USD530674S1 - Micro coaxial connector - Google Patents
Micro coaxial connector Download PDFInfo
- Publication number
- USD530674S1 USD530674S1 US29/236,140 US23614005F USD530674S US D530674 S1 USD530674 S1 US D530674S1 US 23614005 F US23614005 F US 23614005F US D530674 S USD530674 S US D530674S
- Authority
- US
- United States
- Prior art keywords
- coaxial connector
- micro coaxial
- micro
- connector
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Images
Description
FIG. 1 is a front, top and right side perspective view of a micro coaxial connector showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Claims (1)
- The ornamental design for a micro coaxial connector, as shown and described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/236,140 USD530674S1 (en) | 2005-08-11 | 2005-08-11 | Micro coaxial connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/236,140 USD530674S1 (en) | 2005-08-11 | 2005-08-11 | Micro coaxial connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD530674S1 true USD530674S1 (en) | 2006-10-24 |
Family
ID=37110919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/236,140 Expired - Lifetime USD530674S1 (en) | 2005-08-11 | 2005-08-11 | Micro coaxial connector |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD530674S1 (en) |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080214054A1 (en) * | 2007-03-02 | 2008-09-04 | Hon Hai Precision Ind. Co., Ltd. | Plug connector with improved cable arrangement |
| US20110181376A1 (en) * | 2010-01-22 | 2011-07-28 | Kenneth Vanhille | Waveguide structures and processes thereof |
| US20110181377A1 (en) * | 2010-01-22 | 2011-07-28 | Kenneth Vanhille | Thermal management |
| US20110210807A1 (en) * | 2003-03-04 | 2011-09-01 | Sherrer David W | Coaxial waveguide microstructures and methods of formation thereof |
| US8542079B2 (en) | 2007-03-20 | 2013-09-24 | Nuvotronics, Llc | Coaxial transmission line microstructure including an enlarged coaxial structure for transitioning to an electrical connector |
| US8814601B1 (en) | 2011-06-06 | 2014-08-26 | Nuvotronics, Llc | Batch fabricated microconnectors |
| US8866300B1 (en) | 2011-06-05 | 2014-10-21 | Nuvotronics, Llc | Devices and methods for solder flow control in three-dimensional microstructures |
| US8933769B2 (en) | 2006-12-30 | 2015-01-13 | Nuvotronics, Llc | Three-dimensional microstructures having a re-entrant shape aperture and methods of formation |
| US9024417B2 (en) | 2007-03-20 | 2015-05-05 | Nuvotronics, Llc | Integrated electronic components and methods of formation thereof |
| US9306255B1 (en) | 2013-03-15 | 2016-04-05 | Nuvotronics, Inc. | Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other |
| US9306254B1 (en) | 2013-03-15 | 2016-04-05 | Nuvotronics, Inc. | Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration |
| US9325044B2 (en) | 2013-01-26 | 2016-04-26 | Nuvotronics, Inc. | Multi-layer digital elliptic filter and method |
| US9993982B2 (en) | 2011-07-13 | 2018-06-12 | Nuvotronics, Inc. | Methods of fabricating electronic and mechanical structures |
| US10310009B2 (en) | 2014-01-17 | 2019-06-04 | Nuvotronics, Inc | Wafer scale test interface unit and contactors |
| US10319654B1 (en) | 2017-12-01 | 2019-06-11 | Cubic Corporation | Integrated chip scale packages |
| US10497511B2 (en) | 2009-11-23 | 2019-12-03 | Cubic Corporation | Multilayer build processes and devices thereof |
| US10511073B2 (en) | 2014-12-03 | 2019-12-17 | Cubic Corporation | Systems and methods for manufacturing stacked circuits and transmission lines |
| US10847469B2 (en) | 2016-04-26 | 2020-11-24 | Cubic Corporation | CTE compensation for wafer-level and chip-scale packages and assemblies |
-
2005
- 2005-08-11 US US29/236,140 patent/USD530674S1/en not_active Expired - Lifetime
Cited By (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9312589B2 (en) | 2003-03-04 | 2016-04-12 | Nuvotronics, Inc. | Coaxial waveguide microstructure having center and outer conductors configured in a rectangular cross-section |
| US20110210807A1 (en) * | 2003-03-04 | 2011-09-01 | Sherrer David W | Coaxial waveguide microstructures and methods of formation thereof |
| US10074885B2 (en) | 2003-03-04 | 2018-09-11 | Nuvotronics, Inc | Coaxial waveguide microstructures having conductors formed by plural conductive layers |
| US8742874B2 (en) | 2003-03-04 | 2014-06-03 | Nuvotronics, Llc | Coaxial waveguide microstructures having an active device and methods of formation thereof |
| US8933769B2 (en) | 2006-12-30 | 2015-01-13 | Nuvotronics, Llc | Three-dimensional microstructures having a re-entrant shape aperture and methods of formation |
| US9515364B1 (en) | 2006-12-30 | 2016-12-06 | Nuvotronics, Inc. | Three-dimensional microstructure having a first dielectric element and a second multi-layer metal element configured to define a non-solid volume |
| US7553191B2 (en) * | 2007-03-02 | 2009-06-30 | Hon Hai Precision Ind. Co., Ltd. | Plug connector with improved cable arrangement |
| US20080214054A1 (en) * | 2007-03-02 | 2008-09-04 | Hon Hai Precision Ind. Co., Ltd. | Plug connector with improved cable arrangement |
| US9000863B2 (en) | 2007-03-20 | 2015-04-07 | Nuvotronics, Llc. | Coaxial transmission line microstructure with a portion of increased transverse dimension and method of formation thereof |
| US10431521B2 (en) | 2007-03-20 | 2019-10-01 | Cubic Corporation | Integrated electronic components and methods of formation thereof |
| US9024417B2 (en) | 2007-03-20 | 2015-05-05 | Nuvotronics, Llc | Integrated electronic components and methods of formation thereof |
| US8542079B2 (en) | 2007-03-20 | 2013-09-24 | Nuvotronics, Llc | Coaxial transmission line microstructure including an enlarged coaxial structure for transitioning to an electrical connector |
| US10002818B2 (en) | 2007-03-20 | 2018-06-19 | Nuvotronics, Inc. | Integrated electronic components and methods of formation thereof |
| US9570789B2 (en) | 2007-03-20 | 2017-02-14 | Nuvotronics, Inc | Transition structure between a rectangular coaxial microstructure and a cylindrical coaxial cable using step changes in center conductors thereof |
| US10497511B2 (en) | 2009-11-23 | 2019-12-03 | Cubic Corporation | Multilayer build processes and devices thereof |
| US8917150B2 (en) | 2010-01-22 | 2014-12-23 | Nuvotronics, Llc | Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels |
| US8717124B2 (en) | 2010-01-22 | 2014-05-06 | Nuvotronics, Llc | Thermal management |
| US20110181377A1 (en) * | 2010-01-22 | 2011-07-28 | Kenneth Vanhille | Thermal management |
| US20110181376A1 (en) * | 2010-01-22 | 2011-07-28 | Kenneth Vanhille | Waveguide structures and processes thereof |
| US9505613B2 (en) | 2011-06-05 | 2016-11-29 | Nuvotronics, Inc. | Devices and methods for solder flow control in three-dimensional microstructures |
| US8866300B1 (en) | 2011-06-05 | 2014-10-21 | Nuvotronics, Llc | Devices and methods for solder flow control in three-dimensional microstructures |
| US9583856B2 (en) | 2011-06-06 | 2017-02-28 | Nuvotronics, Inc. | Batch fabricated microconnectors |
| US8814601B1 (en) | 2011-06-06 | 2014-08-26 | Nuvotronics, Llc | Batch fabricated microconnectors |
| US9993982B2 (en) | 2011-07-13 | 2018-06-12 | Nuvotronics, Inc. | Methods of fabricating electronic and mechanical structures |
| US9325044B2 (en) | 2013-01-26 | 2016-04-26 | Nuvotronics, Inc. | Multi-layer digital elliptic filter and method |
| US9608303B2 (en) | 2013-01-26 | 2017-03-28 | Nuvotronics, Inc. | Multi-layer digital elliptic filter and method |
| US10193203B2 (en) | 2013-03-15 | 2019-01-29 | Nuvotronics, Inc | Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems |
| US9306255B1 (en) | 2013-03-15 | 2016-04-05 | Nuvotronics, Inc. | Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other |
| US10257951B2 (en) | 2013-03-15 | 2019-04-09 | Nuvotronics, Inc | Substrate-free interconnected electronic mechanical structural systems |
| US10361471B2 (en) | 2013-03-15 | 2019-07-23 | Nuvotronics, Inc | Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems |
| US9888600B2 (en) | 2013-03-15 | 2018-02-06 | Nuvotronics, Inc | Substrate-free interconnected electronic mechanical structural systems |
| US9306254B1 (en) | 2013-03-15 | 2016-04-05 | Nuvotronics, Inc. | Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration |
| US10310009B2 (en) | 2014-01-17 | 2019-06-04 | Nuvotronics, Inc | Wafer scale test interface unit and contactors |
| US10511073B2 (en) | 2014-12-03 | 2019-12-17 | Cubic Corporation | Systems and methods for manufacturing stacked circuits and transmission lines |
| US10847469B2 (en) | 2016-04-26 | 2020-11-24 | Cubic Corporation | CTE compensation for wafer-level and chip-scale packages and assemblies |
| US10319654B1 (en) | 2017-12-01 | 2019-06-11 | Cubic Corporation | Integrated chip scale packages |
| US10553511B2 (en) | 2017-12-01 | 2020-02-04 | Cubic Corporation | Integrated chip scale packages |
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