JP2015523145A5 - - Google Patents

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Publication number
JP2015523145A5
JP2015523145A5 JP2015520207A JP2015520207A JP2015523145A5 JP 2015523145 A5 JP2015523145 A5 JP 2015523145A5 JP 2015520207 A JP2015520207 A JP 2015520207A JP 2015520207 A JP2015520207 A JP 2015520207A JP 2015523145 A5 JP2015523145 A5 JP 2015523145A5
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JP
Japan
Prior art keywords
layer
sensor assembly
thickness
contact pads
solderable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015520207A
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English (en)
Japanese (ja)
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JP2015523145A (ja
JP6187991B2 (ja
Filing date
Publication date
Priority claimed from US13/538,573 external-priority patent/US8618795B1/en
Application filed filed Critical
Publication of JP2015523145A publication Critical patent/JP2015523145A/ja
Publication of JP2015523145A5 publication Critical patent/JP2015523145A5/ja
Application granted granted Critical
Publication of JP6187991B2 publication Critical patent/JP6187991B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2015520207A 2012-06-29 2013-05-30 医療的位置および方向追跡で使用するためのセンサアセンブリ Expired - Fee Related JP6187991B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/538,573 2012-06-29
US13/538,573 US8618795B1 (en) 2012-06-29 2012-06-29 Sensor assembly for use in medical position and orientation tracking
PCT/US2013/043356 WO2014003960A1 (en) 2012-06-29 2013-05-30 Sensor assembly for use in medical position and orientation tracking

Publications (3)

Publication Number Publication Date
JP2015523145A JP2015523145A (ja) 2015-08-13
JP2015523145A5 true JP2015523145A5 (enExample) 2016-07-14
JP6187991B2 JP6187991B2 (ja) 2017-08-30

Family

ID=48670780

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015520207A Expired - Fee Related JP6187991B2 (ja) 2012-06-29 2013-05-30 医療的位置および方向追跡で使用するためのセンサアセンブリ

Country Status (5)

Country Link
US (1) US8618795B1 (enExample)
JP (1) JP6187991B2 (enExample)
CN (1) CN104411267A (enExample)
DE (1) DE112013003183T5 (enExample)
WO (1) WO2014003960A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9638820B2 (en) * 2014-03-03 2017-05-02 Biosense Webster (Israel) Ltd. Calibration jig for a flat location pad
US10588541B2 (en) 2014-07-15 2020-03-17 General Electric Company Magnetic tracker system and method for use for surgical navigation
US10076267B2 (en) 2014-10-03 2018-09-18 General Electric Company Methods and systems for improved navigation
US10727122B2 (en) 2014-12-08 2020-07-28 International Business Machines Corporation Self-aligned via interconnect structures
US10426555B2 (en) * 2015-06-03 2019-10-01 Covidien Lp Medical instrument with sensor for use in a system and method for electromagnetic navigation
US9995600B2 (en) 2015-09-01 2018-06-12 General Electric Company Multi-axis magneto-resistance sensor package
WO2018144993A1 (en) * 2017-02-06 2018-08-09 Boston Scientific Scimed Inc. Electromagnetic navigation system with magneto-resistive sensors and application-specific integrated circuits
WO2019010361A1 (en) * 2017-07-06 2019-01-10 University Of Houston System BIOSENSOR FOR DETECTING A SINGLE MAGNETIC LABEL
JP6997918B2 (ja) 2017-12-03 2022-01-18 エンヴィジョン メディカル リミテッド 電磁センサ付き栄養チューブ
EP3712630B1 (en) * 2019-03-20 2021-04-28 LEM International SA Magnetic field sensor
KR20220036952A (ko) * 2019-07-12 2022-03-23 뉴럴링크 코포레이션 박막 전극 어레이 및 집적 회로를 위한 샌드위치 어셈블리 방식
JP7138261B1 (ja) * 2022-06-30 2022-09-15 旭化成エレクトロニクス株式会社 半導体パッケージ、及び駆動装置

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5558091A (en) * 1993-10-06 1996-09-24 Biosense, Inc. Magnetic determination of position and orientation
US6090498A (en) * 1996-12-27 2000-07-18 Tdk Corporation Magnetoresistance effect element and magnetoresistance device
JP3820300B2 (ja) * 1997-04-17 2006-09-13 日本電産サンキョー株式会社 磁気検出装置の製造方法
US6268662B1 (en) 1998-10-14 2001-07-31 Texas Instruments Incorporated Wire bonded flip-chip assembly of semiconductor devices
JP3651433B2 (ja) * 2001-09-28 2005-05-25 株式会社村田製作所 磁気センサ
US7309647B1 (en) * 2003-03-05 2007-12-18 Altera Corporation Method of mounting an electroless nickel immersion gold flip chip package
US6995957B2 (en) * 2003-03-18 2006-02-07 Hitachi Global Storage Technologies Netherland B.V. Magnetoresistive sensor having a high resistance soft magnetic layer between sensor stack and shield
KR100604334B1 (ko) * 2003-11-25 2006-08-08 (주)케이나인 플립칩 패키징 공정에서 접합력이 향상된 플립칩 접합 방법
US7273803B2 (en) * 2003-12-01 2007-09-25 International Business Machines Corporation Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure
US7271586B2 (en) * 2003-12-04 2007-09-18 Honeywell International Inc. Single package design for 3-axis magnetic sensor
US20060145715A1 (en) * 2005-01-06 2006-07-06 Salmon Peter C Wafer level test head
US20080002460A1 (en) * 2006-03-01 2008-01-03 Tessera, Inc. Structure and method of making lidded chips
US7451651B2 (en) 2006-12-11 2008-11-18 General Electric Company Modular sensor assembly and methods of fabricating the same
WO2008133943A1 (en) 2007-04-24 2008-11-06 Flextronics Ap Llc Small form factor modules using wafer level optics with bottom cavity and flip chip assembly
US20090127718A1 (en) * 2007-11-15 2009-05-21 Chen Singjang Flip chip wafer, flip chip die and manufacturing processes thereof
US20100099250A1 (en) * 2008-10-21 2010-04-22 Samsung Electronics Co., Ltd. Methods of Forming Integrated Circuit Contact Pads Using Electroless Plating of Diffusion Barrier Layers
US9642555B2 (en) * 2008-11-20 2017-05-09 Medtronic, Inc. Subcutaneous lead guidance
US20100130853A1 (en) * 2008-11-25 2010-05-27 General Electric Company System for tracking object
US8283921B2 (en) 2008-11-26 2012-10-09 General Electric Company Magnetoresistance sensors for position and orientation determination
JP2010161136A (ja) * 2009-01-07 2010-07-22 Panasonic Corp 半導体装置及びその製造方法
US20100249571A1 (en) 2009-03-31 2010-09-30 General Electric Company Surgical navigation system with wireless magnetoresistance tracking sensors
WO2010117383A1 (en) 2009-04-08 2010-10-14 National Ict Australia Limited (Nicta) Bonded hermetic feed through for an active implantable medical device
US8173446B2 (en) 2009-12-21 2012-05-08 General Electric Company Method of producing an integrated micromagnet sensor assembly
US20110186980A1 (en) 2010-02-03 2011-08-04 Rfmarq, Inc. Wireless Element With Antenna Formed On A Thin Film Substrate For Embedding into Semiconductor packages
TWM397597U (en) * 2010-04-15 2011-02-01 Di-Quan Hu Package structure of integrated circuit
CN101869509A (zh) * 2010-07-12 2010-10-27 大连医科大学 桡动脉穿刺定位装置

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