JP6187991B2 - 医療的位置および方向追跡で使用するためのセンサアセンブリ - Google Patents
医療的位置および方向追跡で使用するためのセンサアセンブリ Download PDFInfo
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- JP6187991B2 JP6187991B2 JP2015520207A JP2015520207A JP6187991B2 JP 6187991 B2 JP6187991 B2 JP 6187991B2 JP 2015520207 A JP2015520207 A JP 2015520207A JP 2015520207 A JP2015520207 A JP 2015520207A JP 6187991 B2 JP6187991 B2 JP 6187991B2
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/06—Devices, other than using radiation, for detecting or locating foreign bodies ; determining position of probes within or on the body of the patient
- A61B5/061—Determining position of a probe within the body employing means separate from the probe, e.g. sensing internal probe position employing impedance electrodes on the surface of the body
- A61B5/062—Determining position of a probe within the body employing means separate from the probe, e.g. sensing internal probe position employing impedance electrodes on the surface of the body using magnetic field
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
- G01R33/093—Magnetoresistive devices using multilayer structures, e.g. giant magnetoresistance sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/0023—Electronic aspects, e.g. circuits for stimulation, evaluation, control; Treating the measured signals; calibration
- G01R33/0035—Calibration of single magnetic sensors, e.g. integrated calibration
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/0094—Sensor arrays
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/02—Details of sensors specially adapted for in-vivo measurements
- A61B2562/0223—Magnetic field sensors
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/04—Arrangements of multiple sensors of the same type
- A61B2562/046—Arrangements of multiple sensors of the same type in a matrix array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/1624—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting between the body and an opposite side of the item with respect to the body
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12528—Semiconductor component
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- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Molecular Biology (AREA)
- General Health & Medical Sciences (AREA)
- Pathology (AREA)
- Biomedical Technology (AREA)
- Heart & Thoracic Surgery (AREA)
- Medical Informatics (AREA)
- Human Computer Interaction (AREA)
- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- Biophysics (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Magnetic Resonance Imaging Apparatus (AREA)
- Prostheses (AREA)
- Wire Bonding (AREA)
- Measuring Magnetic Variables (AREA)
- Surgical Instruments (AREA)
- Endoscopes (AREA)
Description
22 一体型2軸センサアレイ、位置および方向センサアレイ
26 プリント回路基板
28 はんだボール
30 導電性構造
32 パッド
33 接触パッド
40 ベアダイ
42 厚さ
44 所望の厚さ
50 プロセス
52 ステップ
54 ステップ
56 ステップ
58 ステップ
60 バリア層堆積ステップ
62 耐食堆積ステップ
64 ステップ
66 ステップ
70 マスク
72 接着促進層
74 はんだ付け可能層
76 拡散バリア層
78 耐食層
82 金属スタック
84 接点
88 アンダーフィル材料
90 モールドキャップ
92 実施形態
94 アンダーバンプ金属化プロセス
96 金属化スタック
98 手法
100 金属化プロセス
102 金属化スタック
110 カテーテル
112 先端
114 シャフト
116 ハンドルアセンブリ
124 ケーブル
126 オペレータコンソール
130 ポッティング材料
Claims (19)
- 複数の接触パッドを備える磁気抵抗センサアレイであって、前記複数の接触パッドがはんだ接続によって接続されるように構成されていない、磁気抵抗センサアレイと、
前記複数の接触パッドの各々に堆積された複数のメタライゼーション層であって、前記複数のメタライゼーション層は、少なくとも一層のはんだ付け可能層と、前記少なくとも一層のはんだ付け可能層と前記接触パッドとの間に設けられチタン又は酸化チタンを有する接着促進層と、金の耐食層又は金を含む耐食層と、前記少なくとも一層のはんだ付け可能層と前記耐食層との間に設けられた拡散バリア層とを有し、前記はんだ付け可能層は前記接着促進層と前記拡散バリア層との間に設けられる複数のメタライゼーション層と、
前記複数の接触パッドに対応する複数の接点を備えるプリント回路基板と、
各はんだ付け可能層と前記複数の接点のうちの対応する接点との間に形成されたはんだ材料接続部と
を備える、位置および方向センサアセンブリ。 - 前記磁気抵抗センサアレイが、磁場の存在下で位置および方向の情報を生成するように構成された2軸センサアレイを備える、請求項1記載の位置および方向センサアセンブリ。
- 前記磁気抵抗センサアレイの前記複数の接触パッドが、ワイヤボンディングを介して接続されるように構成された、請求項1記載の位置および方向センサアセンブリ。
- 前記はんだ材料接続部が、前記複数の接点の個々の接点と自己整列する、請求項1記載の位置および方向センサアセンブリ。
- 前記磁気抵抗センサアレイと前記プリント回路基板との間に少なくとも部分的に配置されたアンダーフィル材料を備える、請求項1記載の位置および方向センサアセンブリ。
- 磁気抵抗センサダイのはんだ付け接続に適していない接触パッドに接着促進層を設けるステップと、
チタン又は酸化チタンを有する前記接着促進層にはんだ付け可能層を設けるステップと、
前記はんだ付け可能層に拡散バリア層を設けるステップと、
前記拡散バリア層に金の耐食層又は金を含む耐食層を設けるステップと、
はんだ材料を設けるステップと、
前記磁気抵抗センサダイの前記接触パッドをプリント回路基板の対応する接点と電気的に接続するために、前記はんだ材料をリフローするステップと、
を含む、磁気抵抗センサアセンブリを製造する方法。 - 前記ダイの厚さを薄くするステップを含む、請求項6記載の方法。
- 前記ダイが、複数の追加のダイを含むウェハで形成される、請求項6記載の方法。
- 前記はんだ材料をリフローする前に、前記ウェハから前記ダイおよび前記追加のダイを切断するステップを含む、請求項8記載の方法。
- 前記接触パッドは、前記はんだ付け可能層を設ける前はワイヤボンディングに適している、請求項6記載の方法。
- 前記はんだ付け可能層が、無電解ニッケルを含む、請求項6記載の方法。
- 少なくとも一層のはんだ付け可能層は無電解ニッケルを有し、前記耐食層は金を有し、前記拡散バリア層は無電解ニッケルを有する、請求項1に記載の位置および方向センサアセンブリ。
- 前記拡散バリア層は、500Åから1000Åの範囲内の厚さを有する、請求項1に記載の位置および方向センサアセンブリ。
- 前記耐食層は、500Åから1000Åの範囲内の厚さを有する、請求項1に記載の位置および方向センサアセンブリ。
- 前記磁気抵抗センサアレイは200ミクロン以下の第1の厚さを有し、前記接着促進層は10nmと100nmとの間の第2の厚さを有し、前記少なくとも一層のはんだ付け可能層は3ミクロンから5ミクロンの範囲内の第3の厚さを有し、前記拡散バリア層は500Åから1000Åの範囲内の第4の厚さを有し、前記耐食層は500Åから1000Åの範囲内の第5の厚さを有する、請求項1に記載の位置および方向センサアセンブリ。
- 前記接着促進層は10nmから100nmの範囲内の厚さを有する、請求項1に記載の位置および方向センサアセンブリ。
- 前記少なくとも一層のはんだ付け可能層は3ミクロンから5ミクロンの範囲内の厚さを有する、請求項1に記載の位置および方向センサアセンブリ。
- 前記磁気抵抗センサアレイは200ミクロン以下の厚さを有する、請求項1に記載の位置および方向センサアセンブリ。
- 前記位置および方向センサアセンブリは0.4mmの幅を有する、請求項1に記載の位置および方向センサアセンブリ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/538,573 | 2012-06-29 | ||
US13/538,573 US8618795B1 (en) | 2012-06-29 | 2012-06-29 | Sensor assembly for use in medical position and orientation tracking |
PCT/US2013/043356 WO2014003960A1 (en) | 2012-06-29 | 2013-05-30 | Sensor assembly for use in medical position and orientation tracking |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2015523145A JP2015523145A (ja) | 2015-08-13 |
JP2015523145A5 JP2015523145A5 (ja) | 2016-07-14 |
JP6187991B2 true JP6187991B2 (ja) | 2017-08-30 |
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015520207A Active JP6187991B2 (ja) | 2012-06-29 | 2013-05-30 | 医療的位置および方向追跡で使用するためのセンサアセンブリ |
Country Status (5)
Country | Link |
---|---|
US (1) | US8618795B1 (ja) |
JP (1) | JP6187991B2 (ja) |
CN (1) | CN104411267A (ja) |
DE (1) | DE112013003183T5 (ja) |
WO (1) | WO2014003960A1 (ja) |
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US10426555B2 (en) * | 2015-06-03 | 2019-10-01 | Covidien Lp | Medical instrument with sensor for use in a system and method for electromagnetic navigation |
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US20180220926A1 (en) * | 2017-02-06 | 2018-08-09 | Boston Scientific Scimed Inc. | Electromagnetic navigation system with magneto-resistive sensors and application-specific integrated circuits |
US11821818B2 (en) | 2017-07-06 | 2023-11-21 | University Of Houston System | Biosensor for detecting a single magnetic label |
JP6997918B2 (ja) * | 2017-12-03 | 2022-01-18 | エンヴィジョン メディカル リミテッド | 電磁センサ付き栄養チューブ |
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-
2012
- 2012-06-29 US US13/538,573 patent/US8618795B1/en active Active
-
2013
- 2013-05-30 JP JP2015520207A patent/JP6187991B2/ja active Active
- 2013-05-30 CN CN201380034558.5A patent/CN104411267A/zh active Pending
- 2013-05-30 WO PCT/US2013/043356 patent/WO2014003960A1/en active Application Filing
- 2013-05-30 DE DE112013003183.3T patent/DE112013003183T5/de not_active Withdrawn
Also Published As
Publication number | Publication date |
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DE112013003183T5 (de) | 2015-03-19 |
US8618795B1 (en) | 2013-12-31 |
WO2014003960A1 (en) | 2014-01-03 |
CN104411267A (zh) | 2015-03-11 |
US20140005517A1 (en) | 2014-01-02 |
JP2015523145A (ja) | 2015-08-13 |
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