US738484A
(en)
|
1902-08-09 |
1903-09-08 |
Acme Heel Protector Mfg Company |
Protector for heels and soles of shoes.
|
GB693969A
(en)
|
1950-04-18 |
1953-07-08 |
Standard Telephones Cables Ltd |
Improvements in or relating to joints for coaxial cable
|
US2812501A
(en)
|
1954-03-04 |
1957-11-05 |
Sanders Associates Inc |
Transmission line
|
US2914766A
(en)
|
1955-06-06 |
1959-11-24 |
Sanders Associates Inc |
Three conductor planar antenna
|
US2997519A
(en)
|
1959-10-08 |
1961-08-22 |
Bell Telephone Labor Inc |
Multicoaxial line cables
|
US3311966A
(en)
|
1962-09-24 |
1967-04-04 |
North American Aviation Inc |
Method of fabricating multilayer printed-wiring boards
|
US3335489A
(en)
|
1962-09-24 |
1967-08-15 |
North American Aviation Inc |
Interconnecting circuits with a gallium and indium eutectic
|
US3352730A
(en)
|
1964-08-24 |
1967-11-14 |
Sanders Associates Inc |
Method of making multilayer circuit boards
|
US3309632A
(en)
|
1965-04-13 |
1967-03-14 |
Kollmorgen Corp |
Microwave contactless coaxial connector
|
US3464855A
(en)
|
1966-09-06 |
1969-09-02 |
North American Rockwell |
Process for forming interconnections in a multilayer circuit board
|
FR1573432A
(ja)
|
1967-07-06 |
1969-07-04 |
|
|
US3526867A
(en)
|
1967-07-17 |
1970-09-01 |
Keeler Brass Co |
Interlocking electrical connector
|
US3598107A
(en)
|
1968-07-25 |
1971-08-10 |
Hamamatsu T V Co Ltd |
Pupillary motion observing apparatus
|
US3537043A
(en)
|
1968-08-06 |
1970-10-27 |
Us Air Force |
Lightweight microwave components and wave guides
|
US3577105A
(en)
|
1969-05-29 |
1971-05-04 |
Us Army |
Method and apparatus for joining plated dielectric-form waveguide components
|
DE2020173C3
(de)
|
1970-04-24 |
1981-01-08 |
Spinner-Gmbh Elektrotechnische Fabrik, 8000 Muenchen |
Isolierstützenanordnung in Koaxialleitungen
|
US3775844A
(en)
|
1970-06-25 |
1973-12-04 |
Bunker Ramo |
Method of fabricating a multiwafer electrical circuit structure
|
US3791858A
(en)
|
1971-12-13 |
1974-02-12 |
Ibm |
Method of forming multi-layer circuit panels
|
DE7221114U
(de)
|
1972-06-06 |
1972-10-19 |
Felten & Guilleaume Kabelwerk |
Luftraumisoliertes koaxiales H.F.Kabel mit gewellten Leitern und einzelnen auf dem Innenleiter angeordneten Abstandhaltern aus Kunststoff
|
US3884549A
(en)
|
1973-04-30 |
1975-05-20 |
Univ California |
Two demensional distributed feedback devices and lasers
|
GB1481485A
(en)
|
1975-05-29 |
1977-07-27 |
Furukawa Electric Co Ltd |
Ultra-high-frequency leaky coaxial cable
|
US4033656A
(en)
|
1975-09-02 |
1977-07-05 |
Zero Manufacturing Company |
Low profile integrated circuit socket
|
US4021789A
(en)
|
1975-09-29 |
1977-05-03 |
International Business Machines Corporation |
Self-aligned integrated circuits
|
SE404863B
(sv)
|
1975-12-17 |
1978-10-30 |
Perstorp Ab |
Forfarande vid framstellning av ett flerlagerkort
|
US4275944A
(en)
|
1979-07-09 |
1981-06-30 |
Sochor Jerzy R |
Miniature connector receptacles employing contacts with bowed tines and parallel mounting arms
|
DE3167482D1
(en)
|
1980-09-03 |
1985-01-10 |
Crosfield Electronics Ltd |
Improvements relating to rotary printing presses
|
JPS5772721U
(ja)
|
1980-10-20 |
1982-05-04 |
|
|
FR2496996A1
(fr)
|
1980-12-18 |
1982-06-25 |
Thomson Csf |
Ligne de transmission hyperfrequence, du type triplaque a air et ses utilisations
|
US4417393A
(en)
|
1981-04-01 |
1983-11-29 |
General Electric Company |
Method of fabricating high density electronic circuits having very narrow conductors
|
US4365222A
(en)
|
1981-04-06 |
1982-12-21 |
Bell Telephone Laboratories, Incorporated |
Stripline support assembly
|
US4348253A
(en)
|
1981-11-12 |
1982-09-07 |
Rca Corporation |
Method for fabricating via holes in a semiconductor wafer
|
US4663497A
(en)
|
1982-05-05 |
1987-05-05 |
Hughes Aircraft Company |
High density printed wiring board
|
US4591411A
(en)
|
1982-05-05 |
1986-05-27 |
Hughes Aircraft Company |
Method for forming a high density printed wiring board
|
US4521755A
(en)
|
1982-06-14 |
1985-06-04 |
At&T Bell Laboratories |
Symmetrical low-loss suspended substrate stripline
|
US4539534A
(en)
|
1983-02-23 |
1985-09-03 |
Hughes Aircraft Company |
Square conductor coaxial coupler
|
FR2543746B1
(fr)
|
1983-03-28 |
1985-12-27 |
Commissariat Energie Atomique |
Microconnecteur a haute densite de contacts
|
US4641140A
(en)
|
1983-09-26 |
1987-02-03 |
Harris Corporation |
Miniaturized microwave transmission link
|
US4581301A
(en)
|
1984-04-10 |
1986-04-08 |
Michaelson Henry W |
Additive adhesive based process for the manufacture of printed circuit boards
|
DE3586668T2
(de)
|
1984-06-20 |
1993-04-01 |
Gould Inc |
Laserverfahren zur photomaskenreparatur.
|
US4876322A
(en)
|
1984-08-10 |
1989-10-24 |
Siemens Aktiengesselschaft |
Irradiation cross-linkable thermostable polymer system, for microelectronic applications
|
US4673904A
(en)
|
1984-11-14 |
1987-06-16 |
Itt Corporation |
Micro-coaxial substrate
|
US4647878A
(en)
|
1984-11-14 |
1987-03-03 |
Itt Corporation |
Coaxial shielded directional microwave coupler
|
US4700159A
(en)
|
1985-03-29 |
1987-10-13 |
Weinschel Engineering Co., Inc. |
Support structure for coaxial transmission line using spaced dielectric balls
|
US4915983A
(en)
|
1985-06-10 |
1990-04-10 |
The Foxboro Company |
Multilayer circuit board fabrication process
|
DE3623093A1
(de)
|
1986-07-09 |
1988-01-21 |
Standard Elektrik Lorenz Ag |
Verfahren zur herstellung von durchverbindungen in leiterplatten oder multilayern mit anorganischen oder organisch-anorganischen isolierschichten
|
US5069749A
(en)
|
1986-07-29 |
1991-12-03 |
Digital Equipment Corporation |
Method of fabricating interconnect layers on an integrated circuit chip using seed-grown conductors
|
US4717064A
(en)
|
1986-08-15 |
1988-01-05 |
Unisys Corporation |
Wave solder finger shield apparatus
|
CA1278080C
(en)
|
1986-08-20 |
1990-12-18 |
Yasuo Yamagishi |
Projection-type multi-color liquid crystal display device
|
US4771294A
(en)
|
1986-09-10 |
1988-09-13 |
Harris Corporation |
Modular interface for monolithic millimeter wave antenna array
|
DE3635141C1
(de)
|
1986-10-15 |
1988-03-03 |
Pelikan Ag |
Thermocarbonband mit einer kunststoffgebundenen Aufschmelzfarbe sowie ein Verfahren zur Herstellung dieses Bandes
|
US4857418A
(en)
|
1986-12-08 |
1989-08-15 |
Honeywell Inc. |
Resistive overlayer for magnetic films
|
FR2619253B1
(fr)
|
1987-08-03 |
1990-01-19 |
Aerospatiale |
Dispositif pour le raccord de deux structures pour hyperfrequences, coaxiales et de diametres differents
|
US4880684A
(en)
|
1988-03-11 |
1989-11-14 |
International Business Machines Corporation |
Sealing and stress relief layers and use thereof
|
DE3812414A1
(de)
|
1988-04-14 |
1989-10-26 |
Standard Elektrik Lorenz Ag |
Verfahren zum herstellen einer allseitig geschirmten signalleitung
|
US4808273A
(en)
|
1988-05-10 |
1989-02-28 |
Avantek, Inc. |
Method of forming completely metallized via holes in semiconductors
|
US4859806A
(en)
|
1988-05-17 |
1989-08-22 |
Microelectronics And Computer Technology Corporation |
Discretionary interconnect
|
US5132248A
(en)
|
1988-05-31 |
1992-07-21 |
The United States Of America As Represented By The United States Department Of Energy |
Direct write with microelectronic circuit fabrication
|
US4856184A
(en)
|
1988-06-06 |
1989-08-15 |
Tektronix, Inc. |
Method of fabricating a circuit board
|
JPH027587A
(ja)
|
1988-06-27 |
1990-01-11 |
Yokogawa Electric Corp |
可変周波数光源
|
FR2640083B1
(fr)
|
1988-12-06 |
1991-05-03 |
Thomson Csf |
Support pour ligne de transmission hyperfrequence, notamment du type triplaque
|
US4969979A
(en)
|
1989-05-08 |
1990-11-13 |
International Business Machines Corporation |
Direct electroplating of through holes
|
US5089880A
(en)
|
1989-06-07 |
1992-02-18 |
Amdahl Corporation |
Pressurized interconnection system for semiconductor chips
|
US5100501A
(en)
|
1989-06-30 |
1992-03-31 |
Texas Instruments Incorporated |
Process for selectively depositing a metal in vias and contacts by using a sacrificial layer
|
GB8915517D0
(en)
|
1989-07-06 |
1989-08-23 |
Zed Instr Ltd |
Preparing printing screens
|
JP3027587B2
(ja)
|
1989-11-07 |
2000-04-04 |
株式会社リコー |
ファクシミリ装置
|
US4975142A
(en)
|
1989-11-07 |
1990-12-04 |
General Electric Company |
Fabrication method for printed circuit board
|
JPH041710A
(ja)
|
1990-04-19 |
1992-01-07 |
Matsushita Electric Ind Co Ltd |
レンズ調整装置
|
DE4027994A1
(de)
|
1990-09-04 |
1992-03-05 |
Gw Elektronik Gmbh |
Hf-magnetspulenanordnung und verfahren zu ihrer herstellung
|
GB2249862B
(en)
|
1990-10-01 |
1994-08-17 |
Asahi Optical Co Ltd |
Device and method for retrieving audio signals
|
EP0485831A1
(de)
|
1990-11-13 |
1992-05-20 |
F. Hoffmann-La Roche Ag |
Automatisches Analysengerät
|
EP0519085B1
(en)
|
1990-12-26 |
1996-10-16 |
TDK Corporation |
High-frequency device
|
US5312456A
(en)
|
1991-01-31 |
1994-05-17 |
Carnegie Mellon University |
Micromechanical barb and method for making the same
|
JPH04256203A
(ja)
|
1991-02-07 |
1992-09-10 |
Mitsubishi Electric Corp |
マイクロ波帯ic用パッケージ
|
JP3177746B2
(ja)
|
1991-03-20 |
2001-06-18 |
株式会社日立製作所 |
デ−タ処理システム及び方法
|
US5274484A
(en)
|
1991-04-12 |
1993-12-28 |
Fujitsu Limited |
Gradation methods for driving phase transition liquid crystal using a holding signal
|
US5119049A
(en)
|
1991-04-12 |
1992-06-02 |
Ail Systems, Inc. |
Ultraminiature low loss coaxial delay line
|
US5381157A
(en)
|
1991-05-02 |
1995-01-10 |
Sumitomo Electric Industries, Ltd. |
Monolithic microwave integrated circuit receiving device having a space between antenna element and substrate
|
US5227013A
(en)
|
1991-07-25 |
1993-07-13 |
Microelectronics And Computer Technology Corporation |
Forming via holes in a multilevel substrate in a single step
|
US5207371A
(en)
*
|
1991-07-29 |
1993-05-04 |
Prinz Fritz B |
Method and apparatus for fabrication of three-dimensional metal articles by weld deposition
|
US5299939A
(en)
|
1992-03-05 |
1994-04-05 |
International Business Machines Corporation |
Spring array connector
|
US5213511A
(en)
|
1992-03-27 |
1993-05-25 |
Hughes Aircraft Company |
Dimple interconnect for flat cables and printed wiring boards
|
DE4309917A1
(de)
|
1992-03-30 |
1993-10-07 |
Awa Microelectronics |
Verfahren zur Herstellung von Siliziummikrostrukturen sowie Siliziummikrostruktur
|
US5334956A
(en)
|
1992-03-30 |
1994-08-02 |
Motorola, Inc. |
Coaxial cable having an impedance matched terminating end
|
JP3158621B2
(ja)
|
1992-03-31 |
2001-04-23 |
横河電機株式会社 |
マルチチップモジュール
|
US5430257A
(en)
|
1992-08-12 |
1995-07-04 |
Trw Inc. |
Low stress waveguide window/feedthrough assembly
|
US5294567A
(en)
|
1993-01-08 |
1994-03-15 |
E. I. Du Pont De Nemours And Company |
Method for forming via holes in multilayer circuits
|
JPH08506696A
(ja)
|
1993-02-02 |
1996-07-16 |
エイ・エス・ティー・リサーチ・インコーポレイテッド |
遮蔽グリッドを含む回路基板配列およびその構成
|
JPH06302964A
(ja)
|
1993-04-16 |
1994-10-28 |
Oki Electric Ind Co Ltd |
高速信号伝送用回路基板
|
US5454161A
(en)
|
1993-04-29 |
1995-10-03 |
Fujitsu Limited |
Through hole interconnect substrate fabrication process
|
JP3537161B2
(ja)
|
1993-08-27 |
2004-06-14 |
オリンパス株式会社 |
三次元構造体の製造方法
|
NL9400165A
(nl)
|
1994-02-03 |
1995-09-01 |
Hollandse Signaalapparaten Bv |
Transmissielijnnetwerk.
|
JPH1134331A
(ja)
|
1994-04-18 |
1999-02-09 |
Beam Soken:Kk |
レーザー印刷方式
|
US5466972A
(en)
|
1994-05-09 |
1995-11-14 |
At&T Corp. |
Metallization for polymer-dielectric multichip modules including a Ti/Pd alloy layer
|
JP3587884B2
(ja)
|
1994-07-21 |
2004-11-10 |
富士通株式会社 |
多層回路基板の製造方法
|
JPH08118723A
(ja)
|
1994-10-28 |
1996-05-14 |
Sapporo Breweries Ltd |
レーザ印字装置
|
US5529504A
(en)
|
1995-04-18 |
1996-06-25 |
Hewlett-Packard Company |
Electrically anisotropic elastomeric structure with mechanical compliance and scrub
|
US5682062A
(en)
|
1995-06-05 |
1997-10-28 |
Harris Corporation |
System for interconnecting stacked integrated circuits
|
US5814889A
(en)
|
1995-06-05 |
1998-09-29 |
Harris Corporation |
Intergrated circuit with coaxial isolation and method
|
US5903059A
(en)
|
1995-11-21 |
1999-05-11 |
International Business Machines Corporation |
Microconnectors
|
US5633615A
(en)
|
1995-12-26 |
1997-05-27 |
Hughes Electronics |
Vertical right angle solderless interconnects from suspended stripline to three-wire lines on MIC substrates
|
KR100216839B1
(ko)
|
1996-04-01 |
1999-09-01 |
김규현 |
Bga 반도체 패키지의 솔더 볼 랜드 메탈 구조
|
US5712607A
(en)
|
1996-04-12 |
1998-01-27 |
Dittmer; Timothy W. |
Air-dielectric stripline
|
JPH1012995A
(ja)
*
|
1996-06-24 |
1998-01-16 |
Hitachi Cable Ltd |
立体構造を有する回路部品の製造方法
|
US5793272A
(en)
|
1996-08-23 |
1998-08-11 |
International Business Machines Corporation |
Integrated circuit toroidal inductor
|
TW380772U
(en)
|
1996-09-26 |
2000-01-21 |
Hon Hai Prec Ind Co Ltd |
Miniature connector
|
JP3218996B2
(ja)
|
1996-11-28 |
2001-10-15 |
松下電器産業株式会社 |
ミリ波導波路
|
US5860812A
(en)
|
1997-01-23 |
1999-01-19 |
Litton Systems, Inc. |
One piece molded RF/microwave coaxial connector
|
US7148722B1
(en)
|
1997-02-20 |
2006-12-12 |
Altera Corporation |
PCI-compatible programmable logic devices
|
CA2572786A1
(en)
|
1997-04-04 |
1998-10-15 |
University Of Southern California |
Method for electrochemical fabrication including etching to remove flash
|
US5940674A
(en)
|
1997-04-09 |
1999-08-17 |
Massachusetts Institute Of Technology |
Three-dimensional product manufacture using masks
|
JP3346263B2
(ja)
|
1997-04-11 |
2002-11-18 |
イビデン株式会社 |
プリント配線板及びその製造方法
|
US5925206A
(en)
|
1997-04-21 |
1999-07-20 |
International Business Machines Corporation |
Practical method to make blind vias in circuit boards and other substrates
|
US6180261B1
(en)
|
1997-10-21 |
2001-01-30 |
Nitto Denko Corporation |
Low thermal expansion circuit board and multilayer wiring circuit board
|
FI106585B
(fi)
|
1997-10-22 |
2001-02-28 |
Nokia Mobile Phones Ltd |
Koaksiaalijohto, menetelmä koaksiaalijohdon valmistamiseksi ja langaton viestin
|
US6324754B1
(en)
|
1998-03-25 |
2001-12-04 |
Tessera, Inc. |
Method for fabricating microelectronic assemblies
|
US6329605B1
(en)
|
1998-03-26 |
2001-12-11 |
Tessera, Inc. |
Components with conductive solder mask layers
|
US6008102A
(en)
|
1998-04-09 |
1999-12-28 |
Motorola, Inc. |
Method of forming a three-dimensional integrated inductor
|
US5977842A
(en)
|
1998-07-01 |
1999-11-02 |
Raytheon Company |
High power broadband coaxial balun
|
KR20000011585A
(ko)
|
1998-07-28 |
2000-02-25 |
윤덕용 |
반도체소자및그제조방법
|
US6294401B1
(en)
|
1998-08-19 |
2001-09-25 |
Massachusetts Institute Of Technology |
Nanoparticle-based electrical, chemical, and mechanical structures and methods of making same
|
US6514845B1
(en)
|
1998-10-15 |
2003-02-04 |
Texas Instruments Incorporated |
Solder ball contact and method
|
US6441315B1
(en)
|
1998-11-10 |
2002-08-27 |
Formfactor, Inc. |
Contact structures with blades having a wiping motion
|
US6045973A
(en)
|
1998-12-11 |
2000-04-04 |
Morton International, Inc. |
Photoimageable compositions having improved chemical resistance and stripping ability
|
KR100308871B1
(ko)
|
1998-12-28 |
2001-11-03 |
윤덕용 |
동축 구조의 신호선 및 그의 제조 방법
|
US6388198B1
(en)
|
1999-03-09 |
2002-05-14 |
International Business Machines Corporation |
Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality
|
US6294965B1
(en)
|
1999-03-11 |
2001-09-25 |
Anaren Microwave, Inc. |
Stripline balun
|
JP2000286549A
(ja)
|
1999-03-24 |
2000-10-13 |
Fujitsu Ltd |
バイアコネクションを備えた基板の製造方法
|
US6207901B1
(en)
|
1999-04-01 |
2001-03-27 |
Trw Inc. |
Low loss thermal block RF cable and method for forming RF cable
|
AUPP991899A0
(en)
|
1999-04-23 |
1999-05-20 |
Securency Pty Ltd |
Laser implanted security device
|
US6183268B1
(en)
|
1999-04-27 |
2001-02-06 |
The Whitaker Corporation |
High-density electrical connectors and electrical receptacle contacts therefor
|
US6799976B1
(en)
|
1999-07-28 |
2004-10-05 |
Nanonexus, Inc. |
Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
|
IL146601A0
(en)
|
1999-05-27 |
2002-07-25 |
Patterning Technologies Ltd |
Method of forming a masking pattern on a surface
|
DE60030743T2
(de)
|
1999-07-12 |
2007-09-06 |
Ibiden Co., Ltd., Ogaki |
Verfahren zum Herstellen einer Leiterplatte
|
US6401001B1
(en)
|
1999-07-22 |
2002-06-04 |
Nanotek Instruments, Inc. |
Layer manufacturing using deposition of fused droplets
|
US6232669B1
(en)
|
1999-10-12 |
2001-05-15 |
Advantest Corp. |
Contact structure having silicon finger contactors and total stack-up structure using same
|
US6210221B1
(en)
|
1999-10-13 |
2001-04-03 |
Maury Microwave, Inc. |
Microwave quick connect/disconnect coaxial connectors
|
AU2001244499A1
(en)
|
2000-03-20 |
2001-10-03 |
Paul Brumer |
Nanometric scale coherently controlled deposition
|
EP1139413B1
(en)
|
2000-03-24 |
2005-03-16 |
Texas Instruments Incorporated |
Wire bonding process
|
US6535088B1
(en)
|
2000-04-13 |
2003-03-18 |
Raytheon Company |
Suspended transmission line and method
|
US6673227B2
(en)
*
|
2000-05-29 |
2004-01-06 |
Siemens Production & Logistics Systems Ag |
Process for producing three-dimensional, selectively metallized parts
|
US6677225B1
(en)
|
2000-07-14 |
2004-01-13 |
Zyvex Corporation |
System and method for constraining totally released microcomponents
|
JP4023076B2
(ja)
|
2000-07-27 |
2007-12-19 |
富士通株式会社 |
表裏導通基板及びその製造方法
|
US6350633B1
(en)
|
2000-08-22 |
2002-02-26 |
Charles W. C. Lin |
Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint
|
US6589594B1
(en)
|
2000-08-31 |
2003-07-08 |
Micron Technology, Inc. |
Method for filling a wafer through-via with a conductive material
|
US6690081B2
(en)
*
|
2000-11-18 |
2004-02-10 |
Georgia Tech Research Corporation |
Compliant wafer-level packaging devices and methods of fabrication
|
US6603376B1
(en)
|
2000-12-28 |
2003-08-05 |
Nortel Networks Limited |
Suspended stripline structures to reduce skin effect and dielectric loss to provide low loss transmission of signals with high data rates or high frequencies
|
US6600395B1
(en)
|
2000-12-28 |
2003-07-29 |
Nortel Networks Limited |
Embedded shielded stripline (ESS) structure using air channels within the ESS structure
|
US6800360B2
(en)
|
2001-02-08 |
2004-10-05 |
Sumitomo Electric Industries, Ltd. |
Porous ceramics and method of preparing the same as well as microstrip substrate
|
GB0103754D0
(en)
*
|
2001-02-15 |
2001-04-04 |
Vantico Ltd |
Three-dimensional structured printing
|
KR100368930B1
(ko)
|
2001-03-29 |
2003-01-24 |
한국과학기술원 |
반도체 기판 위에 높이 떠 있는 3차원 금속 소자, 그 회로모델, 및 그 제조방법
|
DE10125794B4
(de)
|
2001-05-26 |
2005-03-24 |
Sator Laser Gmbh |
Verfahren zum Markieren oder Beschriften von Metallteilen
|
KR100367474B1
(ko)
*
|
2001-06-12 |
2003-01-10 |
그랜드디스플레이 주식회사 |
평판전극을 이용한 네온사인장치 및 하판구조
|
US6722197B2
(en)
|
2001-06-19 |
2004-04-20 |
Honeywell International Inc. |
Coupled micromachined structure
|
JP2003032007A
(ja)
|
2001-07-19 |
2003-01-31 |
Nippon Dengyo Kosaku Co Ltd |
同軸給電管
|
US6749737B2
(en)
|
2001-08-10 |
2004-06-15 |
Unimicron Taiwan Corp. |
Method of fabricating inter-layer solid conductive rods
|
US6457979B1
(en)
|
2001-10-29 |
2002-10-01 |
Agilent Technologies, Inc. |
Shielded attachment of coaxial RF connector to thick film integrally shielded transmission line on a substrate
|
US6914513B1
(en)
|
2001-11-08 |
2005-07-05 |
Electro-Science Laboratories, Inc. |
Materials system for low cost, non wire-wound, miniature, multilayer magnetic circuit components
|
CN100550429C
(zh)
|
2001-11-09 |
2009-10-14 |
图恩斯通系统公司 |
具有触头和支座凸块的mems器件及其相关方法
|
US7303663B2
(en)
|
2002-05-07 |
2007-12-04 |
Microfabrica, Inc. |
Multistep release method for electrochemically fabricated structures
|
AU2002360464A1
(en)
|
2001-12-03 |
2003-06-17 |
Memgen Corporation |
Miniature rf and microwave components and methods for fabricating such components
|
US7239219B2
(en)
|
2001-12-03 |
2007-07-03 |
Microfabrica Inc. |
Miniature RF and microwave components and methods for fabricating such components
|
US6710680B2
(en)
|
2001-12-20 |
2004-03-23 |
Motorola, Inc. |
Reduced size, low loss MEMS torsional hinges and MEMS resonators employing such hinges
|
US6648653B2
(en)
|
2002-01-04 |
2003-11-18 |
Insert Enterprise Co., Ltd. |
Super mini coaxial microwave connector
|
US20030221968A1
(en)
|
2002-03-13 |
2003-12-04 |
Memgen Corporation |
Electrochemical fabrication method and apparatus for producing three-dimensional structures having improved surface finish
|
WO2003095710A2
(en)
|
2002-05-07 |
2003-11-20 |
Memgen Corporation |
Methods of and apparatus for electrochemically fabricating structures
|
US6987307B2
(en)
|
2002-06-26 |
2006-01-17 |
Georgia Tech Research Corporation |
Stand-alone organic-based passive devices
|
WO2004004061A1
(en)
|
2002-06-27 |
2004-01-08 |
Memgen Corporation |
Miniature rf and microwave components and methods for fabricating such components
|
US6696666B2
(en)
|
2002-07-03 |
2004-02-24 |
Scimed Life Systems, Inc. |
Tubular cutting process and system
|
US6735009B2
(en)
|
2002-07-16 |
2004-05-11 |
Motorola, Inc. |
Electroptic device
|
US20050230145A1
(en)
|
2002-08-06 |
2005-10-20 |
Toku Ishii |
Thin-diameter coaxial cable and method of producing the same
|
KR100466312B1
(ko)
|
2002-08-07 |
2005-01-13 |
삼성전자주식회사 |
유전막을 갖는 반도체 장치의 제조방법
|
US6827608B2
(en)
|
2002-08-22 |
2004-12-07 |
Corning Gilbert Inc. |
High frequency, blind mate, coaxial interconnect
|
US6992544B2
(en)
|
2002-10-10 |
2006-01-31 |
Agilent Technologies, Inc. |
Shielded surface mount coaxial connector
|
EP1410923B1
(de)
|
2002-10-17 |
2006-08-09 |
Hell Gravure Systems GmbH |
Verfahren zur Herstellung einer Druckform für den Tiefdruck
|
US20050250253A1
(en)
|
2002-10-23 |
2005-11-10 |
Cheung Kin P |
Processes for hermetically packaging wafer level microscopic structures
|
JP2004200227A
(ja)
|
2002-12-16 |
2004-07-15 |
Alps Electric Co Ltd |
プリントインダクタ
|
US6888427B2
(en)
|
2003-01-13 |
2005-05-03 |
Xandex, Inc. |
Flex-circuit-based high speed transmission line
|
US6975267B2
(en)
|
2003-02-05 |
2005-12-13 |
Northrop Grumman Corporation |
Low profile active electronically scanned antenna (AESA) for Ka-band radar systems
|
TWI238513B
(en)
|
2003-03-04 |
2005-08-21 |
Rohm & Haas Elect Mat |
Coaxial waveguide microstructures and methods of formation thereof
|
US7288723B2
(en)
|
2003-04-02 |
2007-10-30 |
Sun Microsystems, Inc. |
Circuit board including isolated signal transmission channels
|
US7628617B2
(en)
|
2003-06-11 |
2009-12-08 |
Neoconix, Inc. |
Structure and process for a contact grid array formed in a circuitized substrate
|
US20050045484A1
(en)
*
|
2003-05-07 |
2005-03-03 |
Microfabrica Inc. |
Electrochemical fabrication process using directly patterned masks
|
TWI244799B
(en)
|
2003-06-06 |
2005-12-01 |
Microfabrica Inc |
Miniature RF and microwave components and methods for fabricating such components
|
WO2005000592A1
(ja)
|
2003-06-26 |
2005-01-06 |
Weather Cock Co.,Ltd. |
立体印刷装置、立体印刷方法および立体印刷物
|
US7145414B2
(en)
|
2003-06-30 |
2006-12-05 |
Endwave Corporation |
Transmission line orientation transition
|
US7277770B2
(en)
|
2003-07-15 |
2007-10-02 |
Huang Wen C |
Direct write process and apparatus
|
JP2005050969A
(ja)
*
|
2003-07-31 |
2005-02-24 |
Cluster Technology Co Ltd |
電気回路部品およびその製造方法
|
TWI234258B
(en)
|
2003-08-01 |
2005-06-11 |
Advanced Semiconductor Eng |
Substrate with reinforced structure of contact pad
|
US7202155B2
(en)
|
2003-08-15 |
2007-04-10 |
Semiconductor Energy Laboratory Co., Ltd. |
Method for manufacturing wiring and method for manufacturing semiconductor device
|
US7612443B1
(en)
|
2003-09-04 |
2009-11-03 |
University Of Notre Dame Du Lac |
Inter-chip communication
|
EP1517166B1
(en)
|
2003-09-15 |
2015-10-21 |
Nuvotronics, LLC |
Device package and methods for the fabrication and testing thereof
|
KR100538470B1
(ko)
|
2003-09-15 |
2005-12-23 |
한국과학기술원 |
유전체 박막을 이용한 동축선 구조의 전송선 시스템, 그제조 방법 및 그를 이용한 패키지 방법
|
WO2005089090A2
(en)
|
2003-10-14 |
2005-09-29 |
North Dakota State University |
Direct write and freeform fabrication apparatus and method
|
EP2256493B1
(en)
|
2003-12-05 |
2014-02-26 |
DexCom, Inc. |
Calibration techniques for a continuous analyte sensor
|
KR100555680B1
(ko)
*
|
2003-12-17 |
2006-03-03 |
삼성전자주식회사 |
높이 단차를 가지는 금속 구조물의 제조방법
|
US7116190B2
(en)
|
2003-12-24 |
2006-10-03 |
Molex Incorporated |
Slot transmission line patch connector
|
GB0400982D0
(en)
|
2004-01-16 |
2004-02-18 |
Fujifilm Electronic Imaging |
Method of forming a pattern on a substrate
|
US20050156693A1
(en)
|
2004-01-20 |
2005-07-21 |
Dove Lewis R. |
Quasi-coax transmission lines
|
US7645940B2
(en)
|
2004-02-06 |
2010-01-12 |
Solectron Corporation |
Substrate with via and pad structures
|
US7109822B2
(en)
|
2004-02-26 |
2006-09-19 |
Bae Systems Information And Electronic Systems Integration Inc. |
Method and apparatus for rapid prototyping of monolithic microwave integrated circuits
|
US7030712B2
(en)
|
2004-03-01 |
2006-04-18 |
Belair Networks Inc. |
Radio frequency (RF) circuit board topology
|
WO2005087654A1
(ja)
|
2004-03-12 |
2005-09-22 |
Japan Science And Technology Agency |
量子ドット操作方法および量子ドット生成操作装置
|
TWI309094B
(en)
|
2004-03-19 |
2009-04-21 |
Neoconix Inc |
Electrical connector in a flexible host and method for fabricating the same
|
US7005371B2
(en)
|
2004-04-29 |
2006-02-28 |
International Business Machines Corporation |
Method of forming suspended transmission line structures in back end of line processing
|
US7128604B2
(en)
|
2004-06-14 |
2006-10-31 |
Corning Gilbert Inc. |
High power coaxial interconnect
|
US6971913B1
(en)
|
2004-07-01 |
2005-12-06 |
Speed Tech Corp. |
Micro coaxial connector
|
TWI237886B
(en)
|
2004-07-06 |
2005-08-11 |
Himax Tech Inc |
Bonding pad and chip structure
|
US7291380B2
(en)
|
2004-07-09 |
2007-11-06 |
Hewlett-Packard Development Company, L.P. |
Laser enhanced plating for forming wiring patterns
|
US7084722B2
(en)
|
2004-07-22 |
2006-08-01 |
Northrop Grumman Corp. |
Switched filterbank and method of making the same
|
US7939003B2
(en)
|
2004-08-11 |
2011-05-10 |
Cornell Research Foundation, Inc. |
Modular fabrication systems and methods
|
US7235431B2
(en)
|
2004-09-02 |
2007-06-26 |
Micron Technology, Inc. |
Methods for packaging a plurality of semiconductor dice using a flowable dielectric material
|
US7077697B2
(en)
|
2004-09-09 |
2006-07-18 |
Corning Gilbert Inc. |
Snap-in float-mount electrical connector
|
CA2479986A1
(fr)
|
2004-09-14 |
2006-03-14 |
Vincent F. Treanton |
Fabrication de guides d`onde optique par ablation laser
|
US7165974B2
(en)
|
2004-10-14 |
2007-01-23 |
Corning Gilbert Inc. |
Multiple-position push-on electrical connector
|
TWI287634B
(en)
|
2004-12-31 |
2007-10-01 |
Wen-Chang Dung |
Micro-electromechanical probe circuit film, method for making the same and applications thereof
|
US7217156B2
(en)
|
2005-01-19 |
2007-05-15 |
Insert Enterprise Co., Ltd. |
RF microwave connector for telecommunication
|
JPWO2006098100A1
(ja)
|
2005-03-14 |
2008-08-21 |
コニカミノルタエムジー株式会社 |
平版印刷版の製版方法及び画像露光装置
|
US7555309B2
(en)
|
2005-04-15 |
2009-06-30 |
Evertz Microsystems Ltd. |
Radio frequency router
|
US7615476B2
(en)
|
2005-06-30 |
2009-11-10 |
Intel Corporation |
Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages
|
US7972650B1
(en)
|
2005-07-13 |
2011-07-05 |
Nscrypt, Inc. |
Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections
|
DE102005033379A1
(de)
*
|
2005-07-16 |
2007-01-18 |
Degussa Ag |
Verwendung von cyclischen Oligomeren in einem formgebenden Verfahren und Formkörper, hergestellt nach diesem Verfahren
|
USD530674S1
(en)
|
2005-08-11 |
2006-10-24 |
Hon Hai Precision Ind. Co., Ltd. |
Micro coaxial connector
|
WO2007038950A1
(en)
|
2005-09-28 |
2007-04-12 |
Stichting Dutch Polymer Institute |
Method for generation of metal surface structures and apparatus therefor
|
JP2007115771A
(ja)
|
2005-10-18 |
2007-05-10 |
Nec System Technologies Ltd |
Lsiピン
|
JP4527646B2
(ja)
|
2005-10-19 |
2010-08-18 |
日本電気株式会社 |
電子装置
|
US20070105395A1
(en)
|
2005-11-04 |
2007-05-10 |
Edward Kinzel |
Laser functionalization and patterning of thick-film inks
|
US7658831B2
(en)
*
|
2005-12-21 |
2010-02-09 |
Formfactor, Inc |
Three dimensional microstructures and methods for making three dimensional microstructures
|
JP4509186B2
(ja)
|
2006-01-31 |
2010-07-21 |
日立金属株式会社 |
積層部品及びこれを用いたモジュール
|
JP4901253B2
(ja)
*
|
2006-03-20 |
2012-03-21 |
独立行政法人理化学研究所 |
3次元金属微細構造体の製造方法
|
EP1912244A1
(en)
|
2006-10-09 |
2008-04-16 |
Carol Ann Wedding |
Positive column tubular PDP
|
JP2008188756A
(ja)
|
2006-12-30 |
2008-08-21 |
Rohm & Haas Electronic Materials Llc |
三次元微細構造体およびその形成方法
|
KR101476438B1
(ko)
|
2006-12-30 |
2014-12-24 |
누보트로닉스, 엘.엘.씨 |
3차원 미세구조 및 그 형성방법
|
TWI445242B
(zh)
|
2006-12-30 |
2014-07-11 |
Nuvotronics Llc |
三維微結構及其形成方法
|
US7532163B2
(en)
|
2007-02-13 |
2009-05-12 |
Raytheon Company |
Conformal electronically scanned phased array antenna and communication system for helmets and other platforms
|
US7898356B2
(en)
|
2007-03-20 |
2011-03-01 |
Nuvotronics, Llc |
Coaxial transmission line microstructures and methods of formation thereof
|
US7755174B2
(en)
|
2007-03-20 |
2010-07-13 |
Nuvotonics, LLC |
Integrated electronic components and methods of formation thereof
|
US7683842B1
(en)
|
2007-05-30 |
2010-03-23 |
Advanced Testing Technologies, Inc. |
Distributed built-in test and performance monitoring system for electronic surveillance
|
US20090004385A1
(en)
*
|
2007-06-29 |
2009-01-01 |
Blackwell James M |
Copper precursors for deposition processes
|
WO2009013751A2
(en)
*
|
2007-07-25 |
2009-01-29 |
Objet Geometries Ltd. |
Solid freeform fabrication using a plurality of modeling materials
|
KR101523403B1
(ko)
|
2007-08-29 |
2015-05-27 |
스카이워크스 솔루션즈, 인코포레이티드 |
밸룬 시그널 스플리터
|
US7920042B2
(en)
|
2007-09-10 |
2011-04-05 |
Enpirion, Inc. |
Micromagnetic device and method of forming the same
|
TWI358799B
(en)
|
2007-11-26 |
2012-02-21 |
Unimicron Technology Corp |
Semiconductor package substrate and method of form
|
US8188932B2
(en)
|
2007-12-12 |
2012-05-29 |
The Boeing Company |
Phased array antenna with lattice transformation
|
JP4506824B2
(ja)
|
2007-12-13 |
2010-07-21 |
富士ゼロックス株式会社 |
回収現像剤搬送装置および画像形成装置
|
US8242593B2
(en)
|
2008-01-27 |
2012-08-14 |
International Business Machines Corporation |
Clustered stacked vias for reliable electronic substrates
|
US7619441B1
(en)
|
2008-03-03 |
2009-11-17 |
Xilinx, Inc. |
Apparatus for interconnecting stacked dice on a programmable integrated circuit
|
WO2009119061A1
(ja)
|
2008-03-27 |
2009-10-01 |
パナソニック株式会社 |
印字装置およびそれを用いた印字方法
|
US7575474B1
(en)
|
2008-06-10 |
2009-08-18 |
Harris Corporation |
Surface mount right angle connector including strain relief and associated methods
|
US8319344B2
(en)
|
2008-07-14 |
2012-11-27 |
Infineon Technologies Ag |
Electrical device with protruding contact elements and overhang regions over a cavity
|
US20100015850A1
(en)
|
2008-07-15 |
2010-01-21 |
Casey Roy Stein |
Low-profile mounted push-on connector
|
US8996155B2
(en)
|
2008-07-25 |
2015-03-31 |
Cornell University |
Apparatus and methods for digital manufacturing
|
US8067305B2
(en)
|
2008-09-03 |
2011-11-29 |
Ultratech, Inc. |
Electrically conductive structure on a semiconductor substrate formed from printing
|
TWI393490B
(zh)
|
2008-12-31 |
2013-04-11 |
Ind Tech Res Inst |
多組同軸導線於基材之單一通孔中之結構與其製作方法
|
US9190201B2
(en)
|
2009-03-04 |
2015-11-17 |
Qualcomm Incorporated |
Magnetic film enhanced inductor
|
US8207261B2
(en)
*
|
2009-03-25 |
2012-06-26 |
E.I. Du Pont De Nemours And Company |
Plastic articles, optionally with partial metal coating
|
EP2244291A1
(en)
|
2009-04-20 |
2010-10-27 |
Nxp B.V. |
Multilevel interconnection system
|
EP2330875A1
(en)
|
2009-07-15 |
2011-06-08 |
Stichting Dutch Polymer Institute |
Method for generating photonically treated printed structures on surfaces, apparatus, and use thereof
|
JP2011070944A
(ja)
*
|
2009-09-25 |
2011-04-07 |
Sekisui Chem Co Ltd |
導電性微粒子の製造方法及び導電性微粒子
|
BR112012007593A2
(pt)
|
2009-09-28 |
2016-08-23 |
Univ Rovira I Virgili |
micro-sistemas funcionais serigrafiados
|
US20110123783A1
(en)
*
|
2009-11-23 |
2011-05-26 |
David Sherrer |
Multilayer build processses and devices thereof
|
EP2524413B1
(en)
|
2010-01-22 |
2018-12-26 |
Nuvotronics LLC |
Thermal management
|
US8917150B2
(en)
|
2010-01-22 |
2014-12-23 |
Nuvotronics, Llc |
Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels
|
TWM389380U
(en)
|
2010-05-19 |
2010-09-21 |
Advanced Connectek Inc |
Miniature high frequency plug connector
|
US20110304520A1
(en)
|
2010-06-11 |
2011-12-15 |
Illinois Tool Works Inc. |
Method of Manufacturing and Operating an Antenna Arrangement for a Communication Device
|
FR2965063B1
(fr)
|
2010-09-21 |
2012-10-12 |
Thales Sa |
Procede pour allonger le temps d'eclairement de cibles par un radar secondaire
|
WO2012058278A2
(en)
*
|
2010-10-27 |
2012-05-03 |
Eugene Giller |
Process and apparatus for fabrication of three-dimensional objects
|
US10105903B2
(en)
|
2010-11-28 |
2018-10-23 |
Stratasys Ltd. |
System and method for additive manufacturing of an object
|
US8814601B1
(en)
|
2011-06-06 |
2014-08-26 |
Nuvotronics, Llc |
Batch fabricated microconnectors
|
US8786515B2
(en)
|
2011-08-30 |
2014-07-22 |
Harris Corporation |
Phased array antenna module and method of making same
|
US8641428B2
(en)
|
2011-12-02 |
2014-02-04 |
Neoconix, Inc. |
Electrical connector and method of making it
|
US9325044B2
(en)
|
2013-01-26 |
2016-04-26 |
Nuvotronics, Inc. |
Multi-layer digital elliptic filter and method
|
US9306254B1
(en)
|
2013-03-15 |
2016-04-05 |
Nuvotronics, Inc. |
Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
|
US9778314B2
(en)
|
2014-08-25 |
2017-10-03 |
Teradyne, Inc. |
Capacitive opens testing of low profile components
|