DE69842086D1 - Gedruckte Leiterplatte umfassend Leiterbahnen für Lot-Anschlußflächen - Google Patents
Gedruckte Leiterplatte umfassend Leiterbahnen für Lot-AnschlußflächenInfo
- Publication number
- DE69842086D1 DE69842086D1 DE69842086T DE69842086T DE69842086D1 DE 69842086 D1 DE69842086 D1 DE 69842086D1 DE 69842086 T DE69842086 T DE 69842086T DE 69842086 T DE69842086 T DE 69842086T DE 69842086 D1 DE69842086 D1 DE 69842086D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- printed circuit
- conductor tracks
- solder pads
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/121—Metallo-organic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19635197 | 1997-07-08 | ||
PCT/IB1998/001047 WO1999003316A1 (fr) | 1997-07-08 | 1998-07-08 | Carte a circuits imprimes et procede de fabrication de ladite carte |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69842086D1 true DE69842086D1 (de) | 2011-02-17 |
Family
ID=16356404
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69842086T Expired - Lifetime DE69842086D1 (de) | 1997-07-08 | 1998-07-08 | Gedruckte Leiterplatte umfassend Leiterbahnen für Lot-Anschlußflächen |
Country Status (7)
Country | Link |
---|---|
US (1) | US6242079B1 (de) |
EP (2) | EP1893005B1 (de) |
JP (2) | JPH1187928A (de) |
KR (1) | KR100361565B1 (de) |
CN (2) | CN100358401C (de) |
DE (1) | DE69842086D1 (de) |
WO (1) | WO1999003316A1 (de) |
Families Citing this family (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6703565B1 (en) * | 1996-09-06 | 2004-03-09 | Matsushita Electric Industrial Co., Ltd. | Printed wiring board |
US6141870A (en) | 1997-08-04 | 2000-11-07 | Peter K. Trzyna | Method for making electrical device |
US6159586A (en) * | 1997-09-25 | 2000-12-12 | Nitto Denko Corporation | Multilayer wiring substrate and method for producing the same |
US6565954B2 (en) | 1998-05-14 | 2003-05-20 | Matsushita Electric Industrial Co., Ltd. | Circuit board and method of manufacturing the same |
SG86345A1 (en) | 1998-05-14 | 2002-02-19 | Matsushita Electric Ind Co Ltd | Circuit board and method of manufacturing the same |
EP1121008B1 (de) * | 1998-09-03 | 2008-07-30 | Ibiden Co., Ltd. | Mehrschichtige leiterplatte und verfahren zu deren herstellung |
MY139405A (en) | 1998-09-28 | 2009-09-30 | Ibiden Co Ltd | Printed circuit board and method for its production |
US6451448B1 (en) * | 1999-12-22 | 2002-09-17 | Mitsubishi Shindoh Co. Ltd. | Surface treated metallic materials and manufacturing method thereof |
JP4651159B2 (ja) * | 2000-06-23 | 2011-03-16 | イビデン株式会社 | 多層プリント配線板および多層プリント配線板の製造方法 |
US6506314B1 (en) * | 2000-07-27 | 2003-01-14 | Atotech Deutschland Gmbh | Adhesion of polymeric materials to metal surfaces |
US6518514B2 (en) * | 2000-08-21 | 2003-02-11 | Matsushita Electric Industrial Co., Ltd. | Circuit board and production of the same |
JP4691797B2 (ja) * | 2001-02-15 | 2011-06-01 | イビデン株式会社 | プリント配線板及びその製造方法 |
US20020170897A1 (en) * | 2001-05-21 | 2002-11-21 | Hall Frank L. | Methods for preparing ball grid array substrates via use of a laser |
JP2003037224A (ja) * | 2001-07-23 | 2003-02-07 | Ibiden Co Ltd | モジュール用基板 |
JP2003037231A (ja) * | 2001-07-23 | 2003-02-07 | Ibiden Co Ltd | モジュール用基板 |
JP3941433B2 (ja) | 2001-08-08 | 2007-07-04 | 株式会社豊田自動織機 | ビアホールのスミア除去方法 |
JP4000796B2 (ja) * | 2001-08-08 | 2007-10-31 | 株式会社豊田自動織機 | ビアホールの銅メッキ方法 |
JP4737885B2 (ja) * | 2001-08-08 | 2011-08-03 | イビデン株式会社 | モジュール用基板 |
JP2003060137A (ja) * | 2001-08-08 | 2003-02-28 | Ibiden Co Ltd | モジュール用基板 |
JP2003133727A (ja) * | 2001-10-22 | 2003-05-09 | Nec Toppan Circuit Solutions Inc | 樹脂穴埋め基板の製造方法およびそれを用いた多層プリント配線板の製造方法 |
JP3807312B2 (ja) * | 2002-01-18 | 2006-08-09 | 富士通株式会社 | プリント基板とその製造方法 |
JP2003234572A (ja) * | 2002-02-06 | 2003-08-22 | Nitto Denko Corp | 両面配線基板の製造方法 |
JP4259024B2 (ja) * | 2002-02-07 | 2009-04-30 | 富士通株式会社 | 多層配線基板の製造方法およびこれにより製造される多層配線基板 |
DE10235332A1 (de) * | 2002-08-01 | 2004-02-19 | Infineon Technologies Ag | Mehrlagiger Schaltungsträger und Herstellung desselben |
JP2005158848A (ja) * | 2003-11-21 | 2005-06-16 | Nitto Denko Corp | 配線回路基板の製造方法 |
AT500807B1 (de) * | 2004-01-23 | 2006-11-15 | Austria Tech & System Tech | Verfahren zum herstellen eines leiterplattenelements sowie leiterplattenelement |
JP4308716B2 (ja) * | 2004-06-09 | 2009-08-05 | 新光電気工業株式会社 | 半導体パッケージの製造方法 |
KR100619348B1 (ko) * | 2004-09-21 | 2006-09-12 | 삼성전기주식회사 | 무전해 니켈 도금을 이용한 패키지 기판의 제조 방법 |
KR20100025597A (ko) * | 2005-05-23 | 2010-03-09 | 이비덴 가부시키가이샤 | 프린트 배선판 |
US8129623B2 (en) * | 2006-01-30 | 2012-03-06 | Kyocera Corporation | Resin film, adhesive sheet, circuit board, and electronic apparatus |
KR100659510B1 (ko) * | 2006-02-16 | 2006-12-20 | 삼성전기주식회사 | 캐비티가 형성된 기판 제조 방법 |
JP5110885B2 (ja) * | 2007-01-19 | 2012-12-26 | キヤノン株式会社 | 複数の導電性の領域を有する構造体 |
TW200906263A (en) * | 2007-05-29 | 2009-02-01 | Matsushita Electric Ind Co Ltd | Circuit board and method for manufacturing the same |
KR100850243B1 (ko) * | 2007-07-26 | 2008-08-04 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
KR101505623B1 (ko) * | 2007-09-19 | 2015-03-24 | 우에무라 고교 가부시키가이샤 | 빌드업 적층 기판의 제조 방법 |
CN101466207B (zh) * | 2007-12-19 | 2011-11-16 | 富葵精密组件(深圳)有限公司 | 电路板及其制作方法 |
JP5262188B2 (ja) * | 2008-02-29 | 2013-08-14 | 富士通株式会社 | 基板 |
JP2008294459A (ja) * | 2008-07-11 | 2008-12-04 | Ibiden Co Ltd | 多層プリント配線板 |
US7542302B1 (en) * | 2008-07-14 | 2009-06-02 | International Business Machines Corporation | Minimizing thickness of deadfronted display assemblies |
CN101765341B (zh) * | 2008-12-26 | 2012-01-04 | 南亚电路板股份有限公司 | 激光辅助基板线路成型结构与方法 |
CN102036509B (zh) * | 2009-09-25 | 2013-03-27 | 北大方正集团有限公司 | 一种电路板通孔盲孔电镀方法 |
KR101860965B1 (ko) * | 2010-06-03 | 2018-07-05 | 디디아이 글로벌 코퍼레이션 | 서브어셈블리를 결합시키기 위해 블라인드 및 내부 마이크로 비아를 사용하는 인쇄 회로 기판 제조시스템 및 그 방법 |
JP5116857B2 (ja) * | 2011-01-07 | 2013-01-09 | イビデン株式会社 | 多層プリント配線板及び多層プリント配線板の製造方法 |
KR20120138290A (ko) * | 2011-06-14 | 2012-12-26 | 삼성디스플레이 주식회사 | 식각액 조성물, 및 이를 이용한 금속 배선과 박막 트랜지스터 기판 형성 방법 |
CN102413639B (zh) * | 2011-07-27 | 2015-04-15 | 深南电路有限公司 | 一种电路板的制造方法 |
KR101299258B1 (ko) * | 2012-10-26 | 2013-08-22 | 주식회사 에스아이 플렉스 | 인쇄회로기판의 bvh 깊이 최소화공법 |
CN103384448A (zh) * | 2013-06-27 | 2013-11-06 | 清华大学 | 印刷电路板及表面处理方法 |
CN105225976A (zh) * | 2014-06-25 | 2016-01-06 | 中芯国际集成电路制造(上海)有限公司 | 焊盘的制作方法及半导体器件 |
CN105826295B (zh) * | 2015-01-07 | 2019-01-29 | 中芯国际集成电路制造(上海)有限公司 | 互连结构及其形成方法 |
TWI578416B (zh) * | 2015-09-18 | 2017-04-11 | Subtron Technology Co Ltd | 封裝載板及其製作方法 |
JP2017191894A (ja) * | 2016-04-14 | 2017-10-19 | イビデン株式会社 | プリント配線基板及びその製造方法 |
KR20180060687A (ko) * | 2016-11-29 | 2018-06-07 | 삼성전기주식회사 | 인쇄회로기판 제조방법 |
US10892671B2 (en) * | 2017-07-25 | 2021-01-12 | GM Global Technology Operations LLC | Electrically conductive copper components and joining processes therefor |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59101356A (ja) | 1982-12-01 | 1984-06-11 | 松下電工株式会社 | 銅箔およびそれを用いた電気用積層板 |
JPS63126297A (ja) | 1986-11-14 | 1988-05-30 | イビデン株式会社 | 多層プリント配線板並びにそれの製造方法と無電解めっき用絶縁剤 |
JP2776886B2 (ja) | 1989-05-31 | 1998-07-16 | イビデン株式会社 | 多層プリント配線板およびその製造方法 |
FR2659361B1 (fr) * | 1990-03-06 | 1994-07-29 | Saurer Diederichs Sa | Dispositif de detissage automatique pour machines a tisser avec organes d'insertion mecanique de la trame. |
JP2915114B2 (ja) | 1990-09-18 | 1999-07-05 | 株式会社トクヤマ | 窒化アルミニウムメタライズ基板の製造方法 |
JPH04277690A (ja) | 1991-03-06 | 1992-10-02 | Nec Corp | 印刷配線基板の表面処理方法 |
JP2781954B2 (ja) * | 1994-03-04 | 1998-07-30 | メック株式会社 | 銅および銅合金の表面処理剤 |
JPH07297547A (ja) | 1994-04-20 | 1995-11-10 | Nec Corp | 多層印刷配線板の製造方法 |
JP3101197B2 (ja) | 1994-12-01 | 2000-10-23 | イビデン株式会社 | 多層プリント配線板およびその製造方法 |
KR100269580B1 (ko) * | 1994-12-01 | 2000-10-16 | 엔도 마사루 | 다층 프린트 배선판 및 그 제조방법(multilayer printed wiring board and process for producing the same) |
JPH08242064A (ja) | 1995-03-01 | 1996-09-17 | Ibiden Co Ltd | プリント配線板 |
JPH0936651A (ja) * | 1995-07-20 | 1997-02-07 | Casio Comput Co Ltd | 携帯無線機器用アンテナ |
JPH0936551A (ja) | 1995-05-15 | 1997-02-07 | Ibiden Co Ltd | 多層プリント配線板用片面回路基板、および多層プリント配線板とその製造方法 |
EP0744884A3 (de) * | 1995-05-23 | 1997-09-24 | Hitachi Chemical Co Ltd | Verfahren zur Herstellung einer mehrschichtigen Leiterplatte |
SG71838A1 (en) * | 1995-06-06 | 2000-04-18 | Ibiden Co Ltd | Printed circuit boards |
JP2923524B2 (ja) | 1995-08-01 | 1999-07-26 | メック株式会社 | 銅および銅合金のマイクロエッチング剤並びにマイクロエッチング方法 |
US6010768A (en) * | 1995-11-10 | 2000-01-04 | Ibiden Co., Ltd. | Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler |
DE69942467D1 (de) * | 1998-07-08 | 2010-07-15 | Ibiden Co Ltd | Leiterplatte und Herstellungsverfahren dafür |
-
1998
- 1998-07-08 KR KR1020007000115A patent/KR100361565B1/ko not_active IP Right Cessation
- 1998-07-08 CN CNB988069741A patent/CN100358401C/zh not_active Expired - Fee Related
- 1998-07-08 US US09/445,511 patent/US6242079B1/en not_active Expired - Lifetime
- 1998-07-08 WO PCT/IB1998/001047 patent/WO1999003316A1/ja not_active Application Discontinuation
- 1998-07-08 EP EP07075921A patent/EP1893005B1/de not_active Expired - Lifetime
- 1998-07-08 EP EP98929570A patent/EP0999731B1/de not_active Expired - Lifetime
- 1998-07-08 CN CN2007101386837A patent/CN101106872B/zh not_active Expired - Lifetime
- 1998-07-08 DE DE69842086T patent/DE69842086D1/de not_active Expired - Lifetime
- 1998-07-08 JP JP10208670A patent/JPH1187928A/ja active Pending
-
1999
- 1999-11-18 JP JP11328056A patent/JP2000124617A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
KR20010021557A (ko) | 2001-03-15 |
EP0999731A1 (de) | 2000-05-10 |
US6242079B1 (en) | 2001-06-05 |
EP1893005A2 (de) | 2008-02-27 |
CN1262859A (zh) | 2000-08-09 |
JP2000124617A (ja) | 2000-04-28 |
KR100361565B1 (ko) | 2002-11-22 |
EP1893005B1 (de) | 2012-02-29 |
JPH1187928A (ja) | 1999-03-30 |
CN101106872B (zh) | 2010-06-23 |
EP1893005A3 (de) | 2009-01-28 |
CN100358401C (zh) | 2007-12-26 |
WO1999003316A1 (fr) | 1999-01-21 |
EP0999731A4 (de) | 2005-11-30 |
EP0999731B1 (de) | 2011-01-05 |
CN101106872A (zh) | 2008-01-16 |
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