JP2011176381A - 回路基板およびその製造方法 - Google Patents
回路基板およびその製造方法 Download PDFInfo
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- JP2011176381A JP2011176381A JP2011134875A JP2011134875A JP2011176381A JP 2011176381 A JP2011176381 A JP 2011176381A JP 2011134875 A JP2011134875 A JP 2011134875A JP 2011134875 A JP2011134875 A JP 2011134875A JP 2011176381 A JP2011176381 A JP 2011176381A
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- 238000004519 manufacturing process Methods 0.000 title claims description 66
- 239000000758 substrate Substances 0.000 claims abstract description 240
- 239000000463 material Substances 0.000 claims abstract description 49
- 239000011247 coating layer Substances 0.000 claims abstract description 27
- 239000002344 surface layer Substances 0.000 claims abstract description 18
- 239000011229 interlayer Substances 0.000 claims abstract description 8
- 229920005989 resin Polymers 0.000 claims description 45
- 239000011347 resin Substances 0.000 claims description 45
- 239000010410 layer Substances 0.000 claims description 37
- 238000000034 method Methods 0.000 claims description 31
- 239000012790 adhesive layer Substances 0.000 claims description 22
- 238000010030 laminating Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 7
- 238000011049 filling Methods 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 2
- 238000009413 insulation Methods 0.000 abstract description 4
- 239000000470 constituent Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 30
- 239000002184 metal Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000011888 foil Substances 0.000 description 14
- 239000000919 ceramic Substances 0.000 description 11
- 238000000465 moulding Methods 0.000 description 10
- 239000011162 core material Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 239000000945 filler Substances 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000003475 lamination Methods 0.000 description 5
- 239000002759 woven fabric Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000007731 hot pressing Methods 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 238000004873 anchoring Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229920005549 butyl rubber Polymers 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000009503 electrostatic coating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920003208 poly(ethylene sulfide) Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/481—Insulating layers on insulating parts, with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/061—Lamination of previously made multilayered subassemblies
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24893—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
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Abstract
【解決手段】開口部を有し表層に回路と絶縁被膜層とが形成された上側基板と、開口部を有し貫通孔に導電性ペーストが充填された導通孔を有する基板間接続シートと表層に回路と絶縁被膜層とが形成された下側基板を積層し加熱加圧する。
特に、絶縁被膜層は、上側基板または下側基板の基板間接続シートと積層接着する側の面に凸状に点在して形成され、基板間接続シートの開口部の面積を上側基板の開口部の面積より大きく形成することにより、キャビティ構造および高い層間接続信頼性を備えた全層IVH構造を有する多層の回路基板を製造することができる。
【選択図】図1E
Description
本実施の形態においては、初めに本発明の基本的な構造を説明し、次に本発明を構成する要素と他の事例について説明する。
次に、本発明の実施の形態2の回路基板の製造方法を以下に説明する。本実施例においても、基本構造は、実施の形態1と同様、積層基板である下側基板2の上に、キャビティ11を有する積層基板である上側基板1が重なって構成されている。図8A〜図8Cは本発明の実施の形態2における回路基板の製造方法を示すための回路基板の断面図である。まず、図8Aに示すように、実施の形態1の図4Aのステップを経て形成した回路基板20と、図6Hのステップを経て形成した基板間接続シート3とを準備する。
2 下側基板
3 基板間接続シート
4,41 接着層
5,6,9 開口部
7,7a,7b,7c ソルダレジスト
8 クッション材
8a 離型層
8b SUS板
10,20,30 回路基板
11 キャビティ
12 電子部品
13 基板
21,31 プリプレグ
22,42a,42b 離型フィルム
23,43 貫通孔
24,34,44 導電性ペースト
25a,25b,35 金属はく
26,36 回路パターン
42 キャリアフィルム
45 接触部
Claims (9)
- 開口部を有し表層に回路と絶縁被膜層とが形成された上側基板を作成するステップと、
表層に回路と絶縁被膜層とが形成された下側基板を作成するステップと、
開口部を有する基板間接続シートに、貫通孔に導電性ペーストが充填された導通孔を作成するステップと、
前記下側基板と前記基板間接続シートと前記上側基板とを積層し加熱加圧するステップとを備え、
前記絶縁被膜層は、前記上側基板または前記下側基板の前記基板間接続シートと積層接着する側の面に凸状に点在して形成され、
前記基板間接続シートの開口部の面積を前記上側基板の開口部の面積より大きく形成することを特徴とする回路基板の製造方法。 - 前記基板間接続シートの材料の厚み方向の熱膨張係数は、前記上側基板および前記下側基板を構成する材料の厚み方向の熱膨張係数より低いものを用いる請求項1に記載の回路基板の製造方法。
- 前記上側基板の開口部の端面に絶縁被膜層を形成する請求項1に記載の回路基板の製造方法。
- 前記上側基板と前記下側基板は貫通孔に導電性ペーストが充填された導通孔を作成し、前記導通孔を介して両面表層の回路を層間接続することを特徴とする請求項1に記載の回路基板の製造方法。
- 開口部を有する基板間接続シートに貫通孔に導電性ペーストが充填された導通孔を作成するステップは、
キャリアフィルム上に接着層が形成されたシート材料に開口部を形成するステップと、
前記シート材料の前記キャリアフィルムの反対側に離型フィルムをラミネートするステップと、
前記キャリアフィルムを剥離するステップと、
前記キャリアフィルムを剥離した面に他の離型フィルムを真空状態でラミネートし、前記開口部に両面の前記離型フィルムが接触した接触部を形成するステップと、
穴加工し貫通孔を形成するステップと、
前記貫通孔に導電性ペーストを充填するステップと、
前記離型フィルムを剥離するステップと、
を含むことを特徴とする請求項1に記載の回路基板の製造方法。 - 前記シート材料に前記開口部を形成するステップは、
レーザー加工にて行うことを特徴とする請求項5に記載の回路基板の製造方法。 - 前記上側基板または前記下側基板は多層の基板を用い、前記表層の回路は導電性めっきにより形成した導通孔によりコア基板としての内層基板と層間接続することを特徴とする請求項1に記載の回路基板の製造方法。
- 開口部を有し表層に回路と絶縁被膜層とを備えた上側基板と、
表層に回路と絶縁被膜層とを備えた下側基板とが、
開口部を有し層間接続用の導通孔を備えた基板間接続シートを介して積層され、
前記上側基板の開口部と前記基板間接続シートの開口部とでキャビティを構成し、
前記絶縁被膜層は、前記上側基板または前記下側基板の前記基板間接続シートと積層接着する側の面に凸状に点在して形成され、
前記基板間接続シートの開口部の面積は前記上側基板の開口部の面積より大きく形成されていることを特徴とする回路基板。 - 前記絶縁被膜層を構成する熱硬化性樹脂は前記基板間接続シートの前記接着層と同じ材料であることを特徴とする請求項8に記載の回路基板。
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014011605A (ja) * | 2012-06-29 | 2014-01-20 | Murata Mfg Co Ltd | 伝送線路 |
JP2014067973A (ja) * | 2012-09-27 | 2014-04-17 | Hitachi Chemical Co Ltd | 接着シート付きプリント配線板とその製造方法及びそれを用いた貼り合せプリント配線板の製造方法 |
JP2014067788A (ja) * | 2012-09-25 | 2014-04-17 | Panasonic Corp | 回路部品内蔵基板の製造方法 |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007038514A1 (de) * | 2007-08-16 | 2009-02-19 | Robert Bosch Gmbh | Elektrische Schaltungsanordnung und Verfahren zur Herstellung einer elektrischen Schaltungsanordnung |
US8217514B2 (en) * | 2008-04-07 | 2012-07-10 | Stats Chippac Ltd. | Integrated circuit packaging system with warpage control system and method of manufacture thereof |
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US20110147069A1 (en) * | 2009-12-18 | 2011-06-23 | International Business Machines Corporation | Multi-tiered Circuit Board and Method of Manufacture |
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US20110216514A1 (en) * | 2010-03-03 | 2011-09-08 | Mutual-Tek Industries Co., Ltd. | Combined multilayer circuit board having embedded components and manufacturing method of the same |
US20120314390A1 (en) * | 2010-03-03 | 2012-12-13 | Mutual-Tek Industries Co., Ltd. | Multilayer circuit board |
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US20130000968A1 (en) * | 2011-06-30 | 2013-01-03 | Broadcom Corporation | 1-Layer Interposer Substrate With Through-Substrate Posts |
US20140227498A1 (en) * | 2011-09-20 | 2014-08-14 | 3M Innovative Properties Company | Method, system for manufacturing a circuit board, and the circuit board thereof |
KR101258120B1 (ko) * | 2012-10-09 | 2013-04-25 | 주식회사 이티엘 | 필름형 인쇄회로 부착방식의 led 조명 모듈. |
KR101241271B1 (ko) * | 2012-10-09 | 2013-03-15 | 주식회사 이티엘 | 필름형 인쇄회로 부착방식의 led 모듈 제조 방법 |
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US9305853B2 (en) * | 2013-08-30 | 2016-04-05 | Apple Inc. | Ultra fine pitch PoP coreless package |
JP2015106610A (ja) * | 2013-11-29 | 2015-06-08 | イビデン株式会社 | 電子部品内蔵基板、電子部品内蔵基板の製造方法 |
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US11641720B2 (en) * | 2020-09-18 | 2023-05-02 | Unimicron Technology Corp. | Circuit board and manufacturing method thereof |
EP4040926A1 (en) | 2021-02-09 | 2022-08-10 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carriers connected by staggered interconnect elements |
CN113299561B (zh) * | 2021-05-21 | 2023-06-27 | 浙江集迈科微电子有限公司 | 一种腔底防溢胶结构的制备方法 |
CN113692112B (zh) * | 2021-08-30 | 2023-03-24 | 维沃移动通信有限公司 | 电路板和电路板的制作方法 |
CN115361779B (zh) * | 2022-08-26 | 2024-09-13 | 宁波华远电子科技有限公司 | 内埋式元器件的硬质封装结构及其制备方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08130372A (ja) * | 1994-10-31 | 1996-05-21 | Matsushita Electric Works Ltd | 多層プリント配線板の製造方法 |
JP2004072124A (ja) * | 2003-11-04 | 2004-03-04 | Kyocera Corp | 電気素子内蔵配線基板 |
JP2005175115A (ja) * | 2003-12-10 | 2005-06-30 | Matsushita Electric Ind Co Ltd | 多層プリント配線板とその製造方法 |
JP2005277387A (ja) * | 2004-02-24 | 2005-10-06 | Nippon Mektron Ltd | 多層フレキシブル回路基板およびその製造方法 |
JP2006156432A (ja) * | 2004-11-25 | 2006-06-15 | Matsushita Electric Works Ltd | 多層プリント配線板の製造方法 |
JP2006160899A (ja) * | 2004-12-08 | 2006-06-22 | Matsushita Electric Ind Co Ltd | 電気絶縁性基材および配線基板の製造方法 |
Family Cites Families (69)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04369252A (ja) | 1991-06-18 | 1992-12-22 | Hitachi Chem Co Ltd | 半導体素子搭載用装置の製造法 |
US5484647A (en) * | 1993-09-21 | 1996-01-16 | Matsushita Electric Industrial Co., Ltd. | Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same |
JPH0897533A (ja) | 1994-09-22 | 1996-04-12 | Ibiden Co Ltd | 電子部品搭載装置 |
US5629497A (en) * | 1994-10-04 | 1997-05-13 | Cmk Corporation | Printed wiring board and method of manufacturing in which a basefilm including conductive circuits is covered by a cured polyimide resin lay |
US5804422A (en) * | 1995-09-20 | 1998-09-08 | Shinko Electric Industries Co., Ltd. | Process for producing a semiconductor package |
JPH09199824A (ja) | 1995-11-16 | 1997-07-31 | Matsushita Electric Ind Co Ltd | プリント配線板とその実装体 |
DE69626747T2 (de) * | 1995-11-16 | 2003-09-04 | Matsushita Electric Industrial Co., Ltd. | Gedruckte Leiterplatte und ihre Anordnung |
JPH09199856A (ja) | 1996-01-16 | 1997-07-31 | Hitachi Chem Co Ltd | 半導体素子搭載用キャビティー付きプリント配線板の製造方法 |
JPH09232761A (ja) | 1996-02-20 | 1997-09-05 | Matsushita Electric Works Ltd | 多層プリント配線板の製造方法 |
JPH09266268A (ja) * | 1996-03-28 | 1997-10-07 | Mitsubishi Electric Corp | 半導体装置の製造方法および半導体装置のパッケージ |
DE19681758B4 (de) * | 1996-06-14 | 2006-09-14 | Ibiden Co., Ltd. | Einseitiges Schaltkreissubstrat für mehrlagige Schaltkreisplatine, mehrlagige Schaltkreisplatine und Verfahren zur Herstellung selbiger |
JPH1079446A (ja) | 1996-09-02 | 1998-03-24 | Hitachi Chem Co Ltd | 半導体素子搭載用多層配線板の製造方法 |
EP0831528A3 (en) | 1996-09-10 | 1999-12-22 | Hitachi Chemical Company, Ltd. | Multilayer wiring board for mounting semiconductor device and method of producing the same |
KR19980024134A (ko) * | 1996-09-18 | 1998-07-06 | 모기 쥰이찌 | 반도체 패키지 |
US6081426A (en) * | 1996-09-18 | 2000-06-27 | Shinko Electric Industries Co., Ltd. | Semiconductor package having a heat slug |
JPH10154879A (ja) | 1996-11-25 | 1998-06-09 | Matsushita Electric Works Ltd | 半導体パッケージ |
CN1265691C (zh) * | 1996-12-19 | 2006-07-19 | 揖斐电株式会社 | 多层印刷布线板及其制造方法 |
SG76530A1 (en) * | 1997-03-03 | 2000-11-21 | Hitachi Chemical Co Ltd | Circuit boards using heat resistant resin for adhesive layers |
EP1005261B1 (en) * | 1997-04-15 | 2003-03-05 | Ibiden Co., Ltd. | Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board |
JPH10303553A (ja) | 1997-04-22 | 1998-11-13 | Matsushita Electric Works Ltd | プリント配線板の製造方法 |
JPH1117051A (ja) | 1997-06-23 | 1999-01-22 | Hitachi Chem Co Ltd | 半導体素子搭載用多層配線板の製造方法及び半導体素子搭載用多層配線板製造用接着シートの製造方法 |
DE69842086D1 (de) * | 1997-07-08 | 2011-02-17 | Ibiden Co Ltd | Gedruckte Leiterplatte umfassend Leiterbahnen für Lot-Anschlußflächen |
JPH1167965A (ja) | 1997-08-26 | 1999-03-09 | Hitachi Chem Co Ltd | 半導体素子搭載用多層配線板の製造方法 |
US6376049B1 (en) * | 1997-10-14 | 2002-04-23 | Ibiden Co., Ltd. | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
KR20070073984A (ko) * | 1998-05-19 | 2007-07-10 | 이비덴 가부시키가이샤 | 프린트배선판 및 프린트배선판의 제조방법 |
DE69830623T2 (de) * | 1998-08-13 | 2006-05-04 | Hitachi Chemical Co., Ltd. | Klebstoff zum verbinden von schaltelementen, leiterplatte und verfahren zur herstellung derselben |
KR20070086862A (ko) * | 1998-09-03 | 2007-08-27 | 이비덴 가부시키가이샤 | 다층프린트배선판 및 그 제조방법 |
MY128333A (en) * | 1998-09-14 | 2007-01-31 | Ibiden Co Ltd | Printed wiring board and its manufacturing method |
MY139405A (en) * | 1998-09-28 | 2009-09-30 | Ibiden Co Ltd | Printed circuit board and method for its production |
US6762921B1 (en) * | 1999-05-13 | 2004-07-13 | Ibiden Co., Ltd. | Multilayer printed-circuit board and method of manufacture |
EP2265101B1 (en) * | 1999-09-02 | 2012-08-29 | Ibiden Co., Ltd. | Printed circuit board and method of manufacturing printed circuit board |
US6924008B2 (en) * | 1999-12-17 | 2005-08-02 | Daicel Chemical Industries, Ltd. | Curable resin composition, a method for the preparation thereof, and a coated article thereof |
US6909054B2 (en) * | 2000-02-25 | 2005-06-21 | Ibiden Co., Ltd. | Multilayer printed wiring board and method for producing multilayer printed wiring board |
JP3744383B2 (ja) * | 2000-06-09 | 2006-02-08 | 松下電器産業株式会社 | 複合配線基板及びその製造方法 |
WO2002027786A1 (fr) * | 2000-09-25 | 2002-04-04 | Ibiden Co., Ltd. | Element semi-conducteur, procede de fabrication d'un element semi-conducteur, carte a circuit imprime multicouche, et procede de fabrication d'une carte a circuit imprime multicouche |
JP3420748B2 (ja) * | 2000-12-14 | 2003-06-30 | 松下電器産業株式会社 | 半導体装置及びその製造方法 |
EP1381081A4 (en) * | 2001-04-09 | 2008-02-27 | Sumitomo Metal Smi Electronics | RADIATION TYPE BGA HOUSING AND PRODUCTION PRODUCTION THEREOF |
US20020189091A1 (en) * | 2001-06-19 | 2002-12-19 | Advanced Semiconductor Engineering, Inc. | Method of making printed circuit board |
JP3664720B2 (ja) * | 2001-10-31 | 2005-06-29 | 新光電気工業株式会社 | 半導体装置用多層回路基板の製造方法 |
JP3910045B2 (ja) * | 2001-11-05 | 2007-04-25 | シャープ株式会社 | 電子部品内装配線板の製造方法 |
US8076782B2 (en) * | 2002-04-01 | 2011-12-13 | Ibiden Co., Ltd. | Substrate for mounting IC chip |
US6946205B2 (en) * | 2002-04-25 | 2005-09-20 | Matsushita Electric Industrial Co., Ltd. | Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same |
TWI233771B (en) * | 2002-12-13 | 2005-06-01 | Victor Company Of Japan | Flexible rigid printed circuit board and method of fabricating the board |
US20060180344A1 (en) * | 2003-01-20 | 2006-08-17 | Shoji Ito | Multilayer printed wiring board and process for producing the same |
EP1601017A4 (en) * | 2003-02-26 | 2009-04-29 | Ibiden Co Ltd | MULTILAYER PRINTED PCB |
US7070207B2 (en) * | 2003-04-22 | 2006-07-04 | Ibiden Co., Ltd. | Substrate for mounting IC chip, multilayerd printed circuit board, and device for optical communication |
JP2005045150A (ja) | 2003-07-25 | 2005-02-17 | Matsushita Electric Ind Co Ltd | 中間接続用配線基材および多層配線基板、ならびにこれらの製造方法 |
US7226654B2 (en) * | 2003-07-29 | 2007-06-05 | Kyocera Corporation | Laminated wiring board and its mounting structure |
US7271476B2 (en) * | 2003-08-28 | 2007-09-18 | Kyocera Corporation | Wiring substrate for mounting semiconductor components |
JP4193650B2 (ja) * | 2003-09-18 | 2008-12-10 | 株式会社デンソー | 回路基板 |
JP4033114B2 (ja) * | 2003-11-25 | 2008-01-16 | 松下電器産業株式会社 | 多層プリント配線板の製造方法 |
WO2005052666A1 (ja) * | 2003-11-27 | 2005-06-09 | Ibiden Co., Ltd. | Icチップ実装用基板、マザーボード用基板、光通信用デバイス、icチップ実装用基板の製造方法、および、マザーボード用基板の製造方法 |
JP4536430B2 (ja) * | 2004-06-10 | 2010-09-01 | イビデン株式会社 | フレックスリジッド配線板 |
TWI296492B (en) * | 2004-06-29 | 2008-05-01 | Phoenix Prec Technology Corp | Un-symmetric circuit board and method for fabricating the same |
TW200638812A (en) * | 2004-11-18 | 2006-11-01 | Matsushita Electric Ind Co Ltd | Wiring board, method for manufacturing same and semiconductor device |
JP2006202991A (ja) * | 2005-01-20 | 2006-08-03 | Sony Corp | 回路基板及びその製造方法、並びに半導体パッケージ及びその製造方法 |
TWI269423B (en) * | 2005-02-02 | 2006-12-21 | Phoenix Prec Technology Corp | Substrate assembly with direct electrical connection as a semiconductor package |
JP2006324568A (ja) * | 2005-05-20 | 2006-11-30 | Matsushita Electric Ind Co Ltd | 多層モジュールとその製造方法 |
JP4222351B2 (ja) | 2005-08-26 | 2009-02-12 | パナソニック電工株式会社 | 凹凸多層回路板モジュールの製造方法 |
JP4072176B2 (ja) * | 2005-08-29 | 2008-04-09 | 新光電気工業株式会社 | 多層配線基板の製造方法 |
US8101868B2 (en) * | 2005-10-14 | 2012-01-24 | Ibiden Co., Ltd. | Multilayered printed circuit board and method for manufacturing the same |
JP4592751B2 (ja) * | 2005-10-14 | 2010-12-08 | 株式会社フジクラ | プリント配線基板の製造方法 |
JP2007310014A (ja) * | 2006-05-16 | 2007-11-29 | Shinko Electric Ind Co Ltd | 配線基板の製造方法および配線基板の製造装置 |
JP2006313932A (ja) | 2006-07-20 | 2006-11-16 | Matsushita Electric Ind Co Ltd | 多層回路基板とその製造方法 |
US7907801B2 (en) * | 2007-01-17 | 2011-03-15 | Ibiden Co., Ltd. | Optical element, package substrate and device for optical communication |
US7919849B2 (en) * | 2007-04-04 | 2011-04-05 | Ibiden Co., Ltd. | Package substrate and device for optical communication |
US7783141B2 (en) * | 2007-04-04 | 2010-08-24 | Ibiden Co., Ltd. | Substrate for mounting IC chip and device for optical communication |
US7729570B2 (en) * | 2007-05-18 | 2010-06-01 | Ibiden Co., Ltd. | Photoelectric circuit board and device for optical communication |
TWI393511B (zh) * | 2007-05-29 | 2013-04-11 | Panasonic Corp | Dimensional printed wiring board and manufacturing method thereof |
-
2008
- 2008-05-23 TW TW097119200A patent/TW200906263A/zh unknown
- 2008-05-28 CN CN2008800003360A patent/CN101543149B/zh not_active Expired - Fee Related
- 2008-05-28 KR KR1020087027747A patent/KR101024166B1/ko not_active IP Right Cessation
- 2008-05-28 US US12/305,046 patent/US8446736B2/en not_active Expired - Fee Related
- 2008-05-28 JP JP2008539173A patent/JP4935823B2/ja not_active Expired - Fee Related
- 2008-05-28 WO PCT/JP2008/001324 patent/WO2008146487A1/ja active Application Filing
- 2008-05-28 EP EP08763924A patent/EP2164311B1/en not_active Not-in-force
-
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- 2011-06-17 JP JP2011134875A patent/JP5223949B2/ja not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08130372A (ja) * | 1994-10-31 | 1996-05-21 | Matsushita Electric Works Ltd | 多層プリント配線板の製造方法 |
JP2004072124A (ja) * | 2003-11-04 | 2004-03-04 | Kyocera Corp | 電気素子内蔵配線基板 |
JP2005175115A (ja) * | 2003-12-10 | 2005-06-30 | Matsushita Electric Ind Co Ltd | 多層プリント配線板とその製造方法 |
JP2005277387A (ja) * | 2004-02-24 | 2005-10-06 | Nippon Mektron Ltd | 多層フレキシブル回路基板およびその製造方法 |
JP2006156432A (ja) * | 2004-11-25 | 2006-06-15 | Matsushita Electric Works Ltd | 多層プリント配線板の製造方法 |
JP2006160899A (ja) * | 2004-12-08 | 2006-06-22 | Matsushita Electric Ind Co Ltd | 電気絶縁性基材および配線基板の製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014011605A (ja) * | 2012-06-29 | 2014-01-20 | Murata Mfg Co Ltd | 伝送線路 |
JP2014067788A (ja) * | 2012-09-25 | 2014-04-17 | Panasonic Corp | 回路部品内蔵基板の製造方法 |
JP2014067973A (ja) * | 2012-09-27 | 2014-04-17 | Hitachi Chemical Co Ltd | 接着シート付きプリント配線板とその製造方法及びそれを用いた貼り合せプリント配線板の製造方法 |
Also Published As
Publication number | Publication date |
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WO2008146487A1 (ja) | 2008-12-04 |
KR101024166B1 (ko) | 2011-03-22 |
CN101543149A (zh) | 2009-09-23 |
TW200906263A (en) | 2009-02-01 |
EP2164311A4 (en) | 2011-03-23 |
CN101543149B (zh) | 2011-12-28 |
US20090175017A1 (en) | 2009-07-09 |
JPWO2008146487A1 (ja) | 2010-08-19 |
US8446736B2 (en) | 2013-05-21 |
JP5223949B2 (ja) | 2013-06-26 |
EP2164311A1 (en) | 2010-03-17 |
EP2164311B1 (en) | 2012-04-18 |
JP4935823B2 (ja) | 2012-05-23 |
KR20090010982A (ko) | 2009-01-30 |
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