DE112013003183T5 - Sensoranordnung zur Verwendung in der medizinischen Positions- und Ausrichtungverfolgung - Google Patents

Sensoranordnung zur Verwendung in der medizinischen Positions- und Ausrichtungverfolgung Download PDF

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Publication number
DE112013003183T5
DE112013003183T5 DE112013003183.3T DE112013003183T DE112013003183T5 DE 112013003183 T5 DE112013003183 T5 DE 112013003183T5 DE 112013003183 T DE112013003183 T DE 112013003183T DE 112013003183 T5 DE112013003183 T5 DE 112013003183T5
Authority
DE
Germany
Prior art keywords
sensor assembly
chip
orientation sensor
layer
orientation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112013003183.3T
Other languages
German (de)
English (en)
Inventor
Kaustubh Ravindra Nagarkar
Daniel E. Groszmann
William Hullinger Huber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of DE112013003183T5 publication Critical patent/DE112013003183T5/de
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09—Magnetoresistive devices
    • G01R33/093—Magnetoresistive devices using multilayer structures, e.g. giant magnetoresistance sensors
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/06—Devices, other than using radiation, for detecting or locating foreign bodies ; Determining position of diagnostic devices within or on the body of the patient
    • A61B5/061—Determining position of a probe within the body employing means separate from the probe, e.g. sensing internal probe position employing impedance electrodes on the surface of the body
    • A61B5/062—Determining position of a probe within the body employing means separate from the probe, e.g. sensing internal probe position employing impedance electrodes on the surface of the body using magnetic field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/0023—Electronic aspects, e.g. circuits for stimulation, evaluation, control; Treating the measured signals; calibration
    • G01R33/0035—Calibration of single magnetic sensors, e.g. integrated calibration
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/0094—Sensor arrays
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/02—Details of sensors specially adapted for in-vivo measurements
    • A61B2562/0223—Magnetic field sensors
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/04—Arrangements of multiple sensors of the same type
    • A61B2562/046—Arrangements of multiple sensors of the same type in a matrix array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/1624—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting between the body and an opposite side of the item with respect to the body
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component

Landscapes

  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Heart & Thoracic Surgery (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Biomedical Technology (AREA)
  • Human Computer Interaction (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • Biophysics (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Prostheses (AREA)
  • Magnetic Resonance Imaging Apparatus (AREA)
  • Surgical Instruments (AREA)
  • Endoscopes (AREA)
  • Measuring Magnetic Variables (AREA)
DE112013003183.3T 2012-06-29 2013-05-30 Sensoranordnung zur Verwendung in der medizinischen Positions- und Ausrichtungverfolgung Withdrawn DE112013003183T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/538,573 2012-06-29
US13/538,573 US8618795B1 (en) 2012-06-29 2012-06-29 Sensor assembly for use in medical position and orientation tracking
PCT/US2013/043356 WO2014003960A1 (en) 2012-06-29 2013-05-30 Sensor assembly for use in medical position and orientation tracking

Publications (1)

Publication Number Publication Date
DE112013003183T5 true DE112013003183T5 (de) 2015-03-19

Family

ID=48670780

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112013003183.3T Withdrawn DE112013003183T5 (de) 2012-06-29 2013-05-30 Sensoranordnung zur Verwendung in der medizinischen Positions- und Ausrichtungverfolgung

Country Status (5)

Country Link
US (1) US8618795B1 (enExample)
JP (1) JP6187991B2 (enExample)
CN (1) CN104411267A (enExample)
DE (1) DE112013003183T5 (enExample)
WO (1) WO2014003960A1 (enExample)

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US9638820B2 (en) * 2014-03-03 2017-05-02 Biosense Webster (Israel) Ltd. Calibration jig for a flat location pad
US10588541B2 (en) 2014-07-15 2020-03-17 General Electric Company Magnetic tracker system and method for use for surgical navigation
US10076267B2 (en) 2014-10-03 2018-09-18 General Electric Company Methods and systems for improved navigation
US10727122B2 (en) 2014-12-08 2020-07-28 International Business Machines Corporation Self-aligned via interconnect structures
US10426555B2 (en) * 2015-06-03 2019-10-01 Covidien Lp Medical instrument with sensor for use in a system and method for electromagnetic navigation
US9995600B2 (en) 2015-09-01 2018-06-12 General Electric Company Multi-axis magneto-resistance sensor package
WO2018144993A1 (en) * 2017-02-06 2018-08-09 Boston Scientific Scimed Inc. Electromagnetic navigation system with magneto-resistive sensors and application-specific integrated circuits
WO2019010361A1 (en) * 2017-07-06 2019-01-10 University Of Houston System BIOSENSOR FOR DETECTING A SINGLE MAGNETIC LABEL
JP6997918B2 (ja) 2017-12-03 2022-01-18 エンヴィジョン メディカル リミテッド 電磁センサ付き栄養チューブ
EP3712630B1 (en) * 2019-03-20 2021-04-28 LEM International SA Magnetic field sensor
KR20220036952A (ko) * 2019-07-12 2022-03-23 뉴럴링크 코포레이션 박막 전극 어레이 및 집적 회로를 위한 샌드위치 어셈블리 방식
JP7138261B1 (ja) * 2022-06-30 2022-09-15 旭化成エレクトロニクス株式会社 半導体パッケージ、及び駆動装置

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US5558091A (en) * 1993-10-06 1996-09-24 Biosense, Inc. Magnetic determination of position and orientation
US6090498A (en) * 1996-12-27 2000-07-18 Tdk Corporation Magnetoresistance effect element and magnetoresistance device
JP3820300B2 (ja) * 1997-04-17 2006-09-13 日本電産サンキョー株式会社 磁気検出装置の製造方法
US6268662B1 (en) 1998-10-14 2001-07-31 Texas Instruments Incorporated Wire bonded flip-chip assembly of semiconductor devices
JP3651433B2 (ja) * 2001-09-28 2005-05-25 株式会社村田製作所 磁気センサ
US7309647B1 (en) * 2003-03-05 2007-12-18 Altera Corporation Method of mounting an electroless nickel immersion gold flip chip package
US6995957B2 (en) * 2003-03-18 2006-02-07 Hitachi Global Storage Technologies Netherland B.V. Magnetoresistive sensor having a high resistance soft magnetic layer between sensor stack and shield
KR100604334B1 (ko) * 2003-11-25 2006-08-08 (주)케이나인 플립칩 패키징 공정에서 접합력이 향상된 플립칩 접합 방법
US7273803B2 (en) * 2003-12-01 2007-09-25 International Business Machines Corporation Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure
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Also Published As

Publication number Publication date
US20140005517A1 (en) 2014-01-02
CN104411267A (zh) 2015-03-11
JP2015523145A (ja) 2015-08-13
JP6187991B2 (ja) 2017-08-30
US8618795B1 (en) 2013-12-31
WO2014003960A1 (en) 2014-01-03

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Free format text: PREVIOUS MAIN CLASS: A61B0019000000

Ipc: A61B0090980000

R012 Request for examination validly filed
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee