JP2008547206A5 - - Google Patents
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- JP2008547206A5 JP2008547206A5 JP2008517093A JP2008517093A JP2008547206A5 JP 2008547206 A5 JP2008547206 A5 JP 2008547206A5 JP 2008517093 A JP2008517093 A JP 2008517093A JP 2008517093 A JP2008517093 A JP 2008517093A JP 2008547206 A5 JP2008547206 A5 JP 2008547206A5
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- JP
- Japan
- Prior art keywords
- chip
- chips
- electrical connections
- electrical
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000006870 function Effects 0.000 claims 7
- 239000000463 material Substances 0.000 claims 7
- 238000000034 method Methods 0.000 claims 7
- 238000005516 engineering process Methods 0.000 claims 6
- 229910052751 metal Inorganic materials 0.000 claims 5
- 239000002184 metal Substances 0.000 claims 5
- 239000004065 semiconductor Substances 0.000 claims 5
- 239000000919 ceramic Substances 0.000 claims 4
- 239000011521 glass Substances 0.000 claims 4
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims 3
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 claims 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 3
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims 3
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 claims 3
- 229910052710 silicon Inorganic materials 0.000 claims 3
- 239000010703 silicon Substances 0.000 claims 3
- 238000009413 insulation Methods 0.000 claims 2
- 239000012212 insulator Substances 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 238000007499 fusion processing Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 230000006386 memory function Effects 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US69075905P | 2005-06-14 | 2005-06-14 | |
| US11/329,886 US7521806B2 (en) | 2005-06-14 | 2006-01-10 | Chip spanning connection |
| PCT/US2006/023249 WO2006138425A2 (en) | 2005-06-14 | 2006-06-14 | Chip spanning connection |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008547206A JP2008547206A (ja) | 2008-12-25 |
| JP2008547206A5 true JP2008547206A5 (enExample) | 2009-08-13 |
Family
ID=37523427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008517093A Pending JP2008547206A (ja) | 2005-06-14 | 2006-06-14 | チップの架橋接続 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7521806B2 (enExample) |
| JP (1) | JP2008547206A (enExample) |
| KR (1) | KR101224299B1 (enExample) |
| WO (1) | WO2006138425A2 (enExample) |
Families Citing this family (197)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4577687B2 (ja) * | 2005-03-17 | 2010-11-10 | エルピーダメモリ株式会社 | 半導体装置 |
| JP4869664B2 (ja) * | 2005-08-26 | 2012-02-08 | 本田技研工業株式会社 | 半導体装置の製造方法 |
| TWI416663B (zh) * | 2005-08-26 | 2013-11-21 | 日立製作所股份有限公司 | Semiconductor device manufacturing method and semiconductor device |
| JP4847072B2 (ja) * | 2005-08-26 | 2011-12-28 | 本田技研工業株式会社 | 半導体集積回路装置およびその製造方法 |
| US7863187B2 (en) * | 2005-09-01 | 2011-01-04 | Micron Technology, Inc. | Microfeature workpieces and methods for forming interconnects in microfeature workpieces |
| US7821107B2 (en) * | 2008-04-22 | 2010-10-26 | Micron Technology, Inc. | Die stacking with an annular via having a recessed socket |
| US7723816B2 (en) * | 2008-08-06 | 2010-05-25 | International Business Machines Corporation | Implementing decoupling capacitors with hot-spot thermal reduction on integrated circuit chips |
| JP4696152B2 (ja) * | 2008-11-10 | 2011-06-08 | 株式会社日立製作所 | 半導体装置の製造方法および半導体装置 |
| US7989918B2 (en) * | 2009-01-26 | 2011-08-02 | International Business Machines Corporation | Implementing tamper evident and resistant detection through modulation of capacitance |
| US8609466B2 (en) | 2009-07-15 | 2013-12-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cap and substrate electrical connection at wafer level |
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-
2006
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- 2006-06-14 WO PCT/US2006/023249 patent/WO2006138425A2/en not_active Ceased
- 2006-06-14 KR KR1020077029399A patent/KR101224299B1/ko active Active
- 2006-06-14 JP JP2008517093A patent/JP2008547206A/ja active Pending
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