JP2010287646A5 - - Google Patents

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Publication number
JP2010287646A5
JP2010287646A5 JP2009138835A JP2009138835A JP2010287646A5 JP 2010287646 A5 JP2010287646 A5 JP 2010287646A5 JP 2009138835 A JP2009138835 A JP 2009138835A JP 2009138835 A JP2009138835 A JP 2009138835A JP 2010287646 A5 JP2010287646 A5 JP 2010287646A5
Authority
JP
Japan
Prior art keywords
wiring
wiring pattern
pad
substrate body
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009138835A
Other languages
English (en)
Japanese (ja)
Other versions
JP5091916B2 (ja
JP2010287646A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009138835A priority Critical patent/JP5091916B2/ja
Priority claimed from JP2009138835A external-priority patent/JP5091916B2/ja
Publication of JP2010287646A publication Critical patent/JP2010287646A/ja
Publication of JP2010287646A5 publication Critical patent/JP2010287646A5/ja
Application granted granted Critical
Publication of JP5091916B2 publication Critical patent/JP5091916B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009138835A 2009-06-10 2009-06-10 配線基板及び半導体装置 Expired - Fee Related JP5091916B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009138835A JP5091916B2 (ja) 2009-06-10 2009-06-10 配線基板及び半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009138835A JP5091916B2 (ja) 2009-06-10 2009-06-10 配線基板及び半導体装置

Publications (3)

Publication Number Publication Date
JP2010287646A JP2010287646A (ja) 2010-12-24
JP2010287646A5 true JP2010287646A5 (enExample) 2012-06-07
JP5091916B2 JP5091916B2 (ja) 2012-12-05

Family

ID=43543154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009138835A Expired - Fee Related JP5091916B2 (ja) 2009-06-10 2009-06-10 配線基板及び半導体装置

Country Status (1)

Country Link
JP (1) JP5091916B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9293405B2 (en) * 2011-03-22 2016-03-22 Renesas Electronics Corporation Semiconductor device
JP2013236039A (ja) * 2012-05-11 2013-11-21 Renesas Electronics Corp 半導体装置
JP6251828B2 (ja) * 2017-01-30 2017-12-20 ルネサスエレクトロニクス株式会社 半導体装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04255291A (ja) * 1991-02-07 1992-09-10 Nec Corp 印刷配線板
JP4150511B2 (ja) * 2001-05-16 2008-09-17 株式会社日立製作所 半導体レ−ザ装置
JP3877642B2 (ja) * 2002-05-21 2007-02-07 ローム株式会社 半導体チップを使用した半導体装置
JP2008047761A (ja) * 2006-08-18 2008-02-28 Ricoh Printing Systems Ltd 半導体レーザ装置
JP2008060159A (ja) * 2006-08-29 2008-03-13 Renesas Technology Corp 半導体装置およびその製造方法
JP5018155B2 (ja) * 2007-03-16 2012-09-05 富士通セミコンダクター株式会社 配線基板、電子部品の実装構造、及び半導体装置
JP2009105139A (ja) * 2007-10-22 2009-05-14 Shinko Electric Ind Co Ltd 配線基板及びその製造方法と半導体装置

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