JP2015029022A5 - - Google Patents

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Publication number
JP2015029022A5
JP2015029022A5 JP2013158233A JP2013158233A JP2015029022A5 JP 2015029022 A5 JP2015029022 A5 JP 2015029022A5 JP 2013158233 A JP2013158233 A JP 2013158233A JP 2013158233 A JP2013158233 A JP 2013158233A JP 2015029022 A5 JP2015029022 A5 JP 2015029022A5
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JP
Japan
Prior art keywords
terminals
wire
main surface
semiconductor chip
terminal
Prior art date
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Granted
Application number
JP2013158233A
Other languages
English (en)
Japanese (ja)
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JP6196092B2 (ja
JP2015029022A (ja
Filing date
Publication date
Priority claimed from JP2013158233A external-priority patent/JP6196092B2/ja
Priority to JP2013158233A priority Critical patent/JP6196092B2/ja
Application filed filed Critical
Priority to US14/329,833 priority patent/US9281289B2/en
Priority to CN201810790404.3A priority patent/CN109037184B/zh
Priority to CN201410352981.6A priority patent/CN104347549B/zh
Priority to KR1020140094613A priority patent/KR20150014867A/ko
Priority to TW103125751A priority patent/TWI631680B/zh
Publication of JP2015029022A publication Critical patent/JP2015029022A/ja
Priority to HK15107383.3A priority patent/HK1206869B/zh
Priority to US15/041,858 priority patent/US10170402B2/en
Publication of JP2015029022A5 publication Critical patent/JP2015029022A5/ja
Publication of JP6196092B2 publication Critical patent/JP6196092B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013158233A 2013-07-30 2013-07-30 半導体装置 Active JP6196092B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2013158233A JP6196092B2 (ja) 2013-07-30 2013-07-30 半導体装置
US14/329,833 US9281289B2 (en) 2013-07-30 2014-07-11 Semiconductor device and method of manufacturing the same
CN201810790404.3A CN109037184B (zh) 2013-07-30 2014-07-23 半导体器件
CN201410352981.6A CN104347549B (zh) 2013-07-30 2014-07-23 半导体器件及其制造方法
KR1020140094613A KR20150014867A (ko) 2013-07-30 2014-07-25 반도체 장치 및 그 제조 방법
TW103125751A TWI631680B (zh) 2013-07-30 2014-07-28 半導體裝置
HK15107383.3A HK1206869B (zh) 2013-07-30 2015-08-01 半导体器件及其制造方法
US15/041,858 US10170402B2 (en) 2013-07-30 2016-02-11 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013158233A JP6196092B2 (ja) 2013-07-30 2013-07-30 半導体装置

Publications (3)

Publication Number Publication Date
JP2015029022A JP2015029022A (ja) 2015-02-12
JP2015029022A5 true JP2015029022A5 (enExample) 2016-04-07
JP6196092B2 JP6196092B2 (ja) 2017-09-13

Family

ID=52426950

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013158233A Active JP6196092B2 (ja) 2013-07-30 2013-07-30 半導体装置

Country Status (5)

Country Link
US (2) US9281289B2 (enExample)
JP (1) JP6196092B2 (enExample)
KR (1) KR20150014867A (enExample)
CN (2) CN104347549B (enExample)
TW (1) TWI631680B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017092212A (ja) * 2015-11-09 2017-05-25 株式会社東芝 半導体装置およびその製造方法
JP6991014B2 (ja) 2017-08-29 2022-01-12 キオクシア株式会社 半導体装置
TWI739379B (zh) * 2019-04-24 2021-09-11 日商新川股份有限公司 半導體裝置、半導體裝置的製造方法、以及打線接合裝置
CN110265378B (zh) * 2019-06-19 2020-10-23 福建福顺半导体制造有限公司 一种电子元件
KR102736238B1 (ko) * 2020-01-10 2024-12-02 에스케이하이닉스 주식회사 본딩 와이어 분지 구조를 포함한 반도체 패키지
KR102864755B1 (ko) 2020-07-10 2025-09-24 삼성전자주식회사 패키지 기판 및 이를 포함하는 반도체 패키지
JP7679289B2 (ja) * 2020-12-23 2025-05-19 スカイワークス ソリューションズ，インコーポレイテッド ツールマークなしのステッチボンディングのための装置および方法
US12021063B2 (en) * 2021-01-28 2024-06-25 Qualcomm Incorporated Circular bond finger pad
CN114864420B (zh) * 2022-04-19 2025-01-28 江西万年芯微电子有限公司 一种提升薄芯片良率的贴片方式
KR20230173269A (ko) 2022-06-16 2023-12-27 삼성전자주식회사 반도체 패키지

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61105851A (ja) 1984-10-30 1986-05-23 Toshiba Corp ワイヤボンデイング方法
JPH06103697B2 (ja) * 1988-06-25 1994-12-14 日本電気株式会社 コンパクトｉｃのワイヤボンディング構造体
JP3662461B2 (ja) * 1999-02-17 2005-06-22 シャープ株式会社 半導体装置、およびその製造方法
JP2001156107A (ja) * 1999-11-30 2001-06-08 Rohm Co Ltd Ｉｃチップ、およびこれの導体ワイヤ接続方法
JP4034932B2 (ja) * 2000-12-15 2008-01-16 株式会社沖データ 半導体装置、ｌｅｄプリントヘッドおよびワイヤボンディング方法
JP2002237567A (ja) * 2001-02-09 2002-08-23 Nec Corp 半導体装置
KR100868419B1 (ko) * 2001-06-07 2008-11-11 가부시끼가이샤 르네사스 테크놀로지 반도체장치 및 그 제조방법
JP4068974B2 (ja) * 2003-01-22 2008-03-26 株式会社ルネサステクノロジ 半導体装置
US6927156B2 (en) * 2003-06-18 2005-08-09 Intel Corporation Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric silicon
JP4726640B2 (ja) * 2006-01-20 2011-07-20 ルネサスエレクトロニクス株式会社 半導体装置
JP4967524B2 (ja) * 2006-08-15 2012-07-04 ヤマハ株式会社 半導体装置及びワイヤーボンディング方法
JP2008171927A (ja) * 2007-01-10 2008-07-24 Renesas Technology Corp 半導体装置
JP2009043793A (ja) * 2007-08-07 2009-02-26 Panasonic Corp 半導体装置、およびその半導体装置の製造方法

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