JP2014527474A5 - - Google Patents

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JP2014527474A5
JP2014527474A5 JP2014520380A JP2014520380A JP2014527474A5 JP 2014527474 A5 JP2014527474 A5 JP 2014527474A5 JP 2014520380 A JP2014520380 A JP 2014520380A JP 2014520380 A JP2014520380 A JP 2014520380A JP 2014527474 A5 JP2014527474 A5 JP 2014527474A5
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現行の工程は、基板の有する構成要素または他の要素がその基板上または基板内にすでに製作されている場合、特にそのトポロジーが層の厚さに対し実質的に非平面状である場合、ほとんど役に立たない。また、基板の多くは、製作に必要な溶剤または加熱工程に対し、感受性が高い。これらの装置を多数の構成要素とともに作製する代替方法としては、ピックアンドプレース工程などがあり、その場合、構成要素は「オフライン」で作製されたのち、電子的および/または機械的な装置上に組み立てられる。その典型的な例は、キャパシタ(コンデンサ)、抵抗、およびインダクタのほか、磁性構成要素などである。
この出願の発明に関連する先行技術文献情報としては、以下のものがある(国際出願日以降国際段階で引用された文献及び他国に国内移行した際に引用された文献を含む)。
(先行技術文献)
(特許文献)
(特許文献1) 米国特許出願公開第2005/0045484号明細書
(特許文献2) 米国特許第7,658,831号明細書
(特許文献3) 米国特許第7,148,141号明細書

Claims (38)

  1. 第1のポリマー材料と、
    第2のポリマー材料と
    を有し、
    前記第2のポリマー材料は、前記第1のポリマー材料と対比し、選択的に金属化されることが可能である
    3次元装置。
  2. 請求項記載の3次元装置において、
    第3の犠牲材料を有し、当該第3の犠牲材料は除去可能であり、選択的に、前記第2のポリマーと対比し、選択的に金属化されないものである3次元装置。
  3. 請求項記載の3次元装置において、
    前記犠牲材料の前記除去により生じる少なくとも1つの空隙を有するものである3次元装置。
  4. 請求項記載の3次元装置において、前記空隙は、前記第1ポリマーと前記第2のポリマーとの間の位置に設けられるものである3次元装置。
  5. 請求項のいずれか1つに記載の3次元装置において、
    前記第2のポリマー材料を有する金属化可能な中心導体コアと、前記第2のポリマー材料を有する金属化可能な外側導体コアとを有する同軸構造を有するものである3次元装置。
  6. 請求項記載の3次元装置において、前記金属化可能な中心および前記外側導体コアの表面上に金属が設けられるものである3次元装置。
  7. 請求項のいずれか1つに記載の3次元装置において、
    前記中心導体コアと、前記外側導体コアとの間に設けられ、前記第1のポリマー材料を有する支柱を有するものである3次元装置。
  8. 請求項のいずれか1つに記載の3次元装置において、
    前記外側導体コアの各壁内に配置された第1および第2の端部を有する支持バーを有し、当該支持バーは、前記中心導体コアの下方に設けられ、前記外側導体コア内で当該中心導体コアを支持するものである3次元装置。
  9. 請求項のいずれか1つに記載の3次元装置において、前記第2のポリマー材料は、選択的に金属化可能な表面を有するものである3次元装置。
  10. 請求項記載の3次元装置において、前記選択的に金属化可能な表面は、無電解金属化または電解金属化のどちらか一方のための金属化触媒を受容するように処理することができるものである3次元装置。
  11. 請求項10記載の3次元装置において、前記処理は、膨張、エッチング、酸化、プラズマ処理、および金属化触媒との接触のうちの少なくとも1つ若しくはそれ以上である3次元装置。
  12. 請求項11のいずれか1つに記載の3次元装置において、金属化可能な前記ポリマー材料のうちの少なくとも1つは、金属化可能な成分を有するものである3次元装置。
  13. 請求項12記載の3次元装置において、前記金属化可能な成分は、無電解的に金属化可能な金属化触媒を有するものである3次元装置。
  14. 請求項12記載の3次元装置において、前記金属化可能な成分は、電解的に金属化可能な伝導性材料を有するものである3次元装置。
  15. 請求項14のいずれか1つに記載の3次元装置において、前記第1および第2のポリマー材料のうちの少なくとも1つは、伝導性ポリマーを有するものである3次元装置。
  16. 請求項15のいずれか1つに記載の3次元装置において、
    前記第2のポリマー材料の表面上に設けられた金属コーティングを有するものである3次元装置。
  17. 請求項16のいずれか1つに記載の3次元装置において、前記第1のポリマー材料および第2のポリマー材料のうちの少なくとも1つは、3次元印刷により積層されるものである3次元装置。
  18. 3次元装置を製作する方法であって、
    3次元印刷を使って第1のポリマー材料を積層する工程と、
    3次元印刷を使って第2のポリマー材料を積層する工程と
    を有し、
    前記第2のポリマー材料は、前記第1のポリマー材料と対比し、選択的に金属化されることが可能である
    方法。
  19. 請求項18記載の方法において、
    除去可能な犠牲材料を積層する工程を有するものである方法。
  20. 請求項19記載の方法において、
    前記犠牲材料を除去して少なくとも1つの空隙を提供する工程を有するものである方法。
  21. 請求項20記載の方法において、前記空隙は、前記第1ポリマーと第2のポリマーとの間の位置に設けられるものである方法。
  22. 請求項1821のいずれか1つに記載の方法において、前記第1および第2のポリマー材料を積層する工程は、前記第2のポリマー材料を有する金属化可能な中心導体コアと、前記第2のポリマー材料を有する金属化可能な外側導体コアとを有する同軸構造を製作する工程を有するものである方法。
  23. 請求項22記載の方法において、
    前記金属化可能な中心導体コアおよび前記外側導体コアの表面上に金属を積層する工程を有するものである方法。
  24. 請求項2223のいずれか1つに記載の方法において、前記第1および第2のポリマー材料を積層する工程は、前記中心導体コアと前記外側導体コアとの間に設けられ、前記第1のポリマー材料を有する支柱を製作する工程を有するものである方法。
  25. 請求項2223のいずれか1つに記載の方法において、前記第1および第2のポリマー材料を積層する工程は、前記外側導体コアの各壁内に配置された第1および第2の端部を有する支持バーであって、前記中心導体コアの下に設けられ、前記外側導体コア内で当該中心導体コアを支持するものである、前記支持バーを製作する工程を有するものである方法。
  26. 請求項1825のいずれか1つに記載の方法において、前記第2のポリマー材料は、選択的に金属化可能な表面を有するものである方法。
  27. 請求項26記載の方法において、
    無電解金属化または電解金属化のどちらか一方のための金属化触媒を受容するように前記選択的に金属化可能な表面を処理する工程を有するものである方法。
  28. 請求項27記載の方法において、前記処理する工程は、膨張、エッチング、酸化、プラズマ処理、および金属化触媒との接触のうちの少なくとも1つ若しくはそれ以上である方法。
  29. 請求項1828のいずれか1つに記載の方法において、前記ポリマー材料のうちの少なくとも1つは、金属化可能な成分を有するものである方法。
  30. 請求項1829のいずれか1つに記載の方法において、
    前記第2のポリマー材料を無電解的に金属化する工程を有するものである方法。
  31. 請求項1829のいずれか1つに記載の方法において、
    前記第2のポリマー材料を電解的に金属化する工程を有するものである方法。
  32. 請求項1831のいずれか1つに記載の方法において、前記第1および第2のポリマー材料のうちの少なくとも1つは、伝導性ポリマーを有するものである方法。
  33. 請求項1832のいずれか1つに記載の方法において、
    前記第2のポリマー材料の表面上に金属コーティングを設ける工程を有するものである方法。
  34. 請求項1833のいずれか1つに記載の方法において、前記3次元印刷は光造形法を有し、当該光造形法工程中の選択された段階で、液体モノマーまたはポリマーが、異なる液体モノマーまたはポリマーで置き換えられるものである方法。
  35. 3次元構造を製作する方法であって、
    a)金属化可能な組成物を有する少なくとも1つの誘電材料を3次元印刷を使って基板上に選択的に積層する工程と、
    b)金属化可能な組成物を有する前記誘電材料上に選択的に金属を積層する工程と
    を有する方法。
  36. 3次元構造を製作する方法であって、
    a)3次元印刷を使って第1の誘電材料を基板上に選択的に積層する工程と、
    b)3次元印刷を使って、前記基板および前記第1の誘電材料のうちの少なくとも1つの上に第2の誘電材料を選択的に積層する工程と、
    c)めっき触媒により、前記誘電材料のうちの1つを選択的に触媒化する工程と、
    d)前記触媒化された誘電材料上に選択的に金属を積層する工程と
    を有する方法。
  37. 3次元構造を製作する方法であって、
    a)3次元印刷を使って支持表面上に第1の犠牲材料の第1の層を積層し、当該第1の層の奥行きの少なくとも一部に向かって延長する1若しくはそれ以上の開口部を内部に有する形状を提供する工程と、
    b)3次元印刷を使って前記第1の層上に第2の犠牲材料の第2の層を積層し、当該第2の層の奥行きの少なくとも一部に向かって延長する1若しくはそれ以上の開口部を前記第2の層内に有する形状を提供する工程であって、前記第1の層の前記開口部のうちの少なくとも1つは、前記第2の層の前記開口部のいずれとも不連続な位置に設けられるものである、前記提供する工程と
    を有する方法。
  38. 3次元装置であって、
    第1のポリマー材料と、
    表面上に金属コーティングを有することにより金属化されたポリマー材料を提供する第2のポリマー材料
    第3の犠牲材料と
    を有する3次元装置。
JP2014520380A 2011-07-13 2012-07-13 電子的および機械的な構造を製作する方法 Expired - Fee Related JP6335782B2 (ja)

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