boding the both wafer 1 (200) and wafer 2 (300) together using adhesive epoxy bonding, to form the complete electrodynamics MEMS micro speaker (100); wherein the flexible polyimide diaphragm (204) is formed by wet and dry etching of the first silicon wafer; such that a thin planar of the micro coil or voice coil (202) is suspended on the flexible polyimide diaphragm (204). The most illustrative drawing: FIG. 1b
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MYPI2014701301A MY168564A (en) | 2014-05-20 | 2014-05-20 | Electrodynamics (mems) micro speaker |
| PCT/MY2015/050035 WO2015178760A1 (en) | 2014-05-20 | 2015-05-20 | Electrodynamics (mems) micro speaker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MYPI2014701301A MY168564A (en) | 2014-05-20 | 2014-05-20 | Electrodynamics (mems) micro speaker |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY168564A true MY168564A (en) | 2018-11-13 |
Family
ID=54554335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2014701301A MY168564A (en) | 2014-05-20 | 2014-05-20 | Electrodynamics (mems) micro speaker |
Country Status (2)
| Country | Link |
|---|---|
| MY (1) | MY168564A (en) |
| WO (1) | WO2015178760A1 (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106454659A (en) * | 2016-10-31 | 2017-02-22 | 歌尔股份有限公司 | Sound production apparatus and manufacturing method thereof |
| CN106454668A (en) * | 2016-10-31 | 2017-02-22 | 歌尔股份有限公司 | MEMS sound production apparatus and electronic device |
| CN106454660A (en) * | 2016-10-31 | 2017-02-22 | 歌尔股份有限公司 | Electret sound production device and electronic equipment |
| DE102017118815A1 (en) * | 2017-08-17 | 2019-02-21 | USound GmbH | Speaker assembly and headphones for spatially locating a sound event |
| CN109211281B (en) * | 2018-08-06 | 2019-10-22 | 歌尔股份有限公司 | A kind of sensor |
| US11051106B2 (en) * | 2019-04-29 | 2021-06-29 | Fortemedia, Inc. | Movable embedded microstructure |
| CN114430520B (en) * | 2020-10-29 | 2024-07-09 | 富迪科技(南京)有限公司 | Packaging structure of miniature loudspeaker |
| CN112188369B (en) * | 2020-11-02 | 2021-08-27 | 地球山(苏州)微电子科技有限公司 | Loudspeaker and manufacturing method thereof |
| CN113452234A (en) | 2021-07-26 | 2021-09-28 | 北京航空航天大学 | Ultra-miniature voice coil motor based on MEMS three-dimensional coil |
| US11818563B2 (en) * | 2022-01-26 | 2023-11-14 | Fortemedia, Inc. | Package structure of micro speaker and method for forming the same |
| US12294845B2 (en) * | 2022-07-01 | 2025-05-06 | Fortemedia, Inc. | Package structure of micro speaker |
| US12464289B2 (en) * | 2023-06-30 | 2025-11-04 | Fortemedia, Inc. | Micro speaker structure with novel magnet design |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4652882B2 (en) * | 2005-03-29 | 2011-03-16 | 古河電気工業株式会社 | Thin speaker |
| EP2495212A3 (en) * | 2005-07-22 | 2012-10-31 | QUALCOMM MEMS Technologies, Inc. | Mems devices having support structures and methods of fabricating the same |
| JPWO2007020925A1 (en) * | 2005-08-17 | 2009-02-26 | 富士電機デバイステクノロジー株式会社 | Electroacoustic transducer |
| KR101411416B1 (en) * | 2007-12-14 | 2014-06-26 | 삼성전자주식회사 | Micro speaker manufacturing method and micro speaker |
-
2014
- 2014-05-20 MY MYPI2014701301A patent/MY168564A/en unknown
-
2015
- 2015-05-20 WO PCT/MY2015/050035 patent/WO2015178760A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015178760A1 (en) | 2015-11-26 |
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