JP2009064897A5 - - Google Patents

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Publication number
JP2009064897A5
JP2009064897A5 JP2007230323A JP2007230323A JP2009064897A5 JP 2009064897 A5 JP2009064897 A5 JP 2009064897A5 JP 2007230323 A JP2007230323 A JP 2007230323A JP 2007230323 A JP2007230323 A JP 2007230323A JP 2009064897 A5 JP2009064897 A5 JP 2009064897A5
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JP
Japan
Prior art keywords
layer
conductor
protective film
conductor post
pad
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2007230323A
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English (en)
Japanese (ja)
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JP4955488B2 (ja
JP2009064897A (ja
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Application filed filed Critical
Priority to JP2007230323A priority Critical patent/JP4955488B2/ja
Priority claimed from JP2007230323A external-priority patent/JP4955488B2/ja
Priority to US12/195,619 priority patent/US7704792B2/en
Publication of JP2009064897A publication Critical patent/JP2009064897A/ja
Publication of JP2009064897A5 publication Critical patent/JP2009064897A5/ja
Application granted granted Critical
Publication of JP4955488B2 publication Critical patent/JP4955488B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007230323A 2007-09-05 2007-09-05 半導体装置及びその製造方法 Expired - Fee Related JP4955488B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007230323A JP4955488B2 (ja) 2007-09-05 2007-09-05 半導体装置及びその製造方法
US12/195,619 US7704792B2 (en) 2007-09-05 2008-08-21 Semiconductor device and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007230323A JP4955488B2 (ja) 2007-09-05 2007-09-05 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2009064897A JP2009064897A (ja) 2009-03-26
JP2009064897A5 true JP2009064897A5 (enExample) 2010-08-12
JP4955488B2 JP4955488B2 (ja) 2012-06-20

Family

ID=40406153

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007230323A Expired - Fee Related JP4955488B2 (ja) 2007-09-05 2007-09-05 半導体装置及びその製造方法

Country Status (2)

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US (1) US7704792B2 (enExample)
JP (1) JP4955488B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012099648A (ja) * 2010-11-02 2012-05-24 Fujitsu Semiconductor Ltd 半導体装置とその製造方法
CN102683226A (zh) * 2011-03-14 2012-09-19 SKLink株式会社 晶圆级封装结构及其制造方法
US10224306B2 (en) * 2016-11-03 2019-03-05 Stmicroelectronics (Grenoble 2) Sas Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
US10541209B2 (en) * 2017-08-03 2020-01-21 General Electric Company Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof
US10804115B2 (en) 2017-08-03 2020-10-13 General Electric Company Electronics package with integrated interconnect structure and method of manufacturing thereof
US10541153B2 (en) * 2017-08-03 2020-01-21 General Electric Company Electronics package with integrated interconnect structure and method of manufacturing thereof
CN113725187A (zh) * 2021-08-24 2021-11-30 日月光半导体制造股份有限公司 半导体封装结构及其制造方法
CN114121466B (zh) * 2021-10-11 2024-11-08 合泰盟方电子（深圳）股份有限公司 一种磁性薄膜电感器生产制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05110223A (ja) * 1991-10-14 1993-04-30 Mitsubishi Electric Corp Ｉｃ実装構造
JP2002237567A (ja) 2001-02-09 2002-08-23 Nec Corp 半導体装置
JP3918842B2 (ja) * 2004-09-03 2007-05-23 ヤマハ株式会社 半導体素子及びそれを備えたワイヤボンディング・チップサイズ・パッケージ

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