JP2015064614A - 応力に起因する変形を最小限に抑えるように構成された支持構造を有するmemsデバイス、およびその製造方法 - Google Patents
応力に起因する変形を最小限に抑えるように構成された支持構造を有するmemsデバイス、およびその製造方法 Download PDFInfo
- Publication number
- JP2015064614A JP2015064614A JP2015002426A JP2015002426A JP2015064614A JP 2015064614 A JP2015064614 A JP 2015064614A JP 2015002426 A JP2015002426 A JP 2015002426A JP 2015002426 A JP2015002426 A JP 2015002426A JP 2015064614 A JP2015064614 A JP 2015064614A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- sublayer
- movable
- reflective
- support structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0067—Mechanical properties
- B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/00142—Bridges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
- B81C1/0065—Mechanical properties
- B81C1/00666—Treatments for controlling internal stress or strain in MEMS structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/04—Optical MEMS
- B81B2201/047—Optical MEMS not provided for in B81B2201/042 - B81B2201/045
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0145—Flexible holders
- B81B2203/0163—Spring holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/019—Suspended structures, i.e. structures allowing a movement characterized by their profile
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/03—Static structures
- B81B2203/0307—Anchors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/05—Type of movement
- B81B2203/053—Translation according to an axis perpendicular to the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0161—Controlling physical properties of the material
- B81C2201/0163—Controlling internal stress of deposited layers
- B81C2201/0167—Controlling internal stress of deposited layers by adding further layers of materials having complementary strains, i.e. compressive or tensile strain
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S359/00—Optical: systems and elements
- Y10S359/90—Methods
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Micromachines (AREA)
- Connection Of Motors, Electrical Generators, Mechanical Devices, And The Like (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Drying Of Semiconductors (AREA)
Abstract
【解決手段】MEMSデバイスの実施形態は、上位の支持構造によって支持される移動可能層を含み、更に、下位の支持構造を含むことができる。1つの実施形態では、上位の支持構造内の残留応力と、移動可能層内の残留応力とが、実質的に等しい。別の実施形態では、上位の支持構造内の残留応力と、下位の支持構造内の残留応力とが、実質的に等しい。特定の実施形態では、実質的に等しい残留応力は、同じ厚さを有する同じ材料で形成される層の使用を通じて得られる。更なる実施形態では、実質的に等しい残留応力は、互いの鏡像である支持構造および/または移動可能層の使用を通じて得られる。
【選択図】図11
Description
19 ギャップ
62 リベット
66 移動可能層
70 基板
90 高反射層
92 機械層
110 第一の副層
112 第二の副層
114 エッチング停止層
Claims (22)
- 基板と、
前記基板の上に位置する電極層と、
前記電極層の上に位置し、通常、エアギャップによって前記電極層から隔てられる移動可能層であって、
前記電極層に面した側の反射性副層と、
前記反射性副層上の機械的副層と、
前記機械的副層上の上部副層と、
を含み、前記上部副層内の残留応力が前記反射性副層内の残留応力と実質的に釣り合う、移動可能層と、
前記移動可能層を支持し、前記移動可能層の一部にのみ隣接して延在する複数の支持構造であって、前記移動可能層の一部が前記複数の支持構造の少なくとも2つの間に延在する、複数の支持構造と、
を備える、電気機械デバイス。 - 前記反射性副層が、広い波長スペクトル領域において高い反射性である、請求項1に記載のデバイス。
- 前記反射性副層が、アルミニウムまたはアルミニウム合金を含む、請求項1に記載のデバイス。
- 前記複数の支持構造が前記移動可能層の下位にあり、前記デバイスが前記移動可能層の上位にある少なくとも一つの上位の支持構造をさらに備え、前記上位の支持構造が、実質的に前記下位の支持構造の上位にあり、前記上位の支持構造内の残留応力が、前記下位の支持構造内の残留応力と実質的に釣り合う、請求項3に記載の電気機械デバイス。
- 前記上位の支持構造と前記下位の支持構造とが、実質的に同じ材料を含む、請求項4に記載の電気機械デバイス。
- 前記移動可能層内の応力が、実質的に前記機械的副層の中立軸に沿って作用する、請求項1に記載の電気機械デバイス。
- 前記移動可能層内の応力が、前記移動可能層に対して大きなモーメントを与えない、請求項1に記載の電気機械デバイス。
- 前記反射性副層の厚さと前記上部副層の厚さの差が、前記上部副層の厚さの5%以内である、請求項1に記載の電気機械デバイス。
- 前記反射性副層と前記上部副層とが、実質的に同じ材料を含む、請求項1に記載の電気機械デバイス。
- 前記反射性副層の熱膨張係数が、前記上部副層の熱膨張係数と実質的に等しい、請求項1に記載の電気機械デバイス。
- 前記エアギャップと前記電極層との間に位置する部分反射性層をさらに備える、請求項1に記載の電気機械デバイス。
- 前記電気機械デバイスが、インターフェロメトリックモジュレータを含む、請求項1に記載の電気機械デバイス。
- 前記電極層および前記移動可能層の少なくとも一方と通信するように構成されたプロセッサであって、画像データを処理するように構成されたプロセッサと、
前記プロセッサと通信するように構成されたメモリデバイスと、
をさらに備える、請求項1に記載の電気機械デバイス。 - 前記電極層および前記移動可能層の少なくとも一方に少なくとも1つの信号を送信するように構成されたドライバ回路と、前記ドライバ回路に前記画像データの少なくとも一部を送信するように構成されたコントローラと、
をさらに備える、請求項13に記載の電気機械デバイス。 - 前記プロセッサに前記画像データを送信するように構成された画像ソースモジュールをさらに備え、前記画像ソースモジュールが、レシーバ、トランシーバ、およびトランスミッタの少なくとも1つを含む、請求項13に記載の電気機械デバイス。
- 入力データを受信して、前記入力データを前記プロセッサに通信するように構成された入力デバイスをさらに備える、請求項13に記載の電気機械デバイス。
- 電気機械デバイスを製造する方法であって、
基板を提供する段階と、
前記基板の上に電極層を堆積する段階と、
前記電極層の上に犠牲層を堆積する段階と、
開口を形成するために、前記犠牲層をパターン形成する段階と、
少なくとも部分的に前記開口内に位置する複数の支持構造を形成する段階と、
前記犠牲層の上に移動可能層を形成する段階であって、前記移動可能層の一部を前記複数の支持構造の少なくとも2つの間に延在させる段階と、
を備え、
前記移動可能層を形成する段階が、
反射性副層を堆積する段階と、
前記反射性副層の上に機械的副層を堆積する段階と、
前記機械的副層の上に上部副層を堆積する段階と、
を含む、方法。 - 前記犠牲層を除去するために前記犠牲層をエッチングし、これによって、前記移動可能層と前記電極層との間にキャビティを形成する段階をさらに含む、請求項17に記載の方法。
- 前記反射性副層と前記上部副層とが、実質的に同じ材料を含む、請求項17に記載の方法。
- 前記反射性副層の厚さと前記上部副層の厚さの差が、前記上部副層の厚さの5%以内である、請求項17に記載の方法。
- 前記反射性副層を堆積する段階が、アルミニウムまたはアルミニウム合金を含む層を堆積する段階を含む、請求項17に記載の方法。
- 前記反射性副層を堆積する段階が、広い波長スペクトル領域において高い反射性である層を堆積する段階を含む、請求項17に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US71001905P | 2005-08-19 | 2005-08-19 | |
US60/710,019 | 2005-08-19 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012251991A Division JP2013068959A (ja) | 2005-08-19 | 2012-11-16 | 応力に起因する変形を最小限に抑えるように構成された支持構造を有するmemsデバイス、およびその製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015122422A Continuation JP2015195717A (ja) | 2005-08-19 | 2015-06-01 | 発電装置用等の回転装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2015064614A true JP2015064614A (ja) | 2015-04-09 |
Family
ID=37451248
Family Applications (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008527198A Expired - Fee Related JP5129136B2 (ja) | 2005-08-19 | 2006-08-17 | テーパ縁を実現するために、memsデバイス内に層を形成するための方法 |
JP2008527197A Expired - Fee Related JP5180076B2 (ja) | 2005-08-19 | 2006-08-17 | 応力に起因する変形を最小限に抑えるように構成された支持構造を有するmemsデバイス、およびその製造方法 |
JP2012031420A Pending JP2012161913A (ja) | 2005-08-19 | 2012-02-16 | テーパ縁を実現するために、memsデバイス内に層を形成するための方法 |
JP2012251991A Withdrawn JP2013068959A (ja) | 2005-08-19 | 2012-11-16 | 応力に起因する変形を最小限に抑えるように構成された支持構造を有するmemsデバイス、およびその製造方法 |
JP2015002426A Pending JP2015064614A (ja) | 2005-08-19 | 2015-01-08 | 応力に起因する変形を最小限に抑えるように構成された支持構造を有するmemsデバイス、およびその製造方法 |
JP2015122422A Pending JP2015195717A (ja) | 2005-08-19 | 2015-06-01 | 発電装置用等の回転装置 |
Family Applications Before (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008527198A Expired - Fee Related JP5129136B2 (ja) | 2005-08-19 | 2006-08-17 | テーパ縁を実現するために、memsデバイス内に層を形成するための方法 |
JP2008527197A Expired - Fee Related JP5180076B2 (ja) | 2005-08-19 | 2006-08-17 | 応力に起因する変形を最小限に抑えるように構成された支持構造を有するmemsデバイス、およびその製造方法 |
JP2012031420A Pending JP2012161913A (ja) | 2005-08-19 | 2012-02-16 | テーパ縁を実現するために、memsデバイス内に層を形成するための方法 |
JP2012251991A Withdrawn JP2013068959A (ja) | 2005-08-19 | 2012-11-16 | 応力に起因する変形を最小限に抑えるように構成された支持構造を有するmemsデバイス、およびその製造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015122422A Pending JP2015195717A (ja) | 2005-08-19 | 2015-06-01 | 発電装置用等の回転装置 |
Country Status (7)
Country | Link |
---|---|
US (9) | US7486867B2 (ja) |
EP (3) | EP2495212A3 (ja) |
JP (6) | JP5129136B2 (ja) |
KR (2) | KR20080055849A (ja) |
CN (3) | CN102320562A (ja) |
TW (3) | TW200713415A (ja) |
WO (3) | WO2007022528A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021506603A (ja) * | 2017-12-19 | 2021-02-22 | ザ ユニヴァーシティ オブ ブリティッシュ コロンビア | 層状構造及び層状構造を製造するための方法 |
Families Citing this family (116)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8928967B2 (en) | 1998-04-08 | 2015-01-06 | Qualcomm Mems Technologies, Inc. | Method and device for modulating light |
KR100703140B1 (ko) | 1998-04-08 | 2007-04-05 | 이리다임 디스플레이 코포레이션 | 간섭 변조기 및 그 제조 방법 |
WO2000025332A1 (de) * | 1998-10-26 | 2000-05-04 | Studer Professional Audio Ag | Vorrichtung zur eingabe von werten mit einem bildschirm |
TWI289708B (en) * | 2002-12-25 | 2007-11-11 | Qualcomm Mems Technologies Inc | Optical interference type color display |
US7342705B2 (en) | 2004-02-03 | 2008-03-11 | Idc, Llc | Spatial light modulator with integrated optical compensation structure |
JP4554978B2 (ja) * | 2004-04-21 | 2010-09-29 | Okiセミコンダクタ株式会社 | Memsデバイスの製造方法及びmemsデバイスを製造するための接合基板 |
US20060066586A1 (en) * | 2004-09-27 | 2006-03-30 | Gally Brian J | Touchscreens for displays |
US7349141B2 (en) * | 2004-09-27 | 2008-03-25 | Idc, Llc | Method and post structures for interferometric modulation |
US7561323B2 (en) * | 2004-09-27 | 2009-07-14 | Idc, Llc | Optical films for directing light towards active areas of displays |
US7944599B2 (en) | 2004-09-27 | 2011-05-17 | Qualcomm Mems Technologies, Inc. | Electromechanical device with optical function separated from mechanical and electrical function |
US7372613B2 (en) | 2004-09-27 | 2008-05-13 | Idc, Llc | Method and device for multistate interferometric light modulation |
US7807488B2 (en) | 2004-09-27 | 2010-10-05 | Qualcomm Mems Technologies, Inc. | Display element having filter material diffused in a substrate of the display element |
DE102005002967B4 (de) * | 2005-01-21 | 2011-03-31 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Herstellen eines Bauelementes mit einem beweglichen Abschnitt |
EP1910218A1 (en) * | 2005-07-22 | 2008-04-16 | Qualcomm Mems Technologies, Inc. | Mems devices having support structures and methods of fabricating the same |
EP2495212A3 (en) | 2005-07-22 | 2012-10-31 | QUALCOMM MEMS Technologies, Inc. | Mems devices having support structures and methods of fabricating the same |
US8043950B2 (en) * | 2005-10-26 | 2011-10-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
US7630114B2 (en) * | 2005-10-28 | 2009-12-08 | Idc, Llc | Diffusion barrier layer for MEMS devices |
US7795061B2 (en) | 2005-12-29 | 2010-09-14 | Qualcomm Mems Technologies, Inc. | Method of creating MEMS device cavities by a non-etching process |
US7916980B2 (en) | 2006-01-13 | 2011-03-29 | Qualcomm Mems Technologies, Inc. | Interconnect structure for MEMS device |
US7382515B2 (en) * | 2006-01-18 | 2008-06-03 | Qualcomm Mems Technologies, Inc. | Silicon-rich silicon nitrides as etch stops in MEMS manufacture |
US7547568B2 (en) | 2006-02-22 | 2009-06-16 | Qualcomm Mems Technologies, Inc. | Electrical conditioning of MEMS device and insulating layer thereof |
US7450295B2 (en) | 2006-03-02 | 2008-11-11 | Qualcomm Mems Technologies, Inc. | Methods for producing MEMS with protective coatings using multi-component sacrificial layers |
US7623287B2 (en) * | 2006-04-19 | 2009-11-24 | Qualcomm Mems Technologies, Inc. | Non-planar surface structures and process for microelectromechanical systems |
US7711239B2 (en) | 2006-04-19 | 2010-05-04 | Qualcomm Mems Technologies, Inc. | Microelectromechanical device and method utilizing nanoparticles |
WO2007136706A1 (en) * | 2006-05-17 | 2007-11-29 | Qualcomm Mems Technologies Inc. | Desiccant in a mems device |
US7405863B2 (en) * | 2006-06-01 | 2008-07-29 | Qualcomm Mems Technologies, Inc. | Patterning of mechanical layer in MEMS to reduce stresses at supports |
KR20150014978A (ko) | 2006-10-06 | 2015-02-09 | 퀄컴 엠이엠에스 테크놀로지스, 인크. | 디스플레이 장치 및 디스플레이의 형성 방법 |
WO2008045207A2 (en) | 2006-10-06 | 2008-04-17 | Qualcomm Mems Technologies, Inc. | Light guide |
US7545552B2 (en) * | 2006-10-19 | 2009-06-09 | Qualcomm Mems Technologies, Inc. | Sacrificial spacer process and resultant structure for MEMS support structure |
US20080124823A1 (en) * | 2006-11-24 | 2008-05-29 | United Microdisplay Optronics Corp. | Method of fabricating patterned layer using lift-off process |
US7706042B2 (en) | 2006-12-20 | 2010-04-27 | Qualcomm Mems Technologies, Inc. | MEMS device and interconnects for same |
US7916378B2 (en) | 2007-03-08 | 2011-03-29 | Qualcomm Mems Technologies, Inc. | Method and apparatus for providing a light absorbing mask in an interferometric modulator display |
US7733552B2 (en) * | 2007-03-21 | 2010-06-08 | Qualcomm Mems Technologies, Inc | MEMS cavity-coating layers and methods |
EP2129619A2 (en) * | 2007-04-04 | 2009-12-09 | Qualcomm Mems Technologies, Inc. | Eliminate release etch attack by interface modification in sacrificial layers |
US7719752B2 (en) | 2007-05-11 | 2010-05-18 | Qualcomm Mems Technologies, Inc. | MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same |
JP5135879B2 (ja) * | 2007-05-21 | 2013-02-06 | 富士電機株式会社 | 炭化珪素半導体装置の製造方法 |
US7625825B2 (en) * | 2007-06-14 | 2009-12-01 | Qualcomm Mems Technologies, Inc. | Method of patterning mechanical layer for MEMS structures |
US8068268B2 (en) * | 2007-07-03 | 2011-11-29 | Qualcomm Mems Technologies, Inc. | MEMS devices having improved uniformity and methods for making them |
US7563720B2 (en) * | 2007-07-23 | 2009-07-21 | Honeywell International Inc. | Boron doped shell for MEMS device |
RU2471210C2 (ru) | 2007-07-25 | 2012-12-27 | Квалкомм Мемс Текнолоджис, Инк. | Дисплеи на основе микроэлектромеханических систем и способы их изготовления |
WO2009036215A2 (en) * | 2007-09-14 | 2009-03-19 | Qualcomm Mems Technologies, Inc. | Etching processes used in mems production |
WO2009041948A1 (en) * | 2007-09-28 | 2009-04-02 | Qualcomm Mems Technologies, Inc. | Multicomponent sacrificial structure |
US8435838B2 (en) * | 2007-09-28 | 2013-05-07 | Qualcomm Mems Technologies, Inc. | Optimization of desiccant usage in a MEMS package |
US8368100B2 (en) | 2007-11-14 | 2013-02-05 | Cree, Inc. | Semiconductor light emitting diodes having reflective structures and methods of fabricating same |
US8068710B2 (en) | 2007-12-07 | 2011-11-29 | Qualcomm Mems Technologies, Inc. | Decoupled holographic film and diffuser |
CN101897033B (zh) * | 2007-12-17 | 2012-11-14 | 高通Mems科技公司 | 具有干涉式背面掩模的光伏装置及其制造方法 |
WO2009082812A1 (en) * | 2007-12-28 | 2009-07-09 | The Royal Institution For The Advancement Of Learning/Mcgill University | Direct contact heat control of micro structures |
DE102008007345B4 (de) | 2008-02-04 | 2016-10-06 | Robert Bosch Gmbh | Mikromechanisches Bauelement und Verfahren zur Herstellung desselben |
US7863079B2 (en) | 2008-02-05 | 2011-01-04 | Qualcomm Mems Technologies, Inc. | Methods of reducing CD loss in a microelectromechanical device |
WO2009142960A1 (en) * | 2008-05-22 | 2009-11-26 | Fujifilm Corporation | Etching piezoelectric material |
US7851239B2 (en) * | 2008-06-05 | 2010-12-14 | Qualcomm Mems Technologies, Inc. | Low temperature amorphous silicon sacrificial layer for controlled adhesion in MEMS devices |
US20100013060A1 (en) * | 2008-06-22 | 2010-01-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of forming a conductive trench in a silicon wafer and silicon wafer comprising such trench |
US7782522B2 (en) | 2008-07-17 | 2010-08-24 | Qualcomm Mems Technologies, Inc. | Encapsulation methods for interferometric modulator and MEMS devices |
US7855826B2 (en) * | 2008-08-12 | 2010-12-21 | Qualcomm Mems Technologies, Inc. | Method and apparatus to reduce or eliminate stiction and image retention in interferometric modulator devices |
US8203776B2 (en) * | 2008-11-26 | 2012-06-19 | Texas Instruments Incorporated | Planarity of pixel mirrors |
US8066893B2 (en) * | 2008-12-23 | 2011-11-29 | Hitachi Global Storage Technologies Netherlands B.V. | Method for creating a magnetic write pole having a stepped perpendicular pole via CMP-assisted liftoff |
US8410690B2 (en) | 2009-02-13 | 2013-04-02 | Qualcomm Mems Technologies, Inc. | Display device with desiccant |
US8722537B2 (en) * | 2009-03-19 | 2014-05-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Multi-sacrificial layer and method |
US8741715B2 (en) * | 2009-04-29 | 2014-06-03 | Cree, Inc. | Gate electrodes for millimeter-wave operation and methods of fabrication |
JP5449539B2 (ja) | 2009-05-29 | 2014-03-19 | クォルコム・メムズ・テクノロジーズ・インコーポレーテッド | 照明デバイスおよび照明デバイスの製造方法 |
TW201102340A (en) * | 2009-07-10 | 2011-01-16 | Nat Univ Tsing Hua | A method for fabricating a multilayer microstructure with balancing residual stress capability |
DE102010000666A1 (de) * | 2010-01-05 | 2011-07-07 | Robert Bosch GmbH, 70469 | Bauelement mit einer mikromechanischen Mikrofonstruktur und Verfahren zu dessen Herstellung |
US8547626B2 (en) * | 2010-03-25 | 2013-10-01 | Qualcomm Mems Technologies, Inc. | Mechanical layer and methods of shaping the same |
KR20130100232A (ko) | 2010-04-09 | 2013-09-10 | 퀄컴 엠이엠에스 테크놀로지스, 인크. | 전기 기계 디바이스의 기계층 및 그 형성 방법 |
CA2796519A1 (en) | 2010-04-16 | 2011-10-20 | Flex Lighting Ii, Llc | Illumination device comprising a film-based lightguide |
MX2012012034A (es) | 2010-04-16 | 2013-05-30 | Flex Lighting Ii Llc | Dispositivo de iluminacion frontal que comprende una guia de luz a base de pelicula. |
US8848294B2 (en) | 2010-05-20 | 2014-09-30 | Qualcomm Mems Technologies, Inc. | Method and structure capable of changing color saturation |
JP5707780B2 (ja) * | 2010-08-25 | 2015-04-30 | セイコーエプソン株式会社 | 波長可変干渉フィルター、光モジュール、及び光分析装置 |
US9070851B2 (en) | 2010-09-24 | 2015-06-30 | Seoul Semiconductor Co., Ltd. | Wafer-level light emitting diode package and method of fabricating the same |
US20120194897A1 (en) * | 2011-01-27 | 2012-08-02 | Qualcomm Mems Technologies, Inc. | Backside patterning to form support posts in an electromechanical device |
US8461655B2 (en) | 2011-03-31 | 2013-06-11 | Infineon Technologies Ag | Micromechanical sound transducer having a membrane support with tapered surface |
US9134527B2 (en) | 2011-04-04 | 2015-09-15 | Qualcomm Mems Technologies, Inc. | Pixel via and methods of forming the same |
US8963159B2 (en) | 2011-04-04 | 2015-02-24 | Qualcomm Mems Technologies, Inc. | Pixel via and methods of forming the same |
US9268089B2 (en) * | 2011-04-21 | 2016-02-23 | Octrolix Bv | Layer having a non-linear taper and method of fabrication |
US8718432B1 (en) * | 2011-04-21 | 2014-05-06 | Octrolix Bv | Method for forming a spotsize converter |
US8659816B2 (en) | 2011-04-25 | 2014-02-25 | Qualcomm Mems Technologies, Inc. | Mechanical layer and methods of making the same |
WO2013000825A1 (en) * | 2011-06-27 | 2013-01-03 | Thin Film Electronics Asa | Short circuit reduction in an electronic component comprising a stack of layers arranged on a flexible substrate |
US9134529B2 (en) | 2011-07-21 | 2015-09-15 | Pixronix, Inc. | Display device with tapered light reflecting layer and manufacturing method for same |
JP5879886B2 (ja) * | 2011-10-03 | 2016-03-08 | セイコーエプソン株式会社 | 虚像表示装置及びその製造方法 |
US8733871B2 (en) * | 2011-10-25 | 2014-05-27 | Stmicroelectronics Pte Ltd. | AlCu hard mask process |
US8803861B2 (en) * | 2012-02-23 | 2014-08-12 | Qualcomm Mems Technologies, Inc. | Electromechanical systems device |
US9450141B2 (en) | 2012-10-15 | 2016-09-20 | Seoul Viosys Co., Ltd. | Method for separating growth substrate, method for light-emitting diode, and light-emitting diode manufactured using methods |
US9013012B2 (en) * | 2013-03-05 | 2015-04-21 | Stmicroelectronics Pte. Ltd. | Self-sealing membrane for MEMS devices |
US9176317B2 (en) * | 2013-03-13 | 2015-11-03 | Pixtronix, Inc. | Display apparatus incorporating dual-level shutters |
US9134530B2 (en) | 2013-03-13 | 2015-09-15 | Pixtronix, Inc. | Display apparatus incorporating dual-level shutters |
US9142452B2 (en) * | 2013-07-22 | 2015-09-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Hard mask removal scheme |
US9510103B2 (en) * | 2013-09-09 | 2016-11-29 | Audio Pixels Ltd. | Microelectromechanical apparatus for generating a physical effect |
US10322481B2 (en) | 2014-03-06 | 2019-06-18 | Infineon Technologies Ag | Support structure and method of forming a support structure |
MY168564A (en) * | 2014-05-20 | 2018-11-13 | Univ Kebangsaan Malaysia Ukm | Electrodynamics (mems) micro speaker |
JP2016139015A (ja) * | 2015-01-28 | 2016-08-04 | セイコーエプソン株式会社 | ミラーデバイス、ミラーデバイスの製造方法、及び画像表示装置 |
KR102266707B1 (ko) * | 2015-02-04 | 2021-06-22 | 삼성디스플레이 주식회사 | 터치패널 제조방법 |
US9613848B2 (en) | 2015-02-12 | 2017-04-04 | Infineon Technologies Ag | Dielectric structures with negative taper and methods of formation thereof |
US9715102B2 (en) | 2015-06-11 | 2017-07-25 | Snaptrack, Inc. | Electromechanical systems device with hinges for reducing tilt instability |
CN107852555B (zh) * | 2015-07-22 | 2020-03-13 | 音频像素有限公司 | Dsr扬声器元件及制造dsr扬声器元件的方法 |
US9995647B2 (en) * | 2015-09-30 | 2018-06-12 | General Monitors, Inc. | Ultrasonic gas leak location system and method |
CN205944139U (zh) | 2016-03-30 | 2017-02-08 | 首尔伟傲世有限公司 | 紫外线发光二极管封装件以及包含此的发光二极管模块 |
JP6341959B2 (ja) | 2016-05-27 | 2018-06-13 | 浜松ホトニクス株式会社 | ファブリペロー干渉フィルタの製造方法 |
JP7018873B2 (ja) | 2016-05-27 | 2022-02-14 | 浜松ホトニクス株式会社 | ファブリペロー干渉フィルタの製造方法 |
JP6861214B2 (ja) * | 2016-08-24 | 2021-04-21 | 浜松ホトニクス株式会社 | ファブリペロー干渉フィルタ |
CN109477958A (zh) * | 2016-08-24 | 2019-03-15 | 浜松光子学株式会社 | 法布里-珀罗干涉滤光器 |
US10800649B2 (en) | 2016-11-28 | 2020-10-13 | Analog Devices International Unlimited Company | Planar processing of suspended microelectromechanical systems (MEMS) devices |
EP3803102A4 (en) | 2018-05-30 | 2022-04-20 | Oceana Energy Company | HYDROELECTRIC POWER SYSTEMS AND PROCESSES |
CN108892098B (zh) * | 2018-06-20 | 2020-09-29 | 青岛科技大学 | 一种偏转可控的mems微型反射镜结构 |
US20220029518A1 (en) * | 2018-12-07 | 2022-01-27 | Oceana Energy Company | Orbital magnetic gears, and related systems |
CN109589798B (zh) * | 2018-12-12 | 2021-05-25 | 南方科技大学 | 分离膜的阈通量的测量方法和测量设备 |
US11256083B2 (en) * | 2018-12-27 | 2022-02-22 | Texas Instruments Incorporated | MEMS electrostatic actuator with linearized displacements |
JP2020112592A (ja) * | 2019-01-08 | 2020-07-27 | ソニーセミコンダクタソリューションズ株式会社 | 光反射素子及び空間光変調器 |
KR102052367B1 (ko) * | 2019-02-20 | 2020-01-08 | 김흥필 | 가변 회전추를 이용한 발전장치 |
US10843920B2 (en) | 2019-03-08 | 2020-11-24 | Analog Devices International Unlimited Company | Suspended microelectromechanical system (MEMS) devices |
US11131595B2 (en) * | 2019-07-26 | 2021-09-28 | Raytheon Technologies Corporation | Pressure sensing device and method for using the same |
DE102020213772A1 (de) | 2020-11-03 | 2022-05-05 | Robert Bosch Gesellschaft mit beschränkter Haftung | Mikromechanisches Bauelement |
CN112551475B (zh) * | 2021-02-20 | 2021-04-20 | 甬矽电子(宁波)股份有限公司 | 芯片封装结构、其制作方法和电子设备 |
US20220365339A1 (en) * | 2021-05-11 | 2022-11-17 | II-VI Delaware, Inc | Optical Package Having Tunable Filter |
CN113820852B (zh) * | 2021-08-30 | 2023-10-17 | 安徽中科米微电子技术有限公司 | 高占空比mems微镜、微镜阵列及制备方法 |
CN113820851B (zh) * | 2021-08-30 | 2023-10-17 | 安徽中科米微电子技术有限公司 | 双轴垂直梳齿mems微镜、微镜阵列及制备方法 |
CN113873404A (zh) * | 2021-09-29 | 2021-12-31 | 瑞声声学科技(深圳)有限公司 | 一种振膜及其制备方法、mems麦克风 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002056554A (ja) * | 2000-08-08 | 2002-02-22 | Fujitsu Ltd | ガルバノマイクロミラーとこれを用いた光ディスク装置 |
JP2004212656A (ja) * | 2002-12-27 | 2004-07-29 | Fuji Photo Film Co Ltd | 光変調素子アレイ及び平面ディスプレイ |
JP2004530253A (ja) * | 2001-01-23 | 2004-09-30 | エイチアールエル、ラボラトリーズ、リミテッド、ライアビリティー、カンパニー | モノリシックスイッチ |
JP2004534280A (ja) * | 2001-07-10 | 2004-11-11 | イリディグム ディスプレイ コーポレイション | フォトニックmems及び構造 |
Family Cites Families (494)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1603131A (ja) | 1968-07-05 | 1971-03-22 | ||
US3728030A (en) | 1970-06-22 | 1973-04-17 | Cary Instruments | Polarization interferometer |
DE2336930A1 (de) | 1973-07-20 | 1975-02-06 | Battelle Institut E V | Infrarot-modulator (ii.) |
US4190488A (en) * | 1978-08-21 | 1980-02-26 | International Business Machines Corporation | Etching method using noble gas halides |
NL8001281A (nl) | 1980-03-04 | 1981-10-01 | Philips Nv | Weergeefinrichting. |
US4377324A (en) | 1980-08-04 | 1983-03-22 | Honeywell Inc. | Graded index Fabry-Perot optical filter device |
US4592628A (en) | 1981-07-01 | 1986-06-03 | International Business Machines | Mirror array light valve |
NL8103377A (nl) | 1981-07-16 | 1983-02-16 | Philips Nv | Weergeefinrichting. |
NL8200354A (nl) | 1982-02-01 | 1983-09-01 | Philips Nv | Passieve weergeefinrichting. |
JPS58158914A (ja) | 1982-03-16 | 1983-09-21 | Semiconductor Res Found | 半導体製造装置 |
US4500171A (en) * | 1982-06-02 | 1985-02-19 | Texas Instruments Incorporated | Process for plastic LCD fill hole sealing |
US4482213A (en) | 1982-11-23 | 1984-11-13 | Texas Instruments Incorporated | Perimeter seal reinforcement holes for plastic LCDs |
US4498953A (en) * | 1983-07-27 | 1985-02-12 | At&T Bell Laboratories | Etching techniques |
US4550684A (en) | 1983-08-11 | 1985-11-05 | Genus, Inc. | Cooled optical window for semiconductor wafer heating |
JPS60159731A (ja) | 1984-01-30 | 1985-08-21 | Sharp Corp | 液晶表示体 |
US5633652A (en) | 1984-02-17 | 1997-05-27 | Canon Kabushiki Kaisha | Method for driving optical modulation device |
US4863245A (en) | 1984-02-28 | 1989-09-05 | Exxon Research And Engineering Company | Superlattice electrooptic devices |
US4550694A (en) * | 1984-05-11 | 1985-11-05 | Evans Cooling Associates | Process and apparatus for cooling internal combustion engines |
US4566935A (en) | 1984-07-31 | 1986-01-28 | Texas Instruments Incorporated | Spatial light modulator and method |
US4710732A (en) * | 1984-07-31 | 1987-12-01 | Texas Instruments Incorporated | Spatial light modulator and method |
US5061049A (en) | 1984-08-31 | 1991-10-29 | Texas Instruments Incorporated | Spatial light modulator and method |
US4560435A (en) | 1984-10-01 | 1985-12-24 | International Business Machines Corporation | Composite back-etch/lift-off stencil for proximity effect minimization |
US5172262A (en) | 1985-10-30 | 1992-12-15 | Texas Instruments Incorporated | Spatial light modulator and method |
GB2186708B (en) | 1985-11-26 | 1990-07-11 | Sharp Kk | A variable interferometric device and a process for the production of the same |
US5835255A (en) | 1986-04-23 | 1998-11-10 | Etalon, Inc. | Visible spectrum modulator arrays |
GB8610129D0 (en) | 1986-04-25 | 1986-05-29 | Secr Defence | Electro-optical device |
US4786128A (en) | 1986-12-02 | 1988-11-22 | Quantum Diagnostics, Ltd. | Device for modulating and reflecting electromagnetic radiation employing electro-optic layer having a variable index of refraction |
NL8701138A (nl) | 1987-05-13 | 1988-12-01 | Philips Nv | Electroscopische beeldweergeefinrichting. |
US4811493A (en) | 1987-08-05 | 1989-03-14 | Burgio Joseph T Jr | Dryer-cooler apparatus |
US4900136A (en) | 1987-08-11 | 1990-02-13 | North American Philips Corporation | Method of metallizing silica-containing gel and solid state light modulator incorporating the metallized gel |
US5259883A (en) | 1988-02-16 | 1993-11-09 | Kabushiki Kaisha Toshiba | Method of thermally processing semiconductor wafers and an apparatus therefor |
US4956619A (en) * | 1988-02-19 | 1990-09-11 | Texas Instruments Incorporated | Spatial light modulator |
JPH0242761A (ja) | 1988-04-20 | 1990-02-13 | Matsushita Electric Ind Co Ltd | アクティブマトリクス基板の製造方法 |
US4949783A (en) | 1988-05-18 | 1990-08-21 | Veeco Instruments, Inc. | Substrate transport and cooling apparatus and method for same |
US4880493A (en) | 1988-06-16 | 1989-11-14 | The United States Of America As Represented By The United States Department Of Energy | Electronic-carrier-controlled photochemical etching process in semiconductor device fabrication |
US5028939A (en) | 1988-08-23 | 1991-07-02 | Texas Instruments Incorporated | Spatial light modulator system |
JP2700903B2 (ja) | 1988-09-30 | 1998-01-21 | シャープ株式会社 | 液晶表示装置 |
JP2731855B2 (ja) | 1989-02-14 | 1998-03-25 | アネルバ株式会社 | 減圧気相成長装置 |
US5192946A (en) | 1989-02-27 | 1993-03-09 | Texas Instruments Incorporated | Digitized color video display system |
US5218472A (en) | 1989-03-22 | 1993-06-08 | Alcan International Limited | Optical interference structures incorporating porous films |
US4900395A (en) * | 1989-04-07 | 1990-02-13 | Fsi International, Inc. | HF gas etching of wafers in an acid processor |
US5022745A (en) | 1989-09-07 | 1991-06-11 | Massachusetts Institute Of Technology | Electrostatically deformable single crystal dielectrically coated mirror |
US4954789A (en) | 1989-09-28 | 1990-09-04 | Texas Instruments Incorporated | Spatial light modulator |
US5124834A (en) | 1989-11-16 | 1992-06-23 | General Electric Company | Transferrable, self-supporting pellicle for elastomer light valve displays and method for making the same |
US5279990A (en) * | 1990-03-02 | 1994-01-18 | Motorola, Inc. | Method of making a small geometry contact using sidewall spacers |
CH682523A5 (fr) | 1990-04-20 | 1993-09-30 | Suisse Electronique Microtech | Dispositif de modulation de lumière à adressage matriciel. |
GB9012099D0 (en) | 1990-05-31 | 1990-07-18 | Kodak Ltd | Optical article for multicolour imaging |
US5099353A (en) | 1990-06-29 | 1992-03-24 | Texas Instruments Incorporated | Architecture and process for integrating DMD with control circuit substrates |
US5018256A (en) | 1990-06-29 | 1991-05-28 | Texas Instruments Incorporated | Architecture and process for integrating DMD with control circuit substrates |
US5142405A (en) | 1990-06-29 | 1992-08-25 | Texas Instruments Incorporated | Bistable dmd addressing circuit and method |
US5083857A (en) * | 1990-06-29 | 1992-01-28 | Texas Instruments Incorporated | Multi-level deformable mirror device |
US5216537A (en) * | 1990-06-29 | 1993-06-01 | Texas Instruments Incorporated | Architecture and process for integrating DMD with control circuit substrates |
US5526688A (en) | 1990-10-12 | 1996-06-18 | Texas Instruments Incorporated | Digital flexure beam accelerometer and method |
US5192395A (en) | 1990-10-12 | 1993-03-09 | Texas Instruments Incorporated | Method of making a digital flexure beam accelerometer |
US5044736A (en) | 1990-11-06 | 1991-09-03 | Motorola, Inc. | Configurable optical filter or display |
US5602671A (en) | 1990-11-13 | 1997-02-11 | Texas Instruments Incorporated | Low surface energy passivation layer for micromechanical devices |
US5233459A (en) | 1991-03-06 | 1993-08-03 | Massachusetts Institute Of Technology | Electric display device |
US5358806A (en) | 1991-03-19 | 1994-10-25 | Hitachi, Ltd. | Phase shift mask, method of correcting the same and apparatus for carrying out the method |
US5226099A (en) | 1991-04-26 | 1993-07-06 | Texas Instruments Incorporated | Digital micromirror shutter device |
US5287215A (en) * | 1991-07-17 | 1994-02-15 | Optron Systems, Inc. | Membrane light modulation systems |
US5168406A (en) | 1991-07-31 | 1992-12-01 | Texas Instruments Incorporated | Color deformable mirror device and method for manufacture |
CH680534A5 (en) | 1991-09-16 | 1992-09-15 | Landis & Gyr Betriebs Ag | Fabry=perot sensor for optical parameter measurement - uses two opposing mirrors respectively attached to deflected measuring membrane and transparent plate |
US5181556A (en) | 1991-09-20 | 1993-01-26 | Intevac, Inc. | System for substrate cooling in an evacuated environment |
US5233456A (en) | 1991-12-20 | 1993-08-03 | Texas Instruments Incorporated | Resonant mirror and method of manufacture |
US5231532A (en) | 1992-02-05 | 1993-07-27 | Texas Instruments Incorporated | Switchable resonant filter for optical radiation |
US5212582A (en) | 1992-03-04 | 1993-05-18 | Texas Instruments Incorporated | Electrostatically controlled beam steering device and method |
US5312513A (en) | 1992-04-03 | 1994-05-17 | Texas Instruments Incorporated | Methods of forming multiple phase light modulators |
US5190637A (en) * | 1992-04-24 | 1993-03-02 | Wisconsin Alumni Research Foundation | Formation of microstructures by multiple level deep X-ray lithography with sacrificial metal layers |
US6219015B1 (en) | 1992-04-28 | 2001-04-17 | The Board Of Directors Of The Leland Stanford, Junior University | Method and apparatus for using an array of grating light valves to produce multicolor optical images |
US5311360A (en) | 1992-04-28 | 1994-05-10 | The Board Of Trustees Of The Leland Stanford, Junior University | Method and apparatus for modulating a light beam |
TW245772B (ja) | 1992-05-19 | 1995-04-21 | Akzo Nv | |
JPH06214169A (ja) | 1992-06-08 | 1994-08-05 | Texas Instr Inc <Ti> | 制御可能な光学的周期的表面フィルタ |
US5347377A (en) | 1992-06-17 | 1994-09-13 | Eastman Kodak Company | Planar waveguide liquid crystal variable retarder |
EP0646286B1 (en) | 1992-06-17 | 2002-10-16 | Harris Corporation | Fabrication of semiconductor devices on SOI substrates |
US5818095A (en) | 1992-08-11 | 1998-10-06 | Texas Instruments Incorporated | High-yield spatial light modulator with light blocking layer |
US5345328A (en) | 1992-08-12 | 1994-09-06 | Sandia Corporation | Tandem resonator reflectance modulator |
US5293272A (en) | 1992-08-24 | 1994-03-08 | Physical Optics Corporation | High finesse holographic fabry-perot etalon and method of fabricating |
US5737050A (en) | 1992-08-25 | 1998-04-07 | Matsushita Electric Industrial Co., Ltd. | Light valve having reduced reflected light, high brightness and high contrast |
US5488505A (en) | 1992-10-01 | 1996-01-30 | Engle; Craig D. | Enhanced electrostatic shutter mosaic modulator |
US5312512A (en) | 1992-10-23 | 1994-05-17 | Ncr Corporation | Global planarization using SOG and CMP |
US6674562B1 (en) | 1994-05-05 | 2004-01-06 | Iridigm Display Corporation | Interferometric modulation of radiation |
US5461411A (en) | 1993-03-29 | 1995-10-24 | Texas Instruments Incorporated | Process and architecture for digital micromirror printer |
US5559358A (en) | 1993-05-25 | 1996-09-24 | Honeywell Inc. | Opto-electro-mechanical device or filter, process for making, and sensors made therefrom |
US6199874B1 (en) | 1993-05-26 | 2001-03-13 | Cornell Research Foundation Inc. | Microelectromechanical accelerometer for automotive applications |
US5324683A (en) * | 1993-06-02 | 1994-06-28 | Motorola, Inc. | Method of forming a semiconductor structure having an air region |
US5489952A (en) | 1993-07-14 | 1996-02-06 | Texas Instruments Incorporated | Method and device for multi-format television |
US5673139A (en) | 1993-07-19 | 1997-09-30 | Medcom, Inc. | Microelectromechanical television scanning device and method for making the same |
US5526172A (en) * | 1993-07-27 | 1996-06-11 | Texas Instruments Incorporated | Microminiature, monolithic, variable electrical signal processor and apparatus including same |
US5629790A (en) | 1993-10-18 | 1997-05-13 | Neukermans; Armand P. | Micromachined torsional scanner |
US5447431A (en) | 1993-10-29 | 1995-09-05 | Brooks Automation, Inc. | Low-gas temperature stabilization system |
EP0733130A4 (en) | 1993-12-17 | 1997-04-02 | Brooks Automation Inc | APPARATUS FOR HEATING OR COOLING TABLETS |
US5583688A (en) | 1993-12-21 | 1996-12-10 | Texas Instruments Incorporated | Multi-level digital micromirror device |
US5500761A (en) | 1994-01-27 | 1996-03-19 | At&T Corp. | Micromechanical modulator |
US5665997A (en) | 1994-03-31 | 1997-09-09 | Texas Instruments Incorporated | Grated landing area to eliminate sticking of micro-mechanical devices |
US5690839A (en) | 1994-05-04 | 1997-11-25 | Daewoo Electronics Co., Ltd. | Method for forming an array of thin film actuated mirrors |
US7550794B2 (en) | 2002-09-20 | 2009-06-23 | Idc, Llc | Micromechanical systems device comprising a displaceable electrode and a charge-trapping layer |
US6040937A (en) | 1994-05-05 | 2000-03-21 | Etalon, Inc. | Interferometric modulation |
US20010003487A1 (en) * | 1996-11-05 | 2001-06-14 | Mark W. Miles | Visible spectrum modulator arrays |
US6680792B2 (en) * | 1994-05-05 | 2004-01-20 | Iridigm Display Corporation | Interferometric modulation of radiation |
US7123216B1 (en) | 1994-05-05 | 2006-10-17 | Idc, Llc | Photonic MEMS and structures |
US7460291B2 (en) * | 1994-05-05 | 2008-12-02 | Idc, Llc | Separable modulator |
US7297471B1 (en) | 2003-04-15 | 2007-11-20 | Idc, Llc | Method for manufacturing an array of interferometric modulators |
US7776631B2 (en) | 1994-05-05 | 2010-08-17 | Qualcomm Mems Technologies, Inc. | MEMS device and method of forming a MEMS device |
KR0135391B1 (ko) | 1994-05-28 | 1998-04-22 | 김광호 | 자기정렬된 액정표시장치용 박막트랜지스터 및 제조방법 |
US5454906A (en) | 1994-06-21 | 1995-10-03 | Texas Instruments Inc. | Method of providing sacrificial spacer for micro-mechanical devices |
JPH0822024A (ja) | 1994-07-05 | 1996-01-23 | Mitsubishi Electric Corp | アクティブマトリクス基板およびその製法 |
US5485304A (en) * | 1994-07-29 | 1996-01-16 | Texas Instruments, Inc. | Support posts for micro-mechanical devices |
US5636052A (en) | 1994-07-29 | 1997-06-03 | Lucent Technologies Inc. | Direct view display based on a micromechanical modulation |
US5656554A (en) | 1994-07-29 | 1997-08-12 | International Business Machines Corporation | Semiconductor chip reclamation technique involving multiple planarization processes |
US5561735A (en) | 1994-08-30 | 1996-10-01 | Vortek Industries Ltd. | Rapid thermal processing apparatus and method |
DK0778982T3 (da) | 1994-09-02 | 2000-11-06 | Rad H Dabbaj | Reflekterende lysventilmodulator |
US6053617A (en) | 1994-09-23 | 2000-04-25 | Texas Instruments Incorporated | Manufacture method for micromechanical devices |
US5619059A (en) | 1994-09-28 | 1997-04-08 | National Research Council Of Canada | Color deformable mirror device having optical thin film interference color coatings |
US5526951A (en) * | 1994-09-30 | 1996-06-18 | Texas Instruments Incorporated | Fabrication method for digital micro-mirror devices using low temperature CVD |
JP3435850B2 (ja) | 1994-10-28 | 2003-08-11 | 株式会社デンソー | 半導体力学量センサ及びその製造方法 |
US5650881A (en) * | 1994-11-02 | 1997-07-22 | Texas Instruments Incorporated | Support post architecture for micromechanical devices |
US5703728A (en) | 1994-11-02 | 1997-12-30 | Texas Instruments Incorporated | Support post architecture for micromechanical devices |
US5552924A (en) | 1994-11-14 | 1996-09-03 | Texas Instruments Incorporated | Micromechanical device having an improved beam |
US5474865A (en) | 1994-11-21 | 1995-12-12 | Sematech, Inc. | Globally planarized binary optical mask using buried absorbers |
JPH08153700A (ja) * | 1994-11-25 | 1996-06-11 | Semiconductor Energy Lab Co Ltd | 導電性被膜の異方性エッチング方法 |
US5610624A (en) | 1994-11-30 | 1997-03-11 | Texas Instruments Incorporated | Spatial light modulator with reduced possibility of an on state defect |
US5726480A (en) * | 1995-01-27 | 1998-03-10 | The Regents Of The University Of California | Etchants for use in micromachining of CMOS Microaccelerometers and microelectromechanical devices and method of making the same |
US5535047A (en) | 1995-04-18 | 1996-07-09 | Texas Instruments Incorporated | Active yoke hidden hinge digital micromirror device |
US6046840A (en) | 1995-06-19 | 2000-04-04 | Reflectivity, Inc. | Double substrate reflective spatial light modulator with self-limiting micro-mechanical elements |
US6969635B2 (en) * | 2000-12-07 | 2005-11-29 | Reflectivity, Inc. | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
US6849471B2 (en) | 2003-03-28 | 2005-02-01 | Reflectivity, Inc. | Barrier layers for microelectromechanical systems |
US5835256A (en) | 1995-06-19 | 1998-11-10 | Reflectivity, Inc. | Reflective spatial light modulator with encapsulated micro-mechanical elements |
US5578976A (en) | 1995-06-22 | 1996-11-26 | Rockwell International Corporation | Micro electromechanical RF switch |
JP3489273B2 (ja) | 1995-06-27 | 2004-01-19 | 株式会社デンソー | 半導体力学量センサの製造方法 |
JP3234854B2 (ja) | 1995-08-28 | 2001-12-04 | アルプス電気株式会社 | 多層膜フィルタ及びその製造方法 |
US6324192B1 (en) | 1995-09-29 | 2001-11-27 | Coretek, Inc. | Electrically tunable fabry-perot structure utilizing a deformable multi-layer mirror and method of making the same |
US5739945A (en) | 1995-09-29 | 1998-04-14 | Tayebati; Parviz | Electrically tunable optical filter utilizing a deformable multi-layer mirror |
US5825528A (en) | 1995-12-26 | 1998-10-20 | Lucent Technologies Inc. | Phase-mismatched fabry-perot cavity micromechanical modulator |
JP3799092B2 (ja) | 1995-12-29 | 2006-07-19 | アジレント・テクノロジーズ・インク | 光変調装置及びディスプレイ装置 |
US5771321A (en) | 1996-01-04 | 1998-06-23 | Massachusetts Institute Of Technology | Micromechanical optical switch and flat panel display |
US5638946A (en) | 1996-01-11 | 1997-06-17 | Northeastern University | Micromechanical switch with insulated switch contact |
US5967163A (en) | 1996-01-30 | 1999-10-19 | Abbott Laboratories | Actuator and method |
US5751469A (en) | 1996-02-01 | 1998-05-12 | Lucent Technologies Inc. | Method and apparatus for an improved micromechanical modulator |
US5828485A (en) * | 1996-02-07 | 1998-10-27 | Light & Sound Design Ltd. | Programmable light beam shape altering device using programmable micromirrors |
JPH09237789A (ja) | 1996-02-29 | 1997-09-09 | Toshiba Corp | 遮蔽体および熱処理装置および熱処理方法 |
US6624944B1 (en) | 1996-03-29 | 2003-09-23 | Texas Instruments Incorporated | Fluorinated coating for an optical element |
US5783864A (en) * | 1996-06-05 | 1998-07-21 | Advanced Micro Devices, Inc. | Multilevel interconnect structure of an integrated circuit having air gaps and pillars separating levels of interconnect |
US5710656A (en) | 1996-07-30 | 1998-01-20 | Lucent Technologies Inc. | Micromechanical optical modulator having a reduced-mass composite membrane |
US5838484A (en) * | 1996-08-19 | 1998-11-17 | Lucent Technologies Inc. | Micromechanical optical modulator with linear operating characteristic |
US5753418A (en) * | 1996-09-03 | 1998-05-19 | Taiwan Semiconductor Manufacturing Company Ltd | 0.3 Micron aperture width patterning process |
FI108581B (fi) * | 1996-10-03 | 2002-02-15 | Valtion Teknillinen | Sähköisesti säädettävä optinen suodin |
JPH10163219A (ja) | 1996-11-05 | 1998-06-19 | Texas Instr Inc <Ti> | 挿入シャッタを使用した炉温急昇降装置とデバイス製造方法 |
DE19730715C1 (de) | 1996-11-12 | 1998-11-26 | Fraunhofer Ges Forschung | Verfahren zum Herstellen eines mikromechanischen Relais |
US5683649A (en) | 1996-11-14 | 1997-11-04 | Eastman Kodak Company | Method for the fabrication of micro-electromechanical ceramic parts |
CN1252810C (zh) | 1997-01-21 | 2006-04-19 | B·F·谷德里奇公司 | 用于超低电容互连的有空气隙的半导体装置的制造 |
JPH10260641A (ja) | 1997-03-17 | 1998-09-29 | Nec Corp | フラットパネル型表示装置用ドライバicの実装構造 |
US6104525A (en) | 1997-04-29 | 2000-08-15 | Daewoo Electronics Co., Ltd. | Array of thin film actuated mirrors and method for the manufacture thereof |
EP0877272B1 (en) | 1997-05-08 | 2002-07-31 | Texas Instruments Incorporated | Improvements in or relating to spatial light modulators |
US5896796A (en) | 1997-06-06 | 1999-04-27 | Chih; Chen-Keng | Device for punching holes in a bicycle rim |
US6508977B2 (en) * | 1997-06-26 | 2003-01-21 | C. Edward Eckert | Reinforced refractory shaft design for fluxing molten metal |
US5914803A (en) | 1997-07-01 | 1999-06-22 | Daewoo Electronics Co., Ltd. | Thin film actuated mirror array in an optical projection system and method for manufacturing the same |
US5960158A (en) | 1997-07-11 | 1999-09-28 | Ag Associates | Apparatus and method for filtering light in a thermal processing chamber |
US5867302A (en) * | 1997-08-07 | 1999-02-02 | Sandia Corporation | Bistable microelectromechanical actuator |
US6031653A (en) | 1997-08-28 | 2000-02-29 | California Institute Of Technology | Low-cost thin-metal-film interference filters |
US6231945B1 (en) | 1997-09-09 | 2001-05-15 | Hitachi, Ltd. | Information recording medium |
US5978127A (en) | 1997-09-09 | 1999-11-02 | Zilog, Inc. | Light phase grating device |
US5937541A (en) | 1997-09-15 | 1999-08-17 | Siemens Aktiengesellschaft | Semiconductor wafer temperature measurement and control thereof using gas temperature measurement |
US5994174A (en) | 1997-09-29 | 1999-11-30 | The Regents Of The University Of California | Method of fabrication of display pixels driven by silicon thin film transistors |
US5822170A (en) | 1997-10-09 | 1998-10-13 | Honeywell Inc. | Hydrophobic coating for reducing humidity effect in electrostatic actuators |
US6333556B1 (en) | 1997-10-09 | 2001-12-25 | Micron Technology, Inc. | Insulating materials |
US5972193A (en) | 1997-10-10 | 1999-10-26 | Industrial Technology Research Institute | Method of manufacturing a planar coil using a transparency substrate |
EP1025711A1 (en) * | 1997-10-31 | 2000-08-09 | Daewoo Electronics Co., Ltd | Method for manufacturing thin film actuated mirror array in an optical projection system |
US6008123A (en) | 1997-11-04 | 1999-12-28 | Lucent Technologies Inc. | Method for using a hardmask to form an opening in a semiconductor substrate |
US5945980A (en) | 1997-11-14 | 1999-08-31 | Logitech, Inc. | Touchpad with active plane for pen detection |
US6028690A (en) | 1997-11-26 | 2000-02-22 | Texas Instruments Incorporated | Reduced micromirror mirror gaps for improved contrast ratio |
US5920421A (en) * | 1997-12-10 | 1999-07-06 | Daewoo Electronics Co., Ltd. | Thin film actuated mirror array in an optical projection system and method for manufacturing the same |
US6438149B1 (en) | 1998-06-26 | 2002-08-20 | Coretek, Inc. | Microelectromechanically tunable, confocal, vertical cavity surface emitting laser and fabry-perot filter |
US6340435B1 (en) | 1998-02-11 | 2002-01-22 | Applied Materials, Inc. | Integrated low K dielectrics and etch stops |
US6660656B2 (en) | 1998-02-11 | 2003-12-09 | Applied Materials Inc. | Plasma processes for depositing low dielectric constant films |
US6689211B1 (en) * | 1999-04-09 | 2004-02-10 | Massachusetts Institute Of Technology | Etch stop layer system |
EP0951068A1 (en) | 1998-04-17 | 1999-10-20 | Interuniversitair Micro-Elektronica Centrum Vzw | Method of fabrication of a microstructure having an inside cavity |
US6097145A (en) | 1998-04-27 | 2000-08-01 | Copytele, Inc. | Aerogel-based phase transition flat panel display |
US5943158A (en) | 1998-05-05 | 1999-08-24 | Lucent Technologies Inc. | Micro-mechanical, anti-reflection, switched optical modulator array and fabrication method |
US6160833A (en) | 1998-05-06 | 2000-12-12 | Xerox Corporation | Blue vertical cavity surface emitting laser |
WO1999059101A2 (en) | 1998-05-12 | 1999-11-18 | E-Ink Corporation | Microencapsulated electrophoretic electrostatically-addressed media for drawing device applications |
US6282010B1 (en) | 1998-05-14 | 2001-08-28 | Texas Instruments Incorporated | Anti-reflective coatings for spatial light modulators |
US6046659A (en) * | 1998-05-15 | 2000-04-04 | Hughes Electronics Corporation | Design and fabrication of broadband surface-micromachined micro-electro-mechanical switches for microwave and millimeter-wave applications |
US6858080B2 (en) | 1998-05-15 | 2005-02-22 | Apollo Diamond, Inc. | Tunable CVD diamond structures |
US6323982B1 (en) | 1998-05-22 | 2001-11-27 | Texas Instruments Incorporated | Yield superstructure for digital micromirror device |
US6430332B1 (en) | 1998-06-05 | 2002-08-06 | Fiber, Llc | Optical switching apparatus |
KR100301803B1 (ko) | 1998-06-05 | 2001-09-22 | 김영환 | 박막트랜지스터 및 그의 제조방법 |
EP1087286A4 (en) | 1998-06-08 | 2007-10-17 | Kaneka Corp | TOUCH-SENSITIVE RESISTANCE BOARD FOR LIQUID CRYSTAL DISPLAY DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE COMPRISING SUCH A TOUCH-SOUND TABLE |
US6100477A (en) * | 1998-07-17 | 2000-08-08 | Texas Instruments Incorporated | Recessed etch RF micro-electro-mechanical switch |
US5976902A (en) | 1998-08-03 | 1999-11-02 | Industrial Technology Research Institute | Method of fabricating a fully self-aligned TFT-LCD |
KR100281182B1 (ko) | 1998-08-10 | 2001-04-02 | 윤종용 | 반도체 장치의 자기 정렬 콘택 형성 방법 |
US5943155A (en) | 1998-08-12 | 1999-08-24 | Lucent Techonolgies Inc. | Mars optical modulators |
US6710539B2 (en) * | 1998-09-02 | 2004-03-23 | Micron Technology, Inc. | Field emission devices having structure for reduced emitter tip to gate spacing |
DE19938072A1 (de) | 1998-09-09 | 2000-03-16 | Siemens Ag | Verfahren zum selbstjustierenden Herstellen von zusätzlichen Strukturen auf Substraten mit vorhandenen ersten Strukturen |
US6249039B1 (en) | 1998-09-10 | 2001-06-19 | Bourns, Inc. | Integrated inductive components and method of fabricating such components |
JP4074714B2 (ja) | 1998-09-25 | 2008-04-09 | 富士フイルム株式会社 | アレイ型光変調素子及び平面ディスプレイの駆動方法 |
US6323834B1 (en) * | 1998-10-08 | 2001-11-27 | International Business Machines Corporation | Micromechanical displays and fabrication method |
DE19847455A1 (de) | 1998-10-15 | 2000-04-27 | Bosch Gmbh Robert | Verfahren zur Bearbeitung von Silizium mittels Ätzprozessen |
JP3919954B2 (ja) | 1998-10-16 | 2007-05-30 | 富士フイルム株式会社 | アレイ型光変調素子及び平面ディスプレイの駆動方法 |
US6171945B1 (en) | 1998-10-22 | 2001-01-09 | Applied Materials, Inc. | CVD nanoporous silica low dielectric constant films |
US6288824B1 (en) | 1998-11-03 | 2001-09-11 | Alex Kastalsky | Display device based on grating electromechanical shutter |
US6391675B1 (en) | 1998-11-25 | 2002-05-21 | Raytheon Company | Method and apparatus for switching high frequency signals |
KR100301050B1 (ko) | 1998-12-14 | 2002-06-20 | 윤종용 | 콘택을포함하는반도체장치의커패시터제조방법 |
US6194323B1 (en) | 1998-12-16 | 2001-02-27 | Lucent Technologies Inc. | Deep sub-micron metal etch with in-situ hard mask etch |
US6284560B1 (en) * | 1998-12-18 | 2001-09-04 | Eastman Kodak Company | Method for producing co-planar surface structures |
US6358021B1 (en) | 1998-12-29 | 2002-03-19 | Honeywell International Inc. | Electrostatic actuators for active surfaces |
US6215221B1 (en) | 1998-12-29 | 2001-04-10 | Honeywell International Inc. | Electrostatic/pneumatic actuators for active surfaces |
WO2000042231A2 (en) | 1999-01-15 | 2000-07-20 | The Regents Of The University Of California | Polycrystalline silicon germanium films for forming micro-electromechanical systems |
JP3864204B2 (ja) | 1999-02-19 | 2006-12-27 | 株式会社日立プラズマパテントライセンシング | プラズマディスプレイパネル |
JP4787412B2 (ja) * | 1999-03-30 | 2011-10-05 | シチズンホールディングス株式会社 | 薄膜基板の形成方法およびその方法によって形成された薄膜基板 |
US6358854B1 (en) | 1999-04-21 | 2002-03-19 | Sandia Corporation | Method to fabricate layered material compositions |
KR100290852B1 (ko) * | 1999-04-29 | 2001-05-15 | 구자홍 | 에칭 방법 |
US6449084B1 (en) | 1999-05-10 | 2002-09-10 | Yanping Guo | Optical deflector |
US6342452B1 (en) | 1999-05-20 | 2002-01-29 | International Business Machines Corporation | Method of fabricating a Si3N4/polycide structure using a dielectric sacrificial layer as a mask |
JP3592136B2 (ja) | 1999-06-04 | 2004-11-24 | キヤノン株式会社 | 液体吐出ヘッドおよびその製造方法と微小電気機械装置の製造方法 |
US6201633B1 (en) | 1999-06-07 | 2001-03-13 | Xerox Corporation | Micro-electromechanical based bistable color display sheets |
US6359673B1 (en) * | 1999-06-21 | 2002-03-19 | Eastman Kodak Company | Sheet having a layer with different light modulating materials |
US6525310B2 (en) * | 1999-08-05 | 2003-02-25 | Microvision, Inc. | Frequency tunable resonant scanner |
WO2001014248A2 (en) | 1999-08-24 | 2001-03-01 | Knowles Electronics, Llc | Assembly process for delicate silicon structures |
KR100307490B1 (ko) | 1999-08-31 | 2001-11-01 | 한신혁 | 반도체 장치의 기생 용량 감소 방법 |
US6322712B1 (en) | 1999-09-01 | 2001-11-27 | Micron Technology, Inc. | Buffer layer in flat panel display |
KR100333482B1 (ko) | 1999-09-15 | 2002-04-25 | 오길록 | 초고속 반도체 광변조기 및 그 제조방법 |
US6337027B1 (en) * | 1999-09-30 | 2002-01-08 | Rockwell Science Center, Llc | Microelectromechanical device manufacturing process |
WO2003007049A1 (en) | 1999-10-05 | 2003-01-23 | Iridigm Display Corporation | Photonic mems and structures |
US6351329B1 (en) | 1999-10-08 | 2002-02-26 | Lucent Technologies Inc. | Optical attenuator |
US7041224B2 (en) * | 1999-10-26 | 2006-05-09 | Reflectivity, Inc. | Method for vapor phase etching of silicon |
US6960305B2 (en) | 1999-10-26 | 2005-11-01 | Reflectivity, Inc | Methods for forming and releasing microelectromechanical structures |
US6259062B1 (en) | 1999-12-03 | 2001-07-10 | Asm America, Inc. | Process chamber cooling |
US6552840B2 (en) | 1999-12-03 | 2003-04-22 | Texas Instruments Incorporated | Electrostatic efficiency of micromechanical devices |
US6674090B1 (en) * | 1999-12-27 | 2004-01-06 | Xerox Corporation | Structure and method for planar lateral oxidation in active |
US20010040675A1 (en) | 2000-01-28 | 2001-11-15 | True Randall J. | Method for forming a micromechanical device |
US20020071169A1 (en) * | 2000-02-01 | 2002-06-13 | Bowers John Edward | Micro-electro-mechanical-system (MEMS) mirror device |
US6407851B1 (en) | 2000-08-01 | 2002-06-18 | Mohammed N. Islam | Micromechanical optical switch |
DE10006035A1 (de) | 2000-02-10 | 2001-08-16 | Bosch Gmbh Robert | Verfahren zur Herstellung eines mikromechanischen Bauelements sowie ein nach dem Verfahren hergestelltes Bauelement |
JP2002174721A (ja) * | 2000-12-06 | 2002-06-21 | Yokogawa Electric Corp | ファブリペローフィルタ |
CN1160684C (zh) | 2000-02-24 | 2004-08-04 | 皇家菲利浦电子有限公司 | 包括光波导的显示器件 |
US6836366B1 (en) * | 2000-03-03 | 2004-12-28 | Axsun Technologies, Inc. | Integrated tunable fabry-perot filter and method of making same |
US7008812B1 (en) * | 2000-05-30 | 2006-03-07 | Ic Mechanics, Inc. | Manufacture of MEMS structures in sealed cavity using dry-release MEMS device encapsulation |
JP2001356701A (ja) | 2000-06-15 | 2001-12-26 | Fuji Photo Film Co Ltd | 光学素子、光源ユニットおよび表示装置 |
US6465320B1 (en) | 2000-06-16 | 2002-10-15 | Motorola, Inc. | Electronic component and method of manufacturing |
US6452465B1 (en) | 2000-06-27 | 2002-09-17 | M-Squared Filters, Llc | High quality-factor tunable resonator |
WO2002001584A1 (en) | 2000-06-28 | 2002-01-03 | The Regents Of The University Of California | Capacitive microelectromechanical switches |
TW535024B (en) | 2000-06-30 | 2003-06-01 | Minolta Co Ltd | Liquid display element and method of producing the same |
DE60142383D1 (de) | 2000-07-03 | 2010-07-29 | Sony Corp | Optische mehrschichtige Struktur, optische Schalteinrichtung, und Bildanzeigevorrichtung |
JP2002023070A (ja) | 2000-07-04 | 2002-01-23 | Sony Corp | 光学多層構造体および光スイッチング素子、並びに画像表示装置 |
JP4614027B2 (ja) | 2000-07-03 | 2011-01-19 | ソニー株式会社 | 光学多層構造体および光スイッチング素子、並びに画像表示装置 |
JP4830183B2 (ja) | 2000-07-19 | 2011-12-07 | ソニー株式会社 | 光学多層構造体および光スイッチング素子、並びに画像表示装置 |
EP1172681A3 (en) | 2000-07-13 | 2004-06-09 | Creo IL. Ltd. | Blazed micro-mechanical light modulator and array thereof |
US6677225B1 (en) | 2000-07-14 | 2004-01-13 | Zyvex Corporation | System and method for constraining totally released microcomponents |
US6795605B1 (en) | 2000-08-01 | 2004-09-21 | Cheetah Omni, Llc | Micromechanical optical switch |
US6867897B2 (en) * | 2003-01-29 | 2005-03-15 | Reflectivity, Inc | Micromirrors and off-diagonal hinge structures for micromirror arrays in projection displays |
AU2001281381A1 (en) * | 2000-08-03 | 2002-02-18 | Analog Devices, Inc. | Bonded wafer optical mems process |
TW471063B (en) * | 2000-08-11 | 2002-01-01 | Winbond Electronics Corp | Method to form opening in insulator layer using ion implantation |
JP2002062490A (ja) | 2000-08-14 | 2002-02-28 | Canon Inc | 干渉性変調素子 |
US6635919B1 (en) | 2000-08-17 | 2003-10-21 | Texas Instruments Incorporated | High Q-large tuning range micro-electro mechanical system (MEMS) varactor for broadband applications |
JP4392970B2 (ja) | 2000-08-21 | 2010-01-06 | キヤノン株式会社 | 干渉性変調素子を用いる表示素子 |
US6376787B1 (en) | 2000-08-24 | 2002-04-23 | Texas Instruments Incorporated | Microelectromechanical switch with fixed metal electrode/dielectric interface with a protective cap layer |
US7006275B2 (en) | 2000-08-30 | 2006-02-28 | Reflectivity, Inc | Packaged micromirror array for a projection display |
MY128644A (en) * | 2000-08-31 | 2007-02-28 | Georgia Tech Res Inst | Fabrication of semiconductor devices with air gaps for ultra low capacitance interconnections and methods of making same |
JP4304852B2 (ja) * | 2000-09-04 | 2009-07-29 | コニカミノルタホールディングス株式会社 | 非平面液晶表示素子及びその製造方法 |
US6466354B1 (en) | 2000-09-19 | 2002-10-15 | Silicon Light Machines | Method and apparatus for interferometric modulation of light |
FI111457B (fi) * | 2000-10-02 | 2003-07-31 | Nokia Corp | Mikromekaaninen rakenne |
US6522801B1 (en) | 2000-10-10 | 2003-02-18 | Agere Systems Inc. | Micro-electro-optical mechanical device having an implanted dopant included therein and a method of manufacture therefor |
GB2367788A (en) * | 2000-10-16 | 2002-04-17 | Seiko Epson Corp | Etching using an ink jet print head |
US6775048B1 (en) | 2000-10-31 | 2004-08-10 | Microsoft Corporation | Microelectrical mechanical structure (MEMS) optical modulator and optical display system |
US6519075B2 (en) * | 2000-11-03 | 2003-02-11 | Agere Systems Inc. | Packaged MEMS device and method for making the same |
DE10055421A1 (de) * | 2000-11-09 | 2002-05-29 | Bosch Gmbh Robert | Verfahren zur Erzeugung einer mikromechanischen Struktur und mikromechanische Struktur |
KR100381011B1 (ko) | 2000-11-13 | 2003-04-26 | 한국전자통신연구원 | 멤즈소자 제조용 미세구조체를 고착없이 띄우는 방법 |
US6525352B1 (en) | 2000-11-22 | 2003-02-25 | Network Photonics, Inc. | Method to reduce release time of micromachined devices |
US6406975B1 (en) | 2000-11-27 | 2002-06-18 | Chartered Semiconductor Manufacturing Inc. | Method for fabricating an air gap shallow trench isolation (STI) structure |
US6647171B1 (en) | 2000-12-01 | 2003-11-11 | Corning Incorporated | MEMS optical switch actuator |
US7307775B2 (en) * | 2000-12-07 | 2007-12-11 | Texas Instruments Incorporated | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
US6906847B2 (en) * | 2000-12-07 | 2005-06-14 | Reflectivity, Inc | Spatial light modulators with light blocking/absorbing areas |
CA2430741A1 (en) * | 2000-12-11 | 2002-06-20 | Rad H. Dabbaj | Electrostatic device |
US20020086456A1 (en) | 2000-12-19 | 2002-07-04 | Cunningham Shawn Jay | Bulk micromachining process for fabricating an optical MEMS device with integrated optical aperture |
DE10063991B4 (de) * | 2000-12-21 | 2005-06-02 | Infineon Technologies Ag | Verfahren zur Herstellung von mikromechanischen Bauelementen |
JP2002207182A (ja) | 2001-01-10 | 2002-07-26 | Sony Corp | 光学多層構造体およびその製造方法、光スイッチング素子、並びに画像表示装置 |
US6947195B2 (en) | 2001-01-18 | 2005-09-20 | Ricoh Company, Ltd. | Optical modulator, optical modulator manufacturing method, light information processing apparatus including optical modulator, image formation apparatus including optical modulator, and image projection and display apparatus including optical modulator |
US6480320B2 (en) * | 2001-02-07 | 2002-11-12 | Transparent Optical, Inc. | Microelectromechanical mirror and mirror array |
JP3858606B2 (ja) | 2001-02-14 | 2006-12-20 | セイコーエプソン株式会社 | 干渉フィルタの製造方法、干渉フィルタ、波長可変干渉フィルタの製造方法及び波長可変干渉フィルタ |
US6620712B2 (en) | 2001-02-14 | 2003-09-16 | Intpax, Inc. | Defined sacrifical region via ion implantation for micro-opto-electro-mechanical system (MOEMS) applications |
US6555904B1 (en) | 2001-03-05 | 2003-04-29 | Analog Devices, Inc. | Electrically shielded glass lid for a packaged device |
US6768403B2 (en) * | 2002-03-12 | 2004-07-27 | Hrl Laboratories, Llc | Torsion spring for electro-mechanical switches and a cantilever-type RF micro-electromechanical switch incorporating the torsion spring |
US6912078B2 (en) * | 2001-03-16 | 2005-06-28 | Corning Incorporated | Electrostatically actuated micro-electro-mechanical devices and method of manufacture |
US20020167072A1 (en) | 2001-03-16 | 2002-11-14 | Andosca Robert George | Electrostatically actuated micro-electro-mechanical devices and method of manufacture |
US6465856B2 (en) | 2001-03-19 | 2002-10-15 | Xerox Corporation | Micro-fabricated shielded conductors |
JP3888075B2 (ja) | 2001-03-23 | 2007-02-28 | セイコーエプソン株式会社 | 光スイッチング素子、光スイッチングデバイス、および画像表示装置 |
JP4684448B2 (ja) | 2001-03-30 | 2011-05-18 | 株式会社リコー | 光変調装置及びその光変調装置の製造方法並びにその光変調装置を具備する画像形成装置及びその光変調装置を具備する画像投影表示装置 |
CN1228818C (zh) * | 2001-04-02 | 2005-11-23 | 华邦电子股份有限公司 | 在半导体中形成漏斗形介层窗的方法 |
US6704475B2 (en) * | 2001-04-03 | 2004-03-09 | Agere Systems Inc. | Mirror for use with a micro-electro-mechanical system (MEMS) optical device and a method of manufacture therefor |
US20020171610A1 (en) | 2001-04-04 | 2002-11-21 | Eastman Kodak Company | Organic electroluminescent display with integrated touch-screen |
US6525396B2 (en) | 2001-04-17 | 2003-02-25 | Texas Instruments Incorporated | Selection of materials and dimensions for a micro-electromechanical switch for use in the RF regime |
US20020149850A1 (en) * | 2001-04-17 | 2002-10-17 | E-Tek Dynamics, Inc. | Tunable optical filter |
US6600587B2 (en) | 2001-04-23 | 2003-07-29 | Memx, Inc. | Surface micromachined optical system with reinforced mirror microstructure |
US6756317B2 (en) * | 2001-04-23 | 2004-06-29 | Memx, Inc. | Method for making a microstructure by surface micromachining |
US6657832B2 (en) | 2001-04-26 | 2003-12-02 | Texas Instruments Incorporated | Mechanically assisted restoring force support for micromachined membranes |
US6602791B2 (en) * | 2001-04-27 | 2003-08-05 | Dalsa Semiconductor Inc. | Manufacture of integrated fluidic devices |
US6465355B1 (en) | 2001-04-27 | 2002-10-15 | Hewlett-Packard Company | Method of fabricating suspended microstructures |
JP2002328313A (ja) | 2001-05-01 | 2002-11-15 | Sony Corp | 光スイッチング素子およびその製造方法、並びに画像表示装置 |
US6576489B2 (en) | 2001-05-07 | 2003-06-10 | Applied Materials, Inc. | Methods of forming microstructure devices |
JP4449249B2 (ja) | 2001-05-11 | 2010-04-14 | ソニー株式会社 | 光学多層構造体の駆動方法および表示装置の駆動方法ならびに表示装置 |
US6424094B1 (en) | 2001-05-15 | 2002-07-23 | Eastman Kodak Company | Organic electroluminescent display with integrated resistive touch screen |
US6800210B2 (en) * | 2001-05-22 | 2004-10-05 | Reflectivity, Inc. | Method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants |
US7106307B2 (en) | 2001-05-24 | 2006-09-12 | Eastman Kodak Company | Touch screen for use with an OLED display |
US6803534B1 (en) | 2001-05-25 | 2004-10-12 | Raytheon Company | Membrane for micro-electro-mechanical switch, and methods of making and using it |
US6639724B2 (en) | 2001-06-05 | 2003-10-28 | Lucent Technologies Inc. | Device having a barrier layer located therein and a method of manufacture therefor |
DE10127622B4 (de) * | 2001-06-07 | 2009-10-22 | Qimonda Ag | Verfahren zur Herstellung eines mit HDPCVD-Oxid gefüllten Isolationsgrabens |
US6598985B2 (en) * | 2001-06-11 | 2003-07-29 | Nanogear | Optical mirror system with multi-axis rotational control |
US6958123B2 (en) * | 2001-06-15 | 2005-10-25 | Reflectivity, Inc | Method for removing a sacrificial material with a compressed fluid |
JP2003001598A (ja) | 2001-06-21 | 2003-01-08 | Sony Corp | Si膜のエッチング方法 |
US7005314B2 (en) * | 2001-06-27 | 2006-02-28 | Intel Corporation | Sacrificial layer technique to make gaps in MEMS applications |
US6822628B2 (en) | 2001-06-28 | 2004-11-23 | Candescent Intellectual Property Services, Inc. | Methods and systems for compensating row-to-row brightness variations of a field emission display |
JP3852306B2 (ja) | 2001-07-06 | 2006-11-29 | ソニー株式会社 | Mems素子の製造方法、glvデバイスの製造方法、及びレーザディスプレイの製造方法 |
KR100437825B1 (ko) | 2001-07-06 | 2004-06-26 | 엘지.필립스 엘시디 주식회사 | 액정표시장치용 어레이기판 |
US6905613B2 (en) | 2001-07-10 | 2005-06-14 | Honeywell International Inc. | Use of an organic dielectric as a sacrificial layer |
JP3740444B2 (ja) | 2001-07-11 | 2006-02-01 | キヤノン株式会社 | 光偏向器、それを用いた光学機器、ねじれ揺動体 |
KR100452112B1 (ko) * | 2001-07-18 | 2004-10-12 | 한국과학기술원 | 정전 구동기 |
US7057251B2 (en) * | 2001-07-20 | 2006-06-06 | Reflectivity, Inc | MEMS device made of transition metal-dielectric oxide materials |
JP2003059905A (ja) | 2001-07-31 | 2003-02-28 | Applied Materials Inc | エッチング方法、キャパシタの製造方法、および半導体装置 |
US6600201B2 (en) | 2001-08-03 | 2003-07-29 | Hewlett-Packard Development Company, L.P. | Systems with high density packing of micromachines |
US6632698B2 (en) * | 2001-08-07 | 2003-10-14 | Hewlett-Packard Development Company, L.P. | Microelectromechanical device having a stiffened support beam, and methods of forming stiffened support beams in MEMS |
US6778728B2 (en) * | 2001-08-10 | 2004-08-17 | Corning Intellisense Corporation | Micro-electro-mechanical mirror devices having a high linear mirror fill factor |
JP2003057571A (ja) | 2001-08-16 | 2003-02-26 | Sony Corp | 光学多層構造体および光スイッチング素子、並びに画像表示装置 |
US6930364B2 (en) * | 2001-09-13 | 2005-08-16 | Silicon Light Machines Corporation | Microelectronic mechanical system and methods |
US20030053078A1 (en) * | 2001-09-17 | 2003-03-20 | Mark Missey | Microelectromechanical tunable fabry-perot wavelength monitor with thermal actuators |
US6940636B2 (en) * | 2001-09-20 | 2005-09-06 | Analog Devices, Inc. | Optical switching apparatus and method of assembling same |
WO2003028059A1 (en) | 2001-09-21 | 2003-04-03 | Hrl Laboratories, Llc | Mems switches and methods of making same |
US6788175B1 (en) * | 2001-10-04 | 2004-09-07 | Superconductor Technologies, Inc. | Anchors for micro-electro-mechanical systems (MEMS) devices |
US6936183B2 (en) * | 2001-10-17 | 2005-08-30 | Applied Materials, Inc. | Etch process for etching microstructures |
AUPR846701A0 (en) | 2001-10-25 | 2001-11-15 | Microtechnology Centre Management Limited | A method of fabrication of micro-devices |
US6666979B2 (en) | 2001-10-29 | 2003-12-23 | Applied Materials, Inc. | Dry etch release of MEMS structures |
JP4045090B2 (ja) | 2001-11-06 | 2008-02-13 | オムロン株式会社 | 静電アクチュエータの調整方法 |
EP1721866B1 (en) * | 2001-11-09 | 2008-12-10 | WiSpry, Inc. | MEMS device having a trilayered beam and related methods |
JP2003177336A (ja) * | 2001-12-11 | 2003-06-27 | Fuji Photo Film Co Ltd | 光変調素子及び光変調素子アレイ並びにそれを用いた露光装置 |
US6803160B2 (en) | 2001-12-13 | 2004-10-12 | Dupont Photomasks, Inc. | Multi-tone photomask and method for manufacturing the same |
US20030111439A1 (en) * | 2001-12-14 | 2003-06-19 | Fetter Linus Albert | Method of forming tapered electrodes for electronic devices |
US6782166B1 (en) | 2001-12-21 | 2004-08-24 | United States Of America As Represented By The Secretary Of The Air Force | Optically transparent electrically conductive charge sheet poling electrodes to maximize performance of electro-optic devices |
DE10163214A1 (de) * | 2001-12-21 | 2003-07-10 | Philips Intellectual Property | Verfahren und Steuersystem zur Sprachsteuerung eines Gerätes |
JP3893421B2 (ja) | 2001-12-27 | 2007-03-14 | 富士フイルム株式会社 | 光変調素子及び光変調素子アレイ並びにそれを用いた露光装置 |
US7106491B2 (en) * | 2001-12-28 | 2006-09-12 | Texas Instruments Incorporated | Split beam micromirror |
US6791735B2 (en) * | 2002-01-09 | 2004-09-14 | The Regents Of The University Of California | Differentially-driven MEMS spatial light modulator |
KR100439423B1 (ko) | 2002-01-16 | 2004-07-09 | 한국전자통신연구원 | 마이크로전자기계 액튜에이터 |
US6608268B1 (en) | 2002-02-05 | 2003-08-19 | Memtronics, A Division Of Cogent Solutions, Inc. | Proximity micro-electro-mechanical system |
US6794119B2 (en) | 2002-02-12 | 2004-09-21 | Iridigm Display Corporation | Method for fabricating a structure for a microelectromechanical systems (MEMS) device |
JP3558066B2 (ja) | 2002-02-19 | 2004-08-25 | ソニー株式会社 | Mems素子とその製造方法、光変調素子、glvデバイスとその製造方法、及びレーザディスプレイ |
US6574033B1 (en) * | 2002-02-27 | 2003-06-03 | Iridigm Display Corporation | Microelectromechanical systems device and method for fabricating same |
AUPS098002A0 (en) * | 2002-03-08 | 2002-03-28 | University Of Western Australia, The | Tunable cavity resonator, and method of fabricating same |
US7145143B2 (en) | 2002-03-18 | 2006-12-05 | Honeywell International Inc. | Tunable sensor |
US7027200B2 (en) * | 2002-03-22 | 2006-04-11 | Reflectivity, Inc | Etching method used in fabrications of microstructures |
US6700770B2 (en) | 2002-03-22 | 2004-03-02 | Turnstone Systems, Inc. | Protection of double end exposed systems |
US6965468B2 (en) | 2003-07-03 | 2005-11-15 | Reflectivity, Inc | Micromirror array having reduced gap between adjacent micromirrors of the micromirror array |
JP2003305697A (ja) * | 2002-04-12 | 2003-10-28 | Sony Corp | 中空構造体の製造方法 |
US7029829B2 (en) * | 2002-04-18 | 2006-04-18 | The Regents Of The University Of Michigan | Low temperature method for forming a microcavity on a substrate and article having same |
US6954297B2 (en) | 2002-04-30 | 2005-10-11 | Hewlett-Packard Development Company, L.P. | Micro-mirror device including dielectrophoretic liquid |
US20030202264A1 (en) | 2002-04-30 | 2003-10-30 | Weber Timothy L. | Micro-mirror device |
US6791441B2 (en) | 2002-05-07 | 2004-09-14 | Raytheon Company | Micro-electro-mechanical switch, and methods of making and using it |
US6953702B2 (en) | 2002-05-16 | 2005-10-11 | Agilent Technologies, Inc. | Fixed wavelength vertical cavity optical devices and method of manufacture therefor |
US6806110B2 (en) | 2002-05-16 | 2004-10-19 | Agilent Technologies, Inc. | Monolithic multi-wavelength vertical-cavity surface emitting laser array and method of manufacture therefor |
JP2003340795A (ja) | 2002-05-20 | 2003-12-02 | Sony Corp | 静電駆動型mems素子とその製造方法、光学mems素子、光変調素子、glvデバイス及びレーザディスプレイ |
JP3801099B2 (ja) | 2002-06-04 | 2006-07-26 | 株式会社デンソー | チューナブルフィルタ、その製造方法、及びそれを使用した光スイッチング装置 |
US6678085B2 (en) | 2002-06-12 | 2004-01-13 | Eastman Kodak Company | High-contrast display system with scanned conformal grating device |
US20040001258A1 (en) * | 2002-06-28 | 2004-01-01 | Mandeep Singh | Solid state etalons with low thermally-induced optical path length change |
US6741377B2 (en) | 2002-07-02 | 2004-05-25 | Iridigm Display Corporation | Device having a light-absorbing mask and a method for fabricating same |
US20040058531A1 (en) * | 2002-08-08 | 2004-03-25 | United Microelectronics Corp. | Method for preventing metal extrusion in a semiconductor structure. |
US6822798B2 (en) | 2002-08-09 | 2004-11-23 | Optron Systems, Inc. | Tunable optical filter |
JP2004106074A (ja) | 2002-09-13 | 2004-04-08 | Sony Corp | 中空構造体の製造方法、及びmems素子の製造方法 |
TW544787B (en) | 2002-09-18 | 2003-08-01 | Promos Technologies Inc | Method of forming self-aligned contact structure with locally etched gate conductive layer |
US7781850B2 (en) | 2002-09-20 | 2010-08-24 | Qualcomm Mems Technologies, Inc. | Controlling electromechanical behavior of structures within a microelectromechanical systems device |
KR100512960B1 (ko) | 2002-09-26 | 2005-09-07 | 삼성전자주식회사 | 플렉서블 mems 트랜스듀서와 그 제조방법 및 이를채용한 플렉서블 mems 무선 마이크로폰 |
US6872319B2 (en) * | 2002-09-30 | 2005-03-29 | Rockwell Scientific Licensing, Llc | Process for high yield fabrication of MEMS devices |
JP2004130396A (ja) * | 2002-10-08 | 2004-04-30 | Sony Corp | マイクロマシン |
JP2004133281A (ja) | 2002-10-11 | 2004-04-30 | Seiko Epson Corp | 微小電気機械デバイスの製造方法、プロジェクタ |
US6986587B2 (en) * | 2002-10-16 | 2006-01-17 | Olympus Corporation | Variable-shape reflection mirror and method of manufacturing the same |
JP2004141995A (ja) | 2002-10-23 | 2004-05-20 | Sony Corp | マイクロマシンおよびその製造方法 |
US6747785B2 (en) | 2002-10-24 | 2004-06-08 | Hewlett-Packard Development Company, L.P. | MEMS-actuated color light modulator and methods |
FR2846318B1 (fr) | 2002-10-24 | 2005-01-07 | Commissariat Energie Atomique | Microstructure electromecanique integree comportant des moyens de reglage de la pression dans une cavite scellee et procede de reglage de la pression |
JP2004149607A (ja) * | 2002-10-29 | 2004-05-27 | Jsr Corp | 多層配線間の空洞形成用重合体およびその製造方法 |
US7370185B2 (en) | 2003-04-30 | 2008-05-06 | Hewlett-Packard Development Company, L.P. | Self-packaged optical interference display device having anti-stiction bumps, integral micro-lens, and reflection-absorbing layers |
US6909589B2 (en) | 2002-11-20 | 2005-06-21 | Corporation For National Research Initiatives | MEMS-based variable capacitor |
US6844959B2 (en) * | 2002-11-26 | 2005-01-18 | Reflectivity, Inc | Spatial light modulators with light absorbing areas |
US6958846B2 (en) | 2002-11-26 | 2005-10-25 | Reflectivity, Inc | Spatial light modulators with light absorbing areas |
US7553686B2 (en) | 2002-12-17 | 2009-06-30 | The Regents Of The University Of Colorado, A Body Corporate | Al2O3 atomic layer deposition to enhance the deposition of hydrophobic or hydrophilic coatings on micro-electromechanical devices |
US6944008B2 (en) | 2002-12-18 | 2005-09-13 | Lucent Technologies Inc. | Charge dissipation in electrostatically driven devices |
TWI289708B (en) | 2002-12-25 | 2007-11-11 | Qualcomm Mems Technologies Inc | Optical interference type color display |
US6872654B2 (en) * | 2002-12-26 | 2005-03-29 | Intel Corporation | Method of fabricating a bismaleimide (BMI) ASA sacrifical material for an integrated circuit air gap dielectric |
TW594155B (en) | 2002-12-27 | 2004-06-21 | Prime View Int Corp Ltd | Optical interference type color display and optical interference modulator |
TW559686B (en) | 2002-12-27 | 2003-11-01 | Prime View Int Co Ltd | Optical interference type panel and the manufacturing method thereof |
US6815234B2 (en) | 2002-12-31 | 2004-11-09 | Infineon Technologies Aktiengesellschaft | Reducing stress in integrated circuits |
US6808953B2 (en) * | 2002-12-31 | 2004-10-26 | Robert Bosch Gmbh | Gap tuning for surface micromachined structures in an epitaxial reactor |
US7002719B2 (en) | 2003-01-15 | 2006-02-21 | Lucent Technologies Inc. | Mirror for an integrated device |
JP4625639B2 (ja) * | 2003-01-17 | 2011-02-02 | 富士フイルム株式会社 | 光変調素子、光変調素子アレイ、画像形成装置、及び平面表示装置 |
US20040140557A1 (en) | 2003-01-21 | 2004-07-22 | United Test & Assembly Center Limited | Wl-bga for MEMS/MOEMS devices |
US6943448B2 (en) | 2003-01-23 | 2005-09-13 | Akustica, Inc. | Multi-metal layer MEMS structure and process for making the same |
TW200413810A (en) | 2003-01-29 | 2004-08-01 | Prime View Int Co Ltd | Light interference display panel and its manufacturing method |
TW557395B (en) | 2003-01-29 | 2003-10-11 | Yen Sun Technology Corp | Optical interference type reflection panel and the manufacturing method thereof |
US20040157426A1 (en) | 2003-02-07 | 2004-08-12 | Luc Ouellet | Fabrication of advanced silicon-based MEMS devices |
US7459402B2 (en) | 2003-02-12 | 2008-12-02 | Texas Instruments Incorporated | Protection layers in micromirror array devices |
US20040159629A1 (en) | 2003-02-19 | 2004-08-19 | Cabot Microelectronics Corporation | MEM device processing with multiple material sacrificial layers |
US20040166603A1 (en) | 2003-02-25 | 2004-08-26 | Carley L. Richard | Micromachined assembly with a multi-layer cap defining a cavity |
US7027202B1 (en) * | 2003-02-28 | 2006-04-11 | Silicon Light Machines Corp | Silicon substrate as a light modulator sacrificial layer |
TW200417806A (en) | 2003-03-05 | 2004-09-16 | Prime View Int Corp Ltd | A structure of a light-incidence electrode of an optical interference display plate |
TWI405196B (zh) | 2003-03-13 | 2013-08-11 | Lg Electronics Inc | 光學記錄媒體及其缺陷區域管理方法及其裝置 |
US6720267B1 (en) | 2003-03-19 | 2004-04-13 | United Microelectronics Corp. | Method for forming a cantilever beam model micro-electromechanical system |
US6913942B2 (en) | 2003-03-28 | 2005-07-05 | Reflectvity, Inc | Sacrificial layers for use in fabrications of microelectromechanical devices |
US7128843B2 (en) | 2003-04-04 | 2006-10-31 | Hrl Laboratories, Llc | Process for fabricating monolithic membrane substrate structures with well-controlled air gaps |
US6987432B2 (en) | 2003-04-16 | 2006-01-17 | Robert Bosch Gmbh | Temperature compensation for silicon MEMS resonator |
JP2004314251A (ja) * | 2003-04-17 | 2004-11-11 | Fuji Photo Film Co Ltd | 薄膜梁及びその成形方法 |
TW567355B (en) | 2003-04-21 | 2003-12-21 | Prime View Int Co Ltd | An interference display cell and fabrication method thereof |
TWI224235B (en) * | 2003-04-21 | 2004-11-21 | Prime View Int Co Ltd | A method for fabricating an interference display cell |
TW594360B (en) | 2003-04-21 | 2004-06-21 | Prime View Int Corp Ltd | A method for fabricating an interference display cell |
TWI226504B (en) | 2003-04-21 | 2005-01-11 | Prime View Int Co Ltd | A structure of an interference display cell |
KR100599083B1 (ko) * | 2003-04-22 | 2006-07-12 | 삼성전자주식회사 | 캔틸레버 형태의 압전 박막 공진 소자 및 그 제조방법 |
US6929969B2 (en) * | 2003-04-23 | 2005-08-16 | Taiwan Semiconductor Manufacturing Company | Reflective spatial light modulator mirror device manufacturing process and layout method |
US6819469B1 (en) | 2003-05-05 | 2004-11-16 | Igor M. Koba | High-resolution spatial light modulator for 3-dimensional holographic display |
TW570896B (en) | 2003-05-26 | 2004-01-11 | Prime View Int Co Ltd | A method for fabricating an interference display cell |
TW591716B (en) * | 2003-05-26 | 2004-06-11 | Prime View Int Co Ltd | A structure of a structure release and manufacturing the same |
FR2855908B1 (fr) * | 2003-06-06 | 2005-08-26 | Soitec Silicon On Insulator | Procede d'obtention d'une structure comprenant au moins un substrat et une couche ultramince |
KR100513696B1 (ko) * | 2003-06-10 | 2005-09-09 | 삼성전자주식회사 | 시이소오형 rf용 mems 스위치 및 그 제조방법 |
US20070064760A1 (en) | 2003-06-12 | 2007-03-22 | Soren Kragh | Optical amplification in miniaturized polymer cavity resonators |
US7221495B2 (en) | 2003-06-24 | 2007-05-22 | Idc Llc | Thin film precursor stack for MEMS manufacturing |
JP2005028504A (ja) | 2003-07-11 | 2005-02-03 | Sony Corp | Mems素子及びその製造方法 |
JP2005051007A (ja) | 2003-07-28 | 2005-02-24 | Tokyo Electron Ltd | 半導体チップの製造方法 |
TWI251712B (en) | 2003-08-15 | 2006-03-21 | Prime View Int Corp Ltd | Interference display plate |
TW200506479A (en) | 2003-08-15 | 2005-02-16 | Prime View Int Co Ltd | Color changeable pixel for an interference display |
TWI305599B (en) | 2003-08-15 | 2009-01-21 | Qualcomm Mems Technologies Inc | Interference display panel and method thereof |
TWI231865B (en) * | 2003-08-26 | 2005-05-01 | Prime View Int Co Ltd | An interference display cell and fabrication method thereof |
TWI230801B (en) | 2003-08-29 | 2005-04-11 | Prime View Int Co Ltd | Reflective display unit using interferometric modulation and manufacturing method thereof |
JP3979982B2 (ja) | 2003-08-29 | 2007-09-19 | シャープ株式会社 | 干渉性変調器および表示装置 |
TWI232333B (en) | 2003-09-03 | 2005-05-11 | Prime View Int Co Ltd | Display unit using interferometric modulation and manufacturing method thereof |
US6982820B2 (en) | 2003-09-26 | 2006-01-03 | Prime View International Co., Ltd. | Color changeable pixel |
TW593126B (en) * | 2003-09-30 | 2004-06-21 | Prime View Int Co Ltd | A structure of a micro electro mechanical system and manufacturing the same |
US6861277B1 (en) * | 2003-10-02 | 2005-03-01 | Hewlett-Packard Development Company, L.P. | Method of forming MEMS device |
CN1874955B (zh) | 2003-10-31 | 2011-03-30 | 爱普科斯公司 | 电子器件的制造方法和电子器件 |
US7012726B1 (en) * | 2003-11-03 | 2006-03-14 | Idc, Llc | MEMS devices with unreleased thin film components |
DE10352001A1 (de) * | 2003-11-07 | 2005-06-09 | Robert Bosch Gmbh | Mikromechanisches Bauelement mit einer Membran und Verfahren zur Herstellung eines solchen Bauelements |
US20050170670A1 (en) | 2003-11-17 | 2005-08-04 | King William P. | Patterning of sacrificial materials |
US6967757B1 (en) | 2003-11-24 | 2005-11-22 | Sandia Corporation | Microelectromechanical mirrors and electrically-programmable diffraction gratings based on two-stage actuation |
US7056757B2 (en) * | 2003-11-25 | 2006-06-06 | Georgia Tech Research Corporation | Methods of forming oxide masks with submicron openings and microstructures formed thereby |
US20050118832A1 (en) * | 2003-12-01 | 2005-06-02 | Korzenski Michael B. | Removal of MEMS sacrificial layers using supercritical fluid/chemical formulations |
EP1689825A4 (en) * | 2003-12-01 | 2008-09-24 | Advanced Tech Materials | REMOVAL OF SACRIFICIAL LAYERS ON MICROELECTROMECHANICAL SYSTEMS USING SUPERCRITICAL FLUID OR CHEMICAL FORMULATIONS |
US7375404B2 (en) | 2003-12-05 | 2008-05-20 | University Of Maryland Biotechnology Institute | Fabrication and integration of polymeric bioMEMS |
US7064883B2 (en) | 2003-12-10 | 2006-06-20 | Silicon Light Machines Corporation | Two dimensional spatial light modulator |
KR100797433B1 (ko) | 2003-12-11 | 2008-01-23 | 마이크로닉 레이저 시스템즈 에이비 | 워크피스를 패터닝하기 위한 방법과 장치 및 그 제조 방법 |
KR100518606B1 (ko) * | 2003-12-19 | 2005-10-04 | 삼성전자주식회사 | 실리콘 기판과 식각 선택비가 큰 마스크층을 이용한리세스 채널 어레이 트랜지스터의 제조 방법 |
US7323217B2 (en) | 2004-01-08 | 2008-01-29 | Qualcomm Mems Technologies, Inc. | Method for making an optical interference type reflective panel |
JP4466081B2 (ja) | 2004-01-08 | 2010-05-26 | ソニー株式会社 | Mems素子 |
TWI235345B (en) | 2004-01-20 | 2005-07-01 | Prime View Int Co Ltd | A structure of an optical interference display unit |
JP4166712B2 (ja) * | 2004-01-29 | 2008-10-15 | 株式会社デンソー | ファブリペローフィルタ |
JP4496091B2 (ja) * | 2004-02-12 | 2010-07-07 | 株式会社東芝 | 薄膜圧電アクチュエータ |
US7041571B2 (en) * | 2004-03-01 | 2006-05-09 | International Business Machines Corporation | Air gap interconnect structure and method of manufacture |
US7119945B2 (en) * | 2004-03-03 | 2006-10-10 | Idc, Llc | Altering temporal response of microelectromechanical elements |
US6999228B2 (en) | 2004-03-05 | 2006-02-14 | Hewlett-Packard Development Company, L.P. | Micro mirror device with adjacently suspended spring and method for the same |
TW200530669A (en) | 2004-03-05 | 2005-09-16 | Prime View Int Co Ltd | Interference display plate and manufacturing method thereof |
TWI261683B (en) | 2004-03-10 | 2006-09-11 | Qualcomm Mems Technologies Inc | Interference reflective element and repairing method thereof |
US7476327B2 (en) | 2004-05-04 | 2009-01-13 | Idc, Llc | Method of manufacture for microelectromechanical devices |
US7256107B2 (en) | 2004-05-04 | 2007-08-14 | The Regents Of The University Of California | Damascene process for use in fabricating semiconductor structures having micro/nano gaps |
US7612759B2 (en) | 2004-05-12 | 2009-11-03 | Shimano Inc. | Cycle computer display apparatus |
US7145213B1 (en) | 2004-05-24 | 2006-12-05 | The United States Of America As Represented By The Secretary Of The Air Force | MEMS RF switch integrated process |
JP2005342808A (ja) | 2004-05-31 | 2005-12-15 | Oki Electric Ind Co Ltd | Memsデバイスの製造方法 |
US7042619B1 (en) * | 2004-06-18 | 2006-05-09 | Miradia Inc. | Mirror structure with single crystal silicon cross-member |
KR101313117B1 (ko) * | 2004-07-29 | 2013-09-30 | 퀄컴 엠이엠에스 테크놀로지스, 인크. | 간섭 변조기의 미소기전 동작을 위한 시스템 및 방법 |
US7273693B2 (en) * | 2004-07-30 | 2007-09-25 | Hewlett-Packard Development Company, L.P. | Method for forming a planar mirror using a sacrificial oxide |
US20060037933A1 (en) * | 2004-08-23 | 2006-02-23 | Wei-Ya Wang | Mirror process using tungsten passivation layer for preventing metal-spiking induced mirror bridging and improving mirror curvature |
JP4852835B2 (ja) | 2004-09-02 | 2012-01-11 | ソニー株式会社 | 回折格子−光変調装置集合体 |
US7710636B2 (en) | 2004-09-27 | 2010-05-04 | Qualcomm Mems Technologies, Inc. | Systems and methods using interferometric optical modulators and diffusers |
US7369296B2 (en) | 2004-09-27 | 2008-05-06 | Idc, Llc | Device and method for modifying actuation voltage thresholds of a deformable membrane in an interferometric modulator |
US7289259B2 (en) * | 2004-09-27 | 2007-10-30 | Idc, Llc | Conductive bus structure for interferometric modulator array |
US20060066932A1 (en) * | 2004-09-27 | 2006-03-30 | Clarence Chui | Method of selective etching using etch stop layer |
US7161730B2 (en) | 2004-09-27 | 2007-01-09 | Idc, Llc | System and method for providing thermal compensation for an interferometric modulator display |
US7327510B2 (en) | 2004-09-27 | 2008-02-05 | Idc, Llc | Process for modifying offset voltage characteristics of an interferometric modulator |
US7527995B2 (en) | 2004-09-27 | 2009-05-05 | Qualcomm Mems Technologies, Inc. | Method of making prestructure for MEMS systems |
US7373026B2 (en) | 2004-09-27 | 2008-05-13 | Idc, Llc | MEMS device fabricated on a pre-patterned substrate |
US7684104B2 (en) | 2004-09-27 | 2010-03-23 | Idc, Llc | MEMS using filler material and method |
US7692839B2 (en) * | 2004-09-27 | 2010-04-06 | Qualcomm Mems Technologies, Inc. | System and method of providing MEMS device with anti-stiction coating |
US7349141B2 (en) * | 2004-09-27 | 2008-03-25 | Idc, Llc | Method and post structures for interferometric modulation |
US7259449B2 (en) | 2004-09-27 | 2007-08-21 | Idc, Llc | Method and system for sealing a substrate |
US7492502B2 (en) * | 2004-09-27 | 2009-02-17 | Idc, Llc | Method of fabricating a free-standing microstructure |
US7429334B2 (en) * | 2004-09-27 | 2008-09-30 | Idc, Llc | Methods of fabricating interferometric modulators by selectively removing a material |
US7130104B2 (en) | 2004-09-27 | 2006-10-31 | Idc, Llc | Methods and devices for inhibiting tilting of a mirror in an interferometric modulator |
US7446926B2 (en) | 2004-09-27 | 2008-11-04 | Idc, Llc | System and method of providing a regenerating protective coating in a MEMS device |
WO2006058034A2 (en) | 2004-11-22 | 2006-06-01 | Intermolecular, Inc. | Molecular self-assembly in substrate processing |
US7199916B2 (en) | 2004-12-07 | 2007-04-03 | Hewlett-Packard Development Company, L.P. | Light modulator device |
EP1825528B1 (en) | 2004-12-09 | 2015-07-08 | Wispry, Inc. | Tunable LC duplexer with multiple pole-zero elements |
TW200628877A (en) * | 2005-02-04 | 2006-08-16 | Prime View Int Co Ltd | Method of manufacturing optical interference type color display |
US7502155B2 (en) | 2005-03-15 | 2009-03-10 | Texas Instruments Incorporated | Antireflective coating for semiconductor devices and method for the same |
US20060234412A1 (en) | 2005-04-19 | 2006-10-19 | Hewlett-Packard Development Company, L.P. Intellectual Property Administration | MEMS release methods |
WO2007004119A2 (en) * | 2005-06-30 | 2007-01-11 | Koninklijke Philips Electronics N.V. | A method of manufacturing a mems element |
EP1910216A1 (en) * | 2005-07-22 | 2008-04-16 | QUALCOMM Incorporated | Support structure for mems device and methods therefor |
EP1910218A1 (en) * | 2005-07-22 | 2008-04-16 | Qualcomm Mems Technologies, Inc. | Mems devices having support structures and methods of fabricating the same |
JP2009503565A (ja) * | 2005-07-22 | 2009-01-29 | クアルコム,インコーポレイテッド | Memsデバイスのための支持構造、およびその方法 |
EP2495212A3 (en) * | 2005-07-22 | 2012-10-31 | QUALCOMM MEMS Technologies, Inc. | Mems devices having support structures and methods of fabricating the same |
US7795061B2 (en) * | 2005-12-29 | 2010-09-14 | Qualcomm Mems Technologies, Inc. | Method of creating MEMS device cavities by a non-etching process |
US20070249078A1 (en) * | 2006-04-19 | 2007-10-25 | Ming-Hau Tung | Non-planar surface structures and process for microelectromechanical systems |
US7527996B2 (en) * | 2006-04-19 | 2009-05-05 | Qualcomm Mems Technologies, Inc. | Non-planar surface structures and process for microelectromechanical systems |
US7321457B2 (en) * | 2006-06-01 | 2008-01-22 | Qualcomm Incorporated | Process and structure for fabrication of MEMS device having isolated edge posts |
-
2006
- 2006-07-20 EP EP20120170329 patent/EP2495212A3/en not_active Ceased
- 2006-08-17 EP EP12170755A patent/EP2497745A3/en not_active Withdrawn
- 2006-08-17 KR KR1020087006538A patent/KR20080055849A/ko not_active Application Discontinuation
- 2006-08-17 JP JP2008527198A patent/JP5129136B2/ja not_active Expired - Fee Related
- 2006-08-17 KR KR1020087006588A patent/KR101317870B1/ko not_active IP Right Cessation
- 2006-08-17 JP JP2008527197A patent/JP5180076B2/ja not_active Expired - Fee Related
- 2006-08-17 WO PCT/US2006/032691 patent/WO2007022528A1/en active Application Filing
- 2006-08-17 WO PCT/US2006/032516 patent/WO2007022479A1/en active Application Filing
- 2006-08-17 CN CN2011103078540A patent/CN102320562A/zh active Pending
- 2006-08-17 EP EP06789884A patent/EP1915319A1/en not_active Withdrawn
- 2006-08-17 WO PCT/US2006/032511 patent/WO2007022476A1/en active Application Filing
- 2006-08-17 CN CNA2006800301337A patent/CN101282903A/zh active Pending
- 2006-08-17 CN CNA2006800302113A patent/CN101258101A/zh active Pending
- 2006-08-18 TW TW095130517A patent/TW200713415A/zh unknown
- 2006-08-18 TW TW095130515A patent/TW200713414A/zh unknown
- 2006-08-18 US US11/506,622 patent/US7486867B2/en not_active Expired - Fee Related
- 2006-08-18 US US11/506,600 patent/US7704773B2/en not_active Expired - Fee Related
- 2006-08-18 US US11/506,770 patent/US7660058B2/en not_active Expired - Fee Related
- 2006-08-18 US US11/506,594 patent/US7747109B2/en not_active Expired - Fee Related
- 2006-08-18 TW TW095130516A patent/TWI435372B/zh not_active IP Right Cessation
-
2010
- 2010-02-08 US US12/702,132 patent/US7835093B2/en not_active Expired - Fee Related
- 2010-04-23 US US12/766,702 patent/US8298847B2/en not_active Expired - Fee Related
- 2010-06-28 US US12/825,214 patent/US8229253B2/en active Active
- 2010-11-15 US US12/946,583 patent/US20110058243A1/en not_active Abandoned
-
2012
- 2012-02-16 JP JP2012031420A patent/JP2012161913A/ja active Pending
- 2012-07-23 US US13/556,127 patent/US20120287138A1/en not_active Abandoned
- 2012-11-16 JP JP2012251991A patent/JP2013068959A/ja not_active Withdrawn
-
2015
- 2015-01-08 JP JP2015002426A patent/JP2015064614A/ja active Pending
- 2015-06-01 JP JP2015122422A patent/JP2015195717A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002056554A (ja) * | 2000-08-08 | 2002-02-22 | Fujitsu Ltd | ガルバノマイクロミラーとこれを用いた光ディスク装置 |
JP2004530253A (ja) * | 2001-01-23 | 2004-09-30 | エイチアールエル、ラボラトリーズ、リミテッド、ライアビリティー、カンパニー | モノリシックスイッチ |
JP2004534280A (ja) * | 2001-07-10 | 2004-11-11 | イリディグム ディスプレイ コーポレイション | フォトニックmems及び構造 |
JP2004212656A (ja) * | 2002-12-27 | 2004-07-29 | Fuji Photo Film Co Ltd | 光変調素子アレイ及び平面ディスプレイ |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021506603A (ja) * | 2017-12-19 | 2021-02-22 | ザ ユニヴァーシティ オブ ブリティッシュ コロンビア | 層状構造及び層状構造を製造するための方法 |
JP7278287B2 (ja) | 2017-12-19 | 2023-05-19 | ザ ユニヴァーシティ オブ ブリティッシュ コロンビア | 層状構造及び層状構造を製造するための方法 |
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5180076B2 (ja) | 応力に起因する変形を最小限に抑えるように構成された支持構造を有するmemsデバイス、およびその製造方法 | |
JP5603311B2 (ja) | 支持構造を有するmemsデバイス、およびその製造方法 | |
US8102590B2 (en) | Method of manufacturing MEMS devices providing air gap control | |
US8270056B2 (en) | Display device with openings between sub-pixels and method of making same | |
US8098417B2 (en) | Electromechanical system having a dielectric movable membrane | |
US7652814B2 (en) | MEMS device with integrated optical element | |
US7535621B2 (en) | Aluminum fluoride films for microelectromechanical system applications | |
JP2009503565A (ja) | Memsデバイスのための支持構造、およびその方法 | |
JP2009503564A (ja) | Memsデバイスのための支持構造、およびその方法 | |
US20080310008A1 (en) | Method of patterning mechanical layer for mems structures | |
US8547626B2 (en) | Mechanical layer and methods of shaping the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150130 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150209 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20160113 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160118 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20161121 |